JP3464379B2 - Thin film magnetic head and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head having at least an inductive magnetic conversion element for writing and a method for manufacturing the thin film magnetic head.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of hard disk devices has increased, there has been a demand for improved performance of thin film magnetic heads. The thin film magnetic head is a composite thin film having a structure in which a recording head having an inductive magnetic conversion element for writing and a reproducing head having a magnetoresistive (hereinafter referred to as MR) element for reading are laminated. Magnetic heads are widely used. An anisotropic magnetoresistive (hereinafter referred to as AMR (Anisotropic Magneto Resi
stive). ) There is an AMR element using the effect and a GMR element using the giant magnetoresistive (hereinafter referred to as GMR (Giant Magneto Resistive)) effect. A reproducing head using the AMR element is an AMR head or simply an MR head. A reproducing head using a GMR element is called a GMR
Called the head. The AMR head is used as a reproducing head whose areal recording density exceeds 1 gigabit / (inch) ² , and the GMR head has an areal recording density of 3 gigabit / (inch) ^2.
(Inch) Used as a playback head of more than ² .

An AMR head is an AM having an AMR effect.
It has an R film. The GMR head uses an AMR film as a GM
It is replaced with a GMR film having an R effect and is structurally similar to an AMR head. However, the GMR film is AM
It exhibits a larger resistance change than the R film when the same external magnetic field is applied. Therefore, it is said that the GMR head can increase the reproduction output by about 3 to 5 times that of the AMR head.

As a method of improving the performance of the reproducing head, there is a method of changing the MR film. Generally, the AMR film is a film made of a magnetic material having an MR effect and has a single-layer structure. On the other hand, many GMR films have a multilayer structure in which a plurality of films are combined. There are several types of mechanisms that cause the GMR effect, and the layer structure of the GMR film changes depending on the mechanism. GMR
As the film, a superlattice GMR film, a granular film, a spin valve film, etc. have been proposed, but they have a relatively simple structure and show a large resistance change even in a weak magnetic field, and are intended for mass production.
A spin valve film is effective as the MR film. In this way, the reproducing head may change the MR film from the AMR film to the G film, for example.
By changing to a material with excellent magnetoresistive sensitivity such as MR film,
The objective of improving performance can be easily achieved.

The factors that determine the performance of the reproducing head include the pattern width, especially the MR height, in addition to the selection of the material as described above. The MR height is the length (height) from the end on the air bearing surface side of the MR element to the end on the opposite side. This MR height is originally controlled by the polishing amount when processing the air bearing surface.

On the other hand, as the performance of the reproducing head is improved, the performance of the recording head is also required to be improved. Among the performances of the recording head, in order to increase the recording density, it is necessary to increase the track density in the magnetic recording medium. Therefore, it has been desired to realize a recording head with a narrow track structure by subjecting the magnetic layer forming the upper magnetic pole to submicron processing using semiconductor processing technology.

The throat height is another factor that determines the performance of the recording head. Throat height is
It is the length (height) of the portion from the air belling surface to the edge of the insulating layer that electrically separates the thin film coil (referred to as the magnetic pole portion in the present application). To improve the performance of the recording head, it is desired to reduce the throat height. The throat height is also controlled by the polishing amount when processing the air bearing surface.

As described above, in order to improve the performance of the thin film magnetic head, it is important to form the recording head and the reproducing head in a well-balanced manner.

Here, referring to FIGS. 14 to 22,
As an example of a conventional method of manufacturing a thin film magnetic head, an example of a method of manufacturing a composite thin film magnetic head will be described.

[0010] In this manufacturing method, first, as shown in FIG. 14, for example, on a substrate 101 made of AlTiC _{(Al 2 O 3 · TiC)} , alumina (Al ₂ O ₃₎
The insulating layer 102 made of is deposited with a thickness of about 5 to 10 μm. Next, as shown in FIG. 15, the insulating layer 102
A lower shield layer 103 for a reproducing head is formed on the top.

Next, as shown in FIG. 16, 100 to 200 nm of alumina, for example, is deposited on the lower shield layer 103.
To form a shield gap film 104. Next, on the shield gap film 104, an MR film 105 for forming an MR element for reproduction is formed by several tens of n.
It is formed to a thickness of m and is formed into a desired shape by high-precision photolithography. Next, as shown in FIG. 17, the shield gap film 106 is formed on the shield gap film 104 and the MR film 105, and the MR film 105 is embedded in the shield gap films 104 and 106.

Next, as shown in FIG. 18, on the shield gap film 106, an upper shield / lower magnetic pole (hereinafter, lower magnetic pole) made of a magnetic material used for both the reproducing head and the recording head, for example, permalloy (NiFe). It is written as.)
Form 107.

