JP3477104B2 - Field emission cold cathode and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field emission cold cathode and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, field emission cold cathodes used in FEDs (field emission displays) and the like have been actively developed. As a typical example, the one proposed by CA Spindt et al. Is known (for example, Journal of Applied Physics, vol.47,
5248 (1976)).

In this field emission type cold cathode, after a silicon oxide layer and a gate electrode layer are formed on a silicon single crystal substrate,
It is formed by forming a hole having a diameter of about 1.5 μm and forming a conical emitter for field emission in the hole by vapor deposition. A specific example will be described below.

First, a silicon oxide layer is deposited on a silicon single crystal substrate by a CVD method or the like, and then a Mo layer and an A layer are formed.
The l layer is formed by a sputtering method or the like. continue,
Pinholes are formed in these layers by etching. After that, for example, Mo as a metal serving as an emitter is vacuum-deposited while rotating the substrate, and the diameter of the pinhole is M
A cone-shaped emitter is formed in the pinhole by utilizing the fact that it gradually decreases with the deposition of o.

However, the method of forming an emitter using the above-mentioned rotary evaporation method has various problems as described below.

In the rotary evaporation method, the diameter of the pinhole is gradually reduced to form the emitter in the pinhole. Therefore, the height of the emitter and the shape of the tip of the emitter are easily varied, and the field emission is performed. There is a problem of poor uniformity. Further, the sharpness of the tip of the emitter required for enhancing the field emission efficiency is lacking, so that problems such as a decrease in the field emission efficiency and an increase in power consumption occur.

Further, the reproducibility and the yield are poor, and there is a problem that the production cost increases when a large number of emitters are formed on the same substrate. Furthermore, when manufacturing a large-area emitter array, the distance between the vapor deposition source and the substrate must be lengthened in order to keep the incident angle constant when performing oblique rotary vapor deposition, which is a huge vacuum vapor deposition apparatus. Need to be used. Therefore, there is a problem in that it is difficult to manufacture the vapor deposition device itself, and the exhaust time also becomes long.

[0008]

As described above, the conventional field emission cold cathode has many problems to be solved from the viewpoints of uniformity of field emission, field emission efficiency, and productivity.

The present invention has been made to solve the above-mentioned conventional problems, and is excellent in field emission uniformity and field emission efficiency.
An object of the present invention is to provide a field-emission cold cathode having high productivity and a method for manufacturing the same.

[0010]

In the method for manufacturing a field emission cold cathode according to the present invention, a region surrounded by a plurality of cut portions is formed as an emitter by cutting the substrate surface in a plurality of directions. Is characterized by.

According to the present invention, an emitter having a sharp tip can be formed by forming the emitter by cutting, and the field emission efficiency (field electron emission efficiency) can be improved. Further, a large number of emitters can be formed with good uniformity, and the uniformity of field emission (field electron emission) can be improved. Furthermore, since a complicated exposure / patterning process and a large-scale vacuum vapor deposition apparatus are not required, productivity can be improved.

As for the shape of the emitter, a first trapezoidal body or a plurality of first trapezoidal bodies obtained by cutting the pyramid in a plane parallel to the bottom surface and having the cut surface as an upper surface are stacked stepwise. A convex shape corresponding to a shape in which pyramidal shaped bodies are stacked on the upper surface of any one of the shaped bodies, or a wedge-shaped shape is obtained when the cutting surface is taken as the upper surface when cut along a plane parallel to the bottom surface. It is preferable that the shape is a convex shape corresponding to the shape in which the wedge-shaped bodies are stacked on the upper surface of any one of the two-trapezoidal bodies or the shape bodies in which a plurality of second trapezoidal bodies are stacked stepwise. .

In the present invention, since the emitter is formed by cutting, it is possible to obtain various emitter shapes as described above. The pyramidal shaped body has 3 apexes at the tip.
Since it is one dimensionally, the field electron emission efficiency can be improved. Since the tip of the wedge-shaped body has a constant length, the amount of field electron emission can be increased. In Rukoto combination of a trapezoidal shape body and the pyramidal shape, or wedge-shape member, it becomes possible to improve both the emitter intensity and field electron emission efficiency.

