JP3456256B2 - Polyimide copolymer and method for producing the same - Google Patents

Polyimide copolymer and method for producing the same

Info

Publication number
JP3456256B2
JP3456256B2 JP13134694A JP13134694A JP3456256B2 JP 3456256 B2 JP3456256 B2 JP 3456256B2 JP 13134694 A JP13134694 A JP 13134694A JP 13134694 A JP13134694 A JP 13134694A JP 3456256 B2 JP3456256 B2 JP 3456256B2
Authority
JP
Japan
Prior art keywords
bis
repeating unit
mol
aminophenoxy
phenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13134694A
Other languages
Japanese (ja)
Other versions
JPH07316292A (en
Inventor
一郎 金子
清 本海
厚志 杉谷
昌弘 湯山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP13134694A priority Critical patent/JP3456256B2/en
Publication of JPH07316292A publication Critical patent/JPH07316292A/en
Application granted granted Critical
Publication of JP3456256B2 publication Critical patent/JP3456256B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、耐熱性に優れると共
に、高い機械的強度、熱的寸法安定性及び低吸湿性を有
し、ファインパターン化フレキシブルプリント配線基板
等の基材として好適なポリイミド共重合体及びその製造
方法に関する。
The present invention relates to a polyimide having excellent heat resistance, high mechanical strength, thermal dimensional stability and low hygroscopicity, which is suitable as a base material for fine patterned flexible printed wiring boards and the like. The present invention relates to a copolymer and a method for producing the same.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】従来、
ポリイミド樹脂は非常に優れた耐熱性、耐薬品性、電気
特性、機械的特性、その他優れた諸特性を有しているこ
とが知られており、特に耐熱性を要する電気絶縁フィル
ムなど各種用途に広く利用されている。しかし、ポリイ
ミド樹脂は他のプラスチックに比べ耐熱性は優れている
が、吸水率が著しく大きい。そのため、寸法安定性や絶
縁性の低下を生じるという欠点を有していた。
2. Description of the Related Art Conventionally, the problems to be solved by the invention
Polyimide resin is known to have excellent heat resistance, chemical resistance, electrical properties, mechanical properties, and other excellent properties, and is particularly useful for various applications such as electrical insulation films that require heat resistance. Widely used. However, the polyimide resin is superior in heat resistance to other plastics, but has a significantly high water absorption. Therefore, it has a drawback that dimensional stability and insulation are deteriorated.

【0003】近年、優れた低吸湿性を有し、しかも機械
的強度に優れたポリイミド樹脂に対する要求が高まって
おり、種々検討が行われている。かかる試みの中で疎水
基を含む芳香族ジアミンや芳香族テトラカルボン酸二無
水物を用い、低吸湿性の向上を目指す取り組みが多く見
られる。しかしながら、これらの取り組みのいずれの場
合にも、低吸湿性の向上が得られるかわりに、機械的特
性、特に弾性率及び引張強度が低下する傾向にあり、低
吸湿性と機械的特性の両方を満足するものではなかっ
た。
In recent years, there has been an increasing demand for polyimide resins having excellent low hygroscopicity and excellent mechanical strength, and various studies have been conducted. Among such attempts, many attempts are made to improve low hygroscopicity by using an aromatic diamine having a hydrophobic group or an aromatic tetracarboxylic dianhydride. However, in each of these approaches, the mechanical properties, in particular the elastic modulus and the tensile strength, tend to decrease in exchange for the improvement of the low hygroscopicity, and both the low hygroscopicity and the mechanical properties are reduced. I was not satisfied.

【0004】本発明は上記事情に鑑みなされたもので、
耐熱性に優れ、熱的寸法安定性が高い上、高い機械的強
度と低吸湿性とを兼備したポリイミド共重合体及びその
製造方法を提供することを目的とする。
The present invention has been made in view of the above circumstances.
An object of the present invention is to provide a polyimide copolymer having excellent heat resistance, high thermal dimensional stability, high mechanical strength and low hygroscopicity, and a method for producing the same.