Next, as shown in FIG. 19, the lower magnetic pole 1
A recording gap layer 108 made of an insulating film, for example, an alumina film is formed on 07, and a photoresist layer 109 is formed in a predetermined pattern on the recording gap layer 108 by high-precision photolithography. Next, on the photoresist layer 109, a first-layer thin-film coil 110 for an inductive recording head made of, for example, copper (Cu) is formed by, for example, a plating method.

Next, as shown in FIG. 20, a photoresist layer 111 is formed in a predetermined pattern on the photoresist layer 109 and the coil 110 by high precision photolithography. Next, in order to flatten the coils 110 and insulate the coils 110, heat treatment is performed at a temperature of 250 ° C., for example.

Next, as shown in FIG. 21, a second-layer thin-film coil 112 made of, for example, copper is formed on the photoresist layer 111 by, for example, a plating method. next,
A photoresist layer 113 is formed in a predetermined pattern on the photoresist layer 111 and the coil 112 by high-precision photolithography, and for example, at 250 ° C. for planarization of the coil 112 and insulation between the coils 112. Heat treatment at temperature.

Next, as shown in FIG. 22, the coil 11
The recording gap layer 108 is partially etched at a position rearward from 0 and 112 (on the right side in FIG. 22) to form a magnetic path. Next, the recording gap layer 108,
An upper yoke / upper magnetic pole (hereinafter referred to as upper magnetic pole) 114 made of a magnetic material for a recording head, such as permalloy, is formed on the photoresist layers 109, 111, 113. The upper magnetic pole 114 contacts the lower magnetic pole 107 and is magnetically coupled to the lower magnetic pole 107 at a position behind the coils 110 and 112. Next, the write gap layer 108 is formed by ion milling using the upper magnetic pole 114 as a mask.
After the lower magnetic pole 107 is etched by about 0.5 μm, an overcoat layer 115 made of alumina, for example, is formed on the upper magnetic pole 114. Finally, the slider is machined to form the track surface (air bearing surface) 120 of the recording head and the reproducing head, and the thin film magnetic head is completed.

FIG. 23 shows a thin film magnetic head in a completed state.
And shown in FIG. FIG. 23 shows a cross section of the thin film magnetic head perpendicular to the track surface 120, and FIG. 24 shows an enlarged cross section of the magnetic pole portion parallel to the track surface 120. In FIG. 23, TH represents throat height,
MR-H represents MR height. Further, in FIG. 24, P2W represents the magnetic pole width, and P2L represents the magnetic pole thickness.

As factors that determine the performance of the thin film magnetic head, in addition to the throat height, the MR height, etc., the Apex angle (Apex Ang) as shown by θ in FIG.
le). The apex angle means the angle formed by the straight line connecting the corners of the side surfaces of the photoresist layers 109, 111, 113 on the track surface side and the upper surface of the upper magnetic pole 114.

As shown in FIG. 24, the upper magnetic pole 114,
The structure in which the side walls of the recording gap layer 108 and a part of the lower magnetic pole 107 are vertically formed in a self-aligned manner is called a trim structure. With this trim structure, it is possible to prevent an increase in the effective track width due to the spread of the magnetic flux generated when writing a narrow track. As shown in FIG. 24, a lead layer 121 is provided on the side of the MR film 105.

The composite thin-film magnetic head manufactured in this manner has many problems, especially in the positional relationship between the recording head and the reproducing head. Due to these problems, deterioration of the characteristics of the whole composite thin-film magnetic head and Reliability issues occur,
The yield often decreased significantly.

[0021]

To improve the performance of the thin film magnetic head, the throat height TH, MR height MR-H, apex angle θ, magnetic pole width P2W and magnetic pole shown in FIGS. 23 and 24 are used. It is important to form the long P2L accurately.

In the present application, in particular, there is a problem regarding the accurate control of the magnetic pole width P2W (hereinafter referred to as the first problem).
And a problem related to accurate control of the throat height TH (hereinafter referred to as a second problem).

First, the first problem will be described. Since the magnetic pole width P2W determines the track width of the recording head, accurate formation is required. Particularly, in recent years, a dimension of 1.0 μm or less is required to enable high areal density recording, that is, to form a recording head having a narrow track structure. For that purpose, it is required to finely form the upper magnetic pole that determines the magnetic pole width P2W.