As for the shape of the emitter, a first trapezoidal body or a plurality of first trapezoidal bodies obtained by cutting the pyramid along a plane parallel to the bottom surface and having the cut surface as the upper surface are stacked stepwise. A convex shape corresponding to a shape in which pyramidal shaped bodies are stacked on the upper surface of any one of the shaped bodies, or a wedge-shaped shape is obtained when the cutting surface is taken as the upper surface when cut along a plane parallel to the bottom surface. A convex shape corresponding to a shape in which a wedge-shaped body is stacked on the upper surface of any one of the two trapezoidal bodies or the shape bodies in which a plurality of second trapezoidal bodies are stacked stepwise in multiple stages, and at least one It is preferable to form the above-mentioned convex emitter surrounded by a plurality of cutting portions by cutting with a plurality of cutting members having different cutting angles with respect to the direction.

In the present invention, by performing cutting with a plurality of cutting members, it is possible to easily obtain a convex shape in which the trapezoidal shape body and the pyramidal shape body or the wedge shape shape body are combined. In addition, since a plurality of cutting members with different cutting angles are used, the slope of the slope such as a trapezoidal body can be made steeper as it is located higher (the higher the aspect ratio, the higher the aspect ratio. It is possible to improve both the intensity of the emitter and the field electron emission efficiency.

In the method for manufacturing a field emission cold cathode, a step of cutting a substrate surface in a plurality of directions to form a first master having a convex portion surrounded by a plurality of cut portions, and Corresponding to the step of forming the first material layer so as to be in close contact with the convex surface of the first master and peeling the first material layer from the first master to correspond to the convex of the first master. Forming a second master having concave portions, forming a second material layer so as to adhere to the surface of the second master having the concave portions, and forming the second material layer into a second It is characterized in that the emitter corresponding to the convex portion of the first master is formed by peeling from the master.

According to the present invention, the first master having the above-mentioned various effects is formed by cutting, and the field emission cold cathode is manufactured based on the first master, which has excellent characteristics. It is possible to mass-produce the field emission cold cathode.

The field emission type cold cathode according to the present invention has a base portion and an emitter which is disposed on the base portion and surrounded by a plurality of cut portions in at least two directions, and the emitter and the base portion. Is an integrated one with no connection points.

According to the present invention, since the emitter and the base portion are integrated, there is no principle that the emitter is peeled off from the base portion, which is excellent in mechanical strength and is also excellent in heat dissipation. A mold cold cathode can be obtained.

The field emission cold cathode according to the present invention is
A first trapezoidal shaped body having an emitter surrounded by a plurality of cutting portions in at least two directions and having a cutting surface as an upper surface when the pyramid is cut by a plane parallel to the bottom surface. Alternatively, a first convex shape or a wedge-shaped shape corresponding to a shape obtained by stacking a pyramidal shape body on the upper surface of one of the shape bodies in which a plurality of first trapezoidal shape bodies are stacked in stages Wedge shape on the upper surface of any one of the second trapezoidal body or the shape body obtained by stacking a plurality of second trapezoidal bodies in a stepwise manner when the cut surface is obtained as an upper surface when cut in a plane parallel to It is a second convex shape corresponding to the shape in which the shaped bodies are stacked, and the slopes of the slopes of the first trapezoidal shaped body and the pyramidal shaped body forming the first convex shape are steeper as they are located higher. Yes, the first constituting the second convex shape The slope of the slope of the trapezoidal shape body and wedge-like shaped body is characterized by a steep as those located above.

According to the present invention, the slope of the slope of the trapezoidal body or the like is steeper as it is located higher (the higher the aspect ratio is, the higher the aspect ratio is). It is possible to improve both the field emission efficiency and the field electron emission efficiency.

[0022]

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIGS. 1A to 1C are schematic views showing a manufacturing process of a field emission cold cathode according to a first embodiment of the present invention. A method of manufacturing the field emission cold cathode according to this embodiment will be described.

First, as shown in FIG. 1A, a substrate 11 made of oxygen-free copper is prepared, and the surface of this substrate is cut or polished in advance so as to have a desired surface roughness. At this time, in order to concentrate the electric field on the tip of the emitter, it is preferable to make the surface roughness 20% or less of the height of the emitter formed on the substrate surface.