【0005】[0005]

【課題を解決するための手段及び作用】本発明者等は上
記目的を達成するため鋭意検討を行った結果、4,4’
−ビス(4−アミノベンズアミド)−3,3’−ジメチ
ルビフェニルと2,2−ビス〔4−(4−アミノフェノ
キシ)フェニル〕ヘキサフルオロプロパン又は2,2−
ビス〔4−(4−アミノフェノキシ)フェニル〕プロパ
ンとを主成分とする芳香族ジアミンと、芳香族テトラカ
ルボン酸二無水物とを重合して得られるポリアミド酸共
重合体を熱的及び化学的に脱水閉環することによって、
下記一般式(1)で表される反復単位(A)と下記一般
式(2)で表される反復単位(B)とを主構成単位とし
て含むポリイミド共重合体、好ましくは下記反復単位
(A)と下記反復単位(B)とがモル比で(A)/
(B)=10/90〜90/10である反復単位を含む
ポリイミド共重合体が得られると共に、このポリイミド
共重合体が優れた低吸湿性を有し、しかも優れた機械的
強度を有することを知見し、本発明をなすに至った。
Means and Actions for Solving the Problems The inventors of the present invention have conducted extensive studies to achieve the above object, and as a result, 4,4 '
-Bis (4-aminobenzamido) -3,3'-dimethylbiphenyl and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane or 2,2-
A polyamic acid copolymer obtained by polymerizing an aromatic diamine containing bis [4- (4-aminophenoxy) phenyl] propane as a main component and an aromatic tetracarboxylic dianhydride is thermally and chemically By dehydration ring closure to
A polyimide copolymer containing a repeating unit (A) represented by the following general formula (1) and a repeating unit (B) represented by the following general formula (2) as main constitutional units, preferably the following repeating unit (A ) And the following repeating unit (B) in a molar ratio of (A) /
(B) A polyimide copolymer containing repeating units of 10/90 to 90/10 is obtained, and the polyimide copolymer has excellent low hygroscopicity and excellent mechanical strength. That is, the present invention has been completed.

【0006】[0006]

【化2】 (但し、式中R1は4価の芳香族基を示し、R2はCH3
又はCF3を示す。)
[Chemical 2] (However, in the formula, R 1 represents a tetravalent aromatic group, and R 2 represents CH 3
Or CF 3 is shown. )

【0007】従って、本発明は、上記一般式(1)で表
される反復単位(A)と上記一般式(2)で表される反
復単位(B)とを主構成単位として含むポリイミド共重
合体、好ましくは上記反復単位(A)と上記反復単位
(B)とがモル比で(A)/(B)=10/90〜90
/10であるポリイミド共重合体、及び、4,4’−ビ
ス(4−アミノベンズアミド)−3,3’−ジメチルビ
フェニルと2,2−ビス〔4−(4−アミノフェノキ
シ)フェニル〕ヘキサフルオロプロパン又は2,2−ビ
ス〔4−(4−アミノフェノキシ)フェニル〕プロパン
とを主成分とする芳香族ジアミンと、芳香族テトラカル
ボン酸二無水物とを重合してポリアミド酸を得、次いで
該ポリアミド酸共重合体を熱的及び化学的に脱水閉環す
ることを特徴とする上記一般式(1)で表される反復単
位(A)と上記一般式(2)で表される反復単位(B)
とを主構成単位として含むポリイミド共重合体の製造方
法を提供する。
Therefore, the present invention provides a polyimide copolymer containing a repeating unit (A) represented by the general formula (1) and a repeating unit (B) represented by the general formula (2) as main constituent units. In combination, preferably the repeating unit (A) and the repeating unit (B) are in a molar ratio of (A) / (B) = 10/90 to 90.
/ 10 polyimide copolymer and 4,4'-bis (4-aminobenzamido) -3,3'-dimethylbiphenyl and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoro An aromatic diamine containing propane or 2,2-bis [4- (4-aminophenoxy) phenyl] propane as a main component is polymerized with an aromatic tetracarboxylic acid dianhydride to obtain a polyamic acid. A repeating unit (A) represented by the general formula (1) and a repeating unit (B represented by the general formula (2), which are characterized in that the polyamic acid copolymer is thermally and chemically dehydrated and ring-closed. )
Provided is a method for producing a polyimide copolymer containing and as a main constituent unit.

