JP3496797B2 - Vibration plate for inkjet head and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head diaphragm and a method for manufacturing the same.

[0002]

2. Description of the Related Art Since an ink jet recording apparatus has almost no vibration or noise during recording and it is particularly easy to color,
In addition to printers that output data from digital processing devices such as computers, they have also been used in facsimiles, copiers, and the like. As an inkjet head used in such an inkjet recording apparatus, a plurality of nozzles, a pressurized liquid chamber corresponding to each nozzle, and an electromechanical conversion element such as a piezoelectric element that pressurizes the pressurized liquid chamber via a diaphragm. There is a so-called piezo actuator system in which an electromechanical conversion element is driven according to a recording signal to pressurize a required pressurized liquid chamber to eject an ink droplet from a nozzle.

A diaphragm for such an ink jet head and a method for manufacturing the same are disclosed in, for example, Japanese Patent Laid-Open No. 6-143.
As disclosed in Japanese Laid-Open Patent Publication No. 573/573, a diaphragm having a diaphragm portion and island-shaped convex portions is formed by using a photolithography technique (photolithography) and Ni plating / electroforming method. When a diaphragm including a first Ni layer and a second Ni layer is formed by using a photoengraving technique (photolithography) and a Ni plating / electroforming method as described in the publication, the first Ni layer has a gloss. There is known a material which is made of matte Ni without addition of an agent.

[0004]

However, when the diaphragm is manufactured by the above-described photoengraving technique (photolithography) and the photoelectroforming method which is the Ni plating / electroforming method, the repulsive force of the diaphragm portion is insufficient. Therefore, the drop speed is not sufficient and high-speed printing cannot be supported. Also, in order to reduce crosstalk (a state where the influence of the pressurization of one pressurizing liquid chamber affects the other pressurizing liquid chamber), it is necessary to make the diaphragm part thinner. There are many pinholes, and the yield is poor.

On the other hand, in the construction method and the diaphragm, since the first layer is matte Ni plating, the hardness is insufficient, the repulsive force of the diaphragm is insufficient, and the drop speed is not sufficient, which corresponds to high-speed printing. Can not do it. The second layer also has a matte Ni
Since the plating is used, the diaphragm is easily bent and deformed when the diaphragm is separated from the electroformed support substrate, resulting in poor yield.

The present invention has been made in view of the above points, and an object of the present invention is to provide a diaphragm capable of coping with high-speed printing.

[0007]

In order to solve the above-mentioned problems, an ink jet head diaphragm according to a first aspect of the present invention is a diaphragm portion which is deformed by the displacement of an electromechanical conversion element and an independent member corresponding to the electromechanical conversion element. In a diaphragm for an ink jet head integrally formed with island-shaped convex portions, the diaphragm portion has a Vickers hardness of Hv300 to Hv12.
The structure is made of a plated metal within the range of 00.

According to a second aspect of the present invention, there is provided an ink jet head diaphragm according to the first aspect, wherein the diaphragm portion is partially annealed.

A diaphragm for an inkjet head according to a third aspect of the present invention is a diaphragm for an inkjet head in which a diaphragm portion that is deformed by displacement of an electromechanical conversion element and an elastic body portion that absorbs pressure in a liquid chamber are integrally formed. The diaphragm part and the elastic part have a Vickers hardness of Hv300.
The structure is made of the above-mentioned high hardness metal.

According to a fourth aspect of the invention, there is provided an ink jet head diaphragm according to the third aspect, wherein the diaphragm portion and the elastic body portion are made of a metal having a Vickers hardness of Hv300 to 1200. It was configured.

According to a fifth aspect of the invention, there is provided an ink jet head diaphragm according to the third or fourth aspect, wherein the diaphragm portion and the elastic body portion are partially annealed.

A diaphragm for an inkjet head according to a sixth aspect of the present invention is a diaphragm for an inkjet head, wherein a diaphragm portion that is deformed by displacement of an electromechanical conversion element and an elastic body portion that absorbs pressure in a liquid chamber are integrally formed. The diaphragm portion is made of a high-hardness metal having a Vickers hardness of Hv300 or more, and the elastic body portion has a Vickers hardness of Hv.
The structure is made of a low hardness metal of less than 300 .

An ink jet head diaphragm according to a seventh aspect is the same as the ink jet head diaphragm according to the sixth aspect, wherein the diaphragm portion has a Vickers hardness of Hv30.
The elastic body portion is formed of a metal within a range of 0 to 1200, and the elastic body portion is formed of a metal within a range of Hv150 to 250 in Vickers hardness.

