JP3471133B2 - Cut surface inspection method and device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection of a deviation angle of a cut surface of a plate-shaped single crystal sample (for example, an AT cut plate of quartz) by X-ray diffraction measurement, and the sample according to the deviation angle. The present invention relates to a method and an apparatus for inspecting a cut surface for selecting.

[0002]

2. Description of the Related Art An AT cut plate made of quartz is specified so that a predetermined crystal lattice plane is inclined at a predetermined angle with respect to the cut plane. Explaining the “cut surface”, the outer surface of the cut plate cut into a plate shape is composed of a flat surface and a back surface (there is no distinction between front and back) and side edges connecting them, but And the back side is called "cut side". The tilt angle formed by the cut surface and the crystal lattice surface becomes important as a factor that determines the characteristics of the crystal unit.

In an actual cut plate, the above-mentioned value of the tilt angle slightly deviates from the reference tilt angle due to a cutting error. It is desired that this error be within the range of about 15 seconds. However, the accuracy of the cutting angle of the AT cut plate is usually only about 1 minute. Therefore, in order to obtain an AT-cut plate in which the variation of the deviation with respect to the reference tilt angle (hereinafter referred to as deviation angle) is set within 15 seconds, the deviation angle of the cut AT-cut plate is measured by X-ray diffraction measurement. It is necessary to select the AT cut plate by classifying the deviation angle in 15 second intervals after the inspection. By doing so, it is possible to obtain several groups of AT-cut plates whose variation in deviation angle is within the range of 15 seconds even if the precision of the cutting angle is poor. Each of these groups is effectively used according to the purpose.

FIG. 10 is a perspective view of a quartz AT cut plate. This figure shows how a given crystal lattice plane of the cut plate is inclined with respect to the cut plane. As the coordinate axes, the Z axis is taken perpendicularly to the cut surface 120 of the cut plate, and the X axis and the Y axis which are orthogonal to each other are taken parallel to the cut surface 120. The crystal lattice plane 122 is a (0, 1, -1, 1) plane of quartz, and in the YZ plane, the crystal lattice plane 122 is inclined with respect to the cut plane 120 at a reference inclination angle α. α is, for example, 3 °. Also, XZ
In the plane, the crystal lattice plane 122 is inclined with respect to the cut plane 120 at the reference inclination angle β. β is generally zero. That is, the crystal lattice plane 122 is parallel to the cut plane 120 in the XZ plane. In an actual cut plate, the amount of deviation from the reference inclination angle α, that is, the deviation angle Δα is measured, and the cut plate is selected.

As a conventional cut surface inspection apparatus, an X-ray diffractometer is used to automatically inspect the deviation angle of an AT cut plate of quartz, and the deviation angle is automatically classified by a predetermined step width. There is one that selects AT cut boards. This type of cut surface inspection apparatus is described in Japanese Patent Laid-Open No. 4-252943.

[0006]

The conventional cut surface inspection apparatus described above measures the deviation angle Δα with respect to the reference inclination angle α in the YZ plane of FIG.
In that case, the deviation angle is automatically measured only on one cut surface of the cut plate, and the cut plate is selected based on the measurement result. However, it was found that the selected AT cut plates often contained cut plates having a deviation angle outside the classification range. Upon investigating the cause, it was found that the deviation angle Δα may be different between the front surface and the back surface of the cut plate. That is, even if the deviation angle Δα1 measured on one cut surface of the cut plate belongs to a certain classification range, the deviation angle Δα1 on the other cut surface is
It has been found that α2 may fall outside the classification range. The reason is as follows. If the front and back surfaces of the cut plate are completely parallel and completely flat, the deviation angle Δα1 measured on the front surface and the deviation angle Δα2 measured on the back surface should be the same in principle. . However, if the front surface and the back surface are not perfectly parallel, or if they are not completely flat due to warpage or the like, the deviation angles will be different between the front surface and the back surface.

Further, in FIG. 10, when there are two cut plates having the same deviation angle Δα with respect to the reference inclination angle α, there is a deviation angle with respect to the reference inclination angle β (usually zero) on the XZ plane. Strictly speaking, if Δβ is different between the two cut plates, the crystal lattice plane 122 relative to the cut plane is
The inclination angles of the two cut plates are different from each other. Therefore, the tilt angle of the crystal lattice plane can be measured with high accuracy.
When it is necessary to select, it is necessary to measure the deviation angle from the reference inclination angle not only on the YZ plane but also on the XZ plane.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to automatically measure deviation angles on both the front surface and the back surface in a specific direction, and to measure the deviation angle in the specific direction. An object of the present invention is to provide a method and apparatus for inspecting a cut surface in which the deviation angle is automatically measured in at least one cut surface in the vertical direction to improve the sorting accuracy.