【0008】以下、本発明につき更に詳細に説明する
と、本発明のポリイミド共重合体は、下記一般式(1)
で表される反復単位(A)と下記一般式(2)で表され
る反復単位(B)との合計量が100モル%であり、反
復単位(A)と反復単位(B)とをモル比で(A)/
(B)=10/90〜90/10の割合で含むものであ
る。
The present invention will be described in more detail below. The polyimide copolymer of the present invention has the following general formula (1).
The total amount of the repeating unit (A) represented by and the repeating unit (B) represented by the following general formula (2) is 100 mol%, and the repeating unit (A) and the repeating unit (B) are mols. Ratio (A) /
(B) = 10/90 to 90/10.

【0009】[0009]

【化3】 (但し、式中R1は4価の芳香族基を示し、R2はCH3
又はCF3を示す。)
[Chemical 3] (However, in the formula, R 1 represents a tetravalent aromatic group, and R 2 represents CH 3
Or CF 3 is shown. )

【0010】上記式中のR1は4価の芳香族基であり、
これは後述するテトラカルボン酸二無水物の主骨格に由
来する。
R 1 in the above formula is a tetravalent aromatic group,
This is derived from the main skeleton of tetracarboxylic dianhydride described later.

【0011】ここで、上記反復単位(A)と上記反復単
位(B)とは、ポリイミド共重合体中にモル比で(A)
/(B)=10/90〜90/10、特に25/75〜
75/25の割合で存在することが好ましい。反復単位
(A)のモル比が90%を越えると、ポリイミド共重合
体の吸水率の改善効果が十分に得られず、また柔軟性が
低下する。一方、反復単位(B)のモル比が90%を越
えると、ポリイミド共重合体の機械的強度、弾性率及び
熱的寸法安定性が非常に低くなる。
Here, the repeating unit (A) and the repeating unit (B) have a molar ratio (A) in the polyimide copolymer.
/ (B) = 10/90 to 90/10, especially 25/75 to
It is preferably present in a ratio of 75/25. When the molar ratio of the repeating unit (A) exceeds 90%, the effect of improving the water absorption of the polyimide copolymer cannot be sufficiently obtained, and the flexibility decreases. On the other hand, when the molar ratio of the repeating unit (B) exceeds 90%, the mechanical strength, elastic modulus and thermal dimensional stability of the polyimide copolymer become very low.

【0012】[0012]

【0013】上記ポリイミド共重合体は高分子量の重合
体であり、ポリアミド酸としての粘度は、例えば0.5
g/100mlDMF中で測定した場合、測定温度30
℃における対数粘度が0.5〜5.0dl/gであるこ
とが好ましい。
The above-mentioned polyimide copolymer is a high molecular weight polymer, and its viscosity as a polyamic acid is, for example, 0.5.
Measurement temperature 30 when measured in g / 100 ml DMF
The logarithmic viscosity at 0 ° C. is preferably 0.5 to 5.0 dl / g.

【0014】上記ポリイミド共重合体は芳香族ジアミン
と芳香族テトラカルボン酸二無水物とを重合してポリア
ミド酸共重合体を得、このポリアミド酸共重合体を公知
の方法で熱的又は化学的に脱水閉環(イミド化)するこ
とによって製造することができる。
The above polyimide copolymer is obtained by polymerizing an aromatic diamine and an aromatic tetracarboxylic dianhydride to obtain a polyamic acid copolymer, and the polyamic acid copolymer is thermally or chemically prepared by a known method. It can be produced by dehydration ring closure (imidization).

【0015】ここで、本発明において、芳香族ジアミン
としては、4,4’−ビス(4−アミノベンズアミド)
−3,3’−ジメチルビフェニルと、2,2−ビス〔4
−(4−アミノフェノキシ)フェニル〕ヘキサフルオロ
プロパン又は2,2−ビス〔4−(4−アミノフェノキ
シ)フェニル〕プロパンとを主成分として用いる。な
お、4,4’−ビス(4−アミノベンズアミド)−3,
3’−ジメチルビフェニルと、2,2−ビス〔4−(4
−アミノフェノキシ)フェニル〕ヘキサフルオロプロパ
ン又は2,2−ビス〔4−(4−アミノフェノキシ)フ
ェニル〕プロパンとの混合割合は、モル比で10/90
〜90/10、特に25/75〜75/25とすること
が好ましい。
In the present invention, as the aromatic diamine, 4,4'-bis (4-aminobenzamide) is used.
-3,3'-dimethylbiphenyl and 2,2-bis [4
-(4-Aminophenoxy) phenyl] hexafluoropropane or 2,2-bis [4- (4-aminophenoxy) phenyl] propane is used as a main component. In addition, 4,4′-bis (4-aminobenzamide) -3,
3'-dimethylbiphenyl and 2,2-bis [4- (4
-Aminophenoxy) phenyl] hexafluoropropane or 2,2-bis [4- (4-aminophenoxy) phenyl] propane is mixed at a molar ratio of 10/90.
It is preferable to be 90 to 90/10, particularly 25/75 to 75/25.

