JP3476098B2 - Exposure equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for manufacturing semiconductor elements and liquid crystal display substrates, and more particularly to a scanning type exposure apparatus having a plurality of illumination optical systems and projection optical systems.

[0002]

2. Description of the Related Art In recent years, liquid crystal display substrates have been widely used as display elements for personal computers, televisions and the like. This liquid crystal display substrate is formed by patterning a transparent thin film electrode on a glass substrate into a desired shape by a photolithography method. As an apparatus for this lithography, there is used a projection exposure apparatus that exposes an original image pattern formed on a mask onto a photoresist layer on a glass substrate via a projection optical system.

Further, recently, a liquid crystal display substrate is required to have a large area, and accordingly, in the above projection exposure apparatus, it is desired to enlarge a projection area. As a means for enlarging the projection area, a scanning exposure apparatus provided with a plurality of projection optical systems has been proposed. That is, a plurality of illumination optical systems are provided, and the mask is illuminated with the light flux emitted from each illumination optical system.
An image of the illuminated mask is formed on a projection area on a glass substrate via a plurality of corresponding projection optical systems.

More specifically, after the light flux emitted from the light source is made uniform in the amount of light through an optical system including a fly-eye lens and the like, it is shaped into a desired shape by a field stop to illuminate the pattern surface of the mask. . A plurality of illumination optical systems having such a configuration are arranged, and the individual illumination areas on the mask are illuminated with the light beams emitted from each illumination optical system. The light flux transmitted through the mask forms a pattern image of the mask on the projection area on the glass substrate through the corresponding projection optical system. Then, by synchronously scanning the mask and the glass substrate with respect to the plurality of projection optical systems, the entire surface of the pattern area on the mask is transferred onto the glass substrate.

By the way, in the scanning type exposure apparatus as described above, it is required that the intensities of the luminous fluxes of the plurality of illumination optical systems be made uniform. That is, if there is an error in the intensity of the illumination light in each illumination area on the mask, the line width of the transferred pattern will be different in each projection area on the glass substrate. In particular, when manufacturing an active matrix liquid crystal device, the quality of the device deteriorates as a change in contrast.

FIG. 5A shows three adjacent projection areas P.
It is a figure which shows A1-PA3. In FIG. 5A, each of the projection areas PA1 to PA3 has the same trapezoidal shape,
Projection areas adjacent to each other (for example, PA1 and PA2, PA
2 and PA3) are arranged so as to be displaced from each other by a predetermined amount in the scanning direction shown in the figure. Further, the bottom side and the top side of each trapezoid extend in a direction orthogonal to the scanning direction (hereinafter, simply referred to as "scanning orthogonal direction"), that is, in the horizontal direction in the drawing. Then, the triangular areas (hereinafter, referred to as “joint portions”) in which the ends of the adjacent projection areas project are arranged so as to overlap in the scanning orthogonal direction within the range indicated by the broken line in the drawing. In this way, the sum of the lengths of the projection regions along the scanning direction is substantially constant at any position in the scanning orthogonal direction.

Further, FIG. 5B shows the projection areas PA1 to P1.
The typical intensity distribution of the light flux in A3 is shown. That is, FIG. 5B is a plot of the intensity of the light flux at both ends and the center of each projection region along the scanning orthogonal direction. As shown in FIG. 5B, each projection area PA
The light intensities of 1 to PA3 are the central positions P2, P5 and P
8 is substantially the same, but so-called tilt unevenness in which the intensity changes substantially linearly in the vertical orthogonal direction in each projection region is likely to occur.

[0008]

The conventional scanning type exposure apparatus has no means for detecting and correcting even if uneven tilt occurs in the scanning orthogonal direction in each projection region. When exposure scanning is performed in the scanning direction in the state where the tilt unevenness in the scanning orthogonal direction is generated, the tilt unevenness of the exposure light amount remains in the scanning orthogonal direction as it is. Therefore, there is a disadvantage that each region of the photosensitive substrate cannot be subjected to scanning exposure with a constant exposure light amount. The present invention has been made in view of the above-mentioned problems, and corrects the unevenness of inclination in the scanning orthogonal direction in each illumination region, and each region of the photosensitive substrate can be scanned and exposed with a constant exposure light amount. The purpose is to provide a device.