As a method for forming the upper magnetic pole, for example, as disclosed in Japanese Patent Laid-Open No. 7-262519,
A frame plating method is used. When the upper magnetic pole 114 is formed by using the frame plating method, first, a coil portion which is covered with the photoresist layers 109, 111 and 113 and rises in a mountain shape (hereinafter referred to as an apex portion).
A thin electrode film made of, for example, permalloy is formed on the entire surface by, for example, sputtering. Next, a photoresist is applied thereon and patterned by photolithography to form a frame (outer frame) for plating. Then, an upper magnetic pole is formed by a plating method using the electrode film previously formed as a seed layer.

By the way, in the apex section, for example, 7
There is a difference in height of 10 μm or more. A photoresist is applied to the apex portion so as to have a thickness of 3 to 4 μm. Assuming that the film thickness of the photoresist on the apex portion is required to be at least 3 μm or more, since the photoresist having fluidity gathers in the lower side, below the apex portion,
For example, a photoresist film having a thickness of 8 to 10 μm or more is formed.

As described above, in order to form a narrow track, it is necessary to form a pattern having a width of about 1.0 μm with a photoresist film. Therefore, with a photoresist film having a thickness of 8-10 μm or more, 1.0 μm
It is necessary to form a fine pattern with a width of about
This was extremely difficult.

Moreover, during photolithography exposure,
Light for exposure is reflected by an electrode film made of, for example, permalloy, and the reflected light also sensitizes the photoresist,
The photoresist pattern may be damaged. As a result, it becomes impossible to form the upper magnetic pole into a desired shape, for example, the side wall of the upper magnetic pole has a rounded shape. As described above, conventionally, it has been extremely difficult to accurately control the magnetic pole width to accurately form the upper magnetic pole for forming the narrow track structure.

In Japanese Patent Laid-Open No. 9-180127, an antireflection film is formed before applying a photoresist serving as a core mask, and the photoresist is applied on the antireflection film. A technique is disclosed that enables a core mask to be formed with high dimensional accuracy without being affected by reflected light.

However, according to this technique, after forming the photoresist pattern and before forming the upper magnetic pole by the plating method, it is necessary to remove the antireflection film in the portion where the upper magnetic pole is to be formed. As the number of steps increases, the antireflection film cannot be accurately removed, and the antireflection film remains, which may make it impossible to accurately form the top pole.

Next, the second problem (throat height TH
(Problems related to accurate control of) are explained. In the conventional method of manufacturing a thin film magnetic head, the coils 110 and 11 are
When forming 2, the heat treatment is performed at a temperature of about 250 ° C. In this heat treatment process, the melt phenomenon of the photoresist layers 109, 111, 113 causes positional fluctuations (pattern shifts) and profile deterioration of the edges of the photoresist layers 109, 111, 113. In particular, since the photoresist layers 109, 111, 113 are formed thickly, the positional variation becomes large.

In order to improve the performance of the recording head, it is desired to reduce the throat height, and in particular, in the future high frequency composite type thin film magnetic head, 1.0 μm or less is required. However, in the conventional thin film magnetic head, the throat height is defined by the edge of the photoresist layer 109 on the magnetic pole portion side. Therefore, if the position variation of the edge of the photoresist layer 109 occurs as described above, the throat height increases. The problem is that the height cannot be controlled accurately.

Further, the photoresist layers 109, 111,
When the position variation of the edge of 113 occurs, for example, when controlling the MR height based on the position of the edge of the photoresist layer 109 when processing the air bearing surface, MR
The problem is that the height cannot be controlled accurately.

The MR height can be accurately controlled by processing the air bearing surface while monitoring the resistance value of the MR film 105. Although it is possible to control the throat height by converting the resistance value of the MR film 105 into the throat height, in order to accurately control the throat height, the alignment between the MR film 105 and the photoresist layer 109 is required. It is necessary that no error occurs, and as described above, the photoresist layers 109 and 11 are
When the position variation of the edges of 1, 113 occurs, the resistance value of the MR film 105 cannot be converted into the throat height and the throat height cannot be accurately controlled.

Further, the photoresist layers 109, 111,
When the position variation of the edge of 113 and the deterioration of the profile occur, the apex angle fluctuates, which causes a problem that the apex angle cannot be accurately controlled.

Further, in the conventional method of manufacturing a thin film magnetic head, the recording gap layer 108 and the lower magnetic pole 107 are formed when the seed layer is etched when the coils 110 and 112 are formed by the plating method and the trim structure is formed. The photoresist layer 109 that defines the throat height is also etched during etching, and the position of the edge of the photoresist layer 109 on the magnetic pole portion side is 1 to 2 μm.
There is a problem in that the phenomenon of receding occurs to some extent, which also makes it difficult to accurately control the throat height.

The present invention has been made in view of the above problems, and a first object thereof is to provide a thin film magnetic head capable of accurately controlling the magnetic pole width and a manufacturing method thereof.