An ink jet head diaphragm according to an eighth aspect is the ink jet head diaphragm according to any one of the first to seventh aspects, wherein the diaphragm portion is formed by nickel alloy plating or brightener addition plating. And

A diaphragm for an inkjet head according to a ninth aspect is the diaphragm for an inkjet head according to the sixth or seventh aspect, wherein the diaphragm portion is formed by nickel alloy plating or brightener-added plating, and the elastic body portion is formed. The structure is formed by additive-free nickel plating.

An ink jet head diaphragm according to a tenth aspect is the same as the ink jet head diaphragm according to the eighth or ninth aspect, wherein the nickel alloy plating is Ni-W.
The alloy plating was any one of Ni-Co, Ni-Mn, Ni-Fe, Ni-P, and Ni-B.

A method for manufacturing a diaphragm for an inkjet head according to claim 11 is the method for manufacturing a diaphragm for an inkjet head according to any one of claims 1 to 10, wherein a temperature of 200 ° C. to 300 ° C. is formed after the diaphragm is formed. The heat treatment is performed for 1 to 2 hours.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is an exploded perspective view of an inkjet head to which the present invention is applied, FIG. 2 is an enlarged cross-sectional view of a main part of the head in a direction orthogonal to a channel direction (nozzle arrangement direction), and FIG. 3 is a main part of the head in a channel direction. It is an expanded sectional view.

This ink jet head comprises a drive unit 1, a liquid chamber unit 2 and a head cover 3. The drive unit 1 includes a plurality of laminated piezoelectric elements 12 which are energy generating elements arranged in two rows and bonded on a ceramic substrate, for example, an insulating substrate 11 such as barium titanate, alumina, or forsterite. , A frame member (support) 13 made of resin, ceramics, or the like, which surrounds each of the two rows of the piezoelectric elements 12, and the adhesive 1
It is joined by 4.

The plurality of piezoelectric elements 12 are provided between the driving elements 17 and 17 and piezoelectric elements 17 (which are referred to as "driving portions") 17 to which a driving pulse is applied to make the ink droplets and fly. Piezoelectric elements (which are referred to as “non-driving parts”) 18, 18 which are positioned and serve as liquid chamber column members that simply fix the liquid chamber unit 2 to the substrate 11 without being given a drive pulse.
... and are composed alternately.

As the piezoelectric element 12, a laminated piezoelectric element having 10 layers or more is used. This laminated piezoelectric element has a thickness of 10 to 50 μm / 1 as shown in FIG.
Layer lead zirconate titanate (PZT) 20 and a thickness of several μ
Although the internal electrodes 21 made of silver / palladium (AgPd) of m / 1 layer are alternately laminated, the material used as the piezoelectric element is not limited to the above, and other electromechanical conversion elements should be used. You can also

The inner electrodes 21 of the respective piezoelectric elements 12 are left and right end surface electrodes 22 and 23 made of AgPd every other layer (the opposing surface sides of the two piezoelectric element rows are the end surface electrodes 22 and the non-opposing surface sides are the end surface electrodes). 23)). On the other hand, on the substrate 11, as shown in FIG.
Each pattern of the common electrode 24 and the individual electrode 25 is provided by Au plating, AgPt paste printing, AgPd paste printing, or the like.

The facing end electrodes 22 of the piezoelectric elements 12 in each row are connected to the common electrode 24 via a conductive adhesive 26.
On the other hand, the non-opposing end face electrodes 23 of the piezoelectric elements 12 in each column are also connected to the individual electrodes 25 via the conductive adhesive 26. Thereby, the drive unit 17
An electric field is generated in the stacking direction by applying a drive voltage to the driving unit 17, and the driving unit 17 is displaced by the expansion (d33) in the stacking direction.
Directional displacement) occurs. The common electrode 24 has holes 13a formed in the frame member 13 as shown in FIG.
By filling the inside with a conductive adhesive 26, the pattern connected to each piezoelectric element is electrically connected.

On the other hand, the liquid chamber unit 2 includes a diaphragm 31 made of a laminated body of metal thin films and a dry film resist (D).
A liquid chamber partition wall member 32 having a two-layer structure formed of a photosensitive resin layer made of FR) and a nozzle plate 33 made of metal, resin or the like are sequentially laminated and formed by heat fusion. By these respective members, one piezoelectric element 12 (driving unit 1
7), a diaphragm portion 34 corresponding to the one piezoelectric element 12, a pressurized liquid chamber 35 that is pressurized through each diaphragm portion 34, and a pressurized liquid chamber 35 located on both sides of the pressurized liquid chamber 35. A common liquid chamber 36 for introducing ink to be supplied to the liquid chamber 35,
36, the ink supply paths 37, 37 that connect the pressurized liquid chamber 35 and the common liquid chambers 36, 36, and the nozzle 38 that communicates with the pressurized liquid chamber 35 to form one channel. Two columns are provided.