Next, the substrate 11 is mounted on the precision cutting machine. Any cutting device may be used as long as it can obtain a desired shape, size, and processing accuracy, but one example is as follows.

The C-axis table for rotationally positioning the substrate has, for example, a radial rotational vibration amount of 0.01 μm or less, an axial rotational vibration amount of 0.005 μm or less, and a positioning accuracy of 1 × 10.
^Use an air spindle of ^-6 (deg) or less.

For the Z axis for moving and positioning in the direction parallel to the C axis, for example, a stroke of 100 mm or more, a straightness of 0.01 μm or less, a squareness of 0.01 μm or less, and a positioning accuracy of 1 nm or less are used.

An air spindle having a radial runout of 0.01 μm or less and an axial runout of 0.005 μm or less is used as a tool spindle for mounting a bite tool to generate a rotary motion of an arc locus on a bite cutting edge. Use the one that consists of.

The Y axis for moving and positioning in a direction parallel to the main shaft rotation axis and orthogonal to the Z axis has, for example, a stroke of 800 mm or more, a straightness of 0.01 μm or less, and a squareness of 0.
Those with a positioning accuracy of 1 μm or less and a positioning accuracy of 1 μm or less are used.

For example, the stroke 80 is provided on the X axis for moving and positioning in the direction orthogonal to the Y axis and orthogonal to the Z axis.
0 mm or more, straightness 0.01 μm or less, squareness 0.01
The one with a positioning accuracy of 1 nm or less is used.

As the cutting tool 12, it is preferable to use a diamond cutting tool having high cutting performance.
A single-crystal diamond tip brazed to the tip of a cemented carbide shank having a size of 8 mm, a width of 8 mm, and a length of about 60 mm is used. The gap M between the adjacent emitters can be defined by the diamond cutting tool front cutting edge length W (W = M). However, as will be described later, by repeating cutting in the gap a plurality of times, M> W. It may be. Further, the apex angle θ of the diamond bite 12 is made equal to the apex angle of the tip of the formed emitter.

Next, as shown in FIG. 1B, a diamond cutting tool 12 having a desired shape (for example, W = 4 μm, θ = 70 degrees) is used, and the cutting work is performed by pressing the cutting tool against the substrate 11. . In this example, the cutting tool 12 cuts the substrate 11 while drawing an arc locus perpendicular to the paper surface, but the cutting tool 12 may be cut while rotating the cutting tool about the central axis. Further, if it has high machinability, it is not always necessary to rotate it.

The cutting tool 12 cuts the surface of the substrate 11 while moving in the X-axis direction perpendicular to the paper surface, and a tapered cutting groove 13 having a flat bottom is formed on the surface of the substrate 11. After cutting one cutting groove 13, Y perpendicular to the X-axis
The cutting tool 12 is moved in the axial direction (the moving distance is the length L of one side of the emitter + groove width (gap between emitters) M), and the next cutting groove 13 is cut in the same manner as described above. In this way, by sequentially forming a plurality of cutting grooves in the direction perpendicular to the paper surface, a large number of triangular ridges 14 each having a triangular prism lying are formed between two adjacent cutting grooves 13.

Next, as shown in FIG. 1C, the substrate is C
By rotating the shaft table by 90 degrees, a plurality of cutting grooves in a direction parallel to the paper surface are sequentially formed in the same manner as described above.
The cutting pitch is (L + M) as described above. As a result, a plurality of cutting grooves that are orthogonal to each other are formed, and a large number of regular pyramid-shaped (pyramid-shaped) emitters 15 are formed in a region surrounded by the cutting grooves.

After the above steps are performed, burrs may be formed on the ridges of the quadrangular pyramid-shaped emitters due to the flow of the workpiece. In such a case, the bite in the above steps is used. Machining the same bite locus as the locus (zero cut)
The burr can be removed by repeating.

FIG. 2 shows a plane structure of the field emission cold cathode obtained by the above steps, and FIG. 3 shows
It is a perspective view showing the shape of each emitter 15.

