JP3481381B2 - Waterproof and airtight material for mold-proof building and method for producing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold-proof, watertight and airtight material for construction and a method for producing the same. More specifically, semiconductor particles exhibiting a photocatalytic action are dispersed in a base material made of a polymer material, and the photocatalyst is obtained. The present invention relates to a watertight airtight building material having an antibacterial and antifungal effect in which an antibacterial metal or an antibacterial metal compound is deposited on the surface of a substrate by an action, and a method for producing the same.

[0002]

2. Description of the Related Art Although the problems of mold in general houses and offices and the problems of mold and bacteria indoors such as hospital nosocomial infections have existed for a long time, there is no effective and simple countermeasure against them. In particular, the gasket part used as the fixing part of the window glass is liable to accumulate dew condensation and dirt, which causes mold to grow and darken, which is not only hygienic but also aesthetically unpleasant. There was a problem. Further, once the mold has grown, it is difficult to remove it, and there is a method of removing it using a chemical such as a mildew treating agent, but it is not easy to remove the mold with chemicals due to problems such as safety of chemicals and odor. Therefore, it is desired from the beginning to give the gasket antibacterial and antifungal properties.

As a method of imparting antibacterial / mildew-proof properties to a gasket, there is a method of adding an organic chemical to the gasket in advance. However, in this method, the chemicals are gradually released, so that the antibacterial and antifungal properties are finally lost. There is also a method of blending an inorganic antibacterial agent in which an antibacterial metal or an antibacterial metal compound is supported on zeolite, silica gel or the like in a gasket. But,
In order to exert sufficient antibacterial and antifungal properties on the gasket surface, it is necessary to add a large amount of antibacterial agent, which impairs the flexibility of the rubber or resin material of the base material and makes it easy to break or break. There is a problem that it becomes easy and the mechanical properties of the material deteriorate. Further, since the antibacterial and antifungal properties depend only on the antibacterial agent existing in the surface layer of the material that comes into contact with the outside air, the antibacterial agent inside the material is wasted, which causes a problem of increasing cost.

By the way, it has been conventionally known that semiconductor particles having a photocatalytic action represented by TiO ₂ exhibit an antibacterial and antifungal action, and recently, maintenance-free antibacterial and antifungal actions have been utilized by utilizing them. Development of materials with For example, JP-A-2-124949 discloses a plastic molded article formed by molding a thermoplastic resin sheet containing a fine powder deodorant mainly containing a composite of TiO ₂ and ZnO, which contains some water. There is. Further, Japanese Patent Laid-Open No. 2-6333 discloses an antibacterial powder in which antibacterial metals such as copper and zinc are supported on the surface of titanium oxide particles, and the powder is blended with resin, rubber, glass and the like. An antibacterial composition is obtained by the above method, and by a known method, in addition to antibacterial treatment of electrical equipment, furniture furnishings, upholstery materials, packaging materials such as food, etc., environmental hygiene facilities, antibacterial agents for equipment. Is taught that the above powder can be used.

[0005]

However, TiO 2
_When compounding photocatalytic semiconductor particles such as ₂ into a polymer material base material, the polymer material itself is decomposed by the photocatalytic function, the flexibility of the base material is impaired, and the mechanical properties deteriorate. Occurs. In order to suppress the damage of the polymer material, it is necessary to use semiconductor particles having a small photocatalytic action, but in that case, sufficient antibacterial and antifungal properties cannot be exhibited. In addition, irradiation of light is indispensable when trying to exert antibacterial and antifungal properties by photocatalytic action, and in the case of watertight airtight materials for indoor building materials such as bathrooms and kitchens, it is necessary to show antibacterial and antifungal properties. There is a problem that it is difficult for a large amount of light to enter. Further, in order to exert sufficient antibacterial and antifungal properties on the surface of the base material, it is necessary to blend a large amount of semiconductor particles having high photocatalytic activity, but the semiconductor particles for photocatalyst are expensive and increase the cost. I will invite you. Moreover, usually
Since the semiconductor particles that exhibit a photocatalytic action with weak light have a fine particle diameter of several nm, there is also a problem that the dispersibility in the polymer material is poor. On the other hand, when semiconductor particles are coated on the surface of a polymer material, sufficient adhesion between the polymer material and the coating film cannot be obtained, and the coating film may peel off.