The diaphragm 31 includes the diaphragm portion 34 corresponding to the driving portion 17, an island-shaped convex portion 40 integrally formed in the central portion of the diaphragm portion 34 for joining with the driving portion 17, and a non-driving portion. A beam 41 joined to the portion 18 and a base 42 joined to the frame member 13 and an elastic body portion (hereinafter referred to as “damper portion”) 43 that absorbs pressure corresponding to the common liquid chamber 36 are formed.

The liquid chamber partition member 32 is formed by applying a dry film resist on the vibrating plate 31 side in advance, exposing it using a required mask, and developing it to form a predetermined liquid chamber pattern.
The photosensitive resin layer 45 and the second photosensitive resin layer 46 having a predetermined liquid chamber pattern formed by applying a dry film resist to the nozzle plate 33 side in advance and exposing using a required mask are developed. Joined by crimping.

The nozzle plate 33 has a large number of nozzles 38, which are fine ejection openings for ejecting ink droplets. The internal shape (inner shape) of this nozzle 38 is
It is formed in a substantially columnar shape (or a substantially truncated cone shape). The diameter of the nozzle 38 is about 25 to 35 μm on the ink droplet outlet side.

The ink ejection surface (nozzle surface side) of the nozzle plate 33 is a water repellent surface 47 which has been subjected to a water repellent surface treatment as shown in FIG. For example, PTF
Ink physical properties such as E-Ni eutectoid plating, electrodeposition coating of fluororesin, vapor-deposited fluororesin (for example, fluorinated pitch), and baking after solvent coating of silicone resin / fluorine resin By providing a water-repellent treatment film selected in accordance with the above, the drop shape of ink and the flying characteristics are stabilized, and high quality image quality can be obtained. The peripheral edge of the nozzle plate 33 is a non-water repellent surface 48 on which the water repellent film is not formed.

These drive unit 1 and liquid chamber unit 2
After separately processing and assembling, the vibration plate 31 of the liquid chamber unit 2 and the piezoelectric element 12 and the frame member 13 of the drive unit 1 are bonded with the adhesive 49.

Then, the substrate 11 is supported and held on a spacer member (head holder) 50 which is a head supporting member, and the head driving I arranged in the spacer member 50 is held.
The PCB substrate having C and the like and the electrodes 24 and 25 connected to the piezoelectric elements 12 (driving unit 17) of the driving unit 1 are F
It is connected via PC cables 51, 51.

Further, the nozzle cover (head cover) 3
Is formed in a box shape that covers the peripheral edge of the nozzle plate 33 and the side surface of the head. An opening is formed corresponding to the water-repellent surface 47 of the nozzle plate 33 and left on the peripheral edge of the nozzle plate 33. The non-water repellent treated surface 48 is adhesively bonded with an adhesive. Further, in order to supply ink from an ink cartridge (not shown) to the liquid chamber, the ink jet head is provided with ink supply holes 52 in the spacer member 50, the substrate 11, the frame member 13 and the vibration plate 31, respectively.
~ 55 are provided.

In the thus constructed ink jet head, when a drive waveform (pulse voltage of 10 to 50 V) is applied to the drive unit 17 according to a recording signal, displacement in the stacking direction occurs in the drive unit 17, Diaphragm 31
The pressurized liquid chamber 35 is pressurized through the diaphragm portion 34 and the pressure rises, and ink droplets are ejected from the nozzle 38. At this time, ink flows also in the direction of the ink supply passages 37, 37 communicating from the pressurized liquid chamber 35 to the common liquid chamber 36. However, by narrowing the cross-sectional area of the ink supply passages 37, 37, the fluid resistance portion is formed. To reduce the flow of ink to the common liquid chambers 36, 36 and prevent the ink ejection efficiency from decreasing.

With the completion of the ink droplet ejection, the ink pressure in the pressurized liquid chamber 35 decreases, and a negative pressure is generated in the pressurized liquid chamber 34 due to the inertia of the ink flow and the discharge process of the driving pulse. And shift to the ink filling process. At this time, the ink supplied from the ink tank flows into the common liquid chambers 36, 36, and the ink supply paths 37, 3 from the common liquid chambers 36, 36.
The liquid is filled into the pressurized liquid chamber 35 via 7. Then, the vibration of the ink meniscus surface near the outlet of the nozzle 38 is attenuated,
When the ink is returned to the vicinity of the outlet of the nozzle 38 by the surface tension (refill) and reaches a stable state, the next ink droplet ejection operation is started.