【0016】[0016]

【0017】一方、芳香族テトラカルボン酸二無水物と
しては、具体的にピロメリット酸二無水物、3,3’,
4,4’−ビフェニルテトラカルボン酸二無水物、2,
3,3’,4’−ビフェニルテトラカルボン酸二無水
物、3,3’4,4’−ベンゾフェノンテトラカルボン
酸二無水物、2,3,6,7−ナフタレンテトラカルボ
ン酸二無水物、1,4,5,8−ナフタレンテトラカル
ボン酸二無水物、2,2−ビス(3,4−ジカルボキシ
フェニル)プロパン二無水物、ビス(3,4−ジカルボ
キシフェニル)エタン二無水物、ビス(3,4−ジカル
ボキシフェニル)エーテル二無水物、1,1−ビス
(3,4−カルボキシフェニル)エタン二無水物、3,
4,9,10−ベリレンテトラカルボン酸二無水物、ベ
ンゼン−1,2,3,4−テトラカルボン酸二無水物、
2,3,6,7−アントラセンテトラカルボン酸二無水
物、1,2,7,8−フェニンレンテトラカルボン酸二
無水物などを挙げることができ、これら一種を単独で又
は二種以上を併用して使用することができる。
On the other hand, as the aromatic tetracarboxylic dianhydride, specifically, pyromellitic dianhydride, 3,3 ',
4,4'-biphenyltetracarboxylic dianhydride, 2,
3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,3′4,4′-benzophenonetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1 , 4,5,8-naphthalenetetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ethane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, 1,1-bis (3,4-carboxyphenyl) ethane dianhydride, 3,
4,9,10-berylenetetracarboxylic dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride,
2,3,6,7-anthracene tetracarboxylic dianhydride, 1,2,7,8-phenylene tetracarboxylic dianhydride and the like can be mentioned, and one of these can be used alone or two or more can be used. It can be used in combination.

【0018】上記芳香族ジアミンと芳香族テトラカルボ
ン酸二無水物との重合反応は、両化合物を有機極性溶媒
中、モル比で芳香族ジアミン混合物100に対して芳香
族テトラカルボン酸二無水物を95〜105、特に等モ
ルの割合で混合することが望ましい。
In the polymerization reaction of the aromatic diamine and the aromatic tetracarboxylic dianhydride, both compounds are mixed with 100 parts of the aromatic dicarboxylic acid dianhydride per 100 aromatic diamine mixture in an organic polar solvent in a molar ratio. It is desirable to mix them in a proportion of 95 to 105, especially equimolar.

