JP3456799B2 - Resistor for cathode ray tube electron gun and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor for an electron gun of a cathode ray tube such as a color brown (image receiving) tube,
In particular, the present invention relates to a resistor for a cathode ray tube electron gun that supplies a high voltage to a focus electrode, an intermediate electrode, etc. by dividing the voltage and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, in cathode ray tubes such as color cathode ray tubes, focus electrodes and intermediate electrodes are
It is necessary to supply high voltage.

In such a case, if a high voltage is supplied from the stem pin of the color CRT, a problem occurs in terms of withstand voltage. Therefore, a resistor for voltage division is incorporated in the color CRT together with the electron gun, and the anode voltage is applied by this resistor. It has been put into practical use to divide the voltage and supply a high voltage to each electrode.

A conventional resistor for a cathode ray tube electron gun will be described below with reference to FIGS. 3 and 4.

As shown in FIGS. 3 and 4, this resistor is provided with a plurality of voltage dividing electrode portions 3 on an insulating substrate 1,
The thick film resistance element 2 is formed so as to connect each electrode portion 3,
In order to prevent withstand voltage and release of gas, it is covered with glass insulating coatings 4a, 4b and 4c, and a metal tab 5 is fixed so as to make electrical contact with the electrode portion 3 for voltage division.

As a method of forming this resistor, a low resistance electrode portion 3 is formed on an insulating substrate 1 having a through hole formed in advance, then a thick film resistance element 2 is formed, and then, as shown in FIG. After forming the glass insulating coatings 4a and 4b, the metal tab 5 is inserted into and fixed to the through-hole provided in advance as shown in FIG. Finally, in order to prevent secondary electron discharge from the insulating substrate 1, a glass insulating film 4c is formed.

[0007]

By the way, such a conventional resistor has the following problems.

That is, after the metal tab 5 is fixed, the glass insulating coating 4c is formed for the purpose of preventing secondary electron emission from the insulating substrate 1. Therefore, a sintering process at about 550 to 700 ° C. must be performed. I have to.

However, when the metal tab 5 is fixed to the insulating substrate 1 in the sintering process as described above, a thermal shock is applied to the metal tab fixing portion and the fixing strength of the metal tab 5 is stabilized. If the adhesion strength is weak, the contact will be poor. This contact failure is attached to the cathode ray tube without being aware of the resistor alone.

Then, when the characteristics of the cathode ray tube are actually inspected, the predetermined voltage is not divided into each electrode such as the focus electrode and the intermediate electrode, and the defective voltage division is counted as a defective division.
There was a problem that a defective resistor was discovered for the first time here.

The present invention has been made to solve the above problems, and provides a resistor for a cathode ray tube electron gun capable of stably supplying a predetermined voltage to each electrode in a divided voltage, and a method of manufacturing the same. The purpose is to do.

[0012]

In order to achieve the above-mentioned object, a resistor for a cathode ray tube electron gun according to claim 1 comprises:
An insulator substrate having a plurality of terminal insertion holes formed so as to penetrate through the substrate having first and second surfaces; and a first surface of the insulator substrate formed adjacent to the plurality of terminal insertion holes. A plurality of electrode parts, a resistance element formed on the first surface of the insulator substrate so as to connect the plurality of electrode parts, and the first element on the first surface of the insulator substrate. A first insulating film formed so as to expose at least the plurality of electrode portions while covering at least the resistance element on the surface, and a portion of the second surface of the insulator substrate facing the plurality of electrodes. Other film thickness
A second insulating film formed so as to be thinner than the portion of the metal, and a metal inserted into each terminal insertion hole of the insulator substrate and fixed so as to sandwich the electrode part and the second insulating film. And a manufacturing tab.

According to a second aspect of the present invention , there is provided a resistor for a cathode ray tube electron gun which penetrates a substrate having first and second surfaces.
And an insulating substrate having a plurality of terminal insertion holes,
Formed on the first surface of the body substrate adjacent to the plurality of terminal insertion holes.
Connect the plurality of electrode portions formed to the plurality of electrode portions
Formed on the first surface of the insulator substrate
And a first surface of the insulator substrate on the first surface.
The plurality of electrode portions while covering at least the resistance element.
A first insulating film formed so as to be exposed;
The plurality of electrode portions formed on the second surface of the body substrate are opposed to each other.
Second insulating film whose thickness is 5-30 μm in the facing part
Is inserted into each terminal insertion hole of the insulator substrate,
It is fixed so as to sandwich the pole portion and the second insulating coating.
And a metal tab.