Next, the diaphragm according to the present invention and the manufacturing method thereof will be described with reference to FIG. In addition, in the following, an example in which the nozzle row of the diaphragm is one row will be described for ease of explanation. First, FIG. 4 is a perspective view illustrating a first embodiment of the diaphragm according to the present invention. In the first embodiment, the diaphragm 31 is integrally formed with the diaphragm portion 34 that is deformed by the displacement of the electromechanical transducer and the independent island-shaped convex portion 40 corresponding to the electromechanical transducer, as described above. The diaphragm portion 34 is formed of a plated metal having a Vickers hardness of Hv 300 to 1200.

In this case, if the hardness of the diaphragm portion 34 is less than Hv300 in Vickers hardness, a high repulsion force cannot be obtained and high-speed printing cannot be performed, and if the Vickers hardness exceeds Hv1200, the hardness becomes high. It becomes too repulsive. By setting the hardness of the diaphragm portion 34 in the range of Hv300 to 1200 in Vickers hardness,
High repulsive force is obtained, ink droplet speed and dot position accuracy are improved, high-speed printing is possible, and low voltage driving (high efficiency driving) is possible.

The diaphragm portion 34 can be provided with a required hardness by, for example, nickel-based alloy plating or brightener-added nickel plating (high-hardness nickel simple substance plating containing an additive). The nickel-based alloy plating is Ni-W, Ni-Co, Ni-Mn, Ni-Fe,
Either Ni-P or Ni-B alloy plating can be used. The required hardness can be easily obtained by using these platings, and the nickel alloy plating and the additive are used in combination to obtain a Vickers hardness of Hv 400 to 1
There can be 200 levels.

Next, FIGS. 5 and 6 are perspective views for explaining the second and third embodiments of the diaphragm according to the present invention. In these second and third embodiments, the diaphragm 31 includes the diaphragm portion 34 that is deformed by the displacement of the electromechanical conversion element, and the independent island-shaped convex portion 40 and the damper portion 4 corresponding to the electromechanical conversion element.
3a and 43b are integrally formed. And the second
In the embodiment, as shown in FIG.
4 is made of a high hardness metal, and the damper portion 43a is also made of a high hardness metal. On the other hand, in the third embodiment, as shown in FIG. 6, the diaphragm portion 34 is made of a high hardness metal and the damper portion 43b. Is made of a low hardness metal.

In this case, the diaphragm portion 34 has a Vickers hardness of Hv300 as described in the first embodiment.
It is preferable that the hardness is in the range of 1200 to 1200, and the high hardness metal can be formed by, for example, nickel alloy plating or brightener-added nickel plating. Further, as the nickel alloy plating, Ni-W, Ni-Co can be used. , Ni-Mn, Ni
Examples thereof include nickel alloy plating such as -Fe, Ni-P, and Ni-B.

By forming the diaphragm portion 34 and the damper portion 43a with a high hardness metal as in the second embodiment, a high repulsive force of the diaphragm portion 34 is obtained, and the ink drop velocity and dot position accuracy are improved. As a result, high-speed printing becomes possible, low-voltage driving (high-efficiency driving) becomes possible, and since the damper part 43a is provided, dynamic stability due to pressure absorption can be obtained. At this time, as in the third embodiment, the diaphragm portion 34 is made of a high-hardness metal and the damper portion 43b is made of a low-hardness metal, so that the damper effect of the common liquid chamber becomes higher and dynamic stability is improved. It can be further improved.

Next, FIG. 7 is a plan view for explaining the fourth embodiment of the diaphragm according to the present invention. In the third embodiment, in the diaphragm 31, as in the third embodiment, the diaphragm portion 34 is formed of a high hardness metal such as the nickel alloy plating or the brightener-added nickel plating described above, and the damper portion 43b is formed. In addition to being formed of a low hardness metal such as matte nickel plating, the diaphragm portion 34 is provided with an annealed portion 61 which is annealed and softened by a laser annealing method in a small edge area.

By doing so, even if the diaphragm portion is thickened, the ink drop velocity and dot position accuracy are improved, high-speed printing is possible, and the pinhole yield is also improved.
In addition, since the damper portion 43b is provided, dynamic stability due to pressure absorption can be obtained.

