JP3502560B2 - Semiconductor module - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor module used for converting large-capacity AC power and DC power.

[0002]

2. Description of the Related Art Semiconductors used for semiconductor modules used for large-capacity power conversion include thyristors, optical thyristors, GTO thyristors, and IGBTs. Here, a thyristor module will be described as an example.

A conventional thyristor module is a thyristor stack consisting of a laminated structure of a thyristor and a heat sink for cooling the thyristor, and a snubber circuit called a snubber circuit which is a peripheral circuit for suppressing an overcurrent suddenly flowing in the thyristor. A resistor, an anode reactor for suppressing current fluctuation, and the like are arranged on the module frame.

This thyristor stack has a laminated structure of a thyristor and a heat sink, but in order to reduce the contact thermal resistance value of the mutual contact surfaces, it is necessary to press-contact with a large force, and a stud as a constituent element therefor. Also, a pressing plate was required.

The structure of a conventional thyristor module will be described with reference to the drawings. FIG. 8 shows a thyristor stack in which two thyristors 1 are connected in series, and a snubber circuit including a series connection of a resistor 2 and a capacitor 3 in parallel with the thyristor 1.
1 is a circuit diagram of a water-cooled thyristor module including an anode reactor 4 connected in series with a thyristor 1. Here, the thyristor 1 and the anode reactor 4 are water-cooled.

FIG. 9 also shows the configuration of the electrical connection and the cooling piping system. It should be noted that FIG. 1A is a plan view and FIG. 1B is a front view. In FIG. 9, the thyristor 1 is sandwiched from both sides by a water-cooled heat sink 5A, and pressed against the stud 10, the pressing plates 11A and 11B, the disc spring 12, and the nut 13 to form a thyristor stack.
Incidentally, 31 is an insulating seat.

The thyristor 1 is cooled by a water-cooled heat sink 5A. The cooling water is guided to each component in the thyristor module through the water inlet side pipe connection portion 7 of the cooling water pipe 6B, takes away the heat of each component, and is discharged from the drainage side pipe connection portion 8. Usually, a plurality of thyristor modules are used to form a thyristor valve. Although not shown here, cooling water is supplied to and discharged from each thyristor module in parallel.

Although various systems are used for the cooling system of the water-cooled thyristor module, the two system system will be described here. The cooling water is branched into a system of the water cooling heat sink 5A and a system of the anode reactor 4. The system of the water cooling heat sink 5A cools each thyristor 1 from the cooling water pipe 6B through the cooling water pipe connecting portion 9B. The other system is from the cooling water pipe 6B to the cooling water pipe connecting portion 9
After passing through A, the anode reactor 4 is cooled.

[0009]

By the way, in a conventional semiconductor module such as a thyristor module, a semiconductor stack is separately assembled and mounted on a module frame. Therefore, semiconductor stack constituent elements such as a stud and a pressing plate are required. Was there.

An object of the present invention is to provide a semiconductor module which can form a semiconductor stack without using studs, pressure plates, etc., which are components of the semiconductor stack.

[0011]

To achieve the above object, the present invention according to claim 1 provides a semiconductor stack having at least one semiconductor and a heat sink for cooling the semiconductor, and a peripheral circuit of the semiconductor. a pipe for supplying cooling medium to the heat sink, the semiconductor stack, the peripheral circuit, and the semiconductor module and a module frame supporting a pipe, the module
The semiconductor is provided between opposing members that form a frame.
Place the semiconductor of the stack, the heat sink, and the disc spring.
The semiconductor and the heat sink are pressed against each other.

With such a structure, it is possible to realize a semiconductor module which can form a semiconductor stack without using a pressing plate, a stud, a fixing nut or the like.

The present invention according to claim 2 is at least
One semiconductor and a heat sink to cool this semiconductor
A semiconductor stack having; a peripheral circuit of the semiconductor;
The piping for supplying the cooling medium to the heat sink and the half
Module for supporting the conductor stack, the peripheral circuit, and piping
In a semiconductor module equipped with a tool frame,
Between the opposing members that make up the module frame
Arrange the semiconductor and heat sink of the semiconductor stack
A member having characteristics as an elastic body in the facing member
Pressure contact the semiconductor and the heat sink using
It is characterized by that.

According to a third aspect of the present invention, in the semiconductor module according to the first or second aspect, a hollow member is used as a part of the member of the module frame, and the inside of the hollow member is a cooling medium. Is characterized in that

According to a fourth aspect of the present invention, in the semiconductor module according to the first aspect, the member of the module frame is an insulator .