A second object of the present invention is to provide a thin film magnetic head and a method for manufacturing the same, which enables accurate control of the throat height, in addition to the above first object.

[0038]

A thin film magnetic head according to the present invention is a first magnetic pole and a second magnetic pole , which are magnetically coupled to each other and a part of a side facing a recording medium faces a gap layer .
Magnetic poles, each comprising at least one layer
The first magnetic layer and the second magnetic layer, and the first magnetic layer and the second magnetic layer.
And a thin film coil disposed between the second magnetic layer and the thin film
An insulating layer surrounding the coil and a substrate, the first and second
The magnetic layer, gap layer, thin-film coil and insulating layer of the substrate
Of the first and second magnetic layers laminated on the
Is a thin-film magnetic head in which the magnetic layer is closer to the substrate, and the gap layer is non-magnetic and conductive, and has an antireflection function of preventing reflection of light for exposure in photolithography. And a second magnetic layer formed on the insulating layer.
It is formed on the top layer .

In the thin film magnetic head of the present invention, the gap layer is formed of one or more layers including a non-magnetic and conductive layer having an antireflection function for preventing reflection of light for exposure in photolithography. Therefore, when the second magnetic layer is formed on the gap layer, adverse effects such as collapse of the photoresist pattern due to reflected light of exposure light in photolithography are prevented.

In the thin film magnetic head of the present invention, the layer having the antireflection function may be made of a non-magnetic nitride such as titanium nitride.

Further, in the thin film magnetic head of the present invention, the gap layer may be formed of two or more layers including a layer having an antireflection function and a nonmagnetic gap insulating layer. Further, the gap insulating layer may be made of alumina or aluminum nitride.

Further, in the thin film magnetic head of the present invention, the thickness of the layer having the antireflection function is preferably 20 to 200 nm.

The thin-film magnetic head of the present invention may have a throat height defining insulating layer that defines the throat height, and the throat height defining insulating layer may be formed of an inorganic insulating film. Further, the thin film magnetic head of the present invention may further have a magnetoresistive element for reading.

A method of manufacturing a thin film magnetic head according to the present invention includes a first magnetic pole and a second magnetic pole which are magnetically coupled to each other and a part of the side facing the recording medium faces each other via a gap layer. , Manufacturing of a thin film magnetic head having a first magnetic layer and a second magnetic layer, each of which is composed of at least one layer, and a thin film coil disposed between the first magnetic layer and the second magnetic layer A method of forming a first magnetic layer corresponding to a first magnetic pole, forming a thin film coil surrounded by an insulating layer on the first magnetic layer, and forming a thin film coil on the insulating layer. A step of forming a gap layer by one or more layers including a non-magnetic and conductive layer having an antireflection function of preventing reflection of light for exposure in photolithography, and on the gap layer, Form a second magnetic layer corresponding to the second magnetic pole And a step of forming the second magnetic layer, the step of forming a photoresist pattern for forming the second magnetic layer on the gap layer by photolithography, and the step of masking the photoresist pattern. As a result, a step of forming a second magnetic layer is included.

Further, in the method of manufacturing the thin film magnetic head of the present invention, the layer having the antireflection function may be made of a non-magnetic nitride such as titanium nitride.

In the method of manufacturing the thin film magnetic head of the invention, the gap layer may be formed of two or more layers including a layer having an antireflection function and a nonmagnetic gap insulating layer. Further, the gap insulating layer may be made of alumina or aluminum nitride.

In the method of manufacturing a thin film magnetic head of the present invention, the thickness of the layer having the antireflection function is 20 to 200 n.
It is preferably m.

Further, in the method of manufacturing the thin film magnetic head of the present invention, before the step of forming the thin film coil, the step of forming the throat height defining insulating layer for defining the throat height on the first magnetic layer. And the throat height defining insulating layer may be formed of an inorganic insulating film. Further, the method of manufacturing the thin film magnetic head of the invention may further include a step of forming a magnetoresistive element for reading.

[0049]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, with reference to FIGS. 1 to 13, a method of manufacturing a composite thin film magnetic head as a method of manufacturing a thin film magnetic head according to an embodiment of the present invention will be described. 1 to 12, (a) shows a cross section perpendicular to the track surface, and (b) shows a cross section parallel to the track surface of the magnetic pole portion.

In the manufacturing method according to this embodiment, first,
As shown in FIG. 1, for example, AlTiC (Al ₂ O ₃
On the substrate 1 made of TiC, for example, alumina (Al
_An insulating layer 2 made of ₂ O ₃ ) is deposited with a thickness of about 3 to 5 μm. Next, as shown in FIG. 2, a plating method is used on the insulating layer 2 using the photoresist film as a mask.
Permalloy (NiFe) is selectively formed with a thickness of about 3 μm to form the lower shield layer 3 for the reproducing head.