Next, FIG. 8 is a plan view illustrating a fifth embodiment of the diaphragm according to the present invention. In the fifth embodiment, in the diaphragm 31, similarly to the second embodiment, the diaphragm portion 34 is formed of a high hardness metal such as the nickel alloy plating or the brightener-added nickel plating described above, and the damper portion 43a is also formed. Similarly, in addition to being formed of a high hardness metal, the diaphragm portion 34 and the damper portion 43a are provided with annealing portions 61 and 62 which are annealed and softened by a laser annealing method in the edge micro area.

By doing so, even if the diaphragm portion is thickened, the ink droplet speed and dot position accuracy are improved, high-speed printing is possible, and the pinhole yield is also improved.
In addition, even if the thickness of the damper portion is increased, the damper characteristics are not impaired, dynamic stability can be obtained, and the yield of pinholes is also improved.

Next, a method of manufacturing the diaphragm for the ink jet head of the first embodiment will be described with reference to FIGS. 9 to 11. First, as shown in FIGS. 9A and 11A, a resist pattern is formed and a conductor substrate 71 to be an electroformed support substrate for supporting a plating film is formed. As the conductor substrate 71, a metal substrate that can be plated, or a glass or ceramic substrate that is made into a conductor by sputtering or the like can be used. Here, a substrate obtained by sputtering nickel on the surface of a glass substrate was used. Further, the conductor board 71 is of a size capable of simultaneously forming a plurality of diaphragms (manufacturing a large number of diaphragms).

Thereafter, as shown in FIG. 9B, a liquid resist 72 is applied to the metallized surface of the conductor substrate 71 and baked. Then, as shown in FIGS. 9C and 11B, a diaphragm outer frame (outer separation band) pattern 73, an ink supply port pattern 74 for forming an ink supply port (ink inflow hole) 55, and an alignment. Mark pattern 75
Is patterned by an exposure and development process (first photolithography process). As described above, the outer frame pattern 73 is a pattern for separating individual diaphragms after formation, because a large number of diaphragms are simultaneously formed on one conductor substrate 71, and the alignment mark is also used. The pattern 75 is for alignment when forming the second layer described later.

Next, as shown in FIG. 9D, metal plating is performed on the conductor substrate 71 to form a first layer 76 (first plating step). The thickness of the first layer 76 is 2 to 10 μm.
I am trying. In addition, the first layer 76 is the diaphragm portion 3
4 is formed, so here, high hardness Ni single plating containing a plating additive, or Ni-W, Ni-Co, Ni is used.
The first layer 76 is formed by performing high hardness metal plating such as alloy plating of -Mn, Ni-Fe, Ni-P, Ni-B. By performing these high hardness metal plating, the first layer 76 having a Vickers hardness of Hv300 to 1200 can be obtained, and by using the nickel alloy plating and the additive together, the Vickers hardness of Hv400 to 1200 can be obtained. A first layer 76 having is obtained.

After that, as shown in FIG.
After coating and baking the liquid resist 77 on the conductor substrate 71 on which the layer 76 has been formed, FIG. 10 (b) and FIG. 11 (c).
As shown in FIG. 3, the outer frame pattern 73, the ink supply port pattern 74, and the alignment mark pattern 75 are patterned by the exposure and development processes, using the alignment mark pattern 75 on the conductor substrate 71 as a reference, as in the first photolithography process. At the same time, in order to make the portion other than the diaphragm portion 34 (thin portion) thicker, including the island-shaped convex portion 40, a pattern of the diaphragm portion pattern 78 corresponding to the diaphragm portion 34 is patterned with the island-shaped convex portion 40 inverted. (Second photolithography process).

Next, the first layer 7 from which the resist 77 has been removed
After activating the surface of No. 6 by acid activation treatment, FIG.
And as shown in FIG. 11 (d), metal plating is applied to the second
The layer 79 is formed (second plating step). At this time, the first
Since the portion of the surface of the layer 76 corresponding to the diaphragm portion 34 is covered with the diaphragm portion pattern 78, this portion remains the thickness of the first layer 76. Therefore, by removing the resist 72 and peeling the plated film from the conductor substrate 71, the diaphragm portion 34 and the island-shaped convex portion 40 formed of a high hardness metal are integrally formed as shown in FIG. The vibrating plate 31 is obtained. In addition, since the plating metal is not deposited on the outer frame pattern 73 and the ink supply port pattern 74, it is in a hollow state after the resist is removed, and each diaphragm is divided.