[0009]

According to the present invention, a first sample is used.
After mounting on the sample table and measuring the deviation angle Δα1 on one cut surface of the sample, turn over the sample and then again perform the first
The deviation angle Δα2 for the other cut surface after mounting on the sample table
Is further measured, and the sample is rotated 90 ° around the rotation axis perpendicular to the cut surface, and then the sample is placed on the second sample table,
The deviation angle Δβ is measured on at least one cut surface in the direction perpendicular to the direction in which the two deviation angles are measured, and the sample is sorted and stored according to the measurement results. As a result, the accuracy of measuring the tilt angle of the crystal lattice plane is improved as compared with the conventional method.

The measurement sequence is as follows. First, the deviation angle Δα is measured for two cut surfaces, the sample is rotated by 90 °, and then the deviation angle Δβ is measured for one cut surface.
First, the deviation angle Δβ is measured on one of the cut surfaces, the sample is rotated 90 °, and the deviation angle Δ is measured on the two cut surfaces.
There are two methods of measuring α, and either method may be used. Further, the deviation angle Δβ can also be measured on two cut surfaces, but in that case, it is preferable to provide a sample reversing mechanism on each of the first sample stage and the second sample stage.

[0011]

1 is a plan view showing the construction of an embodiment of the cut surface inspection apparatus of the present invention. This cut surface inspection device is a device for inspecting and selecting the deviation angle of the cut surface of the AT cut plate of quartz. This apparatus is roughly divided into a sample alignment section 12 that aligns the samples 10, a sample supply robot 16 that supplies the sample to the first sample stage 14, and two X-ray diffractions that measure the deviation angle of the cut surface of the sample. Measuring unit 1
8, 19 and the sample reversing mechanism 20 which turns the sample over, and the sample 90 from the first sample stage 14 to the second sample stage 15 in the horizontal plane.
A sample transport robot 24 that transports while rotating, and a sample sorting and storing unit 22 that sorts and stores samples according to deviation angles.
And a sample ejection robot 17 for ejecting the sample from the second sample table 15 to the sample selection storage section 22. Of these, the sample aligning unit 12 and the sample supply robot 16 constitute a sample supply unit, and the sample transport robot 24 and the sample reversing mechanism 2 are included.
0 configures a sample reversing unit, the sample transport robot 24 configures a sample transport unit, and the sample discharge robot 17 and the sample selection storage unit 22 configure a sample discharge unit. The sample transport robot 24 constitutes a part of the sample reversing unit for the functional portion for transferring the sample between the first sample stage 14 and the sample reversing mechanism 20, and the first sample stage 14 to the second sample The platform 15 and the functional portion for transporting the sample constitute a sample transport unit.

The sample aligning unit 12 functions to align a substantially square sample (AT cut plate) by utilizing vibration, and comprises a loading tray 26, a circular vibrating bowl 28, and a linear aligning table 30. Has become. An optical attitude determination device that detects a sample that does not face a predetermined direction and removes it is provided in the middle of the alignment table 30.

FIG. 4 shows the configuration of the attitude determination device. First,
Explaining the shape of the sample 10, it has a square shape with one side of 10 mm and a thickness of 0.1 to 0.4 mm.
C1.5 chamfers 32 are formed at two adjacent apexes. The sample 10 is extruded from the vibrating bowl onto the alignment table with one sides of the squares in contact with each other. However, the direction in which the positions of the two chamfers 32 face is different. Therefore, there is a posture determination device in order to allow only the sample 32 having the correct posture to pass from the sample 10 having the different directions. The attitude determination device includes three pairs of photoelectric detection units, and three light emitting units 3
4a, 34b, 34c and three light receiving parts 36a, 36
b and 36c. The position of the chamfer 32 is detected based on the detection results of the three light receiving portions of these photoelectric detection units, and the quality of the posture of the sample 10 is determined. Figure 4
If the state of the sample 10 shown in is a correct posture,
At this time, the light receiving units 36a and 36b detect light, and the light receiving unit 36c does not detect light. If the detection result is any other combination, it means that the sample 10 is not in the correct posture. Also, if all the photodetectors detect light,
The sample 10 does not exist. When it is detected that the sample 10 is not in the correct posture, the sample 10 is removed from the alignment table by compressed air and is returned to the vibrating bowl.

