JP3458580B2 - Electronic component mounting equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate while rotating a transfer head having multiple nozzles around a rotary head.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, a transfer head having a plurality of nozzles (multi-nozzles) is index-rotated around a rotary head, and an electronic component provided in an electronic component supply unit is mounted on the transfer head. It is widely practiced that a nozzle is vacuum-sucked, picked up, and mounted on a substrate positioned in a positioning portion.

A transfer head having a multi-nozzle selects and uses nozzles according to the type of electronic parts.
Only the nozzles used are projected downward. Therefore, a nozzle initializing stage, a nozzle selecting stage, and a nozzle projecting stage are provided in the rotation path of the transfer head. In the initializing stage, the nozzles that have been used after mounting the electronic components on the substrate are moved to the raised position (initial position). In the nozzle selection stage, the transfer head selects the optimum nozzle for the electronic component to be picked up next. In the nozzle projecting stage, the selected nozzle is projected downward.

FIG. 8 is a side view of an initializing stage of a conventional electronic component mounting apparatus. The transfer head 1 includes a plurality of nozzles 2. In FIG. 8, only one nozzle 2 projects downward, and the other nozzles 2 retreat to an upper position (initial position). This nozzle 2 is one in which electronic components are mounted on a substrate in the previous step.

A support plate 3 is provided on the initializing stage, and a table portion 4 is placed on the support plate 3. The base 4 is made of synthetic resin. The transfer head 1 makes an index rotation along the periphery of the rotary head,
Stop spinning above. Then, the support plate 3 rises, and the lower end portion of the nozzle 2 protruding downward is pushed up by the base portion 4 to move the nozzle 2 to the initial position (see the support plate 3 and the base portion 4 indicated by chain lines). Next, the support plate 3
Moves down and the transfer head 1 moves to the nozzle selection stage. In the nozzle selection stage, the optimum nozzle for the electronic component to be picked up next is selected, and then this nozzle is projected downward in the nozzle projection stage.

[0006]

Conventionally, since the lower end of the nozzle 2 is pushed up by the base portion 4 as described above, the nozzle is retreated to the initial position.
There is a problem that the lower end portion of the nozzle 2 and the upper surface of the base portion 4 are worn, and the lower end portion of the nozzle 2 is easily damaged.

When the lower end of the nozzle 2 is pushed up by the base 4, the rotary operation of the transfer head 1 for index rotation around the rotary head must be completely stopped. That is, since the initializing operation of the nozzle 2 must be performed by completely stopping the rotation of the transfer head 1, a considerable stop time is required, which is a loss time and the mounting speed for mounting the electronic component on the substrate is reduced. It was one of the reasons why it didn't go up. By the way, in recent years,
The mounting speed of this type of electronic component mounting apparatus has been increased to 5 to 10 or more per second, and the above-mentioned loss time is one of the bottleneck for further increasing the mounting speed.

Therefore, the present invention solves the above-mentioned conventional problems, eliminates the wear and damage of the nozzle due to the initializing of the nozzle, and eliminates the loss of the initializing operation for mounting electronic components. An object is to provide a mounting device.

[0009]

To this end, in the electronic component mounting apparatus of the present invention, the nozzle initializing stage is engaged with the engaged portion provided on the upper portion of the nozzle to repel the nozzle downward. A pull-up means for pulling up the nozzle to a height that engages with the stopper against the spring force of the spring is provided, and the stopper is detached from the nozzle side on the nozzle projecting stage to lower the nozzle by the spring force of the spring. Provided with stopper operation means and
The engagement range of the engaged portion and the pulling means is changed to the above
It is secured long along the rotation path of the mounting head .

[0010]

According to the present invention, in the initializing stage, the nozzle can be retracted to the raised position (initial position) by pulling up the nozzle by the lifting means. In addition, by ensuring the engageable range of the engaged portion on the nozzle side and the pulling means to be long along the rotation path of the transfer head, the transfer head is rotating (that is, the transfer head stops rotating). Even if it is not), the nozzle can be initialized and the loss time can be eliminated or reduced.