Next, a method of manufacturing the ink jet head diaphragm of the second embodiment will be described with reference to FIGS. After forming the first layer 76 made of a high-hardness metal on the conductor substrate 71 through the same steps as those in FIG. 9, the liquid resist 77 is applied and baked on the conductor substrate 71 as shown in FIG. Then, as shown in FIGS. 12B and 13A, with the alignment mark pattern 75 on the conductor substrate 71 as a reference, as in the first photolithography process, the outer frame pattern 73 and the ink supply port pattern 74 are used. The alignment mark pattern 75 is patterned by the exposure and development processes.

At the same time, since the portions other than the diaphragm portion 34 (thin portion) and the damper portion 43 are made thicker including the island-shaped convex portion 40, the island-shaped convex portion 40 is inverted to correspond to the diaphragm portion 34. Diaphragm pattern 7
8 is patterned, and the damper portion pattern 80 is patterned on a portion corresponding to the damper portion 43 (second photolithography process).

Next, the first layer 7 from which the resist 77 has been removed
After activating the surface of No. 6 by acid activation treatment, FIG.
And as shown in FIG. 13B, metal plating is applied to the second
The layer 79 is formed (second plating step). At this time, the first
Of the surface of the layer 76, the portion corresponding to the diaphragm portion 34 is covered with the diaphragm portion pattern 78, and similarly, the portion corresponding to the damper portion 43 is covered with the damper portion pattern 80. It remains at the thickness of 76. Therefore, by removing the resist 77 and peeling the plating film from the conductor substrate 71, the diaphragm portion 34, the damper portion 43, and the island-shaped convex portion 40, which are made of high-hardness metal, are removed as shown in FIG. The diaphragm 31 formed integrally is obtained.

Next, a method for manufacturing the ink jet head diaphragm of the third embodiment will be described with reference to FIGS. First, as shown in FIG. 14A, the liquid resist 85 is applied and baked on the conductor substrate 71.
As shown in FIGS. 14B and 16A, the pattern 86 having the opening 86a including the portion corresponding to the diaphragm portion 34 is patterned by the exposure and development processes.

Then, as shown in FIGS. 14 (c) and 16 (b), the conductor substrate 7 is formed at the opening 86a of the pattern 86.
High hardness plating is performed on the exposed surface of No. 1 to form a first layer high hardness plating film 87. After that, FIG.
As shown in FIG. 1D, the resist 88 including the surface of the first-layer high-hardness plated film 87 is applied and baked again, and then, as shown in FIG.
As shown in FIG. 4 (e) and FIG. 16 (c), the damper portion 43
The pattern 89 having the opening 89a corresponding to is patterned by the exposure and development processes.

Then, as shown in FIGS. 15 (a) and 16 (d), the conductor substrate 7 is formed at the opening 89a of the pattern 89.
Low hardness plating on the exposed surface of No. 1 (matte N
i plating, etc.) to form the first-layer low-hardness plating film 90. Thereafter, as shown in FIG. 15B, the resist 85 is applied again including the surface of the first layer low hardness plating film 90,
After baking, as shown in FIGS. 15C and 17A, a pattern 91 that covers the diaphragm portion 34 and a pattern 92 that covers a portion corresponding to the damper portion 43 are patterned.

At this time, the pattern 91 and the pattern 92 are the first layer high hardness plating film 87 and the first layer, respectively, so that the unprecipitated region does not occur in the nickel plating applied to form the island-shaped protrusions and the like next. It is made narrower than the region of the low hardness plating film 90.

Therefore, as shown in FIGS. 15 (d) and 17 (b), after Ni plating is performed to form a plating film 93 on the exposed portions of the conductor substrate 71 and the first-layer high-hardness plating film 87, By peeling the plated laminate from the conductor substrate 71, the diaphragm portion 34 is removed as shown in FIG.
Is the first-layer high-hardness plating film 87, and the damper part 43 is the first
A diaphragm component formed of the layer low hardness plating film 90 is obtained.

The vibrating plate component (Ni laminated body) obtained through each of the above-described manufacturing steps was heated at a temperature of 200 ° C. to 300 ° C. for 1 to 2
By performing the heat treatment for a time (see FIG. 10, FIG. 12, etc.), the interlayer adhesion between the first layer and the second layer is improved.

In the above embodiment, the ink jet head which pressurizes the pressurizing liquid chamber by using the displacement of the laminated piezoelectric element in the d33 direction has been described, but the displacement of the laminated piezoelectric element in the d31 direction is applied. The same can be applied to an inkjet head that pressurizes the pressure chamber, an inkjet head that uses other bimorph type piezoelectric elements, and the like.