As described above, according to the present embodiment, by forming the emitter by the precision cutting process, a field emission cold cathode having excellent uniformity of field emission and excellent field emission efficiency and high productivity is manufactured. be able to.

Further, since the emitter is formed by cutting the substrate, the emitter 15 and the base portion 16 are integrally manufactured as shown in FIG. 1 (c). Therefore, the field emission type cold cathode having excellent mechanical strength and excellent heat dissipation can be obtained without the emitter 15 peeling off from the base portion 16.

The width of the cutting groove (interval between the emitters) M
Can be variously adjusted by adjusting the number of times of cutting and the cutting position. Also, the width L of the emitter is
By adjusting the vertical angle θ of the cutting tool, etc., in addition to L = M,
It can be L> M or L <M.

Further, in the above embodiment, FIG.
A supporting substrate such as glass is provided on the back surface of the substrate 11 made of oxygen-free copper before any of the steps (c) to (c), before the substrate 11 is cut, or after the substrate 11 is cut to form an emitter. You may make it adhere | attach. In this case, in addition to directly bonding the support substrate to the back surface of the substrate 11, a layer made of a soft material such as resin is applied to the back surface of the substrate 11,
It may be formed by printing, vapor deposition, attachment with an adhesive, or the like, and the support substrate may be provided on the back surface of the substrate 11 via a layer of this resin or the like.

When it is desired to obtain a matrix shape as a display device such as an FED, particularly to obtain a cathode line, a plurality of cathode lines separated from each other are formed by cutting off a part of the substrate 11. Is possible. In this case, as described above, the substrate 1
By providing the support substrate on the back surface of No. 1, the mechanical strength can be increased.

In the above example, the shape of the emitter is a regular quadrangular pyramid (quadrangular pyramid having a square bottom), but if the shape is a quadrangular pyramid (quadrangular pyramid having a rectangular bottom), it is not necessarily a regular quadrangular pyramid. There is no.

Further, in the above-mentioned example, the shape of the emitter is a quadrangular pyramid, but it is also possible to form a wedge-shaped emitter 15 having a shape like a sharp edge, as shown in FIG. .

In this case, in the process shown in FIG. 1, after forming a cutting groove in a direction perpendicular to the paper surface (first direction), a cutting groove in a horizontal direction (second direction) is formed on the paper surface. When doing so, cut so that the vertices do not become one. That is, the first
2nd from the cutting pitch when forming the cutting groove in the direction of
The cutting process is performed by increasing the cutting pitch when forming the cutting groove in the direction. In this case, as compared with the quadrangular pyramid-shaped emitter, there is a demerit that the three-dimensional emitter sharpness is reduced from the two-dimensional emitter sharpness, but the electron emission area at the tip of the emitter is increased, so that the emission current amount is increased. There is a merit of increasing. Further, since the tip of the emitter is formed into a ridge line without forming a single apex, there is an advantage that the positional accuracy in forming the cutting groove in the second direction may be low. The surface obtained by cutting in the second direction parallel to the paper surface is also an inclined surface having an inclination, but may be a surface perpendicular to the bottom surface.

Further, as shown in FIG. 5, the emitter 15 may have a triangular pyramid shape. For example, when manufacturing a regular triangular pyramid-shaped emitter, the bite apex angle is 60 degrees, the angle at which the cutting directions intersect is 60 degrees, and three times (three times or more if zero cut is included) in three directions. It may be cut. In the case of a quadrangular pyramid-shaped emitter, there is a possibility that the edges that should originally become vertices may become ridgelines due to the positioning error of the processing device, but in the case of a triangular pyramid, the vertices are always obtained. is there.

In the present embodiment, the thickness of the substrate 11 is 10 times the height of the emitter 15 in consideration of the processing accuracy at the time of cutting and the warp, distortion, peeling, etc. of the substrate during cutting.
It is preferably double or more.

Further, in the present embodiment, from the viewpoint of excellent processing accuracy and processability, good thermal conductivity and heat dissipation when the abnormal electron emission current of the emitter increases, low resistance and little signal delay. Therefore, although the oxygen-free copper plate is used as the substrate 11, it is also possible to use other materials. For example, a region where the emitter is formed by cutting may be formed by Cu plating, Ni plating, or printing, or the like. In addition, a resin or the like can be used as long as it has conductivity. Furthermore, it is also possible to use a material having a low work function or a material having a negative electron affinity (NEA material) that can be easily cut.