Returning to FIG. 1, the sample supply robot 16 is
Samples at the tip of the alignment table 30 are supplied to the first sample table 14 one by one. The sample supply robot 16 includes a rotatable horizontal arm 38. Below the tip of the arm 38 is a suction pad capable of sucking a sample by the action of vacuum suction. One side of the sample on the first sample table 14 is pressed against the reference surface, and the sample is accurately oriented.

The first X-ray diffraction measuring section 18 is a stationary X-ray.
It comprises a ray tube 40 and a stationary X-ray detector 42.
Similarly, the second X-ray diffraction measurement unit 19 includes a stationary X-ray tube 41 and a stationary X-ray detector 43. The two X-ray diffraction measurement units 18 and 19 are arranged such that their X-ray optical systems are parallel to each other. With such an arrangement, the two X-ray diffraction measurement units are installed in one cut surface inspection apparatus. It's getting easier. FIG. 7A is a front view of the first X-ray diffraction measurement unit. The X-ray 44 emitted from the X-ray tube 40 hits one cut surface (lower surface) of the sample 10 on the first sample table 14. The X-rays 46 diffracted here are detected by the X-ray detector 42. Three protrusions 48 (which are well shown in FIG. 2) are formed on the first sample table 14, and the sample 10 is mounted on these protrusions 48. In the center of the first sample stand 14,
A groove 50 (see also FIG. 2) is formed to ensure passage of X-rays. As shown in FIG. 7B, the first sample stage 1
4, an air hole 52 is opened, the air hole 52 is connected to a negative pressure source, and the sample 10 is held on the first sample stage 14 by the action of negative pressure.

FIG. 8 shows the sample 10 placed on the first sample table.
It is an enlarged front view of the vicinity. This figure shows the sample 10 on the first sample stage 14 viewed from the lower side of FIG.
For 0, the X-ray diffraction state in the YZ plane of FIG. 10 is shown. The sample 10 shown in this figure is a crystal lattice plane 5 of (0, 1, -1, 1) in an AT cut plate of quartz.
4 is inclined by 3 ° with respect to the cut surface 56 so as to descend to the left in the figure. Incident X-ray 44 is cut surface 5
It is designed to be incident at an angle of 16 ° 20 'with respect to 6. At this time, the diffracted X-ray 46 is diffracted with respect to the incident X-ray 44 at an angle of 26 ° 40 ', and the X-ray detector 4 is directed in this direction.
2 are arranged. The rotation center line 58 of the first sample stage is
The position is adjusted so that it exists on the cut surface 56,
It extends perpendicular to the page. First sample stand and sample 1 on it
0 can be rotated about this rotation center line 58 in a minute angle range, and the crystal lattice plane 54 is determined by finding the angular position of the sample stage when the detected X-ray intensity becomes maximum. It is possible to obtain the deviation angle Δα, which is the degree of deviation with respect to the reference inclination angle α (3 °). When adjusting the origin of the X-ray diffraction measurement unit, a standard sample having a predetermined reference inclination angle is used, and the sample stage is rotated so that the diffracted X-ray from the standard sample can be detected. The position is the origin. An error in the inclination angle of the measurement sample is measured with reference to the inclination angle α of the standard sample, and this is the deviation angle Δα.

FIG. 9A is an enlarged side view of the vicinity of the sample 10 placed on the second sample table 15. In this figure, the second sample stage 15 is viewed from the right side of FIG. The second sample stage 15 can support the sample 10 with a slight inclination so that the crystal lattice plane 54 becomes horizontal. In this sample 10, the crystal lattice plane 54 is tilted by 3 ° with respect to the cut plane in the YZ plane of FIG. 10, so that the crystal lattice plane 54 is supported by tilting the sample 10 by 3 °. Level. To do this, the protrusion 48b is higher than the protrusion 48a. The X-ray optical system is in the XZ plane. In this state, as shown in FIG. 9B, when the X-ray diffraction measurement is performed in the XZ plane, the reference inclination angle β (zero in this example) between the cut plane and the crystal lattice plane is measured in the XZ plane. The deviation angle Δβ can be measured. FIG. 9B shows the second sample stage 15 viewed from the lower side of FIG.