[0059]

As described above, according to the ink jet head diaphragm of the first aspect, the diaphragm portion which is deformed by the displacement of the electromechanical transducer and the independent island-shaped convex portion corresponding to the electromechanical transducer are provided. Is integrally formed, and the diaphragm part has a Vickers hardness of Hv300 to 1
Since it is formed of the plated metal within the range of 200, a high repulsive force of the diaphragm portion can be obtained, the ink droplet speed can be improved and the printing speed can be increased.
The dot position accuracy is improved, and high efficiency driving by low voltage driving is possible.

According to the ink jet head diaphragm of the second aspect, in the ink jet head diaphragm of the first aspect, the diaphragm portion is partially annealed. Therefore, the crosstalk due to the high hardness diaphragm portion. The characteristics can be improved, the thickness of the diaphragm portion can be increased, and the reduction in yield due to the generation of pinholes can be suppressed.

According to the vibrating plate for an ink jet head of the third aspect, since the diaphragm portion which is deformed by the displacement of the electromechanical conversion element and the elastic body portion which absorbs the pressure are integrally formed of high hardness metal, The high repulsive force of the diaphragm can be obtained, the ink droplet speed can be improved and the printing speed can be increased, the dot position accuracy can be improved, and high efficiency driving by low voltage driving can be achieved. Having the damper part improves the dynamic stability.

According to the ink jet head diaphragm of the fourth aspect, in the ink jet head diaphragm of the third aspect, the diaphragm portion and the elastic body portion are formed of a metal having a Vickers hardness within a range of Hv300 to 1200. The high repulsive force of the diaphragm allows the ink droplet speed to be improved and the printing speed to be increased, the dot position accuracy to be improved, and low voltage driving to achieve high efficiency driving. It becomes possible, and the dynamic stability is improved by having a damper part.

According to the ink jet head diaphragm of the fifth aspect, in the ink jet head diaphragm of the third or fourth aspect, the diaphragm portion and the elastic body portion are partially annealed. It is possible to increase the thickness of the damper portion and the damper portion, and it is possible to reduce the decrease in yield due to the generation of pinholes.

According to the ink jet head diaphragm of the sixth aspect, the diaphragm portion which is deformed by the displacement of the electromechanical transducer is made of a high hardness metal, and the elastic body portion which absorbs the pressure is made of a low hardness metal. The high repulsive force of the diaphragm allows the ink droplet speed to be improved and the printing speed to be increased, the dot position accuracy to be improved, and low voltage driving to achieve high efficiency driving. It becomes possible, and the dynamic stability is improved by having a damper part.

According to the ink jet head diaphragm of the seventh aspect, in the ink jet head diaphragm of the sixth aspect, the diaphragm portion has a Vickers hardness of Hv3.
Since it is made of a metal in the range of 00 to 1200 and the elastic body is made of a metal in the range of Hv150 to 250 in Vickers hardness, a high repulsive force of the diaphragm portion can be obtained, The ink droplet speed is improved to increase the printing speed, the dot position accuracy is improved, high efficiency driving is possible by low voltage driving, and the dynamic stability is improved by having a damper part. .

According to the eighth aspect of the present invention, there is provided the ink jet head diaphragm according to any one of the first to seventh aspects, wherein the diaphragm portion is formed by nickel alloy plating or brightener addition plating. Since it is configured, manufacturing becomes easy.

According to the ninth aspect of the present invention, there is provided the ink jet head diaphragm according to the sixth or seventh aspect, in which the diaphragm portion is formed by nickel alloy plating or brightener addition plating, and the elastic body portion is formed. Since the structure is formed by additive-free nickel plating, manufacturing is facilitated in addition to the above effects.

According to the ink jet head diaphragm of the tenth aspect, in the ink jet head diaphragm of the eighth or ninth aspect, the nickel-based alloy plating is Ni-.
W, Ni-Co, Ni-Mn, Ni-Fe, Ni-P, Ni-B
Since the alloy plating is any one of the above, the required hardness can be easily obtained.

According to the method for manufacturing a vibration plate for an inkjet head of claim 11, in the method for manufacturing a vibration plate for an inkjet head according to any one of claims 1 to 10, after the vibration plate is formed, 200 ° C to 300 ° C. At the temperature of 1
Since the heat treatment is performed for up to 2 hours, interlayer adhesion is improved and peeling failure can be prevented.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an inkjet head to which the present invention is applied.

FIG. 2 is an enlarged sectional view of an essential part of the head in a direction orthogonal to a channel direction.

FIG. 3 is an enlarged cross-sectional view of the main part of the same head in the channel direction.

FIG. 4 is a perspective explanatory view showing a first embodiment of the diaphragm according to the present invention.