[0009]

In order to solve the above problems, in the present invention, the mask and the photosensitive substrate are provided for a projection optical system for forming an image of the mask having a predetermined pattern on the photosensitive substrate. An exposure apparatus that projects and exposes the pattern of the mask onto the photosensitive substrate by the projection optical system while relatively moving and in a predetermined direction, a plurality of illumination optical systems that respectively form a plurality of illumination areas on the mask. A plurality of projection optical systems that respectively form images of the plurality of illumination areas on the mask in a plurality of projection areas on the photosensitive substrate, and the predetermined direction in each of the plurality of projection areas on the photosensitive substrate. Based on the detection means for detecting the light intensity distribution along the direction orthogonal to each other and the detection result by the detection means, it is possible to detect the light intensity distribution in each of the plurality of projection regions on the photosensitive substrate. And a control means for controlling each of the plurality of illumination optical systems so that the light intensity distribution is substantially constant along the direction orthogonal to the predetermined direction. Provide a device.

According to a preferred aspect of the present invention, the control means drives a lens for rotating a predetermined lens in each illumination optical system in a plane including a direction orthogonal to the predetermined direction and an optical axis. Equipped with means. In this case, the plurality of illumination optical systems each have an optical integrator that forms a large number of secondary light sources based on the light flux from the light source, and a condensing optical system that condenses the light from the optical integrator, It is preferable that the predetermined lens is a negative lens of the lenses forming the condensing optical system. In order to solve the above problems, in the present invention,
Form an image of a mask with a predetermined pattern on the photosensitive substrate
With respect to the projection optical system, the mask and the photosensitive substrate
While relatively moving in a predetermined direction, the projection optical system
And project the pattern of the mask onto the photosensitive substrate.
In a light exposure method, using multiple illumination optics
A plurality of illumination areas are formed on the mask,
The plurality of illuminated areas on the mask using projection optics
Image on each of the plurality of projection areas on the photosensitive substrate
And in each of the plurality of projected areas on the photosensitive substrate
Measures the light intensity distribution along the direction orthogonal to the specified direction
Then, based on the measured light intensity distribution,
Light intensity component in each of the plurality of projection regions on the optical substrate
The cloth is substantially constant along the direction orthogonal to the predetermined direction
To control the plurality of illumination optics.
A characteristic exposure method is provided.

[0011]

In the present invention, the light intensity distribution along the scanning orthogonal direction in each of the plurality of projection areas on the photosensitive substrate is detected so that the light intensity distribution becomes substantially constant along the scanning orthogonal direction. In other words, each illumination optical system is controlled so that the unevenness of inclination is substantially eliminated. Specifically, the lens included in each illumination optical system is rotated (tilted) in a plane including the scanning orthogonal direction and the optical axis, or decentered (shifted) in the scanning orthogonal direction in the plane orthogonal to the optical axis. ) To correct the unevenness of inclination.

As described above, in the exposure apparatus of the present invention, even if unevenness in tilt occurs in the scanning orthogonal direction in each projection area due to each projection optical system, this can be corrected. Therefore, it is possible to minimize the change in the light intensity distribution over the entire photosensitive substrate and perform scanning exposure with a constant exposure light amount on each projection region of the photosensitive substrate. As a result, the transfer accuracy is improved and the quality of the manufactured device is significantly improved.

[0013]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram schematically showing the configuration of an exposure apparatus according to an embodiment of the present invention. The illustrated apparatus includes three light sources 1 which are, for example, ultra-high pressure mercury lamps. The light flux L emitted from each light source 1 is condensed via the elliptical mirror 2 and is incident on the incident end of the light guide 20. The light guide 20 is made of, for example, a plurality of randomly bundled optical fibers and has three entrance ends and five exit ends. And, regardless of the fluctuation of the output of each light source 1,
The number of optical fibers is evenly branched to each exit end so that the amount of light flux output from each exit end is substantially constant.

In this way, the light from each exit end of the light guide 20 forms a secondary light source in each illumination optical system.
The light from each exit end is converted into a parallel light flux through the lens 3, and then passes through a transmittance adjusting filter 14 such as an optical modulator whose transmittance changes according to an applied voltage, and serves as an optical integrator. Incident on the fly-eye lens 4. The light whose intensity is made uniform through the fly-eye lens 4 is shaped into a desired shape, for example, a trapezoidal shape, by the field stop 7 through the half mirror 5 and the lens system 6. The light beam shaped into a trapezoid by the field stop 7 forms an image of the field stop 7 on the pattern surface of the mask 9 via the lens system 8. The lens system 6 is composed of a positive lens component 6a, a negative lens component 6b, and a positive lens component 6c in order from the light source side.