It should be noted that instead of making the heights of the protrusions of the second sample stage 15 different, the protrusions are made to have the same height, and the second sample stage 15
It is also possible to adopt a method of inclining the whole of the above from the horizontal plane by 3 °.

Returning to FIG. 1, the sample transfer robot 24 is
The sample can be transported between the first sample stage 14 and the sample reversing mechanism 20, and between the first sample stage 14 and the second sample stage 15. The sample transport robot 24 is provided with a guide frame 6
A movable table 62 that can reciprocate linearly along 0 is provided. A vacuum suction pad is provided below the tip of the moving table 62.

FIG. 5 is an enlarged perspective view of the sample transfer robot. The moving table 62 is driven by a motor 63 and can move in the direction of arrow 90 along the guide frame 60. Mobile stand 6
A base end of a rotary arm 92 is rotatably supported on the shaft 2. The rotating arm 92 is provided with a motor 94 on the moving base 62.
Thus, it is rotationally driven in the horizontal plane via the pair of toothed pulleys 97, 98 and the toothed belt 96. The toothed pulley 98 is fixed to the rotating arm 92. A suction rod 100 is rotatably supported at the tip of the rotary arm 92. A suction pad 102 is fixed to the lower end of the suction rod 100 so that the sample can be sucked by negative pressure. A toothed pulley 104 is provided at the upper end of the suction rod 100.
Is fixed, and a toothed belt 108 is wound around the toothed pulley 104 on the front end side and the toothed pulley 106 on the base end side. The toothed pulley 106 on the base end side is fixed to the moving base 62. That is, the toothed pulley 10
The shaft fixed to 6 penetrates through the inside of the toothed pulley 98 and the rotary arm 92, and is fixed to the moving base 62. The diameter of the toothed pulley 104 on the front end side is twice the diameter of the toothed pulley 104 on the proximal end side.

The operation of this sample transport robot will be described.
When the motor 94 rotates, the rotating arm 92 rotates clockwise through the toothed belt 96. As a result, the suction rod 100 revolves clockwise around the rotation center of the rotation arm 92. The suction rod 100 is rotatably supported by the rotary arm 92, and the rotation of the suction rod 100 is restricted by the toothed belt 108. Since the toothed pulley 106 on the base end side is fixed to the moving base 62,
When viewed from the rotating rotary arm 92, the toothed pulley 106 on the proximal end side rotates counterclockwise. The toothed pulley 104 on the distal end side rotates in the same direction as the toothed pulley 106 on the proximal end side via the toothed belt 108. Therefore, when viewed from the rotating rotary arm 92, the toothed pulley 104 on the tip side also rotates counterclockwise. Further, since the diameter ratio of the two toothed pulleys 104 and 106 is twice, the toothed pulley 104 on the front end side rotates at half the angular velocity of the toothed pulley 106 on the proximal end side. As can be seen from the above description, the rotating arm 92 is not
When rotated clockwise by 0 °, the toothed pulley 104 and the suction rod 100 rotate counterclockwise by 90 ° with respect to the rotating arm 92. That is, the suction rod 100 is 180 °
It revolves clockwise only and rotates about 90 ° counterclockwise. As a result, the suction rod 100 rotates 90 ° clockwise with respect to the movable table 62.

FIG. 6 shows such a situation. By the negative pressure from the negative pressure introducing tube 110, the first sample stage 14
When the upper sample 10 is sucked by the suction pad 102 and the rotary arm 92 is rotated clockwise by 180 °, the suction pad 102 rotates counterclockwise by 90 ° with respect to the movable table 62 while revolving. This causes the sample 10 to change clockwise by 90 ° in the horizontal plane. Rotating arm 92
When the movable table 62 is moved in the direction of the second sample table along the guide frame during the rotation of the sample in this way, the orientation of the sample is changed by 90 ° and then the sample is placed on the second movable table. be able to.

Returning to FIG. 1, the sample selection storage unit 22 is
0 (only 4 of them are shown) storage boxes 6
6 is provided. The nine storage boxes correspond to nine types of classification ranges of the deviation angle of the cut surface. Surface deviation angle Δα1
If both the deviation angle Δα2 on the back side and the deviation angle Δα2 on the back side belong to the same classification range, the sample is stored in the storage box corresponding to the classification range. Samples (defective parallelism) such that the deviation angles Δα on the front and back sides belong to different classification ranges are stored in the tenth storage box for defective products. A sample (deviation of deviation angle Δβ) having a deviation angle Δβ equal to or larger than the allowable value is also put in the storage box for this defective product.