Therefore, an object of the present invention is to reduce the mechanical properties such as strength and flexibility due to the photocatalytic action when the above-mentioned semiconductor particles having the photocatalytic action are compounded in the polymer material, and the photocatalyst. To provide a watertight airtight material for construction such as a gasket member, which solves the problem of deterioration of antibacterial and antifungal properties when compounded with semiconductor particles having a small action, and exhibits excellent antibacterial and antifungal effects over a long period of time. is there. Further, the object of the present invention is excellent by depositing an antibacterial metal or an antibacterial metal compound having an antibacterial / antifungal action only on the surface of a polymer material substrate exposed to the outside air by a redox reaction of a photocatalyst. An object of the present invention is to provide a watertight airtight material for construction, which exhibits antibacterial and antifungal effects, is excellent in workability, flexibility, strength, etc., and can be relatively easily manufactured at low cost, and a manufacturing method thereof.

[0007]

In order to achieve the above object, according to the present invention, a semiconductor particle exhibiting a weak photocatalytic action to the extent that it does not damage the base material made of a polymeric material. Mixed with and exposed to the substrate surface
Provided is a watertight and airtight material for antifungal construction , comprising an antibacterial metal or an antibacterial metal compound deposited on the surface of conductor particles . In a preferred embodiment, the semiconductor particles have a particle size of 0.1 to 1 μm, and have a particle size of 1 to 20 with respect to the polymer material substrate so that at least a part thereof is exposed on the surface of the substrate.
It is mixed in a weight percentage. Further according to the invention,
Suitable for use in the production of the mold-proof watertight airtight material for construction as described above, a base material mixed with semiconductor particles exhibiting a weak photocatalytic effect that does not damage the base material made of a polymer material And further comprising the substrate material:
The antibacterial metal ion or the antibacterial metal compound ion is brought into contact with the solution, and the antibacterial metal ion or the antibacterial metal compound ion is reduced by the photocatalytic action of the semiconductor particles by irradiating with ultraviolet rays, and the base material surface is antibacterial. Disclosed is a method for producing a watertight and airtight material for antifungal construction, which comprises depositing a functional metal or an antibacterial metal compound.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The anti-mold watertight airtight material for construction according to the present invention uses semiconductor particles having a small photocatalytic action as semiconductor particles mixed in a base material of a polymer material such as rubber or resin,
Suppressing the decomposition of the polymer material by photocatalysis, and solving the problem of the mechanical properties such as elongation and strength of the polymer material is reduced, the polymer material containing such semiconductor particles mixed antibacterial metal ions or By contacting it with a solution containing antibacterial metal compound ions and irradiating it with ultraviolet rays,
Due to the photocatalytic action of the semiconductor particles, the surface of the base material (exposed
The surface of the semiconductor particles) is deposited with an antibacterial metal or antibacterial metal compound that exhibits excellent antibacterial and antifungal properties even in the absence of light irradiation of silver, copper, etc. It is intended to exhibit antifungal properties. The semiconductor particles exhibiting a weak photocatalytic action according to the present invention means that the amount mixed with respect to the base material is controlled, the particle size is controlled, the shape or the specific surface area is controlled, or the material properties are controlled to be weak. It is designed to exhibit a great photocatalytic action. Speaking of the specific surface area of semiconductor particles, it is generally 1 to 100 m.
The range of ² / g is suitable, and preferably 1 to 20 m ² / g.
Is. Also, for example, pigment type TiO ₂ having a particle size of 2
Those having a specific surface area of about 00 m to ¹ μm and about 10 m ² / g can be preferably used.

That is, in the present invention, the semiconductor particles having a photocatalytic action dispersed in the polymer material are used as a photocatalyst for the redox reaction for depositing the antibacterial metal or the antibacterial metal compound on the surface of the substrate thereafter. Has been done. Therefore, such a semiconductor particle does not show a sufficient photocatalytic action under illuminance under a normal use condition, but a photocatalytic action enough to reduce an antibacterial metal ion or an antibacterial metal compound ion under strong ultraviolet irradiation. It is sufficient to use a semiconductor particle exhibiting the above, and even if such a semiconductor particle is dispersed in a polymer material, the antibacterial metal or the antibacterial metal compound is deposited only on the surface of the base material without damaging the polymer material. It becomes possible. Further, since the reaction for depositing the antibacterial metal or the antibacterial metal compound is carried out in a short time,
The damage of the polymer material due to the ultraviolet irradiation is weak. Furthermore, the watertight airtight material for construction obtained by the present invention is Ag, Cu, Pt, Pd, A deposited on the surface of the base material.
An antibacterial metal such as u or an antibacterial metal compound thereof can exhibit excellent antibacterial and antifungal effects for a long period of time even in the absence of light irradiation.