【0019】また、有機極性溶媒としては、例えばジメ
チルスルフォキシド等のスルフォキシド系溶媒、N、N
−ジメチルホルムアミド、N、N−ジエチルホルムアミ
ド等のホルムアミド系溶媒、N、N−ジメチルアセトア
ミド等のアセトアミド系溶媒、N−メチル−2−ピロリ
ドン、N−ビニル−2−ピロリドン等のピロリドン系溶
媒、フェノール、o−、m−又はp−クレゾール、キシ
レノール、ハロゲン化フェノール、カテコール等のフェ
ノール系溶媒、あるいはヘキサメチルホスホルムアミ
ド、γ−ブチロラクトン等を挙げることができる。これ
らは一種を単独で又は二種以上を混合して用いることが
でき、また、キシレン、トルエン等の芳香族炭化水素系
の有機非極性溶媒を併用して用いることもできる。上記
有機極性溶媒の使用量は特に限定されないが、重合反応
より得られるポリアミド酸共重合体が有機極性溶媒中に
5〜30重量%、特に10〜20重量%溶解しているよ
うに芳香族ジアミン、芳香族テトラカルボン酸二無水
物、有機極性溶媒の使用量を決定することが望ましい。
Further, as the organic polar solvent, for example, sulfoxide-based solvent such as dimethyl sulfoxide, N, N
Formamide solvents such as dimethylformamide, N, N-diethylformamide, acetamide solvents such as N, N-dimethylacetamide, pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone, phenol , Phenol solvent such as o-, m- or p-cresol, xylenol, halogenated phenol, and catechol, or hexamethylphosphoramide, γ-butyrolactone, and the like. These may be used alone or in combination of two or more, and may also be used in combination with an aromatic hydrocarbon-based organic nonpolar solvent such as xylene or toluene. The amount of the above organic polar solvent used is not particularly limited, but the aromatic diamine is such that the polyamic acid copolymer obtained by the polymerization reaction is dissolved in the organic polar solvent in an amount of 5 to 30% by weight, particularly 10 to 20% by weight. It is desirable to determine the amounts of the aromatic tetracarboxylic dianhydride and organic polar solvent used.

【0020】上記重合反応条件は0〜70℃、特に0〜
30℃の温度で1〜40時間、特に2〜16時間行うこ
とが好ましく、この重合反応より効率的にポリアミド酸
共重合体を得ることができる。
The polymerization reaction conditions are 0 to 70 ° C., especially 0 to
It is preferable to carry out the reaction at a temperature of 30 ° C. for 1 to 40 hours, particularly 2 to 16 hours, and a polyamic acid copolymer can be obtained more efficiently by this polymerization reaction.

【0021】次に、上記ポリアミド酸共重合体の脱水閉
環は通常の方法で行うことができ、熱的又は化学的脱水
閉環(イミド化)を好適に採用することができる。ここ
で、熱的な脱水閉環方法しては、200〜500℃で5
〜120分間加熱する方法が好適である。
Next, the dehydration ring closure of the polyamic acid copolymer can be carried out by an ordinary method, and thermal or chemical dehydration ring closure (imidization) can be preferably adopted. Here, as the thermal dehydration ring-closing method, 5 at 200 to 500 ° C.
A method of heating for 120 minutes is preferable.

【0022】また、ポリアミド酸共重合体を化学的に脱
水閉環するには、脱水剤及び触媒を用いた方法が好適で
ある。この場合、脱水剤としては、例えば脂肪族酸無水
物、芳香族酸無水物、N,N’−ジアルキルカルボジイ
ミド、低級脂肪酸ハロゲン化物、ハロゲン化低級脂肪酸
ハロゲン化物、ハロゲン化低級脂肪酸無水物、アリルフ
ォスフォン酸ジハロゲン化物、チオニルハロゲン化物等
が挙げられ、これらは一種を単独で又は二種以上を混合
しても使用することができる。脱水剤の使用量はポリア
ミド酸の繰り返し単位当り約0.1〜10モル量、特に
0.5〜4モル量が好ましい。
A method using a dehydrating agent and a catalyst is suitable for chemically dehydrating and ring-closing the polyamic acid copolymer. In this case, examples of the dehydrating agent include aliphatic acid anhydrides, aromatic acid anhydrides, N, N'-dialkylcarbodiimides, lower fatty acid halides, halogenated lower fatty acid halides, halogenated lower fatty acid anhydrides, allyl phosphite. Examples thereof include phonic acid dihalide and thionyl halide. These can be used alone or in combination of two or more. The amount of the dehydrating agent used is preferably about 0.1 to 10 mols, and particularly preferably 0.5 to 4 mols per repeating unit of the polyamic acid.

【0023】触媒としては、例えばトリエチルアミン等
の脂肪族第三級アミン、ジメチルアニリン等の芳香族第
三級アミン、ピリジン、β−ピコリン、イソキノリン等
の複素環式第三級アミン等が挙げられ、これらは一種を
単独で又は二種以上を混合して使用することができる。
触媒の使用量は、ポリアミド酸の繰り返し単位当り約
0.01〜4モル量、特に0.1〜2モル量が好まし
い。
Examples of the catalyst include aliphatic tertiary amines such as triethylamine, aromatic tertiary amines such as dimethylaniline, and heterocyclic tertiary amines such as pyridine, β-picoline and isoquinoline. These can be used alone or in combination of two or more.
The amount of the catalyst used is preferably about 0.01 to 4 mols, and particularly preferably 0.1 to 2 mols per repeating unit of polyamic acid.

