JP3498461B2 - Electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvement of an electronic component having a plurality of protruding electrodes.

[0002]

2. Description of the Related Art Electronic components include, for example, components having a so-called ball grid array (BGA) structure, bumped resistors or capacitors, and the like. The semiconductor package of this kind of ball grid array, or the bumps on the back surface of the resistor or capacitor with bumps are connected to the land of the circuit board by soldering.
FIG. 13 shows a conventionally used electronic component 1 having a ball grid array structure. The electronic component 1 has a plurality of ball-shaped protruding electrodes 11 arranged in a grid pattern on the back surface side thereof. These ball-shaped protruding electrodes 11 are ICs
It is a portion that is electrically connected to the circuit board in order to extract a large number of signals from the chip 1a. The protruding electrodes 11 of the semiconductor package having the ball grid array structure of FIG.
Are formed at a pitch of 0.5 mm, for example, about 200 pieces. Further, FIG. 14 shows a resistance chip 2 with bumps. The resistance chip 2 has two protruding electrodes 11, 11 as bumps, for example.

[0003]

[SUMMARY OF THE INVENTION However, in the child part electrodeposition having a ball grid array semiconductor package as described above has the following problems. FIG. 15 shows that the electronic component 1 and the circuit board 3 of FIG.
Shows the state of being electrically connected. It is known that stress is applied to the vicinity of the protruding electrodes 11 between the electronic component 1 and the circuit board 3 having such a structure, and 200 protruding electrodes 11 are provided at the 0.5 mm pitch as described above. In some cases, the electrical connection life is about 5 years. Further, in FIG. 15, it has been proved by the inventor's test that the protruding electrodes 11 to which the largest stress is applied are the outermost electrode and the innermost electrode. Therefore, if microcracks are formed in the outermost protruding electrode 11 and the innermost protruding electrode 11, a problem will occur in the electrical connection between the electronic component 1 and the circuit board 3.

Further, as shown in FIG. 16, a conventional electronic component 1
Each of the protruding electrodes 11 has the same size and the same shape. Therefore, as shown in FIG. 17, when the camera recognizes the back side of the electronic component 1, the following problems occur. That is, depending on the recognition area of the camera, for example, as shown in FIG.
There is no problem when recognizing the entire area AR where 1 can be recognized, but when the camera can recognize only a partial area AR1 of the area AR as shown in FIG. 17B, as shown in FIG. Even when the position of the camera is displaced by one protrusion electrode 11 or by an integral multiple thereof, the protrusion electrodes 11 having the same size and the same shape are recognized. Therefore, there is a problem that the camera cannot recognize the correct position on the back surface side of the electronic component 1. That is, even if the area AR1 is at the correct recognition position as shown in FIG. 18A, if the camera is positioned one pitch of the protruding electrode 11 apart,
The protruding electrode 11 having the same shape and the same size in the adjacent area AR2
Will be mistakenly recognized.

Therefore, the present invention has been made to solve the above problems, and ensures the electrical connection state of a plurality of projecting electrodes, and moreover, it is easy to determine the direction of electronic components and align electronic components. The purpose is to provide an electronic component that can be performed.

[0006]

The electronic component of the present invention is based on
A plurality of protruding electrodes for electrically connecting to the wiring part of the board and
Electrical connection between the bump electrode and the wiring part of this board
For electronic components that have a protrusion for reinforcement to reinforce
The first reinforcing protrusion of the reinforcing protrusions is
It is located outside of the multiple protruding electrodes and
The second reinforcing protrusion of the protrusions is the plurality of protrusion electrodes.
It is located inside the pole.

According to the present invention, the first reinforcing protrusion is
Located outside the multiple protruding electrodes in electronic components,
In addition, the second reinforcing projection is used in the electronic component.
If it is located inside the bump electrode, the bump of the electronic component
If the electrode and the wiring part of the board are electrically connected
The outer reinforcement protrusions and the inner reinforcement protrusions
It is able to withstand the stress generated. This allows
Check the electrical connection between the protruding electrode and the wiring of the board for a long time.
Can be kept. Further, by forming the reinforcing protrusion in a shape different from that of, for example, the plurality of protruding electrodes, it is possible to reliably distinguish the plurality of electrically connecting protruding electrodes from the reinforcing protrusion. And at least one of the reinforcing protrusions
If the size is different from the plurality of protruding electrodes, the orientation of the electronic component can be surely recognized.

[0008]

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiment described below is a preferred specific example of the present invention,
Although various technically preferable limitations are given, the scope of the present invention is not limited to these forms unless otherwise specified in the description below.