The polymer material used as the base material is vinyl chloride resin, acrylic rubber, nitrile rubber (NBR), butyl rubber (IIR), styrene-butadiene rubber (SB).
R), ethylene propylene terpolymer (EPDM), etc. are not particularly limited as long as they have appropriate flexibility and strength, and can be appropriately selected according to the application. When the watertight airtight material for construction according to the present invention is used as a gasket member, various resins and rubbers conventionally used in gaskets can be preferably used as the polymer material.

The semiconductor particles to be blended with the polymer material are semiconductors having even a slight photocatalytic action, and if the position of the conduction band is less than the reduction potential of the antibacterial metal ion or the antibacterial metal compound ion. Can also be used, for example TiO ₂ , SrTiO ₃ , ZnO, CdS, S
Examples thereof include nO ₂ , and among these, TiO ₂ is particularly preferable. The particle size of the semiconductor particles used is 0.01 μm
10 μm, preferably 0.1 μm to 1 μm is suitable. When the particle size is smaller than 0.1 μm, there are problems that the particle size is too small to handle and the dispersibility deteriorates. On the other hand, if the particle size is too large, large particles are present on the material surface, the surface smoothness is lost, and the particles exposed on the material surface are likely to fall off. From the viewpoint of particle size, cost and safety, rutile type TiO ₂ for pigments, which has been conventionally used as a white pigment, is particularly preferable as the semiconductor compounded in the polymer material.

The amount of the semiconductor particles having a photocatalytic action mixed in the polymer material is 0.5 to 0.5 with respect to the polymer material.
100% by weight (here, 100% by weight corresponds to the weight of the semiconductor particles being equal to the weight of the polymer material), preferably 1 to 20% by weight. If the amount is less than 1% by weight, the amount of semiconductor particles exposed on the surface decreases, and the amount of antibacterial metal or antibacterial metal compound deposited on the surface decreases, and sufficient antibacterial and antifungal properties are obtained. It will be difficult. On the other hand, when it exceeds 100% by weight, there is no problem in exhibiting antibacterial and antifungal properties, but the mechanical properties as a watertight airtight material for construction remarkably deteriorate.

Various methods can be used as a method for producing a watertight airtight material for construction in which semiconductor particles are dispersed in a polymer material. For example, by mixing the above-mentioned semiconductor particles in a polymer material, sufficiently kneading, and then extrusion-molding using a suitable extrusion die, as shown in FIG. It is possible to obtain a watertight airtight material for construction having an arbitrary cross-sectional shape, which is dispersed in. Further, not only extrusion molding but also molding or manufacturing of a polymer material in which the semiconductor particles are dispersed can be carried out by various methods such as injection molding or press molding for manufacturing a polymer molded article.

As a mode of dispersing the semiconductor particles in the polymer material, in addition to the mode shown in FIG. 1, many semiconductor particles having a photocatalytic action are spread toward at least one surface of the polymer material substrate. Or a double layer structure of a layer made of a polymer material in which semiconductor particles having a photocatalytic action are dispersed and a layer made of a polymer material in which the semiconductor particles are not dispersed, There is a sufficient amount of semiconductor particles in the surface layer of, but the compounding amount is reduced by making it as little as possible inside.
Further, it is possible to considerably prevent deterioration of mechanical properties such as elongation and strength of the material when a large amount of semiconductor particles are blended.
As a method for producing such a two-layered polymeric material, for example, a suitable amount of semiconductor particles are mixed in advance with the polymeric material and sufficiently kneaded to form a surface layer material, and the surface layer material and the inner layer material are constituted. By co-extruding the polymer material at the same time, it is possible to obtain a polymer material having a two-layer structure in which the surface layer material in which the semiconductor particles are dispersed is firmly bonded to the surface of the inner layer material.
Further, in injection molding or press molding, a film obtained by kneading the semiconductor particles or the polymer particles with the semiconductor particles is previously applied or adhered to the inner wall surface of the cavity of the mold, and the polymer material is injected therein. The polymer material in which the semiconductor particles are dispersed in the surface layer can also be obtained by filling and pressing.