【0024】なお、上記化学的脱水閉環の反応条件は、
20〜400℃で0.2〜20時間、特に50〜350
℃で0.5〜5時間が好ましい。
The reaction conditions for the above chemical dehydration ring closure are as follows:
0.2 to 20 hours at 20 to 400 ° C., especially 50 to 350
Preference is given to 0.5 to 5 hours at 0 ° C.

【0025】ポリイミド共重合体をフィルム状として得
るには、上記ポリアミド酸共重合体の有機溶媒溶解液を
エンドレスベルト等の支持体に流延又は塗布して膜状と
し、この膜を100〜150℃で乾燥し、溶媒を10〜
30%含有するポリアミド酸の自己支持性の膜を得る。
次いで、この膜を支持体上から引き剥し、端部を固定し
た後、約200〜250℃に加熱して溶媒をとばし、更
に200〜500℃で脱水イミド化することにより、厚
みが10〜150μmのポリイミドフィルムを得ること
ができる。
To obtain a polyimide copolymer in the form of a film, a solution of the above polyamic acid copolymer in an organic solvent is cast or coated on a support such as an endless belt to form a film, and the film is 100 to 150. Dry at 0 ° C and add 10-
A polyamic acid self-supporting membrane containing 30% is obtained.
Then, the film is peeled off from the support, the ends are fixed, and then heated to about 200 to 250 ° C. to remove the solvent, and further dehydrated and imidized at 200 to 500 ° C. to have a thickness of 10 to 150 μm. Can be obtained.

【0026】[0026]

【発明の効果】本発明のポリイミド共重合体により構成
されているポリイミドフィルムは、耐熱性等の諸特性に
優れている上、機械的強度及び熱的寸法安定性が高く、
かつ低吸湿性を有しているため、例えば電気絶縁材料や
ファインパターン化フレキシブルプリント基板等のフィ
ルム材料として好適である。更に、本発明の製造方法に
よれば、上記ポリイミド共重合体を工業的に有利に製造
することができる。
The polyimide film composed of the polyimide copolymer of the present invention is excellent in various properties such as heat resistance, and has high mechanical strength and thermal dimensional stability.
Moreover, since it has low hygroscopicity, it is suitable as a film material such as an electrically insulating material or a fine patterned flexible printed circuit board. Further, according to the production method of the present invention, the polyimide copolymer can be industrially advantageously produced.

【0027】[0027]

【実施例】以下、参考例、実施例及び比較例を示し、本
発明を具体的に説明するが、本発明は下記実施例に制限
されるものではない。
EXAMPLES The present invention will be specifically described below with reference to Reference Examples, Examples and Comparative Examples, but the present invention is not limited to the following Examples.

【0028】〔参考例〕まず、下記のように4,4’−
ビス(4−アミノベンズアミド)−3,3’−ジメチル
ビフェニルを合成した。
Reference Example First, as shown below, 4,4'-
Bis (4-aminobenzamido) -3,3′-dimethylbiphenyl was synthesized.

【0029】テトラヒドロフラン300mlに3,3’
−ジヒドロキシ−4,4’−ジアミノビフェニル37.
1g(0.175mol)とトリエチルアミン38.6
g(0.381mol)を溶解し、0℃に冷却後、その
中にテトラヒドロフラン150mlにp−ニトロ塩化ベ
ンゾイル68.2g(0.368mol)を溶かした溶
液を反応液の温度が10℃以下になるように滴下した。
その後、室温に戻し、2時間撹拌を続けた。
3,3 'in 300 ml of tetrahydrofuran
-Dihydroxy-4,4'-diaminobiphenyl 37.
1 g (0.175 mol) and triethylamine 38.6
After dissolving g (0.381 mol) and cooling to 0 ° C, a solution of 68.2 g (0.368 mol) of p-nitrobenzoyl chloride in 150 ml of tetrahydrofuran has a reaction liquid temperature of 10 ° C or lower. So that it was dripped.
Then, it returned to room temperature and continued stirring for 2 hours.