Thus, the light source 1 which is a common component
And the light guide 20, the lens 3, the transmittance adjusting filter 14, the fly-eye lens 4, the half mirror 5,
The lens system 6, the field stop 7 and the lens system 8 constitute one illumination optical system. It should be noted that FIG. 1 shows the overall configuration of only the first illumination optical system LO1, and only some of the configurations of the other four illumination optical systems LO2 to LO5.

Light fluxes from the respective illumination optical systems illuminate individual small areas (illumination areas) on the mask 9. The luminous fluxes that have passed through the respective illumination areas on the mask 9 correspond to the corresponding equal-magnification erecting projection optical systems PL1 to PL.
Each projection area on the photosensitive substrate 10 is irradiated via the light source 5. In this way, a pattern image corresponding to each illumination area of the mask 9 is formed in each projection area on the photosensitive substrate 10.

FIG. 2 is a diagram showing a projection area on the photosensitive substrate in the above-mentioned embodiment. As shown in the drawing, each projection area has the same trapezoidal shape, and adjacent projection areas (for example, PA1 and PA2, PA2 and PA3) are arranged side by side so as to be displaced from each other by a predetermined amount in the X direction (scanning direction). There is. Further, the bottom side and the top side of each trapezoid extend in the Y direction (scanning orthogonal direction) as a whole. The joints of the adjacent projection areas are arranged so as to overlap each other in the Y direction (scanning orthogonal direction) within the range indicated by the broken line in the drawing. In other words, X at any position in the Y direction (scanning orthogonal direction)
The total length of the projection areas along the direction (scanning direction) is configured to be substantially constant.

The projection areas PA1 to P1 as described above are provided.
A plurality of corresponding projection optical systems PL1 to PL5 and illumination optical systems LO1 to LO5 are also provided so as to obtain the arrangement A5.
It is arranged similarly to the projection areas PA1 to PA5. Then, by synchronously scanning the mask 9 and the photosensitive substrate 10 in the X direction (direction perpendicular to the paper surface in FIG. 1) with respect to the projection optical systems PL1 to PL5, the entire surface of the pattern area on the mask 9 is scanned. Transfer to the exposure area EA on the photosensitive substrate 10.

Further, a part of the light flux L is reflected by the half mirror 5 provided in the optical path of each of the illumination optical systems LO1 to LO5, and is made incident on the detector 11. Detector 1
1 is a signal P1 obtained by receiving an incident light beam and performing photoelectric conversion
To P5 are output to the signal processing device 12. Signal processing device 1
In 2, the intensity of the luminous flux of each illumination optical system is obtained based on the signals P1 to P5, and the intensity showing the lowest value among the intensities is set as the reference value. Upon receiving the light intensity information from the signal processing device 12, the filter driving unit 15 appropriately adjusts the transmittance of the transmittance adjusting filter 14 of each illumination optical system so that the intensities of the other light fluxes substantially match the reference value. change.

As described above, even if the output of each light source 1 fluctuates, substantially the same amount of light is obtained at each output end of the light guide 20, so that the light intensity detected by the detector 11 is different for each illumination optical system. About equal. However, as in this embodiment, by providing the transmittance adjusting filter 14 to correct the intensity of the luminous flux of each illumination optical system,
The intensity of the luminous flux of each illumination optical system can be more accurately made constant.

FIG. 3 is a diagram for explaining the correction of inclination unevenness in the projection area. FIG. 3A shows the light intensity distribution before inclination unevenness correction for the three adjacent projection areas PA2 to PA4 in FIG. (B) shows the light intensity distribution after the correction of the unevenness of inclination. Hereinafter, with reference to FIG. 3, an operation of correcting unevenness in inclination will be described.

First, prior to projection exposure, the detector 16 is scanned in the Y direction (scanning orthogonal direction) within a plane having the same height as the photosensitive substrate 10 as shown in FIG. The light intensity distribution along is measured and stored. Specifically, in FIG. 2, the intensity of the light flux is measured at positions P1 to P9 at the center and both ends along the Y direction (scanning orthogonal direction) of each of the projection areas PA2 to PA4. The measured light intensity information is input to the signal processing device 12. In this way, in the signal processing device 12, FIG.
As shown in (a), a light intensity distribution that changes substantially linearly in the scanning orthogonal direction is obtained for each projection region.