According to a fifth aspect of the present invention, in the semiconductor module according to the fourth aspect, the peripheral circuit is directly attached to the module frame . According to a sixth aspect of the present invention, in the semiconductor module according to the fourth aspect, the module frame is provided with a notch portion for attaching a peripheral circuit, and the peripheral circuit is attached to the notch portion. To do.

According to a seventh aspect of the present invention, in the semiconductor module according to the first aspect, a racetrack-shaped insulating band is used as a member of the module frame,
The semiconductor stack is arranged inside the insulating band, and peripheral circuits are attached to the insulating band.

[0018]

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In the following drawings, the same reference numerals indicate the same or corresponding parts including the drawings showing the conventional example.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
The configuration of the thyristor module according to the embodiment of the present invention is shown in FIG.
Is a front view of the physical arrangement. In the drawings, some parts that are not necessary for explanation are omitted.

In FIG. 1, various components such as the thyristor 1 are mounted on a module frame 15 made of metal. Here, the thyristor 1, the water-cooled heat sink 5B for element cooling, and the disc spring 12 which is an adjusting element of the pressure contact force change due to thermal expansion and contraction constitute a thyristor stack in pressure contact, but the disc spring 12 is a module frame. It is configured by using a part of the 15 members.

The cooling water is a cooling water pipe 6 which is a cooling water mother pipe.
It is supplied to the water-cooled heat sink 5B and the anode reactor 4 from B, cools each element, and is then collected in the cooling water pipe 6A.

The resistor 2 and the capacitor 3 are attached to the module frame 15 via the insulator 20. As described above, in this embodiment, the module frame 15 is provided with the function of pressing the thyristor 1 and the water-cooled heat sink 5B to form a thyristor stack, and thus the pressing plates 11A and 11A as in the conventional example.
It is possible to form a pressure contact thyristor stack without using B or the stud 10.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, a member having elasticity such as a leaf spring 17 is used as a part of the metal module frame 16 of the thyristor module.

Also in this embodiment, a pressure contact thyristor stack can be constructed without using the pressing plates 11A and 11B and the studs 10 as in the conventional example, and the elasticity of the leaf springs 17 and the like can be obtained. By using the member having the module frame, the module frame can be a module frame which also has a function of a disc spring which is one of the constituent elements of the thyristor stack.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, a part of the metal module frame 18 of the thyristor module, that is, two opposing sides of the frame forming the rectangular outer frame of the module frame 18 as shown in FIG. In addition, for example, a hollow member such as a stainless pipe 19 is used.

Also in this embodiment, unlike the conventional example, a pressure contact thyristor stack can be constructed without using the pressing plates 11A and 11B, the studs 10 and the like, and the stainless pipe 19 and the like are hollow. By allowing cooling water to pass through the inside of the member, the module frame can be a module frame that also functions as a cooling water pipe.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, a module frame of a thyristor module, which is obtained by cutting out a part of the insulating plate 21, is used, and a thyristor stack is incorporated in the cutout portion 25 to form a thyristor stack integrated module frame. It is a thing.

Also in this embodiment, it is possible to construct a pressure contact thyristor stack without using the pressing plates 11A, 11B and the studs 10 unlike the conventional example.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIG. In the fifth embodiment, as in the fourth embodiment, a module frame in which a part of the insulating plate 21 is cut out is used.
A thyristor stack is incorporated in the cutout portion 25, and the resistor 2 and the capacitor 3 are directly attached to the insulating plate 21.

In general, a thyristor module, which is constructed by connecting a plurality of thyristors 1 in series using a module frame made of metal, reduces the insulation distance in the module, so that the middle of the thyristors 1 connected in series is reduced. The potential of the module frame is fixed to the potential. Therefore, the peripheral circuits such as the resistor 2 and the capacitor 3 need to be floated from the frame potential by using the insulator 20 and the like as shown in the first to third embodiments.

However, according to the fifth embodiment, since the module frame itself is an insulator, an insulator for floating the peripheral circuit is unnecessary. This makes it possible to form a module frame in which the thyristor stack is integrated and the peripheral circuit is directly attached.

(Sixth Embodiment) Next, a sixth embodiment of the present invention will be described with reference to FIG. In the sixth embodiment, as in the fourth and fifth embodiments, the module frame is obtained by cutting out a part of the insulating plate 22. In the notch parts 25, 26, 27,
At the same time as incorporating the thyristor stack, resistor 2,
Peripheral circuits such as the capacitor 3 and the anode reactor 4 are also incorporated by using the insulating supports 23A to 23C.
As a result, the height of the thyristor module can be suppressed and the creepage distance between the peripheral circuits can be increased.