Next, as shown in FIG. 3, for example, alumina is sputter deposited to a thickness of 100 to 200 nm on the lower shield layer 3 to form a shield gap film 4.
Next, the MR film 5 for forming the MR element for reproduction is formed on the shield gap film 4 to have a thickness of 10 nm or less, and is formed into a desired shape by high-precision photolithography.
Next, the shield gap film 6 is formed on the shield gap film 4 and the MR film 5, and the MR film 5 is embedded in the shield gap films 4 and 6.

Next, as shown in FIG. 4, an upper shield / lower magnetic pole (hereinafter, referred to as lower magnetic pole) 7 made of, for example, permalloy, for example, about 3 to 4 is formed on the shield gap film 6.
Selectively formed with a thickness of μm. The bottom pole 7 corresponds to the first pole and the first magnetic layer in the present invention.

Next, an inorganic insulating film, for example, a silicon oxide film (SiO ₂ ) having a thickness of about 1 to ₂ μm is formed on the lower magnetic pole 7, taper etching is performed, and selective patterning is performed. The insulating layer 8 for defining the apex angle and the throat height is formed. The insulating layer 8 is not limited to a silicon oxide film, but an alumina film,
Other inorganic insulating films such as a silicon nitride film (SiN) may be used. Further, the above film is formed by sputtering or CVD (Ch
It may be formed by the emical vapor deposition method.

Next, as shown in FIG. 5, the first layer thin film coil 10 for an induction type recording head made of, for example, copper (Cu) is formed on the insulating layer 8 by, for example, electrolytic plating.
Is formed with a thickness of 2 to 3 μm.

Next, as shown in FIG. 6, a photoresist layer 11 is formed in a predetermined pattern on the insulating layer 8 and the coil 10 by high precision photolithography. Next, in order to flatten the coils 10 and insulate the coils 10, heat treatment is performed at a temperature of 250 ° C., for example.

Next, the second-layer thin-film coil 12 made of, for example, copper is formed on the photoresist layer 11 by, for example, electrolytic plating to have a thickness of 2 to 3 μm. Next, a photoresist layer 13 is formed in a predetermined pattern on the photoresist layer 11 and the coil 12 by high-precision photolithography, and for example, 250 for flattening the coil 12 and insulating between the coils 12. Heat treatment at a temperature of ° C.

Next, as shown in FIG. 7, a recording gap layer 15 made of a non-magnetic material, having conductivity and having an antireflection function for preventing reflection of light for exposure in photolithography, is formed. For example, by sputtering 2
It is formed with a thickness of 0 to 200 nm. As a film made of such a non-magnetic material and having conductivity and an antireflection function, there is, for example, a titanium nitride (TiN) film.
The titanium nitride film changes its surface color from light yellow to deep yellow depending on the film thickness, which indicates that it has an antireflection function. The recording gap layer 15 in the present embodiment is not limited to the titanium nitride film, and may be non-magnetic, conductive, and have an antireflection function. As such a film, tantalum nitride (Ta
There are some non-magnetic metal nitride films such as N).
As the light for exposure in photolithography, for example, i-line (wavelength 365 nm) is used, but not limited to this, g-line (wavelength 436 nm), i-line cut broadband light, broadband light, ultraviolet light, excimer laser. Other laser light, X-rays, electron beams or the like may be used.

The recording gap layer 15 may be formed of a single layer such as a titanium nitride film, or an insulating film made of a non-magnetic material such as an alumina film or an aluminum nitride (AlN) film and a titanium nitride film. It may be formed of two or more layers made of a non-magnetic material, such as a combination with a film. However, in this case, at least the uppermost layer is required to have conductivity and have an antireflection function for preventing reflection of exposure light in photolithography. The insulating film made of the above nonmagnetic material for forming the recording gap layer 15 corresponds to the insulating layer for the gap in the present invention.

Next, as shown in FIG.
The recording gap layer 15 is partially etched at a position behind 12 (on the right side in FIG. 8A) to form a magnetic path. A photoresist is applied on the recording gap layer 15 and patterned by photolithography to form a photoresist pattern 16 to be a frame (outer frame) for forming the upper magnetic pole by frame plating.