In this embodiment, the above-mentioned 9 for deviation angle classification is used.
One storage box is 1 depending on the deviation angle Δα of the cut surface of the sample.
It is classified as shown in Table 1 below at intervals of 5 seconds.

[Table 1] First storage box-less than 52.5 seconds 2nd storage box-52.5 seconds or more-less than 37.5 seconds Third storage box −37.5 seconds or more −22.5 seconds or less 4th storage box -22.5 seconds or more-less than 7.5 seconds Fifth storage box -7.5 seconds or more +7.5 seconds or less 6th storage box +7.5 seconds or more +22.5 seconds or less 7th storage box +22.5 seconds or more +37.5 seconds or less Eighth storage box +37.5 seconds or more +52.5 seconds or less 9th storage box + 52.5 seconds or more

FIG. 2 is a perspective view of the sample reversing mechanism 20.
A pair of gripping members 70 and 72 are provided on the rectangular inversion table 68 so as to be openable and closable, and these gripping members are opened and closed by an air cylinder. The reversing table 68 is rotationally driven by a motor 74 via a pair of toothed pulleys and a toothed belt 76. The reversing table 68 rotates about the horizontal rotation axis 73 by 180 ° in one rotation operation. The sample 10 on the first sample table 14 is adsorbed to the adsorption pad 102 of the sample conveyance robot and then conveyed between the holding members 70 and 72 in the open state. When the gripping members 70 and 72 are closed and the sample 10 is held by the gripping members 70 and 72, the suction pad 102 separates from the sample 10. Then, the reversing table 68 is 180 °
When rotated, the sample 10 is turned inside out. The sample 10 turned upside down is adsorbed by the adsorption pad 102, and the gripping member 7
When 0 and 72 are opened, the sample 10 is placed on the first sample stage 10 again.

FIG. 3A shows a gripping member 7 of the sample reversing mechanism.
It is a front sectional view of 0 and 72. The holding member 70 has a recess 7
8 is formed, and the contact body 80 is slidably inserted in the recess 78. A guide rod 82 is fixed to the back surface of the contact body 80, the guide rod 82 penetrates the grip member 70, and a retaining ring 84 is fixed to the exposed portion of the guide rod 82. A compression coil spring 86 is inserted between the contact body 80 and the wall surface of the recess 78. As a result, the contact body 80 is given an elastic force in the direction of protruding from the recess 78 (in the direction of closing the grip member 70) and stops at the retaining ring 84. A groove 88 having a V-shaped cross section is formed in the contact body 80, and the side edge of the sample 10 is sandwiched by the groove 88 from both sides. The other holding member 72 has the same structure. Projecting pieces 130 and 132 are fixed to the gripping members 70 and 72, and the stopper 134 is sandwiched between the projecting pieces 130 and 132. Projecting pieces 130, 132 and stopper 134
Is actually incorporated inside the inversion table 68 of FIG. When the sample 10 carried by the suction pad 77 comes between the gripping members 70, 72, the gripping members 70, 72 are closed.

FIG. 3B shows a state where the gripping members 70 and 72 are closed. The gripping members 70 and 72 move inward by the action of the air cylinder. Protruding piece 130,
When 132 hits the stopper 94, the gripping members 70, 72
Stops. At this time, the side edge of the sample 10 is sandwiched by the groove 88 of the contact body 80. The length of the above-mentioned stopper 134 is set so that the sample 10 is not pressed by the gripping members 70 and 72 more than necessary. The groove 88 is slightly in contact with the side edge of the sample 10, but the groove 88 is
When it contacts 0, the contact body 80 moves backward against the gripping members 70, 72 against the compression coil spring 86. Therefore, the sample 10 is sandwiched by the elastic restoring force of the compression coil spring 86. In this state, the gripping member 7
0 and 72 are rotated by 180 ° around a rotation axis parallel to the cut surface of the sample 10 (perpendicular to the paper surface). As a result, the sample 10 is turned upside down.