According to a third aspect of the present invention, there is provided a method of manufacturing a resistor for a cathode ray tube electron gun, wherein a plurality of electrode portions adjacent to the plurality of terminal insertion holes are provided on the first surface of the insulator substrate, and the plurality of electrode portions. A step of forming a resistance element for connecting the plurality of electrodes, and a first step of exposing the plurality of electrode portions while covering at least the resistance element on the insulator substrate.
A step of forming a first insulating coating on the surface of the insulating substrate, and a step of forming a second insulating coating on the second surface of the insulating substrate, the portion facing the plurality of electrode portions having a reduced film thickness. A step of inserting a metal tab into each terminal insertion hole of the insulator substrate, and sandwiching and fixing the electrode portion and the thin portion of the second insulating film.

[0015]

According to the present onset Ming, adjacent to the plurality of terminal insertion holes of the surface of the insulator substrate to form a plurality of electrode portions, the resistance element on the surface of the insulating substrate so as to connect the plurality of electrode portions And forming a first insulating film on the insulator substrate so as to expose a plurality of electrode portions while covering at least the resistance element on the surface of the insulator substrate, and a plurality of electrodes on the opposite surface. The thickness of the part facing the part is thin.
The insulating film is formed, a metal tab is inserted into each terminal insertion hole of the insulating substrate, and the electrode portion and the thin portion of the second insulating film are sandwiched and fixed. In addition, the second insulating film
The thickness of the part facing multiple electrodes is thinner than other parts.
Forming a thin film in the second insulating film
A portion and a thick portion may be provided.

That is, this resistor is completed by covering the front and back surfaces of the insulating substrate on which the electrode portion and the resistive element are formed with the first and second insulating coatings and then fixing the metal tabs.
After that, since it is not necessary to sinter the glass insulating coating for preventing secondary electron discharge, the metal tab fixing portion is not subjected to thermal history (thermal shock in the coating sintering step), and the metal tab fixing portion has a fixing strength. Is stable.

[0017] In this onset Ming, a plurality of the second insulation film
By setting the film thickness of the part facing the electrode part in the range of 5 μm to 30 μm, this resistor was attached to the cathode ray tube, and the glass insulating film thickness and the glass insulating film cracking occurrence rate in the metal tab adhesion forming process and As a result of examining the film thickness of the glass insulating film and the defective rate of withstand voltage characteristic of the color cathode ray tube, good results were obtained.

That is, although the metal tab can be fixed even when the film thickness of the portion of the second insulating film for fixing the metal tab facing the plurality of electrode portions is 5 μm or less, the withstand voltage characteristic deteriorates. It is necessary to have a film thickness of 5 μm or more, and when this film thickness is 30 μm or more, there is no problem in withstand voltage characteristics, but it was found that the second insulating film is easily cracked when the metal tab is fixed. did.

As described above, in a cathode ray tube such as a color cathode ray tube, it is possible to stably supply a high voltage with a partial voltage to the focus electrode and the intermediate electrode.

Further, it becomes possible to omit the conventional step of applying the glass insulating coating 4c, which contributes to shortening of the lead time for manufacturing the product and reduction of the equipment cost, so that an inexpensive resistor can be manufactured.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing the structure of a resistor (hereinafter referred to as a resistor) for a cathode ray tube electron gun according to an embodiment of the present invention, and FIG. It is a figure which shows the result of having inspected the color CRT (color picture tube) manufactured by.

A cathode ray tube such as a color cathode-ray tube is composed of a screen portion, a neck portion having an electron gun, and a funnel portion connecting them. Electron gun
A plurality of cathodes such as R, G, and B and corresponding first to first
It has a plurality of grids such as a fourth grid, a convergence electrode, and the like, and is fixedly supported by the insulating support in the above-described order. Convergence electrodes include
High voltage applied to the anode terminal (25KV ~ 30KV,
A valve spacer that adds about 25 KV is usually installed. Further, behind the insulating support, a resistor is fixed by a connecting member for in-pipe parts made of ribbon or wire. This resistor is used to divide the voltage of the anode terminal (25KV) into the focus electrode or the intermediate electrode, for example, by dividing it into a medium voltage of about 5KV to 8KV, and supply the voltage to the anode terminal, the focus electrode and the intermediate electrode. The electrodes and the like are connected to the resistor by a metal tab and a thick film resistance element provided on the resistor.