Next, as shown in FIG. 9, the photoresist pattern 16 is used as a mask, the recording gap layer 15 having conductivity is used as a seed layer, and electrolytic plating is performed.
Upper yoke and upper magnetic pole (hereinafter, referred to as upper magnetic pole) 17
Is formed to a thickness of about 3 to 5 μm. The coil 1
The recording gap layer 15 is provided at a position rearward of 0 and 12.
The lower magnetic pole 7 serves as a seed layer in a portion where is removed by etching. The upper magnetic pole 17 is the second pole in the present invention.
Corresponding to the magnetic pole and the second magnetic layer. This top pole 1
7 is in contact with the lower magnetic pole 7 at a position rearward of the coils 10 and 12 and is magnetically coupled. Next, as shown in FIG. 10, the photoresist pattern 16 is removed.

Next, as shown in FIG. 11, the upper magnetic pole 1
The recording gap layer 15 and the bottom pole 7 are etched by about 0.5 μm by ion milling using the mask 7 as a mask to form a trim structure.

Next, as shown in FIG. 12, the upper magnetic pole 1
7 and an overcoat layer 18 made of alumina, for example.
To form. Finally, the slider is machined to form track surfaces (air bearing surfaces) of the recording head and the reproducing head, and the thin film magnetic head is completed.

FIG. 13 is a plan view of a thin film magnetic head manufactured by the manufacturing method according to the present embodiment. The overcoat layer 18 is omitted in this figure. Further, this figure shows a state before machining the slider. In this figure, TH represents the throat height, and this throat height TH is the insulating layer 8
Is defined by the edge of the magnetic pole portion side of the.

As described above, according to the present embodiment, the recording gap layer 15 is non-magnetic and conductive,
This recording gap layer 1 should have an antireflection function.
Since the photoresist pattern 16 which serves as a frame (outer frame) when the upper magnetic pole 17 is formed by the electrolytic plating method is formed on the electrode 5, the exposure light is exposed by the electrode film during photolithography exposure. It is possible to prevent the adverse effects such as the collapse of the photoresist pattern caused by the reflected light. As a result, the top pole 17
It is possible to accurately form the upper magnetic pole 17 into a desired shape such that the side wall of is formed vertically without rounding.
As described above, according to the present embodiment, the magnetic pole width can be accurately controlled, and the upper magnetic pole 17 for forming the narrow track structure can be accurately formed. Further, according to the present embodiment, the trim structure having a desired shape can be accurately formed by etching the recording gap layer 9 and the lower magnetic pole 7 using the accurately formed upper magnetic pole 17 as a mask. It is possible to prevent the effective track width from increasing due to the spread of the magnetic flux generated when writing the track.

The antireflection function of the recording gap layer 15 is effective in preventing the adverse effect of the reflected light of the exposure light even if the reflectance is reduced by about several percent as compared with the case where it is not provided. . When a titanium nitride film is used as the recording gap layer 15, the reflectance reduction rate varies depending on the thickness, but a reflectance reduction rate of about 10 to 70% can be realized. In particular, in the case of a titanium nitride film, when the film thickness is set to about 50 to 100 nm, the surface changes its color to dark yellow and the reduction rate of reflectance increases.

When a titanium nitride film is used as the recording gap layer 15, the photoresist is sharply cut, so scum (resist residue) in the photoresist pattern 16 can be prevented, and in particular, the magnetic pole width can be accurately controlled. It is possible to accurately form the upper magnetic pole 17 for forming the narrow track structure.

Further, according to the present embodiment, the recording gap layer 15 also serves as an antireflection film.
As compared with the case where the antireflection film is formed separately from the recording gap layer as shown in Japanese Patent No. 80127, the step of forming the antireflection film and the step of removing the antireflection film are unnecessary, and the number of steps is reduced. You can

Further, according to the present embodiment, since it is not necessary to remove the antireflection film, it is possible to prevent the antireflection film from remaining between the photoresist patterns. Therefore, the top pole 17 can be accurately formed even in detail. It becomes possible to do.

Further, according to the present embodiment, titanium nitride can be used for the recording gap layer 15. The recording gap layer 15 made of titanium nitride has good film quality and few pinholes as compared with the conventional recording gap layer made of alumina, so that it becomes a high quality recording gap layer and can improve the reliability of the thin film magnetic head. it can. Further, for the same reason, the thickness of the recording gap layer 15 can be reduced, so that the characteristics of the recording head can be improved.

Further, in this embodiment, since the insulating layer 8 defining the throat height is formed of the inorganic insulating film,
Heat treatment at a temperature of about 250 ° C. when forming the coils 10 and 12 does not cause position variation (pattern shift) of the edge of the insulating layer 8 and deterioration of the profile. Therefore, the throat height can be accurately controlled. Further, it is possible to accurately control the MR height and the apex angle.