FIG. 5 is a perspective explanatory view showing a second embodiment of the diaphragm according to the present invention.

FIG. 6 is an explanatory perspective view showing a diaphragm according to a third embodiment of the present invention.

FIG. 7 is an explanatory perspective view showing a diaphragm according to a fourth embodiment of the present invention.

FIG. 8 is an explanatory perspective view showing a diaphragm according to a fifth embodiment of the present invention.

FIG. 9 is an explanatory diagram illustrating a method of manufacturing the diaphragm according to the first embodiment.

FIG. 10 is an explanatory diagram illustrating the continuation of the method of manufacturing the diaphragm according to the embodiment.

FIG. 11 is a perspective explanatory view illustrating a method of manufacturing the diaphragm according to the embodiment.

FIG. 12 is an explanatory diagram illustrating a method of manufacturing the diaphragm according to the second embodiment.

FIG. 13 is an explanatory diagram illustrating a continuation of the method for manufacturing the diaphragm according to the embodiment.

FIG. 14 is an explanatory diagram illustrating a method of manufacturing the diaphragm according to the third embodiment.

FIG. 15 is an explanatory diagram illustrating the continuation of the method of manufacturing the diaphragm according to the embodiment.

FIG. 16 is a plan view illustrating the method of manufacturing the diaphragm according to the example.

FIG. 17 is a plan view for explaining the continuation of the method of manufacturing the diaphragm according to the embodiment.

[Explanation of symbols]

1 ... Drive unit, 2 ... Liquid chamber unit, 3 ... Frame,
12 ... Multilayer piezoelectric element, 17 ... Driving part, 18 ... Non-driving part, 31 ... Vibrating plate, 34 ... Diaphragm part, 40 ... Island-shaped convex part, 43, 43a, 43b ... Damper part.

Claims (11)

(57) [Claims] 1. A diaphragm for an inkjet head, wherein a diaphragm portion that deforms due to displacement of an electromechanical conversion element and an island-shaped convex portion that corresponds to the electromechanical conversion element are integrally formed, and the diaphragm portion is Vickers. A diaphragm for an inkjet head, which is formed of a plated metal having a hardness within a range of Hv300 to 1200. 2. The diaphragm for an inkjet head according to claim 1, wherein the diaphragm portion is partially annealed. 3. A diaphragm for an ink jet head, wherein a diaphragm portion that is deformed by displacement of an electromechanical transducer and an elastic body portion that absorbs pressure in a liquid chamber are integrally formed,
The diaphragm part and the elastic part have a Vickers hardness of H
A diaphragm for an inkjet head, which is formed of a high hardness metal of v300 or more . 4. The diaphragm for an inkjet head according to claim 3, wherein the diaphragm portion and the elastic body portion are formed of a metal having a Vickers hardness of Hv300 to 1200. Diaphragm. 5. The diaphragm for an inkjet head according to claim 3, wherein the diaphragm portion and the elastic body portion are partially annealed. 6. A diaphragm for an ink jet head, wherein a diaphragm portion that deforms due to displacement of an electromechanical transducer and an elastic body portion that absorbs pressure in a liquid chamber are integrally formed,
The diaphragm part has a Vickers hardness of Hv300 or more.
Made of high hardness metal, the elastic part is Vickers hard
A diaphragm for an inkjet head, which is formed of a low-hardness metal having a hardness of less than Hv300 . 7. The diaphragm for an inkjet head according to claim 6, wherein the diaphragm portion is made of a metal having a Vickers hardness of Hv300 to 1200.
The vibrating plate for an inkjet head, wherein the elastic portion is made of a metal having a Vickers hardness of Hv 150 to 250. 8. A vibration plate for an inkjet head according to claim 1, wherein the diaphragm portion is formed by nickel alloy plating or brightening agent-added plating. Board. 9. The diaphragm for an inkjet head according to claim 6, wherein the diaphragm portion is formed by nickel alloy plating or brightener-added plating, and the elastic body portion is formed by non-added nickel plating. A diaphragm for an inkjet head, which is characterized in that 10. The diaphragm for an ink jet head according to claim 8 or 9, wherein the nickel alloy plating is Ni-W, Ni-Co, Ni-Mn, Ni-Fe, Ni-P,
A diaphragm for an inkjet head, which is a Ni-B alloy plating. 11. The method for manufacturing a diaphragm for an inkjet head according to claim 1, wherein after the diaphragm is formed, heat treatment is performed at a temperature of 200 ° C. to 300 ° C. for 1 to 2 hours. And a method for manufacturing a diaphragm for an inkjet head.