(Embodiment 2) FIGS. 6A to 6C are schematic views showing a manufacturing process of a field emission type cold cathode according to a second embodiment of the present invention. A method of manufacturing the field emission cold cathode according to this embodiment will be described.

First, as shown in FIG. 6A, a substrate 11 made of oxygen-free copper is prepared, and like the first embodiment, the surface of this substrate is preliminarily cut so as to have a desired surface roughness. Alternatively, polish it. In addition, multi-structured diamond cutting tools 12a and 12b having different blade angles (vertical angles) (θ1> θ2) are prepared.

Next, as shown in FIG. 6B, the substrate 11 is cut using the multi-structured diamond cutting tools 12a and 12b to form the cutting groove 13 in the direction perpendicular to the paper surface (first direction). Form. The cutting apparatus and the basic cutting method are almost the same as those in the first embodiment. The interval between the diamond cutting tool 12a and the diamond cutting tool 12b is set to be twice the pitch of the adjacent emitters, and the cutting tool is sequentially moved at the same pitch as the emitter pitch to perform a cutting process.
Is formed. Since the apex angles (θ1, θ2) of the diamond bite 12a and the diamond bite 12b are different, the aspect ratio of the stepped triangular ridge 14 becomes higher toward the tip.

Next, as shown in FIG. 6C, the substrate is C
The shaft table is rotated 90 degrees to form a plurality of cutting grooves in the direction parallel to the paper surface (second direction) in the same manner as described above. As a result, a plurality of cutting grooves that are orthogonal to each other are formed, and a large number of emitters 15 are formed in a region surrounded by the cutting grooves.
Is formed. The emitter 15 thus obtained
Is a shape in which a plurality of regular quadrangular pyramids (pyramid shapes) are overlapped with each other, and the quadrangular pyramid on the tip side of the emitter has a steeper slope. That is, the quadrangular pyramid on the tip side has a higher aspect ratio.

FIG. 7 shows a plane structure of the field emission type cold cathode obtained by the above steps, and FIG. 8 shows
It is a perspective view showing the shape of each emitter 15.

Although a multi-bite structure is used in the above example, a plurality of cutting tools having different apex angles are used for cutting with a cutting tool having a larger apex angle, and then a cutting tool having a smaller apex angle. You may be allowed to do.

The electron emission efficiency of the field emission type emitter is greatly influenced by the aspect ratio of the emitter in addition to the tip radius of curvature and the work function of the emitter. The higher the aspect ratio, especially the aspect ratio of the tip of the emitter, the higher the field electron emission efficiency, but it has been difficult to form an emitter having such a structure by the conventional method. In the present embodiment, since the aspect ratio becomes higher toward the tip end side of the emitter, the field electron emission efficiency can be effectively increased.

Further, in the present embodiment, since the area of the bottom of the emitter can be increased, there is an effect that the strength against thermal deformation and the like, the thermal conductivity and the like are increased.

In the present embodiment, the emitter shape is formed by stacking the quadrangular pyramids in two steps, but the emitter shape may be formed by stacking the triangular pyramids. Further, as shown in FIG. 9, the emitter shape may be such that these pyramids are stacked in three or more steps. Furthermore, as shown in FIG. 10, it is also possible to form an emitter shape in which wedge-shaped shaped bodies are stacked in two or more stages.

(Embodiment 3) FIGS. 11A to 11E show
It is a schematic diagram which showed the manufacturing process of the field emission type cold cathode which concerns on the 3rd Embodiment of this invention, Based on the figure, the manufacturing method of the field emission type cold cathode in this embodiment is demonstrated.

First, as shown in FIG. 11A, a substrate manufactured by the method described in the first or second embodiment is prepared as a first master 21. Here, the first
The substrate obtained by the method of the embodiment of
Set to 1. On the first master 21, a convex portion 22 having a shape corresponding to the emitter is formed.