Further, in this embodiment, since the insulating layer 8 defining the throat height is formed of the inorganic insulating film,
There is no change in the position of the insulating layer 8 during the etching of the seed layer when forming the coils 10 and 12 by the plating method and during the etching of the write gap layer 15 and the lower magnetic pole 7 to form the trim structure. Also, the throat height can be accurately controlled.

In this way, according to the present embodiment,
A thin-film magnetic head with a high-performance narrow track structure, in which the magnetic pole width, throat height, MR height and apex angle are accurately controlled, and the increase in the effective track width due to the spread of the magnetic flux generated when writing a narrow track is prevented. It becomes possible to manufacture.

Further, according to this embodiment, since the thick insulating layer 8 can be formed between the lower magnetic pole (upper shield) 7 and the coils 10 and 12, the lower magnetic pole (upper shield) 7 can be formed.
A large withstand voltage can be obtained between the coil and the coils 10 and 12, and leakage of magnetic flux from the coils 10 and 12 can be reduced.

In the present embodiment, the top pole 1
7 includes, for example, NiFe (Ni: 80%, Fe: 20).
%), But not limited to this, NiFe (Ni:
50%, Fe: 50%), iron nitride (FeN), Fe-
A high saturation magnetic flux density material such as Co-Zr amorphous may be used, or two or more kinds of these materials may be stacked and used. Also, as the lower magnetic pole 7, a magnetic material obtained by stacking NiFe and the above-mentioned high saturation magnetic flux density material may be used.

The present invention is not limited to the above-described embodiment. For example, in the above-mentioned embodiment, the manufacturing method of the composite type thin film magnetic head has been described. It can also be applied to a thin-film magnetic head for recording, which has an element, and a thin-film magnetic head for both recording and reproduction. Further, the present invention can also be applied to a thin film magnetic head having a structure in which the order of stacking the write element and the read element is exchanged.

[0076]

As described above, the thin film magnetic head according to any one of claims 1 to 8 or claim 9 to 9 .
According to the method of manufacturing a thin-film magnetic head described in any one of 16 above, the gap layer is made of non-magnetic and conductive nitride.
Since it is formed of one or more layers including a layer having an antireflection function for preventing the reflection of light for exposure in photolithography, it is possible to use it for exposure in photolithography when forming the magnetic layer on the gap layer. It is possible to prevent the adverse effect such as the collapse of the photoresist pattern due to the reflected light of the above-mentioned light, and it is possible to accurately control the magnetic pole width. Further, since the gap layer has the antireflection function, the step of forming the antireflection film and the step of removing the antireflection film are unnecessary as compared with the case where the antireflection film is formed separately from the gap layer. Therefore, it is possible to reduce the number of steps in manufacturing the thin-film magnetic head, and it is possible to accurately form the magnetic layer in detail.

According to the method of manufacturing a thin-film magnetic head according to claim 2 or the method of manufacturing a thin-film magnetic head according to claim 10 , the layer having an antireflection function for forming the gap layer comprises:
Since it is made of titanium nitride, the photoresist is particularly sharply cut, so that scum in the photoresist pattern can be prevented and the magnetic layer can be accurately formed.

Further, according to the method of manufacturing a thin film magnetic head according to claim 7, wherein or claim 15 thin-film magnetic head according, since the forming throat height defining insulation layer defining the throat height with inorganic insulating film, Further, it is possible to prevent the positional variation of the throat height defining insulating layer and to achieve an accurate control of the throat height.

[Brief description of drawings]

FIG. 1 is a cross-sectional view for explaining one step in a method of manufacturing a thin film magnetic head according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a step following FIG.

FIG. 3 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 4 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 5 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 6 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 7 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 8 is a cross-sectional view for explaining a process following the process in FIG.

FIG. 9 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 10 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 11 is a cross-sectional view for explaining a step following FIG.

FIG. 12 is a cross-sectional view for explaining a step following FIG.

FIG. 13 is a plan view of a thin film magnetic head manufactured by a manufacturing method according to an embodiment of the present invention.

FIG. 14 is a sectional view for explaining one step in a conventional method for manufacturing a thin film magnetic head.

FIG. 15 is a cross-sectional view for explaining a process following the process in FIG.

16 is a cross-sectional view for explaining a step following FIG.

FIG. 17 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 18 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 19 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 20 is a cross-sectional view for explaining a process following the process in FIG.

21 is a cross-sectional view for explaining a step following FIG. 20. FIG.

FIG. 22 is a cross-sectional view for explaining a step following FIG.

FIG. 23 is a cross-sectional view showing a cross section perpendicular to the track surface in the conventional thin film magnetic head.

FIG. 24 is a sectional view showing a section parallel to the track surface of the magnetic pole portion in the conventional thin film magnetic head.