As described above, the method of depositing the antibacterial metal or the antibacterial metal compound on the surface of the polymer material in which the semiconductor particles are dispersed is carried out by a suitable method containing an antibacterial metal such as silver nitrate such as silver nitrate or copper chloride or copper. A solution of the compound is prepared, and one method is to immerse the polymer material in which the semiconductor particles are dispersed in the solution, and irradiate it with ultraviolet rays from an ultraviolet lamp or a black light to obtain antibacterial properties due to the electrons generated by the photocatalytic action. The metal ion or the antibacterial metal compound ion is reduced, and the antibacterial metal or the antibacterial metal compound is deposited on the surface of the polymer material. In this case, the amount of the antibacterial metal or the antibacterial metal compound deposited is determined by the amount of the antibacterial metal ion in the solution, that is, the concentration of the prepared solution or the alcohol or EDTA added to the solution.
It is controlled by the concentration of reducing agent such as. There is also a method of controlling the deposition amount by the ultraviolet irradiation time, but in the case of the present invention, the ultraviolet irradiation time is preferably shorter in order to avoid damage to the polymer material, and therefore the deposition amount is controlled by the concentration of the prepared solution. Is preferred.

As another method, there is a method in which the solution is applied onto a polymer material in which semiconductor particles are dispersed by an appropriate method such as spraying, and then the solution is irradiated with ultraviolet rays. In this method, the amount of the antibacterial metal or the antibacterial metal compound deposited can be controlled by the amount of the antibacterial metal ion in the solution, that is, the concentration of the prepared solution, the concentration of the reducing agent added, and the coating amount. By the above method, as shown in FIG.
The semiconductor which is exposed on the surface of the base material made of the polymer material 1.
The watertight airtight material for construction 10 according to the present invention is produced in which the antibacterial metal or the antibacterial metal compound 3 is deposited on the surface of the body particles 2 . Further, when the antifungal property of the watertight airtight material for construction of the present invention is lowered, the antifungal property is maintained by reprecipitating the antibacterial metal or the antibacterial metal compound on the surface of the watertight airtight material by the above method. You can In this case, since the treatment is carried out after the construction, it is preferable to apply ultraviolet rays after applying by a spray method or the like.

The production of the watertight airtight material for buildings in which the antibacterial metal or the antibacterial metal compound is deposited on the surface of the polymer material in which the semiconductor particles are dispersed is carried out continuously from the conventional method for producing a watertight airtight material for buildings. It is possible. That is, the conventional production of the watertight airtight material for construction is performed by continuously extruding a polymer material, but the production of the watertight airtight material for construction according to the present invention is as shown in FIG. Pellets of a polymer material mixed with semiconductor particles are put into a hopper 11 and extrusion-molded by an extruder 12, and then immersed in a bath 13 of a solution containing antibacterial metal ions or antibacterial metal compound ions, and then irradiated with ultraviolet rays. UV irradiation is performed by the device 14 to deposit an antibacterial metal or an antibacterial metal compound on the surface of the molded body, which is then passed through a washing bath 15 and washed with water, and then wound up by a winder 16. The watertight airtight material for construction 10 according to the present invention continuously without significantly changing the process and without reducing the productivity.
Can be manufactured. In addition, with such a manufacturing process, it is possible to manufacture a normal watertight airtight material for construction only by changing the bath 13 to a water bath containing no antibacterial metal ions or antibacterial metal compound ions.

[0018]

EXAMPLES The effects of the present invention will be specifically described below with reference to Examples and Comparative Examples, but it goes without saying that the present invention is not limited to the following Examples.

Basic example Vinyl chloride compound (composition: vinyl chloride resin = 3
8.6 wt%, plasticizer = 36.7 wt%, calcium carbonate = 23.1 wt%, stabilizer = 1.2 wt%, pigment =
0.4wt%) 200g particle size 200nm, specific surface area 1
² g of 0 m ² / g pigment-use TiO ₂ (rutile type) was kneaded, and then press-molded to obtain □ 150 × 150 mm
^{2. A} vinyl chloride resin sheet containing semiconductor particles and having a thickness of 1 mm was prepared.

The particle size 7nm for basic Comparative Examples comparison, except that blending a specific surface area of 320 m ² / g of photocatalytic TiO ₂ (anatase), basic
A vinyl chloride resin sheet was produced in the same manner as in the example .