An embodiment of the present invention will be described below with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the transfer head, and FIGS. 3, 4 and 5 are sectional views of the transfer head.
[Fig. 3] is a plan view of the initializing stage.

In FIG. 1, 10 is a rotary head, and a large number of transfer heads 11 are provided along the circumference thereof. The transfer head 11 is index-rotated in the direction of arrow N along the circumference of the rotary head 13. Below the rotation path of the transfer head 11, an electronic component supply unit 12 and a positioning unit 15 for the substrate 14 are provided. The electronic component supply unit 12 has a large number of parts feeders 13 arranged in parallel. The parts feeder 13 reciprocates in the lateral direction (X direction), and stops the parts feeder 13 provided with predetermined electronic parts at the pick-up position P of the electronic parts by the transfer head 11. The positioning unit 15 horizontally moves the substrate 14 in the X direction and the Y direction to position the substrate 14 at a predetermined position.
An initializing stage A, a nozzle selecting stage B, a nozzle projecting stage C, and an observing stage D are provided on the rotation path of the transfer head 11.

Next, referring to FIGS. 2 to 5, the transfer head 1
The structure of 1 will be described. Note that FIG. 3 shows the pickup position P.
The transfer head is shown between the time when it passes through and the time when it reaches the positioning portion 15. Further, FIG. 4 shows a transfer head in the initializing stage A. Also in FIG.
Shows the transfer head in the nozzle projecting stage C.

In FIGS. 2 and 3, reference numeral 20 denotes an elevating plate, and a bracket 21 is attached to the front surface thereof. A motor 22 is mounted on the bracket 21. A rotary shaft 23 of the motor 22 is upright, and a disc 24, a rotary plate 25, and a block 26 as a nozzle pulling member are mounted on the rotary shaft 23 in this order from the top. Disk 24,
A nozzle shaft 27 is inserted in the rotary plate 25.
There are four nozzle shafts 27, which are arranged around the rotary shaft 23. A nozzle 28 is connected to the lower end of the nozzle shaft 27. A nozzle holder 29 is mounted inside the block 26 so as to be rotatable around the rotary shaft 23, and the nozzle 28 is inserted into the nozzle holder 29. Reference numeral 30 is a bearing provided on the inner surface of the block 26.

The back plate 3 is provided on the lower surface of the block 26.
1 is provided. The nozzle 28 is the back plate 3
It projects downward from 1. The back plate 31 serves as a light diffusing plate when observing the electronic component 9 vacuum-adsorbed on the lower end of the nozzle 28 with a camera (not shown) arranged on the observation stage D. Nozzle shaft 27 and nozzle 28
An engaged portion 32 is provided between them. A spring 33 is provided between the rotary plate 25 and the engaged portion 32. The spring 33 is attached to the nozzle shaft 27 and elastically urges the nozzle 28 downward by its spring force. A stopper 34 is rotatably attached to the rotary plate 25 by a pin 35.

The stopper 34 includes four nozzle shafts 2
Four are provided corresponding to 7. A ring-shaped spring 36 is fastened to the stopper 34. Due to the spring force of the spring 36, the stopper 34 is elastically urged in the direction in which the lower end claw 34a engages with the upper end claw 32a of the engaged portion 32. In FIG. 5, the nozzle projecting stage C is provided with a rod 37 as stopper operating means.
The rod 37 is driven by a driving means (not shown) to move forward and backward in the horizontal direction. In FIG. 5, when the rod 37 advances to the right, it pushes the upper end of the stopper 34 and rotates the stopper 34 clockwise against the spring force of the spring 36. Then, the claw 34a of the stopper 34 separates from the claw 32a of the engaging member 32, and the nozzle 28 is repulsed by the spring 33 and projects downward (see the stopper 34 and the nozzle 28 indicated by the chain line).

2 and 3, the disc 24 is held by the elevating plate 40. A bearing 41 is provided between the elevating plate 40 and the disc 24, and the disc 24 is rotatably held inside the elevating plate 40. Further, an enlarged portion 42 for preventing coming off is provided on the upper end portion of the nozzle shaft 27 protruding upward from the disc 24. A rod 43 is vertically inserted between the bracket 21 and the elevating plate 40. A spring 44 is attached to the rod 43, and the elevating plate 40 is elastically urged downward by the spring force.