Next, as shown in FIG. 11 (b), the surface of the first master 21 is degreased and further activated with a fluoride such as ammonium fluoride, and then electroless Ni plating and electrolytic Ni plating are performed. The first material layer 2 adhered to the surface of the first master 21 by using a plating method or an electrolytic plating method.
3 is formed.

Next, as shown in FIG. 11C, the first material layer 23 is peeled off from the first master 21, so that
A mold mold substrate 23a (second master) having a large number of sharp concave portions 24 corresponding to the convex portions 22 of the first master 21 is formed (for example, a Ni mold mold substrate having a supporting layer having a thickness of 50 μm). .

The die mold substrate to be the second master 23a is formed by electroplating as a metal die, as well as by a resin die, or a ceramic green sheet or the like that is pressed and fired. It is also possible to use a method of forming a mold.

Next, as shown in FIG. 11 (d), the surface of the second master 23a is degreased or anodized so that the Ni plating layer formed in a later step is easily peeled off. Keep it. After that, the second material layer 25 that adheres to the surface of the second master 23a is formed. The second material layer 25 is formed by Ni plating (for example, Ni electroforming) or by electroless Ni plating and then Ni electroforming. In addition, when the Ni plating layer which becomes the second material layer 25 is thin, a glass substrate or the like may be lined on the Ni plating layer.

Next, as shown in FIG. 11 (e), the second material layer 25 is peeled off from the second master 23a, so that the shape corresponding to the recess 24 of the second master 23a, that is, the first master 23a. A large number of sharp protrusions (emitters 25a) having a shape corresponding to the protrusions 22 of the master 21 are integrally formed with the base portion 25b.

The field-emission cold cathode manufactured by the above method can be used as it is in various electronic devices, but by further performing the following steps, a gated emitter used for FED or the like is manufactured. It is also possible to do so.

That is, after the step of FIG. 11E, a silicon oxide film, a silicon nitride film or the like is used as an insulating layer between the gate and the emitter by using the CVD method, the sputtering method, the electron beam evaporation method, the printing method or the like. , On the substrate on which the emitter is formed. Subsequently, nickel, chromium, tungsten, or the like is formed as a gate electrode layer over the insulating layer by electroless plating, electroplating, a printing method, a sputtering method, an evaporation method, or the like. After that, CMP method, CDE method, RI
A gated emitter can be manufactured by opening a region corresponding to the tip of the emitter by using the E method, the wet etching method, or the like.

Further, by arranging a plurality of field emission cold cathodes having a large number of emitters obtained in this embodiment by a method such as tiling, a large area field emission cold cathode can be manufactured. is there.

As described above, in the present embodiment, the second master is produced based on the first master obtained by the cutting process, and the field emission type having a large number of emitters is manufactured by using the second master. A cold cathode is manufactured, and a large number of sharp emitters can be manufactured with good reproducibility. The tip of the recess of the second master can be sharply pointed by a growth action or the like in the recess by electroplating, and an emitter having excellent sharpness can be formed.

Although the respective embodiments of the present invention have been described above, the field emission cold cathode manufactured according to the present invention is
A plurality of emitters may be arranged and used, or a single emitter may be used. Specific applications of the field emission cold cathode manufactured by the present invention include FED and GT.
O, ultra-high speed devices, emitters such as photomultiplier tubes, and FE
It can also be used as an emitter for SEM, STM and the like.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be carried out without departing from the spirit of the present invention.

[0070]

According to the present invention, by using precision cutting, it is possible to obtain a field emission type cold cathode having excellent field emission uniformity and field emission efficiency and high productivity.

[Brief description of drawings]

FIG. 1 is a process sectional view showing an example of a method of manufacturing a field emission cold cathode according to a first embodiment of the present invention.

FIG. 2 is a plan view showing an example of the configuration of the field emission cold cathode according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing an example of a structure of an emitter of the field emission cold cathode according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing another example of the configuration of the emitter of the field emission cold cathode according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing another example of the configuration of the emitter of the field emission cold cathode according to the first embodiment of the invention.

FIG. 6 is a process sectional view showing an example of a method for manufacturing a field emission cold cathode according to a second embodiment of the present invention.