Next, the overall operation of this cut surface inspection apparatus will be described. In FIG. 1, first, a large number of samples 10 are loaded into a loading tray 26 of the sample alignment unit 12. The sample falls from the vibrating input tray 26 into the vibrating bowl 28, and the vibrating bowl 2
The vibration of 8 causes the vibration bowl 28 to rotate in a clockwise direction to be aligned along the outer circumference of the vibrating bowl 28. The aligned samples are pushed out to the alignment table 30, but of these samples, those having an inappropriate posture are eliminated by the posture determination unit. The sample at the tip of the alignment table 30 is adsorbed by the adsorption pad of the arm 38 of the sample supply robot 16 and placed on the first sample table 14. When the deviation angle Δα1 of one cut surface (lower surface) of the sample is measured by the first X-ray diffraction measurement unit 18, the sample is adsorbed by the adsorption pad of the moving table 62 of the sample transport robot 24, and the sample reversing mechanism. Sent to 20. The sample is turned upside down by the sample reversing mechanism 20, is again adsorbed by the suction pad of the moving table 62 of the sample transport robot 24, and is placed on the first sample table 14 with the other cut surface facing downward. To be The deviation angle Δα2 is also measured on the other cut surface. When the deviation angles of both cut surfaces are measured, the sample is adsorbed by the adsorption pad of the moving table 62 of the sample transport robot 24 and 90 ° in the horizontal plane.
It is rotated clockwise only and placed on the second sample stage 15. When the second X-ray diffraction measurement unit 19 measures the deviation angle Δβ of the other cut surface of the sample, the sample ejection robot 17 sends the deviation angle Δβ to the sample selection storage unit 22, and the measured deviation angles Δα1, Δα2, According to Δβ, it is dropped into an appropriate storage box 66.

In the above-mentioned embodiment, 9 kinds of deviation angle ranges and 10 kinds of defective products are selected in total. However, it is time-consuming to perform high-precision measurement like the present invention in selecting 100% of cut plates. Therefore, it is not always a good idea in terms of profitability. Therefore, in practice, it is preferable to use the present invention as an apparatus for highly accurately confirming the deviation angle of a sample whose deviation angle has been selected. In this case, the storage box 66 of FIG.
For example, two pieces, one for passing and one for failing, are sufficient. Further, in that case, the data of the three types of deviation angles Δα1, Δα2, and Δβ are aggregated and analyzed, and the appearance frequency at each predetermined angle is displayed as a histogram, instead of simply selecting the pass or fail. It is also possible to implement data management such as.

The present invention is not limited to the above embodiment, but the following modifications are possible. (1) When classifying the deviation angle of the sample, it is possible to classify by any angle step instead of the above 15 second step. (2) The posture determination device for the sample is not limited to the optical posture determination device shown in FIG. 4, and a posture determination method using optical rotation, a posture determination method using low-precision X-ray diffraction measurement, etc. Other means may be used. (3) The mechanism for picking up the sample from the sample table is not limited to the suction pad as described above, and another mechanism may be used. (4) The present invention is applicable not only to an AT cut plate of quartz but also to any cut plate in which a predetermined crystal lattice plane is inclined with respect to the cut surface.

[0031]

According to the present invention, the deviation angle of the crystal lattice plane is measured on both the front surface and the back surface of the cut surface in one direction, and the deviation of the crystal lattice plane is also measured in the direction perpendicular to the one direction. Measuring the corner. Thereby, the sample can be selected by measuring the inclination angle of the crystal lattice plane of the cut plate with high accuracy. Especially for samples where the parallelism between the front surface and the back surface is poor, or for samples where the tilt angle β in the direction perpendicular to the direction of the reference tilt angle α to be selected exceeds the allowable value. However, these can be reliably excluded from the selection target as defective products.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of an embodiment of a cut surface inspection apparatus of the present invention.

FIG. 2 is a perspective view of a sample reversing mechanism.

FIG. 3 is a front sectional view of a gripping member of the sample reversing mechanism.

FIG. 4 is a perspective view of a main part of a posture determination device.

FIG. 5 is an enlarged perspective view of a sample transport robot.

FIG. 6 is a diagram illustrating the operation of the sample transport robot.

FIG. 7 is a front view of an X-ray diffraction measurement unit and a front cross-sectional view of a sample table.

FIG. 8 is an enlarged front view of the vicinity of the sample placed on the first sample stage.

FIG. 9 is an enlarged side view and an enlarged front view of the vicinity of a sample placed on a second sample stage.

FIG. 10 is a perspective view of an AT cut plate of quartz.