【0030】次いで、析出物を濾過し、テトラヒドロフ
ランで洗浄し、更に水、メタノールで洗浄した後、乾燥
して、4,4’−ビス(4−ニトロベンズアミド)−
3,3’−ジメチルビフェニルの黄白色結晶を得た。そ
の収量は89.0g(収率99.6%)であった。粗結
晶をN,N−ジメチルホルムアミドにより再結晶し、純
品を得た。
Then, the precipitate was filtered, washed with tetrahydrofuran, further washed with water and methanol, and then dried to obtain 4,4'-bis (4-nitrobenzamide)-.
Yellow-white crystals of 3,3′-dimethylbiphenyl were obtained. The yield was 89.0 g (yield 99.6%). The crude crystal was recrystallized from N, N-dimethylformamide to obtain a pure product.

【0031】1,000mlのオートクレーブに上で得
られた4,4’−ビス(4−ニトロベンズアミド)−
3,3’−ジメチルビフェニル15.0g(0.029
4mol)を、5%Pd/C3g、ジメチルホルムアミ
ド500mlとともに装入した。60℃で激しく撹拌し
ながら水素を導入し、水素の吸収が認められなくなるま
で撹拌を続けた。
4,4'-bis (4-nitrobenzamide) -obtained above in 1,000 ml autoclave
3,3'-Dimethylbiphenyl 15.0 g (0.029
4 mol) was charged together with 3 g of 5% Pd / C and 500 ml of dimethylformamide. Hydrogen was introduced with vigorous stirring at 60 ° C., and stirring was continued until hydrogen absorption was no longer observed.

【0032】冷却後、濾過して触媒を除去し、減圧濃縮
して水500mlへ注ぎ、沈澱物を濾過し、水及びメタ
ノールで洗浄後減圧乾燥し、4,4’−ビス(4−アミ
ノベンズアミド)−3,3’−ジメチルビフェニルの白
色結晶を得た。収量は13.2g(収率99.6%)で
あった。粗結晶をジメチルホルムアミド/メタノールの
混合溶媒により再結晶し、純品を得た。
After cooling, the catalyst was removed by filtration, concentrated under reduced pressure and poured into 500 ml of water. The precipitate was filtered, washed with water and methanol and dried under reduced pressure to obtain 4,4'-bis (4-aminobenzamide). ) -3,3'-Dimethylbiphenyl white crystals were obtained. The yield was 13.2 g (yield 99.6%). The crude crystal was recrystallized with a mixed solvent of dimethylformamide / methanol to obtain a pure product.

【0033】〔実施例1〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)259.0gを入
れ、窒素ガスを流しながら4,4’−ビス(4−アミノ
ベンズアミド)−3,3’−ジメチルビフェニル4.5
1g(0.010mol)及び2,2−ビス〔4−(4
−アミノフェノキシ)フェニル〕ヘキサフルオロプロパ
ン15.55g(0.030mol)をN,N−ジメチ
ルホルムアミドに溶解させた。次にピロメリット酸二無
水物8.72g(0.040mol)を加え、25℃で
3時間反応させた。
Example 1 A 500 ml flask was charged with N,
259.0 g of N-dimethylformamide (DMF) was added, and 4,4′-bis (4-aminobenzamide) -3,3′-dimethylbiphenyl 4.5 while flowing nitrogen gas.
1 g (0.010 mol) and 2,2-bis [4- (4
15.55 g (0.030 mol) of -aminophenoxy) phenyl] hexafluoropropane was dissolved in N, N-dimethylformamide. Next, 8.72 g (0.040 mol) of pyromellitic dianhydride was added and reacted at 25 ° C. for 3 hours.

【0034】次に、これらのポリアミド酸溶液をガラス
板上にアプリケーターで薄くのばし、オーブン中110
℃,60分間乾燥してから剥離して、鉄枠に固定し、2
00℃,60分、次いで300℃で60分脱溶剤イミド
化して、約25μmの厚みのフィルムを得た。そのフィ
ルムの特性を表1に示す。
Next, these polyamic acid solutions are thinly spread on a glass plate with an applicator, and then 110% in an oven.
After drying for 60 minutes at ℃, peel it off and fix it on the iron frame.
Desolvation imidization was carried out at 00 ° C. for 60 minutes and then at 300 ° C. for 60 minutes to obtain a film having a thickness of about 25 μm. The characteristics of the film are shown in Table 1.