(Seventh Embodiment) Next, a seventh embodiment of the present invention will be described with reference to FIG. In the thyristor module of the seventh embodiment, a racetrack-shaped insulating band 24 made of FRP (glass fiber reinforced plastic) or the like is used as a module frame.

A thyristor stack composed of a thyristor 1, a water-cooled heat sink 5A, a disc spring 12 and the like is arranged inside the insulating band 24, and a resistor 2, a capacitor 3, and an anode, which are peripheral circuits, are arranged outside the insulating band 24. By disposing the reactor 4 and the cooling water pipes 6A and 6B, a thyristor stack integrated module frame can be obtained.

[0035]

As described above, according to the present invention, the semiconductor stack in the semiconductor module used for converting large-capacity AC power and DC power does not require components such as studs and pressing plates. The semiconductor module can be configured.

[Brief description of drawings]

FIG. 1 is a plan view and a front view showing a configuration of a thyristor module according to a first embodiment of the present invention.

FIG. 2 is a plan view and a front view showing the configuration of a thyristor module according to a second embodiment of the present invention.

FIG. 3 is a plan view and a front view showing the configuration of a thyristor module according to a third embodiment of the present invention.

FIG. 4 is a plan view and a front view showing the configuration of a thyristor module according to a fourth embodiment of the present invention.

FIG. 5 is a plan view and a front view showing a configuration of a thyristor module according to a fifth embodiment of the present invention.

6A and 6B are a plan view and a front view showing the configuration of a thyristor module according to a sixth embodiment of the present invention.

FIG. 7 is a plan view and a front view showing the configuration of a thyristor module according to a seventh embodiment of the present invention.

FIG. 8 is a circuit diagram of a semiconductor module

FIG. 9 is a diagram showing an electric circuit and a cooling system of a conventional water-cooled semiconductor module.

[Explanation of symbols]

1 ... Thyristor 2 ... Resistor 3 ... Capacitor 4 ... Anode reactor 5A, 5B ... Water-cooled heat sink 6A, 6B ... Cooling water piping 7 ... Water side piping connection 8 ... Drain side pipe connection 9A, 9B ... Cooling water pipe connection 10 ... Stud 11A, 11B ... Pressing plate 12 ... Disc spring 13 ... Nut 14, 15, 16, 18 ... Module frame 17 ... Leaf spring 19 ... Stainless steel pipe 20 ... Insulator 21, 22 ... Insulation plate 23A-23C ... Insulation support 24 ... Insulation band 25, 26, 27 ... Notch 31 ... Insulator

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H02M 7/04

Claims (7)

(57) [Claims] 1. A semiconductor stack having at least one semiconductor and a heat sink for cooling the semiconductor, a peripheral circuit of the semiconductor, piping for supplying a cooling medium to the heat sink, the semiconductor stack, the peripheral circuit,
And a module frame for supporting piping, the module frame being configured.
And the semiconductor of the semiconductor stack between opposing members
A heat sink and a disc spring are arranged so that the semiconductor and the front
A semiconductor module characterized in that a heat sink is pressure-welded . 2. At least one semiconductor and this semiconductor
A semiconductor stack having a heat sink for cooling;
Cooling medium is placed on the semiconductor peripheral circuit and the heat sink.
Supply piping, the semiconductor stack, the peripheral circuit,
And a semiconductor frame with a module frame supporting the piping
In the body module, the module frame is configured
And the semiconductor of the semiconductor stack between opposing members
A heat sink is arranged, and an elastic body is provided on the facing member.
Using the member having the above characteristics, the semiconductor and the
A semiconductor module characterized by pressing a heat sink
The 3. Using the hollow member to a part of members of the module frame, claim 1, characterized in that the interior of the hollow member as the cooling medium passes through or
Or the semiconductor module described in 2 . 4. A member of the module frame is made of an insulator.
The semiconductor module according to claim 1, characterized in that the. 5. The semiconductor module according to claim 4, wherein the peripheral circuit is directly attached to the module frame . 6. The semiconductor module according to claim 4, wherein the module frame is provided with a notch for attaching the peripheral circuit, and the peripheral circuit is attached to the notch. 7. A racetrack-shaped insulating band is used as a member of the module frame, the semiconductor stack is arranged inside the insulating band, and the peripheral circuit is attached to the insulating band. The semiconductor module according to claim 1.