[Explanation of symbols]

10 samples 12 Sample alignment section 14 1st sample stand 15 Second sample stand 16 Sample feeding robot 17 Sample ejection robot 18 First X-ray diffraction measurement unit 19 Second X-ray diffraction measurement unit 20 Sample inversion mechanism 22 Sample selection storage 24 Sample transfer robot 40, 41 X-ray tube 42,43 X-ray detector 60 guide frame 62 Mobile platform 66 Storage Box 92 rotating arm 102 suction pad 104 Toothed pulley on the tip side 106 Toothed pulley on the base end side 108 toothed belt

Claims (10)

(57) [Claims] 1. A cut surface inspection apparatus having the following configuration. (A) A sample supply unit that supplies the first sample stage with the sample cut into a plate shape such that the predetermined crystal lattice plane has a predetermined reference inclination angle with respect to the cut surface, aligned in a predetermined direction. (B) By irradiating the sample on the first sample stage with X-rays from the first X-ray source and detecting the diffracted X-rays from this sample with the first X-ray detector, In one vertical plane (hereinafter referred to as YZ plane), the Y of the cut surface
A first X-ray diffraction measurement unit that measures a deviation angle (hereinafter referred to as a YZ deviation angle) from a reference inclination angle on the Z plane. (C) A sample reversing unit that picks up the sample on the first sample table, turns it over, and then returns it to the first sample table. (D) Picking up the sample on the first sample stage and rotating the sample by 90 ° around the axis of rotation perpendicular to the cut surface,
A sample transport unit that supplies this sample to the second sample stage. (E) A sample on the second sample stage is irradiated with X-rays from a second X-ray source, and diffracted X-rays from this sample are detected by a second X-ray detector to form a cut surface. Vertical and said Y
One plane perpendicular to the Z plane (hereinafter referred to as the XZ plane)
A second X-ray diffraction measurement unit for measuring a deviation angle (hereinafter, referred to as XZ deviation angle) of a cut surface from a reference inclination angle on the XZ plane. (F) Taking the sample on the second sample table,
A sample discharging unit that selects samples according to the deviation angle and the XZ deviation angle. 2. The sample transfer section includes a movable table which can reciprocate on a horizontal straight line, a rotary arm which is supported by the movable table and rotatable in a horizontal plane, and which is supported by a tip of the rotary arm. And a suction pad for adsorbing a sample rotatable about a vertical rotation axis, wherein a rotation angle of the suction pad with respect to the rotation arm changes in proportion to a rotation angle of the rotation arm with respect to the moving table. The cut surface inspection device according to claim 1. 3. The rotating arm rotates 180 ° and the suction pad moves in a direction opposite to the rotating arm while the sample transfer section transfers a sample from the first sample stage to the second sample stage. The cut surface inspection device according to claim 2, wherein the cut surface inspection device is rotated by 90 °. 4. The toothed pulley on the base end side fixed to the moving table in a state of being arranged concentrically with the rotation axis of the rotating arm, and the sample transfer section fixed to the suction pad to rotate the sample. A toothed pulley on the tip side rotatable with respect to the arm, and a toothed belt is wound between the toothed pulley on the proximal side and the toothed pulley on the tip side, The cut surface inspection apparatus according to claim 2, wherein the diameter of the toothed pulley is twice the diameter of the toothed pulley on the proximal end side. 5. The sample reversing unit includes a pair of openable and closable gripping members for sandwiching a side edge of the sample, and these gripping members rotate about a rotation axis parallel to a cut surface of the sample. The cut surface inspection apparatus according to claim 1, wherein the cut surface inspection apparatus is capable. 6. A cut surface inspection device having the following configuration. (A) A sample supply unit that supplies the first sample stage with the sample cut into a plate shape such that the predetermined crystal lattice plane has a predetermined reference inclination angle with respect to the cut surface, aligned in a predetermined direction. (B) By irradiating the sample on the first sample stage with X-rays from the first X-ray source and detecting the diffracted X-rays from this sample with the first X-ray detector, Within one vertical plane (hereinafter referred to as the XZ plane), the X of the cut surface
A first X-ray diffraction measurement unit that measures a deviation angle (hereinafter, referred to as an XZ deviation angle) from a reference inclination angle on the Z plane. (C) Picking up the sample on the first sample stage and rotating the sample by 90 ° around the axis of rotation perpendicular to the cut surface,
A sample transport unit that supplies this sample to the second sample stage. (D) By irradiating the sample on the second sample table with X-rays from the second X-ray source and detecting the diffracted X-rays from this sample with the second X-ray detector, Vertical and said X
