JP3546526B2 - Solenoid coil device and method of manufacturing the same - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to a solenoid coil device and a method for manufacturing the same. The solenoid coil device and the method of manufacturing the same according to the present invention are applied to, for example, a rotary actuator such as an electromagnetic rotary valve and a linear actuator such as an electromagnetic linear solenoid.
[0002]
[Prior art]
Japanese Patent Publication No. Sho 62-13684 discloses an H-bridge type drive control circuit for driving a solenoid coil for driving an electromagnetic rotary valve. This drive control circuit has an inverter circuit, a so-called H-bridge circuit, comprising a high-side switch and a low-side switch at both ends of a solenoid coil, enabling bidirectional energization by opening and closing these, and according to the energization direction and energization current value. The direction and amount of rotation of the valve are controlled. Some electromagnetic rotary valves of this type have a closed coil and an open coil, each of which is energized and controlled by a single switching means. In addition, the solenoid coil is also driven by a drive control circuit such as a similar H-bridge circuit in a direct acting type electromagnetic valve or electromagnetic actuator.
[0003]
The drive control circuit for driving the solenoid coil includes one or more semiconductor integrated circuits (semiconductor chips are hereinafter referred to as ICs) together with an abnormality detection circuit for detecting coil energization abnormality, a drive signal synthesis circuit (for example, a PWM signal forming circuit), and the like. Are mounted on a circuit board, and the circuit board is sealed with a resin, a case, or the like to form an IC device, and the IC device is fixed at an appropriate place.
[0004]
[Problems to be solved by the invention]
However, the above-described solenoid actuator driven by a solenoid coil has the following problems.
First, there is a problem that the number of components is large, the component manufacturing process and the assembling process are complicated, and the space required for accommodation is large.
[0005]
That is, it is necessary to dispose an IC device and a solenoid coil, and connect a connector pin projecting from a connector of the IC device and a connector pin projecting from a connector formed on the solenoid coil by a connection cable having female connectors formed at both ends. there were. Furthermore, in applications such as those for vehicles, there are many vibrations, and these connectors may be loosened.
[0006]
The present invention has been made in view of the above problems, and provides a solenoid coil device that can reduce the number of components, shorten the component manufacturing process and the assembling process, reduce the size, and improve the vibration resistance. , Aim.
[0007]
[Means for Solving the Problems]
Each invention has a cylindrical bobbin portion in which a coil is wound and a columnar portion of a magnetic core is built in, and a block-shaped block portion connected to one end of the bobbin portion, and is integrally formed of resin as a material. And a resin body to be provided,
It has a common configuration including an input / output connector pin partially buried in the block portion and the coil driving semiconductor integrated circuit buried in the block portion.
[0008]
The first configuration of the present invention is characterized in that, in the above-described common configuration, a lead terminal of the semiconductor integrated circuit also serves as the connector pin.
A second configuration of the present invention is characterized in that, in the above-mentioned common configuration, a lead terminal of the semiconductor integrated circuit also serves as the coil end winding terminal.
In a third configuration of the present invention, in the above-described common configuration, the magnetic core further includes a yoke portion disposed in close contact with an end surface of the columnar portion on the block portion side, Is characterized by being arranged close to the yoke portion.
[0009]
According to a fourth configuration of the present invention, in the method for manufacturing a solenoid coil device according to the third configuration, a semiconductor integrated circuit is joined to the yoke and inserted into a mold.
According to a fifth aspect of the present invention, in the method for manufacturing a solenoid coil device having the above-mentioned common configuration, further, the distal end portion forms a contact portion that makes electrical contact with a connector pin of a mating connector, and the intermediate portion is connected to each other with a tie bar. After preparing a plurality of the connector pins and individually connecting the base ends of the connector pins to the plurality of lead terminals of the semiconductor integrated circuit, the base end of the tie bar is formed with the resin body by insert molding. It is characterized in that the tie bar is separated and then removed.
[0010]
[Action and effect of the invention]
The solenoid coil device having the common configuration has a resin body in which a block portion is integrally formed at one end of a bobbin portion, and in a solenoid coil device in which a coil is wound around a bobbin portion, A base end of a connector pin and a semiconductor integrated circuit (IC) for driving a coil are embedded therein.
[0011]
With this configuration, the following operation and effect can be obtained.