A horizontally long plate 4 is provided at the upper end of the rod 43.
5 are connected. A bearing 46 is mounted on the outer surface of the plate 45. In FIG. 4, the initializing stage A is provided with a push-up plate 47 that pushes up the bearing 46 from below. Reference numeral 48 denotes a push-up rod, which is driven by a drive unit (not shown) on the electronic component mounting apparatus main body side to move up and down. As shown in FIG. 6, the push-up plate 47 is elongated along the rotation direction N of the bearing 46, and thus the bearing 46 can be pushed up within the range of the length L thereof. This means that even when the transfer head 11 is rotating, the bearings 46 can be pushed up by the push-up plate 47 to initialize the nozzles 28.

In FIG. 4, when the push-up plate 47 rises from the chain line position to the solid line position, the bearing 46 is pushed up, and the lift plate 40 also springs 44.
Is compressed and pushed up. Then, the nozzle 28 also compresses the spring 33 and retreats from the protruding position (the position where the nozzle 28 is used) shown by the lower dashed line to the raised position shown by the upper solid line.

In FIG. 3, a slider 49 is mounted on the back surface of the lift plate 20. The slider 49 is fitted on a vertical guide rail 50 attached to the outer peripheral surface of the rotary head 10, and the transfer head 11 is moved up and down along the guide rail 50 by an elevating mechanism (not shown), and the transfer head 11 of the electronic component supply unit 12 is moved. The electronic component 9 provided in the parts feeder 13 is vacuum-sucked at the lower end of the nozzle 28 to be picked up, and the picked-up electronic component 9 is mounted on the substrate 14 positioned by the positioning unit 15.

This electronic component mounting apparatus is constructed as described above, and the overall operation will be described below. In FIG. 1, the transfer head 11 is an electronic component 9 of the parts feeder 13.
Is picked up at the pickup position P. At this time,
As shown in FIG. 3, only the nozzle 28 for picking up projects downward, and other nozzles 2 other than this nozzle 28
8 is moving up. The transfer head 11 picking up the electronic component 9 is index-rotated in the direction of the arrow N to move to the observation stage D, and the electronic component 9 vacuum-adsorbed on the lower end portion of the nozzle 28 is observed by a camera to detect its positional deviation. To do. Next, the transfer head 11 moves above the substrate 14, corrects the positional deviation of the electronic component 9, and mounts the electronic component 9 on the substrate 14. The description of the method for correcting the positional deviation of the electronic component 9 is omitted.

Next, the transfer head 11 moves to the initializing stage A. FIG. 4 shows an initializing operation in the initializing stage A. The push-up plate 47 is on standby at the initializing stage A, and when the bearing 46 arrives above the push-up plate 47, the push-up plate 47 rises from the chain line position to the solid line position in FIG.
Pull up the bearing 46. Then, the nozzle 28 ascends from the position shown by the chain line to the position shown by the solid line, and the claw 34a of the stopper 34 engages with the claw 32a of the engaged member 32, and thereafter the nozzle 28 maintains the raised position. With the above, the initializing operation is completed.

Next, the transfer head 11 moves to the nozzle selection stage B shown in FIG. 1, where the motor 22 drives the nozzle 28 to rotate about the rotary shaft 23, and the electronic component 9 to be picked up next time. The optimum nozzle 28 is moved to a position facing the rod 37. Next, transfer head 1
1 moves to the nozzle projecting stage C. FIG. 5 shows the transfer head 11 on the nozzle protrusion stage C.
Here, as the rod 37 moves forward to the right, the upper end of the stopper 34 is pushed and the stopper 34 is rotated clockwise. Then, the claw 34a of the stopper 34 is engaged with the engaged portion 3
The nozzle 28 is separated from the second claw 32a, and the nozzle 28 moves to the spring 33.
And is projected downward (see the nozzle 28 indicated by a chain line). Next, the transfer head 11 moves to the pickup position P, and the above operation is repeated. When the same type of nozzle 28 is continuously used in the transfer head 11, the operations of the initializing stage A, the nozzle selecting stage B, and the nozzle projecting stage C are not performed.