As shown in FIG. 1, the resistor applies the voltage (25 KV) at the anode terminal to the focus electrode, the intermediate electrode, etc.
For example, a plurality of electrode portions 3 for dividing and supplying to a medium voltage of about 5 KV to 8 KV are provided on the surface of the insulating substrate 1, and the thick film resistance element 2 is formed so as to connect each electrode portion 3. In order to increase the withstand voltage of the thick film resistance element 2 and prevent gas emission, the first surface, which is the front side, of the insulating substrate 1 is covered with the glass insulating film 4a as the first insulating film, and the back surface is the first surface. Glass insulating film 4 having the surface 2 as a second insulating film
The metal tabs 5 are covered with b and 4d, and the metal tabs 5 are inserted into the through holes provided in the central portion of each electrode portion 3 of the insulating substrate 1 in advance, and pressure is applied from both sides of the insulating substrate 1 to each electrode portion 3. The second glass insulating coating is fixed so as to sandwich the thinned portion 4d of the second glass insulating coating and at least the flange portion of the metal tab 5 is brought into contact with the electrode portion 3.
The glass insulating coatings 4a, 4b and 4d are high resistance coatings of about 1000 MΩ, and the thick film resistance element 2 is a low resistance material of about several KΩ. Further, the glass insulating film 4d is formed on the back surface portion of the substrate surface substantially facing each electrode portion 3 to be thinner than the glass insulating films 4a and 4b (film thickness of about 150 to 200 μm), for example, in a range of about 5 μm to 30 μm. Has been done.

Next, a method of manufacturing the above resistor will be described.

In the case of this resistor, first of all, a plurality of relatively low resistances containing glass and the like containing ruthenium oxide as a main component are provided around the through hole provided at a predetermined position of the insulating substrate 1 made of alumina ceramics or the like. The electrode part 3 is formed by printing by screen printing and drying (150 ° C.).

Then, a mixed layer containing ruthenium oxide and glass as main components is printed in a meandering manner by a screen printing method so as to be connected to the electrode portion 3, dried (150 ° C.), and baked (800
To 900 ° C.) to form the thick film resistance element 2. The thick film resistance element 2 has a much lower resistance than the insulator substrate 1.

Then, on both surfaces of the insulating substrate 1 on which the thick film resistance element 2 is formed, the thick film resistance element 2 is covered together with the through holes and the peripheral portions of the electrode portions 3 except the central portions of the electrode portions 3. As described above, the glass insulating coatings 4a, 4b, 4d are printed by one-layer printing and two-layer overlapping printing by the screen printing method, and dried (
C.) and baking (550 to 700.degree. C.) to form an insulating layer. At this time, the glass insulating film 4 formed on both surfaces of the insulating substrate 1
The film thickness of a and 4b is 150 to 200 μm. The glass insulating coating 4d is formed so as to cover only the back surface portion of the surface of the insulating substrate 1 facing each electrode portion 3, and the film thickness thereof is thinner than that of the glass insulating coatings 4a and 4b, for example, 5 to 30 μm.
The range is about m.

Further, a metal tab 5 is inserted into a through hole provided in advance at the positions of the plurality of electrode portions 3 on the insulator substrate 1, and the metal tab 5 is used to insert the electrode 3 and the glass insulating film 4.
The metal tab 5 is fixed to the insulator substrate 1 by sandwiching it with d.

As a result of a characteristic inspection of a color cathode ray tube manufactured by incorporating the resistor formed as described above together with an electron gun, as shown in FIG. 2, the glass insulating film thickness and the glass in the metal tab fixing forming step are shown. Examination of the insulating film cracking occurrence rate, the glass insulating film thickness and the color cathode ray tube withstand voltage characteristic defective rate shows that the glass insulating film 4d for fixing the metal tab 5 has a thickness of 5 μm or less. Can be fixed, but the withstand voltage characteristics will deteriorate.
If the thickness is 30 μm or more, and the film thickness is 30 μm or more, there is no problem in the withstand voltage characteristic, but the crack occurrence rate of the glass insulating coating 4d increases when the metal tab 5 is fixed, and the glass insulating coating 4d becomes It becomes easy to crack.

That is, based on the result of this characteristic inspection, by setting the film thickness of the glass insulating coating 4d in the range of about 5 .mu.m to 30 .mu.m, the partial pressure failure when the voltage is divided from the anode voltage to the focus electrode or the intermediate electrode is reduced. It was found that high voltage can be stably supplied to each electrode.

As described above, according to the resistor for the cathode ray tube electron gun and the method of manufacturing the same of the present embodiment, after the metal tab 5 is fixedly formed, the thermal history (thermal shock in the film sintering step).
Since it is not subject to the impact, the fixing strength is stable and the metal tab 5
It is possible to reduce the contact failure rate of the fixed portion.