Next, receiving the light intensity distribution information from the signal processing device 12, the lens driving section 17 appropriately tilts the negative lens 6b of the lens system 6 of each illumination optical system as indicated by the arrow in the figure. That is, in the plane of the paper of FIG.
Rotate b as appropriate. In this way, the light intensity distribution in the scanning orthogonal direction in each projection region can be made substantially constant as shown in FIG. As described above, since the intensities of the light fluxes at the center positions P2, P5, and P8 of the respective projection areas are substantially equal to each other, by correcting the inclination unevenness of each projection area, all the projection areas are covered. The light intensity can be made substantially uniform over the entire area.

After correcting the inclination unevenness as described above, when the light intensity of the joint portion is different between the adjacent projection areas, the light intensity of the adjacent joint portions should be substantially equal to each other. The transmittance adjusting filter 14 may be appropriately controlled. Further, in the above-described embodiment, each illumination optical system has the common light source 1 and the light guide 20, and each emission end of the light guide 20 serves as a secondary light source. Instead of such a configuration using the light guide 20, each illumination optical system may have a light source. An embodiment in which each illumination optical system has a light source will be described below with reference to FIG.
In FIG. 4, members having the same functions as those of the embodiment shown in FIG. 1 are designated by the same reference numerals.

In FIG. 4, a light flux L emitted from the light source 1
Is condensed through the elliptical mirror 2 and then converted into a parallel light flux through the lens 3. The light flux passing through the lens 3 passes through the transmittance adjusting filter 14, the fly-eye lens 4, the half mirror 5, the lens system 6, the field stop 7 and the lens system 8 in this order, as in the embodiment of FIG. Form an illuminated area on top. Note that FIG. 4 shows the overall configuration of only the first illumination optical system LO1, and only the configurations of the positions of the other four illumination optical systems LO2 to LO5.

The embodiment of FIG. 4 differs from the embodiment of FIG. 1 in that the signal processing device 12 controls the power supply 13 for adjusting the voltage applied to the light source 1 in each illumination optical system. Here, the signal processing device 12 includes the detector 11
The intensities of the luminous fluxes of the respective illumination optical systems are obtained based on the signals P1 to P5 from, and the intensity showing the lowest value among the intensities is set as the reference value. Further, the signal processing device 12 controls the voltage applied to each light source of the power source 13 so that the intensities of the other light fluxes substantially match this reference value.

In this embodiment, when a specific light source 1 of the plurality of illumination optical systems LO1 to LO5 is replaced with a new light source, the new light source has a significantly higher brightness than other light sources. However, it is difficult to correct the intensity of each light flux only by adjusting the applied voltage by the power source 13. In this case, by changing the transmittance of the transmittance adjusting filter 14 arranged in the optical path in each of the illumination optical systems LO1 to LO5, correction is performed so that the intensity of each light flux of each illumination optical system becomes constant. do it.

Further, in each of the above-mentioned embodiments, the transmittance adjusting filter is used as the light intensity correcting means, but an ND filter capable of moving back and forth in the optical path of each illumination optical system may be used. In this case, a plurality of ND filters having different transmittances may be prepared, and these ND filters may be used alone or in combination.

In each of the above-described embodiments, the lens 6b is tilted to correct the unevenness of inclination. However, the lens 3 on the light source side of the fly-eye lens is shifted in the direction of the arrow in FIG. May be corrected. In this case, it is desirable that no change such as telecentricity occurs in the corresponding projection area.