Evaluation of mechanical properties: Tensile strength tests were carried out on the respective vinyl chloride resin sheets prepared in the above-mentioned basic example and basic comparative example , based on the method specified in 6.6 and 6.12 of JIS A 5756. And an elongation test were carried out. Further, each vinyl chloride resin sheet produced in the basic example and the basic comparative example was subjected to accelerated exposure for 500 hours, and the subsequent samples were also subjected to a tensile test and an elongation test to evaluate the mechanical properties. The results are shown in Table 1. In Table 1, results that satisfy the standard value specified in JIS A 5756 are indicated by ◯, and results that do not satisfy the standard value are indicated by x.

[Table 1]

From the results shown in Table 1, it is recognized that for the samples before accelerated exposure, the vinyl chloride resin sheets of the basic example and the basic comparative example both satisfy the standard value. However, after accelerated exposure, the elongation of the vinyl chloride resin sheet of the basic comparative example decreased, and the standard value could not be satisfied. this is,
The elongation was lowered because the plasticizer contained in the vinyl chloride resin was decomposed by the photocatalytic action of light irradiation during accelerated exposure. In the vinyl chloride resin sheet of the basic example, since the photocatalytic action of TiO ₂ contained in the vinyl chloride resin sheet is small, the mechanical properties are not deteriorated due to the decomposition of the plasticizer as described above. Therefore, it can be confirmed that the polymer material in which the semiconductor particles having a large photocatalytic action are blended as in the basic comparative example is difficult to be actually used because its mechanical property is deteriorated.

Example 1 The vinyl chloride resin sheet containing semiconductor particles prepared in the basic example was immersed in a 0.05 mol / liter copper chloride aqueous solution, and 1
Ultraviolet rays were irradiated with a 00W ultraviolet lamp to deposit 0.05 mg / cm ² of copper on the vinyl chloride resin sheet containing semiconductor particles.

Comparative Examples 1 and 2 For comparison, 1% by weight of an antifungal vinyl chloride resin sheet containing 1% by weight of an organic antifungal agent (Comparative Example 1 ) and an inorganic antibacterial agent in which silver is supported on zeolite % Antifungal vinyl chloride resin sheet was prepared (Comparative Example 2 ).

Antifungal test: For each antifungal vinyl chloride resin sheet produced in Example 1 and Comparative Examples 1 and 2 , JIS A 5756 6.14.
The antifungal test was carried out based on the method specified in 1. In addition, after each mold-proof vinyl chloride resin sheet produced in Example 1 and Comparative Examples 1 and 2 was subjected to accelerated exposure for 500 hours, the same mold-proof test was carried out. The results are shown in Table 2.
The judgment in Table 2 is in accordance with JIS Z 2911.
3 shows no growth of mycelium in the part inoculated with mold, 2
The area of mycelial growth is not more than 1/3 of the fungal inoculation area, 1 is the area of mycelial growth is 1 / of the fungal inoculation area
Those with a rating of more than 3 are shown on a 3-point scale.

[Table 2]

From the results shown in Table 2, it is confirmed that the antifungal vinyl chloride resin sheet produced in Example 1 has good antifungal properties both before and after accelerated exposure. On the other hand, the antifungal vinyl chloride resin sheet produced in Comparative Example 1 has good antifungal properties before accelerated exposure, but loses antifungal properties after accelerated exposure. Comparative Example 1 contains an organic antifungal agent, and exhibits antifungal property by leaching this agent from the inside of the sheet to the outside. Therefore, it was confirmed that the antifungal vinyl chloride resin sheet produced in Comparative Example 1 loses the chemicals contained in the sheet and loses the antifungal property when used for a long time. The antifungal vinyl chloride resin sheet produced in Comparative Example 2 has no change in antifungal property before and after accelerated exposure, which shows that the inorganic antibacterial agent is stable. However, the antifungal property itself is inferior to that of Example 1. This is because the amount of inorganic antibacterial agent was small,
This is because there is not enough antibacterial agent on the surface of the base material.
However, blending in a large amount reduces the mechanical properties of the polymer material itself, and is expensive in terms of cost because it uses an expensive inorganic antibacterial agent. From the above,
By adding TiO ₂ for pigments, which has low photocatalytic activity and low cost, to a polymeric material and depositing an antibacterial metal or an antibacterial metal compound on the surface by utilizing photocatalytic activity, a longer period of time than conventional methods can be obtained. , It was confirmed that it can exhibit excellent antifungal properties.