First, it is possible to reduce the number of parts, shorten the parts manufacturing process and the assembling process, and reduce the size. That is, in this configuration, an IC for driving the solenoid coil and a base end of a connector pin for transmitting and receiving signals and supplying power to the IC are provided on the bobbin of the conventional solenoid coil (correctly, the end of the bobbin). It is buried, so that these devices can be configured as a single part, and the manufacturing process can be made substantially the same as the process of manufacturing a bobbin of a conventional solenoid coil, which is extremely simple. For example, the bobbin of the conventional solenoid coil needs to fix the coil end winding terminal, and needs to perform insert molding. However, in this configuration, the IC connected to the connector pin may be inserted together with the coil end winding terminal, thereby protecting and packaging the IC, supporting and fixing the connector pin, and further connecting the connector pin and the lead terminal. The connection can be protected. Further, since the relative positional relationship between the lead of the IC and the coil of the bobbin can be strictly defined, automation of electrical connection between the two can be realized, a cable with a connector can be omitted, and the IC is packaged. The conventional resin molding process can be omitted. Further, the number of connection points between the IC and the coil can be reduced, and the vibration resistance in a high vibration environment can be improved.
[0012]
In particular, the block portion of the resin body is originally formed to surround and support the yoke portion of the magnetic core, and this configuration and the above-described effects are realized only by slightly increasing the size of the block portion. This eliminates the need for significant changes in the conventional so-called coil bobbin manufacturing process. Further, the wiring distance between the semiconductor integrated circuit and the coil can be reduced.
In the first configuration of the present invention, the lead terminals of the semiconductor integrated circuit also serve as the connector pins in the above-described common configuration, so that the configuration and steps can be further simplified, and the reliability can be improved. it can.
[0013]
In the second configuration of the present invention, the lead terminal of the semiconductor integrated circuit also serves as the coil end winding terminal in the common configuration, so that the configuration and steps can be further simplified, and the reliability is improved. can do.
In the third configuration of the present invention, in the above-described common configuration, a yoke portion of the magnetic core is formed in close contact with an end face of the columnar portion of the magnetic core built in the bobbin portion of the resin body on the block portion side. You. The block unit incorporates and encloses the yoke unit and the semiconductor integrated circuit in a state of being close to (or close to) each other.
[0014]
With this configuration, the heat generated in the semiconductor integrated circuit can be radiated and absorbed through the yoke having good thermal conductivity and large heat capacity, so that the power consumption of the semiconductor integrated circuit can be increased, and There is no need to extend the process at all as compared to the above common configuration .
According to a fourth configuration of the present invention, in the third configuration, a semiconductor integrated circuit (IC) is further joined (for example, bonded) to a yoke and inserted into a mold. With this configuration, it is easy to maintain the relative positions of the IC and the yoke during injection of the insert and the resin, and the yoke can perform the heat sink function and the cooling function of the IC.
[0015]
In a fifth configuration of the present invention, in the method of manufacturing a solenoid coil device having the common configuration, the base end of the connector pin connected to the lead terminal of the semiconductor integrated circuit may be further connected to the block (or a connector integrated with the block). Tie bar in the middle of the exposed portion of the connector pin that is not in electrical contact with the connector pin of the mating connector. This tie bar prevents relative displacement of each connector pin during insert molding. After the completion of the molding, the tie bar is cut.
[0016]
In this way, the relative positional accuracy between pins, which has been very important in the molding of the connector, can be remarkably improved. That is, in the conventional connector, the positional deviation between adjacent connector pins (relative positional error between the pins) must be suppressed to several + μm or less in order to ensure good detachability. According to this configuration, the relative position between the pins after the insertion can be controlled with high accuracy. In addition, since no tie bar is provided at the contact portion of the connector pin, there is no hindrance to detachment.
[0017]
【Example】
(Example 1)
FIG. 1 shows a circuit diagram of an H-bridge type bidirectional energizing solenoid coil device as an embodiment of the solenoid coil device of the present invention.
The solenoid coil device includes a semiconductor integrated circuit (IC) 1, a rotary solenoid 2 controlled by the IC 1, connector pins 31 to 33 for supplying power to the IC 1 from outside and transmitting / receiving signals to / from the outside, And a built-in resin body 4. The rotary solenoid 2 includes a coil 5 wound around a resin body 4 and a magnetic core 6 inserted into the resin body 4 to form a magnetic circuit. Since the structure and detailed operation of the rotary solenoid 2 are not the gist of the present embodiment, the description is omitted.