In each of the above embodiments, the lens in each illumination optical system is tilted and shifted to correct the unevenness of inclination, but instead of this, for example, Japanese Patent Laid-Open No. 2-1701
The technique disclosed in Japanese Patent No. 52 may be used to correct the tilt unevenness. Briefly, in FIGS. 1 and 4, the fly-eye lens 4 of each of the illumination optical systems LO1 to LO5 is
In the optical path between the lens system 6 and the lens system 6, a substrate coated with a dielectric multilayer film having an angular transmittance characteristic is provided in each illumination optical system LO1.
It is provided so that the inclination angle of LO5 to the optical axis is variable. At this time, the signal processing device 12 determines that each illumination optical system LO
The light intensity distribution information on the photosensitive substrate 10 is transmitted to an inclination adjusting unit (not shown) that changes the inclination of the substrate in 1 to LO5. The tilt adjusting unit adjusts the tilt angle of the substrate in each of the illumination optical systems LO1 to LO5 based on the light intensity distribution information so that the light intensity distribution in the scanning orthogonal direction in each projection region is substantially constant. Thereby, the light intensity can be made substantially uniform over the entire projection area.

It is also possible to provide a parallel plane plate having a variable tilt angle with respect to the optical axis of each of the illumination optical systems LO1 to LO5 on the light source side of the fly-eye lens 4. At this time, by tilting the plane-parallel plate with respect to the optical axis, the light flux incident on the fly-eye lens 4 moves parallel to the optical axis, so that the intensity distribution of the light flux on the incident surface of the fly-eye lens 4 is Change. As a result, unevenness in tilt occurs in the light flux from the fly-eye lens 4 via the lens system 6. Therefore, the tilt angles of the plane parallel plates of the illumination optical systems LO1 to LO5 may be adjusted so as to correct the tilt unevenness in the scanning orthogonal direction in each projection region.

In each of the above-described embodiments, the projection areas in FIG. 2 partially overlap each other in the scanning orthogonal direction. However, a configuration in which the illumination optical system and the projection optical system that form the projection areas PA2 and PA4 of FIG. 2 are not provided may be adopted. In this case, after the mask 9 and the photosensitive substrate 10 are scanned in the X direction, the mask 9 and the photosensitive substrate 10 are moved in the Y direction by a predetermined distance and again scanned in the X direction to expose the entire pattern area of the mask. It can be transferred onto a substrate.

Further, in each of the above-described embodiments, the exposure apparatus using the projection optical system of equal magnification has been described, but the present invention is also applicable to the exposure apparatus using the projection optical system having a predetermined magnification. You can Furthermore, in each of the above-described embodiments, the exposure apparatus using the refraction-type projection optical system has been described, but the present invention can also be applied to the exposure apparatus using the reflection-type projection optical system. Further, in each of the above-described embodiments, the aperture shape of the field stop is trapezoidal in each illumination optical system, but a field stop having a hexagonal aperture may be used, for example.

[0034]

As described above, according to the exposure apparatus of the present invention, even if tilt unevenness occurs in the scanning orthogonal direction in each projection area, it can be corrected. Therefore, each projection area of the photosensitive substrate can be scanned and exposed with a constant exposure light amount, and as a result, the transfer accuracy is improved and the quality of the manufactured device is significantly improved.

[Brief description of drawings]

FIG. 1 is a diagram schematically showing a configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a projection area on a photosensitive substrate in the apparatus of FIG.

3A and 3B are diagrams illustrating correction of tilt unevenness in a projection area of the apparatus of FIG. 1, in which FIG. 3A is a light intensity distribution before tilt unevenness correction, and FIG. 3B is a light intensity distribution after tilt unevenness correction. Are shown respectively.

FIG. 4 is a diagram schematically showing a configuration of an exposure apparatus according to another embodiment of the present invention.

FIG. 5 is a diagram for explaining the inconvenience of the prior art,
(A) is a projection area PA by three adjacent projection optical systems
1 is a diagram showing PA3, (b) is a projection area PA1
It is a figure which shows the typical intensity distribution of the exposure light beam in -PA3.

[Explanation of symbols]

1 light source 2 elliptical mirror 3 lenses 4 fly eye lens 5 half mirror 6 lens system 7 Field stop 9 mask 10 Photosensitive substrate 11 detector 12 Signal processing device 14 Transmittance adjustment filter 15 Filter driver 16 detector 17 Lens drive 20 Light guide

─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-6-232030 (JP, A) JP-A-2-170152 (JP, A) JP-A-60-109228 (JP, A) JP-A-5- 283317 (JP, A) JP-A-4-180613 (JP, A) JP-A-6-181162 (JP, A) Actual development 5-81841 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/027 G03F 7/20 521

Claims (12)