[Explanation of symbols]

1 ... Substrate, 2 ... Insulating layer, 3 ... Lower shield layer, 4, 6 ...
Shield gap film, 5 ... MR film, 7 ... Lower magnetic pole, 8 ...
Insulating layer, 10, 12 ... Thin film coil, 11, 13 ... Photoresist layer, 15 ... Recording gap layer, 16 ... Photoresist pattern, 17 ... Top pole, 18 ... Overcoat layer.

Claims (16)

(57) [Claims] 1. A first magnetic pole which is magnetically coupled and a part of which is opposed to a recording medium is opposed via a gap layer.
And a second pole, each including at least one layer
A first magnetic layer and a second magnetic layer consisting of
A thin-film coil disposed between the magnetic layer and the second magnetic layer, an insulating layer surrounding the thin-film coil, and a substrate,
The first and second magnetic layers, the gap layer, and the thin film coil
And an insulating layer is laminated on the substrate, and the first and
And the second magnetic layer, the first magnetic layer is closer to the substrate.
A thin film magnetic head arranged close to the gap layer, wherein the gap layer is made of non-magnetic and conductive nitride.
Ri, is formed with one or more layers including a layer having an antireflection function for preventing reflection of light for exposure in photolithography, are and formed on the insulating layer, the second magnetic layer, the Formed on the gap layer
The thin-film magnetic head is characterized by 2. A thin-film magnetic head according to claim 1, wherein the nitride is titanium nitride. Wherein the gap layer is, claim 1, characterized in that it is formed by two or more layers comprising a layer and the gap insulation layer of nonmagnetic having the antireflection function, or
2. The thin film magnetic head described in 2 . 4. The thin film magnetic head according to claim 3 , wherein the gap insulating layer is made of alumina. 5. The thin film magnetic head according to claim 3 , wherein the gap insulating layer is made of aluminum nitride. 6. The thickness of the layer having an antireflection function is 2
It is 0-200 nm, It is characterized by the above-mentioned 1 thru | or.
5. The thin film magnetic head according to any one of 5 above. 7. A throat height defining insulating layer for defining a throat height, wherein the throat height defining insulating layer is formed of an inorganic insulating film.
7. The thin-film magnetic head according to any one of 1 to 6 . 8. Further, the thin film magnetic head according to any one of claims 1 to 7, characterized by having a magnetoresistive element for reading. 9. A first magnetic pole, which is magnetically coupled and has a first magnetic pole and a second magnetic pole partially opposed to the recording medium and facing each other via a gap layer, the first magnetic pole including at least one layer. The magnetic layer and the second magnetic layer, and
A method of manufacturing a thin-film magnetic head having a magnetic layer and a thin-film coil disposed between the second magnetic layer, the method comprising: forming a first magnetic layer corresponding to the first magnetic pole; Forming a thin film coil surrounded by an insulating layer on the first magnetic layer; and forming a thin film coil of non-magnetic and conductive nitride on the insulating layer.
Ri, by one or more layers including a layer having an antireflection function for preventing reflection of light for exposure in photolithography, and forming a gap layer, on the gap layer, the second magnetic pole Corresponding second
And a step of forming the second magnetic layer, the step of forming the second magnetic layer forms a photoresist pattern for forming the second magnetic layer on the gap layer by photolithography. And a second step of using the photoresist pattern as a mask.
And a step of forming a magnetic layer as described above. 10. The method for manufacturing a thin film magnetic head according to claim 9, wherein the nitride is titanium nitride. Wherein said gap layer is, according to claim 9 or 1, characterized in that it is formed by two or more layers comprising a layer and a non-magnetic gap insulating layer having the anti-reflection function
0. A method of manufacturing a thin film magnetic head according to 0 . 12. The method of manufacturing a thin film magnetic head according to claim 11 , wherein the gap insulating layer is made of alumina. 13. The method of manufacturing a thin film magnetic head according to claim 11 , wherein the insulating layer for the gap is made of aluminum nitride. 14. The thickness of the layer having the anti-reflection function 9 claims, characterized in that it is 20~200nm
14. A method of manufacturing a thin film magnetic head according to any one of 13 to 13 . 15. Prior to the step of forming the thin film coil, a step of forming a throat height defining insulating layer that defines a throat height on the first magnetic layer,
15. The method of manufacturing a thin film magnetic head according to any one of 9 to 14 , wherein the throat height defining insulating layer is formed of an inorganic insulating film. 16. The method according to claim 9 , further comprising the step of forming a magnetoresistive element for reading.
5. A method of manufacturing a thin film magnetic head according to any one of 1.