[0018]
The IC 1 includes an energization control circuit 11 and a controller 12.
The energization control circuit 11 is an H-bridge type bidirectional energization control circuit including NPN power transistors T1 to T4, diodes D1 to D4 for absorbing surge current, and resistors r1 to r4 for limiting base current. Is composed of a one-chip power IC. The energization control circuit 1 energizes the coil 5 of the rotary solenoid 2 with a current value at a predetermined duty ratio in a predetermined energizing direction by switching control of the signal voltages Vs1 and Vs2. That is, energization control in the predetermined first direction can be performed by the duty control of the signal voltage Vs1, and energization control in the opposite direction can be performed by the duty control of the signal voltage Vs2.
[0019]
The controller 12 is a circuit that generates the signal voltages Vs1 and Vs2, and is actually formed of a one-chip IC. The controller 12 generates, as one of the signal voltages Vs1 and Vs2, a carrier pulse signal of a predetermined frequency having an on-duty ratio substantially proportional to the magnitude of the input opening voltage made of a digital signal, and the other of the signal voltages Vs1 and Vs2. To generate a low-level signal voltage for shutting off the transistor. Accordingly, when the signal voltage Vs1 has a predetermined duty ratio, the rotation angle of the rotary solenoid 2 has an opening corresponding to the first direction, and when the signal voltage Vs2 has a predetermined duty ratio, the opening angle corresponds to the opposite direction. When both signal voltages Vs1 and Vs2 are at a low level, the opening becomes a predetermined intermediate opening (50% opening in this embodiment).
[0020]
In this embodiment, as described above, the energization control circuit 11 and the controller 12 are each composed of a one-chip IC chip, and these IC chips are mounted on an alumina wiring board (not shown) and housed in a package to implement the hybrid IC. Make up.
FIG. 2 shows the entire cross section of this solenoid coil device.
[0021]
The resin body 4 is formed by insert resin molding, and has a cylindrical bobbin portion 41, a block portion 42 formed at one end of the bobbin portion 41, and a standing portion provided from one end of the block portion 42 in the radial direction of the bobbin portion 41. And a connector resin portion 43.
The coil 5 is wound around the outer periphery of the bobbin portion 41, but is not shown in FIG. The bobbin portion 41 has a columnar portion 61 of the magnetic core 6 built therein. The magnetic core 6 has a cylindrical columnar portion 61 and a yoke portion 62 embedded in the block portion 42 and in close contact with one end of the columnar portion 61, and a second yoke portion in close contact with the other end of the columnar portion 61. (Not shown). The yoke portion 62 and the second yoke portion extend in a direction perpendicular to the axis of the columnar portion.
[0022]
The resin package of IC1 is adhered to the surface of the yoke portion 62 on the side opposite to the columnar portion, and lead terminals 13 to 15 are fixed to the alumina wiring board in IC1. Are protruded and embedded in the connector resin portion 43, and the tip ends of the lead terminals 16 to 17 extend in the opposite direction and protrude to the outside. The base ends of the connector pins 31 to 33 are individually resistance-welded to the front ends of the lead terminals 13 to 15, and the front ends and the center of the connector pins 31 to 33 project outside. FIG. 3 shows a coupling relationship between the IC 1 and the connector pins 31 to 33. The base ends 31a, 32a, and 33a of the connector pins 31 to 33 are bent so as to sandwich the lead terminals 13 to 15, respectively, and are resistance-welded.
[0023]
Next, the manufacturing process of this device will be described in order below.
First, as shown in FIG. 4, the three connector pins 31 to 33 are punched in a state where the central portions thereof are connected by a tie bar 314, and their base ends 31 a to 33 a are resistance-welded to the lead terminals 13 to 15. Next, the IC 1 is bonded to the yoke portion 62, and the yoke portion 62 and the columnar portion 61 are bonded to form an insert assembly. The insert assembly is set at a predetermined position of a mold (not shown). The resin body 4 is insert molded. Next, after cutting the tie bar 314 as shown in FIG. 5, the coil 2 is wound around the bobbin portion 41 of the resin body 4 formed by insert molding, and both ends of the coil 2 are wound around the lead terminals 16 and 17. Note that the positions of the lead terminals 16 and 17 are not limited to those in FIG. 2, and may be bent further toward the bobbin portion 41.