[0027]

As described above, the mold-proof, watertight airtight material for construction according to the present invention is a mixture of semiconductor particles exhibiting a weak photocatalytic effect that does not damage the polymer material. There is no problem such as damage to the polymer material due to conventional photocatalytic action, that is, there is no problem of deterioration of mechanical properties such as elongation and strength of the polymer material, and the photocatalytic action of the above-mentioned semiconductor particles is applied to the surface of the material. Since only the antibacterial metal or the antibacterial metal compound is deposited, excellent antibacterial and antifungal properties can be exhibited for a long period of time. Further, the amount of antibacterial metal or antibacterial metal compound used can be reduced, and excellent antibacterial and antifungal properties are exhibited even in the absence of light irradiation. Therefore, according to the present invention, there is provided a watertight airtight material for a mildewproof construction, which does not require a special device and is low in cost and maintains the mechanical properties and the mildewproofness for a long time. The watertight airtight material for construction according to the present invention can be used for various purposes, and as an example, it can be particularly advantageously applied to a gasket of a building material used around water such as kitchen or bathroom where mold is likely to adhere. . Furthermore, by using the method of the present invention, it is possible to impart excellent antibacterial and antifungal properties to resin products other than watertight airtight materials for construction without impairing their mechanical properties.

[Brief description of drawings]

FIG. 1 is a partially enlarged cross-sectional view showing a state in which semiconductor particles having a photocatalytic action are dispersed in a polymer material.

FIG. 2 is a partially enlarged cross-sectional view of an antifungal watertight airtight material for molds, which has an antibacterial metal or an antibacterial metal compound deposited on the surface of a polymer material in which semiconductor particles are dispersed.

FIG. 3 is a schematic view showing an example of a manufacturing process of the mold-proof, watertight and airtight material for a building according to the present invention.

[Explanation of symbols]

1 Polymeric Materials 2 Semiconductor Particles 3 Antibacterial Metals or Antibacterial Metal Compounds 10 Antifungal Watertight Airtight Materials for Buildings 11 Hoppers 12 Extruders 13 Baths of Antibacterial Metal Ions or Solutions Containing Antibacterial Metal Ions 14 UV Irradiation Devices 15 Washing bath 16 Winding machine

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI C08K 3/10 C08K 3/10 (72) Inventor Kazuhito Hashimoto 2703, Iijima-cho, Sakae-ku, Yokohama-shi, Kanagawa 2 New City Hongodai D Bldg. 213 (72) Inventor Nobuyuki Nakata 1300 Horikiri, Kurobe City, Toyama Prefecture (72) Inventor Toshio Arai 841 Fujiki, Toyama City, Toyama Prefecture (56) Reference JP-A-6-227847 (JP, A) JP-A-4-359985 (JP) , A) JP 7-26851 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) E06B 3/62 A61L 2/16 B29D 31/00 C08J 5/10 C08J 7/00 304 C08K 3/10

Claims (4)

(57) [Claims] 1. The semiconductor particles, wherein semiconductor particles exhibiting a weak photocatalytic effect that does not damage the base material are mixed in a base material made of a polymer material and exposed on the surface of the base material.
An antifungal watertight airtight material for construction , comprising an antibacterial metal or an antibacterial metal compound deposited on the surface of a child . 2. The semiconductor particles have a particle size of 0.01 to 10 μm, and a proportion of 0.5 to 100% by weight based on the polymer material base material so that at least a part of the semiconductor particles is exposed on the surface of the base material. The anti-mold water-tight airtight material for construction according to claim 1 , which is mixed in. 3. The semiconductor particles have a particle size of 0.1 to 1 μm, and are mixed in a ratio of 1 to 20% by weight with respect to a polymer material base material so that at least a part of the semiconductor particles is exposed on the surface of the base material. The water-proof and air-tight material for antifungal construction according to claim 2 . 4. A base material in which semiconductor particles exhibiting a weak photocatalytic action that does not damage the base material made of a polymer material are mixed, and a solution containing an antibacterial metal ion or an antibacterial metal compound ion is used. It is characterized in that the antibacterial metal ion or the antibacterial metal compound ion is reduced by photocatalytic action of the semiconductor particles by contacting and irradiating with ultraviolet rays, and the antibacterial metal or the antibacterial metal compound is deposited on the substrate surface. A method for producing a watertight and airtight material for antifungal construction.