FIG. 1 shows an example of an electronic component and a circuit board 30 on which the electronic component 20 is mounted.
FIG. 2 shows the rear surface 21 side of the electronic component 20.
A large number of protruding electrodes 11 are arranged in a predetermined pattern on the back surface 21 of the electronic component. These protruding electrodes 11 are
The electrode terminals are arranged in a grid pattern so as to have a predetermined pitch, and preferably have a ball shape. Therefore, the electronic component 20 has a so-called ball grid array (B
It is a (GA) type semiconductor package. Electronic component 2 of FIG.
On the substrate 23 of 0, a predetermined semiconductor element 2
4 is packaged by overcoating with a sealing member 25 such as epoxy resin. Each signal line of the semiconductor element 24 is connected to the substrate 23.
2 is electrically connected to each protruding electrode 11 in FIG.

In FIG. 2, on the back surface 21 of the electronic component 20, for example, four reinforcing protrusions (also referred to as reinforcing lands) 40 are provided outside the many protruding electrodes 11. The reinforcing protrusions 40 are arranged at the four corners of the back surface 21, for example. The protrusion 40 for reinforcement is a solder bump like the protrusion electrode 11, but is spherical or hemispherical, and its diameter L1 is set larger than the diameter L2 of the protrusion electrode 11. As a result, the user can reliably distinguish between the reinforcing protrusion 40 and the protrusion electrode 11. In the embodiment of FIG. 2, the four reinforcing protrusions 40 are thus set at the four corners of the back surface 21, that is, outside the protrusion electrodes 11.

FIG. 3 shows the protruding electrode 11 of the electronic component 20.
FIG. 6 is a diagram showing a state in which the reinforcing protrusions 40 are electrically connected to the circuit board 30. Reinforcing protrusion 40
Irrespective of the electrical connection between the electronic component 20 and the circuit board 30, each protruding electrode 11 is connected to the electronic component 20 and the circuit board 30.
Plays the role of electrical connection between the wiring parts.
Since the reinforcing protrusions 40 are located at the four corners of the back surface 21, the stress applied to each of the protruding electrodes 11 is applied to the outermost protrusions, so that the reinforcing protrusions 40 play a role of withstanding the stress. Therefore, the protruding electrode 1 involved in the electrical connection
1 is less likely to be stressed, and the occurrence of microcracks or the like on the protruding electrode 11 is eliminated. Therefore, the electronic component 20
The electrical connection between the protruding electrode 11 and the wiring portion of the circuit board 30 can be ensured for a long period of time.

FIG. 4 differs from FIG. 2 in that
0 is 4 on the innermost side of the region where the protruding electrode 11 is present.
Are arranged. That is , as shown in FIG. 5, in the state where the wiring parts of the electronic component 120 and the circuit board 30 are electrically connected to each other by the protruding electrodes 11, the stress is most applied to the reinforcing protrusions 40 in the innermost region. since such, results in the projection 40 for the reinforcement charge of stress, microcracks or the like does not occur in the other projection electrodes 11. Therefore, electrical connection between the electronic component 120, the protruding electrode 11 and the wiring portion of the circuit board 30 can be ensured for a long period of time.

FIG. 6 shows an example in which four reinforcing protrusions 40 are arranged on both the outermost side and the innermost side of the array pattern portion of the protruding electrode 11 for electrical connection. By doing so, as shown in FIG. 7, the electronic component 220 is
When electrically connected to the wiring portion of the circuit board 30 via the large number of protruding electrodes 11, the reinforcing protrusion 40 bears the stress applied to the outermost and innermost portions. Therefore, microcracks due to stress do not occur in a large number of protruding electrodes 11 for electrical connection, so that electrical connection between the protruding electrodes 11 of the electronic component 220 and the wiring portion of the circuit board 30 should be ensured for a long time. You can

As described above, the electronic components 20, 120, 22
As shown by 0, with respect to the outermost position, the innermost position, or both the outermost position and the innermost position of the pattern portion in which the bump electrode 11 is formed,
By providing the protrusion 40 for reinforcement, the protrusion 4 for reinforcement is provided.
Since 0 can bear the stress, no microcracks are formed in the many protruding electrodes 11 required for electrical connection, and there is no inconvenience in electrical connection between the circuit board 30 and the electronic components 20, 120, 220. . Moreover, this protrusion 4 for reinforcement
As the value of 0 is larger, the strength for supporting the stress is increased, and the electrical connection state between the electronic component and the circuit board can be secured for a longer period.