FIG. 7 is a plan view showing an example of a configuration of a field emission cold cathode according to a second embodiment of the present invention.

FIG. 8 is a perspective view showing an example of a structure of an emitter of a field emission cold cathode according to a second embodiment of the present invention.

FIG. 9 is a perspective view showing another example of the structure of the emitter of the field emission cold cathode according to the second embodiment of the present invention.

FIG. 10 is a perspective view showing another example of the configuration of the emitter of the field emission cold cathode according to the second embodiment of the present invention.

FIG. 11 is a process cross-sectional view showing an example of the method for manufacturing the field emission cold cathode according to the third embodiment of the invention.

[Explanation of symbols]

11 ... Substrate 12 ... Diamond bite 13 ... Cutting groove 14 ... Triangular Mausoleum 15 ... Emitter 16 ... Base part 21 ... First master 22 ... Projection 23 ... First material layer 23a ... second master 24 ... Recess 25 ... Second material layer 25a ... emitter 25b ... Base part

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-9-185942 (JP, A) JP-A-8-17331 (JP, A) JP-A-10-92301 (JP, A) JP-A-8- 111171 (JP, A) JP 49-60169 (JP, A) JP 50-114969 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01J 9/02 H01J 1 / 30

Claims (3)

(57) [Claims] 1. A method of manufacturing a field emission cold cathode, comprising forming a region surrounded by a plurality of cut portions as an emitter by cutting a substrate surface in a plurality of directions with a cutting tool, wherein the emitter has a shape of , A first trapezoidal body obtained by cutting a pyramid in a plane parallel to the bottom surface with the cut surface as an upper surface, or a shape body in which a plurality of first trapezoidal bodies are stacked in stages A second trapezoidal shape body or a second trapezoidal shape body obtained by cutting the wedge shape into a plane parallel to the bottom surface of the convex shape corresponding to the shape in which the pyramidal shape bodies are stacked on the upper surface of the A field emission type cold cathode characterized by having a convex shape corresponding to a shape in which a wedge-shaped body is stacked on the upper surface of one of the shape bodies in which a plurality of trapezoidal bodies are stacked in stages. Production method. 2. By cutting the substrate surface in a plurality of directions
The area surrounded by multiple cuts as an emitter
The method of manufacturing a field emission cold cathode according to claim 1, wherein the shape of the emitter is a first trapezoidal shape body or a first trapezoidal shape obtained by cutting a pyramid with a plane parallel to a bottom surface thereof. A convex shape corresponding to a shape in which pyramidal shaped bodies are stacked on the upper surface of one of the shaped bodies stacked stepwise in multiple stages, or a wedge-shaped shape is cut by a plane parallel to the bottom surface. A shape in which a wedge-shaped body is stacked on the upper surface of any one of the second trapezoidal body or the shape body in which a plurality of second trapezoidal bodies are stacked stepwise in some cases with the cut surface as the upper surface. It is a corresponding convex shape, and by performing cutting with a plurality of cutting members having different cutting angles in at least one direction, it is possible to form the convex shaped emitter surrounded by a plurality of cutting portions. electric field, characterized Method of manufacturing output type cold cathode. 3. At least 2 obtained by cutting with a cutting tool
It has an emitter surrounded by a plurality of cutting parts in the direction or more, and the shape of this emitter is a first trapezoidal shape body or a first trapezoidal shape obtained by cutting the pyramid with a plane parallel to the bottom surface. A first convex shape corresponding to a shape in which a pyramidal shape body is stacked on the upper surface of any one of the shape bodies in which a plurality of one trapezoidal shape bodies are stacked in stages or a wedge shape is parallel to the bottom surface. A wedge-shaped body on the upper surface of any one of a second trapezoidal body or a shape body obtained by stacking a plurality of second trapezoidal bodies in a stepwise manner when the cut surface is obtained as an upper surface when cut in a flat plane. Is a second convex shape corresponding to the stacked shape, and the slopes of the slopes of the first trapezoidal shaped body and the pyramidal shaped body forming the first convex shape are steeper as they are located higher, Second trapezoidal body that constitutes the second convex shape Field emission cathode, characterized in that the inclination of the slope of the fine wedge shape body is steep as those located above.