FIG. 7 is a plan view of an initializing stage of an electronic component mounting apparatus according to another embodiment of the present invention.
In this example, a long plate 51 having a length L in the index rotation direction is attached to the plate 45, and the initializing stage A
A bearing 52 connected to the push-up rod 48 is provided, and the long plate 51 is pushed up from below by the bearing 52 by raising the bearing 52 by the push-up rod 48. As shown in FIG. 6 and FIG. 7, by ensuring that the range in which the nozzle 28 can be pulled up is long along the rotation path of the transfer head 11 (the length L in the above-described embodiment), the transfer head is rotating. Even when the transfer head is not stopped rotating, the nozzles can be initialized, and the loss time can be eliminated or reduced. Further, in the above-described embodiment, the rotary plate 24 as the pulling member for pulling up the nozzle 28 is provided with the stopper 34.
The rotary plate 24 is installed above the stopper 34.
It may be provided below. As described above, the present invention is not limited to the above-described embodiment, and various design changes can be made.

[0025]

According to the present invention, in the initializing stage, the nozzle can be retracted to the raised position (initial position) by pulling up the nozzle by the lifting means. In addition, by ensuring the engageable range of the engaged portion on the nozzle side and the pulling means to be long along the rotation path of the transfer head, the transfer head is rotating (that is, the transfer head stops rotating). Even if it is not), the nozzle can be initialized and the loss time can be eliminated or reduced.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a sectional view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 4 is a sectional view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 5 is a sectional view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 6 is a plan view of an initializing stage of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 7 is a plan view of an initializing stage of an electronic component mounting apparatus according to another embodiment of the present invention.

FIG. 8 is a side view of an initializing stage of a conventional electronic component mounting apparatus.

[Explanation of symbols]

9 electronic components 10 rotary head 11 Transfer head 12 Electronic component supply department 14 board 15 Board positioning part 27 Nozzle shaft 28 nozzles 32 Engagement part 34 Stopper 37 Stopper operation member 46 bearing 47 push-up plate 51 long plate 52 bearing A Initialization stage B nozzle selection stage C nozzle protruding stage

Claims (3)

(57) [Claims] 1. A rotary head, a transfer head that rotates around the rotary head, an electronic component supply unit and a substrate positioning unit that are provided in a rotation path of the transfer head, and are provided below the transfer head. An electronic component mounting apparatus for picking up an electronic component provided in an electronic component supply unit by a nozzle projecting to and transferring and mounting the electronic component on a substrate positioned in a positioning unit, wherein the transfer head includes a plurality of upright nozzles. A spring for resiliently ejecting these nozzles downward, and a stopper releasably engaged with the nozzle to prevent the nozzle from descending due to the spring force of the spring. An initializing stage and a nozzle projecting stage are provided between the electronic component supply unit and the electronic component supplying unit, and the initializing stage is provided above the nozzle. A pull-up means for pulling up the nozzle to a height at which it engages with the engaged portion which is engaged with the stopper against the spring force of the spring, and the stopper is attached to the nozzle projecting stage from the nozzle side. Provided is stopper operation means for separating and lowering the nozzle by the spring force of the spring , and the engaged portion.
And the engaging range of the lifting means is set to the transfer head
An electronic component mounting device characterized by being secured long along a rotation path . 2. The engaged portion is a bearing, and
Press the ring ring along the direction of rotation of this bearing.
The lifting means by pushing up with a lifting plate
Extend the engageable range along the rotation path of the transfer head
The electronic component mounting according to claim 1, wherein the electronic component mounting is ensured.
apparatus. 3. The engaged portion is a long plate, and the long plate is
The above-mentioned pulling means by pushing up by alling
Extend the engageable range along the rotation path of the transfer head
The electronic component mounting according to claim 1, wherein the electronic component mounting is ensured.
apparatus.