[0024]
FIG. 5 is a plan view of the solenoid coil device viewed parallel to the axis.
(Modification)
In the above-described embodiment, the columnar portion 61 and the yoke portion 62 of the magnetic core 6 are integrally formed with the resin body 4 by insert molding, but either or both of the columnar portion 61 and the yoke portion 62 are formed on the resin body 4. Can also be inserted from Further, the columnar portion 61 and the yoke portion 62 can be formed integrally.
[0025]
(Example 2)
Another embodiment will be described with reference to FIG.
In this embodiment, the coil end winding terminal 8 is formed separately from the lead terminals 16 and 17 of the IC 1, and the lead terminals 16 and 17 are individually crimped to the pair of coil end winding terminals 8. Or, resistance welding.
[Brief description of the drawings]
FIG. 1 is a circuit diagram of a solenoid coil device according to a first embodiment.
FIG. 2 is a sectional view of the solenoid coil device of FIG.
FIG. 3 is a diagram showing connections between IC1 and connector pins 31 to 33 of the solenoid coil device of FIG. 1;
FIG. 4 is a view showing a connection between IC1 and connector pins 31 to 33 of the solenoid coil device in FIG. 1 before insert molding.
FIG. 5 is a plan view of the solenoid coil device of FIG. 1;
FIG. 6 is a cross-sectional view illustrating a solenoid coil device according to a second embodiment.
[Explanation of symbols]
1 is an IC, 2 is a rotary solenoid, 4 is a resin body, 5 is a coil, 6 is a magnetic core, 13 to 17 are lead terminals, 31 to 33 are connector pins, 41 is a bobbin portion of the resin body 4, and 42 is a resin body Reference numeral 4 denotes a block portion, 43 denotes a connector resin portion of the resin body 4, 61 denotes a columnar portion of the magnetic core 6, and 62 denotes a yoke portion of the magnetic core 6.

Claims (5)

A resin body having a cylindrical bobbin portion in which a coil is wound and a columnar portion of a magnetic core is incorporated, and a block-shaped block portion connected to one end of the bobbin portion, and integrally formed of resin as a material In a solenoid coil device comprising:
An input / output connector pin partially buried in the block portion, and the coil driving semiconductor integrated circuit buried in the block portion,
A lead terminal of the semiconductor integrated circuit also serves as the connector pin. A resin body having a cylindrical bobbin portion in which a coil is wound and a columnar portion of a magnetic core is incorporated, and a block-shaped block portion connected to one end of the bobbin portion, and integrally formed of resin as a material In a solenoid coil device comprising:
An input / output connector pin partially buried in the block portion, and the coil driving semiconductor integrated circuit buried in the block portion,
The semiconductor lead terminals of the integrated circuit, the solenoid coil means, characterized in that also serves as a with the coil end winding terminals. A resin body having a cylindrical bobbin portion in which a coil is wound and a columnar portion of a magnetic core is incorporated, and a block-shaped block portion connected to one end of the bobbin portion, and integrally formed of resin as a material In a solenoid coil device comprising:
An input / output connector pin partially buried in the block portion, and the coil driving semiconductor integrated circuit buried in the block portion,
It said solenoid magnetic core has a yoke portion which is disposed in close contact with the end surface of the block portion side the columnar portion, the semiconductor integrated circuit is characterized in that it is tightly positioned on the yoke portion Coil device. 4. The method of manufacturing a solenoid coil device according to claim 3, wherein the semiconductor integrated circuit is joined to the yoke portion and inserted into a mold for shaping the resin body. A resin body having a cylindrical bobbin portion in which a coil is wound and a columnar portion of a magnetic core is incorporated, and a block-shaped block portion connected to one end of the bobbin portion, and integrally formed of resin as a material A method of manufacturing a solenoid coil device comprising: an input / output connector pin partially embedded in the block portion; and the coil driving semiconductor integrated circuit embedded in the block portion.
A plurality of the connector pins are prepared in which a distal end portion is in contact with a connector pin of a mating connector and an intermediate portion is connected to each other by a tie bar, and a base end portion of the connector pin is connected to a plurality of the semiconductor integrated circuits. A method of manufacturing the solenoid coil device, wherein the base ends of the tie bars are covered with the resin body by insert molding after individually connecting the tie bars to the lead terminals, and then the tie bars are separated and removed.

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