(57) [Claims] 1. A mask that is moved by the projection optical system while moving the mask and the photosensitive substrate in a predetermined direction relative to a projection optical system that forms an image of a mask having a predetermined pattern on the photosensitive substrate. A plurality of illumination optical systems that respectively form a plurality of illumination areas on the mask, and an image of the plurality of illumination areas on the mask. A plurality of projection optical systems respectively formed in the plurality of projection regions above, and a detection unit for detecting a light intensity distribution along a direction orthogonal to the predetermined direction in each of the plurality of projection regions on the photosensitive substrate, A light intensity distribution in each of the plurality of projection regions on the photosensitive substrate based on a detection result by the detection means is substantially along a direction orthogonal to the predetermined direction. As a constant, the exposure apparatus characterized by comprising a control means for controlling each of the plurality of illumination optical systems. 2. The control means includes lens driving means for rotating a predetermined lens in each illumination optical system in a plane including a direction orthogonal to the predetermined direction and an optical axis. The exposure apparatus according to claim 1, which is characterized in that 3. The plurality of illumination optical systems each include an optical integrator that forms a large number of secondary light sources based on a light beam from a light source, and a condensing optical system that condenses light from the optical integrator. However, the said predetermined lens is a negative lens among the lenses which comprise the said condensing optical system, The exposure apparatus of Claim 2 characterized by the above-mentioned. 4. The control means includes lens driving means for eccentricizing a predetermined lens in each illumination optical system in a direction orthogonal to the predetermined direction in a plane orthogonal to the optical axis. The exposure apparatus according to claim 1. 5. The plurality of illumination optical systems include a lens system that converts light from a light source in the plurality of illumination optical systems into a parallel light beam, and a plurality of two optical systems based on the parallel light beam through the lens system. The exposure apparatus according to claim 4, further comprising an optical integrator that forms a secondary light source, and the predetermined lens is a positive lens of the lenses that form the lens system. 6. A second detection unit for detecting the intensity of each light beam of the plurality of illumination optical systems, and a light beam of each of the plurality of illumination optical systems based on a detection result of the second detection unit. A second control for controlling each of the plurality of illumination optics so that the intensity is substantially constant.
The exposure apparatus according to claim 1, further comprising a control unit. 7. The second control means is a transmittance adjusting filter arranged in the optical path of each illumination optical system and having a variable transmittance, and a transmittance controlling means for controlling the transmittance of the transmittance adjusting filter. 7. The method according to claim 6, further comprising:
The exposure apparatus according to. 8. The exposure apparatus according to claim 6, wherein the second control unit includes an output control unit for controlling the output of the light source of each illumination optical system. 9. A mask having a predetermined pattern and a photosensitive substrate.
A plate for forming an image of the mask on the photosensitive substrate.
While moving with respect to the shadow optical system, the pattern of the mask is moved.
In an exposure method for projecting and exposing a photosensitive layer onto the photosensitive substrate, the exposure apparatus according to any one of claims 1 to 8 is used.
The plurality of images on the plurality of projection areas on the photosensitive substrate.
An exposure method characterized by forming. 10. An image of a mask having a predetermined pattern is formed.
For the projection optical system formed on the photosensitive substrate, the mask
While relatively moving the photosensitive substrate and the photosensitive substrate in a predetermined direction,
The projection optical system allows the pattern of the mask to be sensed.
In an exposure method of projecting and exposing on a light substrate, a plurality of illumination areas are formed on the mask by using a plurality of illumination optical systems.
Regions, and a plurality of projection optics are used to form the plurality of illumination areas on the mask.
The image of the bright area is projected onto the plurality of projection areas on the photosensitive substrate, respectively.
Formed on each of the plurality of projection areas on the photosensitive substrate.
The light intensity distribution along a direction orthogonal to the fixed direction is measured, and based on the measured light intensity distribution, the photosensitive group
The light intensity distribution in each of the plurality of projection areas on the plate
To be substantially constant along a direction orthogonal to the predetermined direction.
To control the plurality of illumination optical systems so that
Exposure method. 11. The plurality of projection areas on the photosensitive substrate.
Before the tilt unevenness in each of the
The control of a plurality of illumination optical systems.
11. The exposure method according to 10. 12. The plurality of projection areas on the photosensitive substrate
The light intensity of the joint between the adjacent projection areas in the
The multiple illumination optics are controlled so that they are almost coincident with each other.
The exposure method according to claim 11, wherein the exposure method is controlled.