For example, by providing the reinforcing protrusion, the life of electrical connection between the electronic component and the circuit board is about 2.
It grows about 5 times. This electronic component 20, 120, 220
Is, for example, 200 protruding electrodes 1 with a pitch of 0.5 mm.
1 of the ball grid array type.
In this case, the number of years that the electrical connection can be secured, that is, the so-called connection life can be secured as long as 12 years. It should be noted that the determination as to whether the reinforcing protrusion is provided at the outermost or innermost circumference, or both the outermost circumference and the innermost circumference, is appropriately selected in consideration of the required life of the electronic component.

Next, please refer to FIG. 8 and FIG. 8 and 9
Shows the back surface 321 side of the electronic component 320. On the back surface 321 of the electronic component 320, a plurality of protruding electrodes 11
Are formed in a predetermined pattern with a predetermined pitch. Then, at the four corners of the back surface 321, the above-described two types of reinforcing protrusions 40 and 41 are formed. In FIG. 8, the reinforcing protrusion 41 has a square shape, but the other reinforcing protrusions 40 have a circular shape. By changing the shapes of the reinforcing protrusions 41 and 40 in this manner, the user can surely know the orientation of the electronic component 320. In this case, since the shape of one reinforcing protrusion 41 is different from the shape of the other reinforcing protrusion 40, it is determined that this electronic component 320 is, for example, one pin type electronic component 320. it can.

The electronic component 420 shown in FIG. 9 is provided with four reinforcing protrusions 41. These reinforcing protrusions 41 are
It is arranged at four corners of the back surface 421 of the electronic component 420.
The reinforcing protrusion 41 is formed in a square shape, which is different from the connecting protrusion electrode 11 having a circular shape. By doing so, when recognizing an image of the rear surface 421 of the electronic component 420 using a camera, for example, only one reinforcing projection 41 or one connecting projection electrode 11 is recognized depending on the magnification of the camera. If you cannot (Fig. 9
(A) or FIG. 9 (b)), but even in this case, since the shapes of the reinforcing projection 41 and the connecting projection electrode 11 are different, the reinforcing projection 41 and the connecting projection are different. Electrode 1
There is no fear of erroneously recognizing 1.

That is, in FIG. 8, if the camera recognizes the area AR3 (see FIG. 9A) , it is determined that the image can be correctly recognized, and if the camera recognizes the area AR4.
(See FIG. 9B) It can be determined that the image recognition is performed with a pitch shift.

10 and 11 show the upper surface 522 of the electronic component 520. Positioning protrusions 91 are arranged on the circuit board 30 side at positions corresponding to the four corners of the back surface 521. In order to position the electronic component 520, the four projections 91 for positioning project the protruding portion 9 so as to project outside the package 530 of the electronic component 520.
1a. Accordingly, the protruding electrode 11 of the electronic component 520 can be positioned by the four positioning protrusions 91. Therefore, each protruding electrode 11 for connection of the electronic component 520 can be reliably positioned and connected at a predetermined position of the wiring portion 30a on the circuit board 30 side.

By the way, in the above-described embodiment, the so-called ball grid array type electronic component is described as an example, but the present invention is not limited to this, and an electronic device such as a bumped resistor or capacitor as shown in FIG. 14 is used. It can also be applied to parts. Further, the present invention is not limited to the semiconductor package IC type electronic component, and the same effects can be exerted on other types of electronic components such as flip chips. In the above-described embodiment, the reinforcing protrusions (reinforcing lands) are provided at the corner portions of the electronic component, but the reinforcing protrusions are not limited to this portion and are provided at the central portions of the sides of the electronic component. Alternatively, even when it is provided in both or one of the corner portion and the central portion, the life of electrical connection between the protruding electrode of the electronic component and the wiring portion of the circuit board can be extended.

FIG. 12 shows a procedure for mounting an electronic component on a wiring portion of a circuit board when a protruding electrode and a reinforcing protrusion are provided on the back surface of the electronic component. The circuit board 30 first recognizes the position where the electronic component 20 (120, 220, 320, 420, 520) on the circuit board 30 is positioned. And electronic component 20
By recognizing the back surface of (120, 220, 320, 420, 520), what kind of pattern of the protruding electrode 11 for connection this electronic component has and what kind of reinforcing protrusion it has Recognize. The electronic component is the circuit board 3
Mounted at a predetermined position of 0, the protruding electrodes for connection are properly electrically connected to a predetermined wiring portion of the circuit board 30 by soldering. In this case, the reinforcing protrusion is not used for electrical connection between the electronic component and the circuit board, and bears the stress generated between the circuit board and the electronic component.