As a result, when this resistor is attached to a color cathode ray tube or the like, it becomes possible to stably supply a divided high voltage to each electrode such as the focus electrode and the intermediate electrode. Further, since the conventional step of coating and baking the glass insulating coating 4c can be omitted, it is possible to contribute to shortening the lead time for manufacturing the product, reducing the facility cost, etc., and it is possible to manufacture an inexpensive resistor.

[0034]

As described above, according to the first and third aspects of the present invention, the front and back surfaces of the insulating substrate having the electrode portion and the thick film resistance element are covered with the first and second insulating coatings. After that, if the metal tab is fixed, the resistor is completed.Therefore, it is not necessary to sinter the glass insulating film after fixing the metal tab. The fixing strength of the tab fixing part is stable.

According to the second aspect of the invention, the thickness of the thin portion of the second insulating film is set in the range of 5 μm to 30 μm, so that the resistor is attached to the cathode ray tube and the characteristic inspection is performed. As a result, it was possible to reduce the film thickness of the glass insulating film, the crack occurrence rate of the glass insulating film in the step of forming and fixing the metal tab, the film thickness of the glass insulating film, and the defective rate of withstand voltage characteristic of the color cathode ray tube.

As a result of the above, in a cathode ray tube such as a color cathode ray tube, it becomes possible to stably supply a partial voltage of a high voltage to a focus electrode or an intermediate electrode.

Further, it becomes possible to omit the conventional coating process of the glass insulating film 4c, which contributes to the reduction of the lead time for manufacturing the product and the cost of the equipment, and the inexpensive resistor can be manufactured.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a resistor for a cathode ray tube electron gun according to an embodiment of the present invention.

FIG. 2 is a diagram showing a glass insulating film thickness of this resistor, a glass insulating film cracking occurrence rate in a metal tab adhesion forming step, and a color cathode ray tube withstand voltage characteristic defective rate.

FIG. 3 is a plan view showing a conventional resistor for a cathode ray tube electron gun.

4 is a cross-sectional view taken along the line AA ′ of the resistor for the cathode ray tube electron gun of FIG.

[Explanation of symbols]

1 ... Insulator substrate, 2 ... Thick film resistance element, 3 ... Electrode part, 4
a, 4b, 4c, 4d ... Glass insulating film, 5 ... Metal tab.

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01J 9/14, 9/18 H01J 29/48-29/51

Claims (3)

(57) [Claims] 1. An insulator substrate having a plurality of terminal insertion holes penetrating a substrate having first and second surfaces, and a plurality of terminal insertion holes formed on the first surface of the insulator substrate. A plurality of electrode portions formed adjacent to each other, a resistance element formed on the first surface of the insulator substrate so as to connect the plurality of electrode portions, and a resistance element formed on the first surface of the insulator substrate. a first insulating film above is formed first so as to expose the plurality of electrode portions while covering at least the resistive element on the surface, the second surface of the insulator substrate, said plurality of electrodes Oppose to
A second insulating film formed so that the film thickness of the portion to be thinned is smaller than that of the other part; and the electrode portion and the second insulating film which are inserted into the terminal insertion holes of the insulator substrate. A resistor for a cathode ray tube electron gun, comprising: a metal tab fixed so as to be sandwiched. 2. An insulator substrate having a plurality of terminal insertion holes penetrating a substrate having first and second surfaces, and a plurality of terminal insertion holes formed on the first surface of the insulator substrate. A plurality of electrode portions formed adjacent to each other, a resistance element formed on the first surface of the insulator substrate so as to connect the plurality of electrode portions, and a resistance element formed on the first surface of the insulator substrate. A first insulating film formed to cover at least the resistance element on the first surface and expose the plurality of electrode portions; and a first surface formed on a second surface of the insulator substrate. A second insulating coating having a film thickness of 5 to 30 μm in a portion facing the plurality of electrode portions, and inserted into each terminal insertion hole of the insulator substrate to sandwich the electrode portion and the second insulating coating. For a cathode ray tube electron gun, characterized in that . 3. A step of forming a plurality of electrode portions respectively adjacent to a plurality of terminal insertion holes and a resistance element connecting the plurality of electrode portions on the first surface of the insulator substrate; A step of forming a first insulating coating on the first surface of the insulator substrate so as to expose the plurality of electrode portions while covering at least the resistive element, and the second surface of the insulator substrate on the first surface. A step of forming a second insulating film in which the film thickness of the portion facing the plurality of electrode portions is thin, and inserting a metal tab into each terminal insertion hole of the insulator substrate,
A method of manufacturing a resistor for a cathode ray tube electron gun, comprising: sandwiching and fixing the electrode portion and a portion of the second insulating coating having a small film thickness.