One plane perpendicular to the Z plane (hereinafter referred to as the YZ plane)
A second X-ray diffraction measurement unit for measuring a deviation angle (hereinafter, referred to as a YZ deviation angle) of a cut surface from a reference inclination angle on the YZ plane. (E) A sample reversing unit that picks up the sample on the second sample stage, turns it over, and then returns it to the second sample stage. (F) Taking the sample on the second sample stage,
A sample discharging unit that selects samples according to the deviation angle and the YZ deviation angle. 7. A cut surface inspection method comprising the following steps. (A) A step of aligning a plate-shaped sample in a predetermined direction so that a predetermined crystal lattice plane has a predetermined reference inclination angle with respect to the cut surface and supplying the sample to the first sample stage. (B) By irradiating one cut surface of the sample on the first sample table with X-rays and detecting diffracted X-rays from the cut surface,
Within one plane (hereinafter referred to as YZ plane) perpendicular to the cut plane, YZ is performed for the one cut plane.
A step of measuring a deviation angle (hereinafter referred to as YZ deviation angle) from a reference inclination angle on a plane. (C) A step of picking up the sample on the first sample stage, turning it over, and supplying the inverted sample to the first sample stage again. (D) By irradiating the other cut surface of the sample on the first sample table with X-rays and detecting the diffracted X-rays therefrom,
Measuring the YZ deviation angle on the other cut surface in the YZ plane. (E) Taking the sample for which the YZ deviation angle has been measured on both cut surfaces from the first sample stand and rotating the sample 90 ° about the axis of rotation perpendicular to the cut surface, and then subjecting this sample to the second Supplying to the sample stage. (F) By irradiating the other cut surface of the sample on the second sample stage with X-rays and detecting diffracted X-rays from the cut surface, one of the cut surfaces is perpendicular to the cut surface and is perpendicular to the YZ plane. A step of measuring a deviation angle (hereinafter, referred to as XZ deviation angle) from a reference inclination angle on the XZ plane with respect to the other cut surface in a plane (hereinafter, referred to as XZ plane). (G) Picking up the sample on the second sample stage and selecting the sample according to the two YZ deviation angles and the XZ deviation angle. 8. The step of supplying a sample from the first sample stage to the second sample stage includes a movable stage capable of reciprocating on a horizontal straight line, and a stage supported by the movable stage and rotatable in a horizontal plane. And a rotation angle of the suction pad with respect to the rotation arm, which is carried out by a sample transfer unit including a rotation arm and a suction pad for adsorbing a sample which is supported on a tip of the rotation arm and is rotatable about a vertical rotation axis. 9. The cut surface inspection method according to claim 7, wherein the change occurs in proportion to a rotation angle of the rotary arm with respect to the movable table. 9. The rotating arm rotates 180 ° while transporting a sample from the first sample stage to the second sample stage,
9. The cut surface inspection method according to claim 8, wherein the suction pad rotates 90 ° in a direction opposite to the rotation arm. 10. A cut surface inspection method comprising the following steps. (A) A step of aligning a plate-shaped sample in a predetermined direction so that a predetermined crystal lattice plane has a predetermined reference inclination angle with respect to the cut surface and supplying the sample to the first sample stage. (B) By irradiating one cut surface of the sample on the first sample table with X-rays and detecting diffracted X-rays from the cut surface,
Within one plane (hereinafter, referred to as XZ plane) perpendicular to the cut surface, XZ is performed for the one cut surface.
A step of measuring a deviation angle (hereinafter referred to as an XZ deviation angle) from a reference inclination angle on a plane. (C) The sample for which the XZ deviation angle has been measured is taken from the first sample stage, the sample is rotated 90 ° around the axis of rotation perpendicular to the cut surface, and then this sample is supplied to the second sample stage. Stages. (D) By irradiating the one cut surface of the sample on the second sample stage with X-rays and detecting diffracted X-rays from the cut surface, one of the cut surfaces is perpendicular to the cut surface and is perpendicular to the XZ plane. A step of measuring a deviation angle (hereinafter, referred to as YZ deviation angle) from a reference inclination angle on the YZ plane for the one cut surface in a plane (hereinafter, referred to as YZ plane). (E) Picking up the sample on the second sample stage, turning it over, and supplying the inverted sample to the second sample stage again. (F) By irradiating the other cut surface of the sample on the second sample table with X-rays and detecting the diffracted X-rays therefrom,
Measuring the YZ deviation angle on the other cut surface in the YZ plane. (G) Picking up the sample on the second sample stage,
Selecting the sample according to the deviation angle and the two YZ deviation angles.