In the embodiment of the present invention, the reinforcing protrusions electrically reinforce the protruding electrodes and the wiring portion of the substrate,
The connection life can be extended. In addition, the protrusion for reinforcement is
For example, by making the shape different from that of the plurality of protrusion electrodes, it is possible to reliably distinguish between the plurality of protrusion electrodes for electrical connection and the protrusion for reinforcement. If at least one of the reinforcing protrusions has a size different from that of the plurality of protrusion electrodes, the orientation of the electronic component can be reliably recognized. When at least one of the protrusions for reinforcement protrudes laterally from the outer diameter portion of the electronic component, when the electronic component is mounted on the board, it is used as a marker for the orientation of the electronic component and the alignment for mounting. can do.

Since the reinforcing protrusion is located outside the plurality of protruding electrodes in the electronic component, the reinforcing protrusion is electrically connected to the protruding electrode of the electronic component and the wiring portion of the substrate. The protrusion can withstand the stress generated. Therefore, the electrical connection state between the protruding electrode and the wiring portion of the substrate can be secured for a long period of time. Similarly, the reinforcing protrusions are located inside the multiple protruding electrodes in the electronic component, so that the reinforcing protrusions are generated when the protruding electrodes are electrically connected to the wiring part of the substrate. Can withstand the stresses that occur.

[0025]

As described above, according to the present invention,
Located on the outside and inside of the area where multiple bump electrodes are present.
Due to the reinforcing protrusions, the electrical connection state of the plurality of protrusion electrodes can be ensured for a long period of time , and moreover, the orientation of the electronic component can be determined and the positioning of the electronic component can be easily performed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which electronic components are mounted on a circuit board.

FIG. 2 is a view showing an arrangement example of a protruding electrode and a reinforcing protrusion provided on the back surface side of the electronic component of FIG.

FIG. 3 is a diagram showing a state in which an electronic component and a circuit board are connected using the protruding electrode and the reinforcing protrusion of FIG.

FIG. 4 is a diagram showing another example of arrangement of protruding electrodes and reinforcing protrusions on the back surface side of an electronic component.

5 is a diagram showing the connection between the electronic component and the circuit board in FIG.

FIG. 6 is a diagram showing another arrangement pattern of connection projection electrodes and reinforcement projections in the electronic component of the present invention.

FIG. 7 is a diagram showing an example of connection between the electronic component of FIG. 6 and a circuit board.

FIG. 8 is a diagram showing another arrangement pattern of reinforcing protrusions and connecting protrusion electrodes of an electronic component.

FIG. 9 is a diagram showing an array pattern of yet another reinforcing projection and connection projection electrode of the electronic component.

FIG. 10 is a perspective view showing a state in which electronic components are positioned and mounted on a circuit board.

11 is a plan view of the electronic component and the circuit board of FIG.

FIG. 12 is a diagram showing an example of a procedure for mounting an electronic component on a circuit board when the electronic component has a protruding electrode for connection on the back surface side.

FIG. 13 is a side view showing an example of a conventional electronic component having a ball grid array structure.

FIG. 14 is a perspective view showing a normal bumped resistor.

FIG. 15 is a view showing a state in which a conventional electronic component is connected to a circuit board via a connecting projection electrode.

FIG. 16 is a diagram showing an array pattern of protruding electrodes of a conventional electronic component.

FIG. 17 is a view showing a state in which a camera recognizes a protruding electrode for connection of a conventional electronic component.

18 is a diagram showing an example of a recognition operation of the back surface of the electronic component by the camera in FIG.

[Explanation of symbols] 11 Projection electrode for connection 20 electronic components 30 circuit board (board) 40 Reinforcing protrusion

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-1-238148 (JP, A) JP-A-58-53837 (JP, A) JP-A-7-183426 (JP, A) JP-A-8- 70062 (JP, A) Actual Kaihei 4-99537 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 311 H01L 23/12

Claims (3)

(57) [Claims] 1. A plurality of protruding electrodes for electrically connecting to a wiring portion of a substrate, and a plurality of protruding electrodes and the wiring portion of the substrate.
In an electronic component including a reinforcing protrusion for reinforcing an electrically connected state, a first reinforcing protrusion of the reinforcing protrusions is
The reinforcing protrusions are located outside the plurality of protrusion electrodes.
The second reinforcing protrusion of the
An electronic component characterized by being located inside . 2. The electronic component according to claim 1, wherein the protruding electrode has a ball grid array structure.
Electronic components. 3. The electronic component according to claim 1, wherein the reinforcing projections are arranged on a surface of the board having a wiring portion of the board.
Electronic parts characterized by being placed.