【0035】〔実施例2〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)252.9gを入
れ、窒素ガスを流しながら4,4’−ビス(4−アミノ
ベンズアミド)−3,3’−ジメチルビフェニル9.0
1g(0.020mol)及び2,2−ビス〔4−(4
−アミノフェノキシ)フェニル〕ヘキサフルオロプロパ
ン10.37g(0.020mol)をN,N−ジメチ
ルホルムアミドに溶解させた。次にピロメリット酸二無
水物8.72g(0.040mol)を加え、25℃で
3時間反応させた後、実施例1と同様の方法によりフィ
ルムを得た。そのフィルムの特性を表1に示す。
Example 2 In a 500 ml flask, N,
252.9 g of N-dimethylformamide (DMF) was added, and 4,4′-bis (4-aminobenzamide) -3,3′-dimethylbiphenyl 9.0 was added while flowing nitrogen gas.
1 g (0.020 mol) and 2,2-bis [4- (4
10.37 g (0.020 mol) of -aminophenoxy) phenyl] hexafluoropropane was dissolved in N, N-dimethylformamide. Next, after adding 8.72 g (0.040 mol) of pyromellitic dianhydride and reacting at 25 ° C. for 3 hours, a film was obtained by the same method as in Example 1. The characteristics of the film are shown in Table 1.

【0036】〔実施例3〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)246.8gを入
れ、窒素ガスを流しながら4,4’−ビス(4−アミノ
ベンズアミド)−3,3’−ジメチルビフェニル13.
52g(0.030mol)及び2,2−ビス〔4−
(4−アミノフェノキシ)フェニル〕ヘキサフルオロプ
ロパン5.18g(0.010mol)をN,N−ジメ
チルホルムアミドに溶解させた。次にピロメリット酸二
無水物8.72g(0.040mol)を加え、25℃
で3時間反応させた後、実施例1と同様の方法によりフ
ィルムを得た。そのフィルムの特性を表1に示す。
Example 3 A 500 ml flask was charged with N,
246.8 g of N-dimethylformamide (DMF) was added, and 4,4′-bis (4-aminobenzamide) -3,3′-dimethylbiphenyl was added while flowing nitrogen gas.
52 g (0.030 mol) and 2,2-bis [4-
5.18 g (0.010 mol) of (4-aminophenoxy) phenyl] hexafluoropropane was dissolved in N, N-dimethylformamide. Next, add 8.72 g (0.040 mol) of pyromellitic dianhydride, and add 25 ° C.
After reacting for 3 hours, a film was obtained by the same method as in Example 1. The characteristics of the film are shown in Table 1.

【0037】〔実施例4〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)233.4gを入
れ、窒素ガスを流しながら4,4’−ビス(4−アミノ
ベンズアミド)−3,3’−ジメチルビフェニル9.0
1g(0.020mol)及び2,2−ビス〔4−(4
−アミノフェノキシ)フェニル〕プロパン8.21g
(0.020mol)をN,N−ジメチルホルムアミド
に溶解させた。次にピロメリット酸二無水物8.72g
(0.040mol)を加え、25℃で3時間反応させ
た後、実施例1と同様の方法によりフィルムを得た。そ
のフィルムの特性を表1に示す。
[Example 4] A 500 ml flask was charged with N,
233.4 g of N-dimethylformamide (DMF) was added, and 4,4′-bis (4-aminobenzamide) -3,3′-dimethylbiphenyl 9.0 was added while flowing nitrogen gas.
1 g (0.020 mol) and 2,2-bis [4- (4
-Aminophenoxy) phenyl] propane 8.21 g
(0.020 mol) was dissolved in N, N-dimethylformamide. Next, 8.72 g of pyromellitic dianhydride
(0.040 mol) was added and reacted at 25 ° C. for 3 hours, and then a film was obtained by the same method as in Example 1. The characteristics of the film are shown in Table 1.

【0038】〔実施例5〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)237.1gを入
れ、窒素ガスを流しながら4,4’−ビス(4−アミノ
ベンズアミド)−3,3’−ジメチルビフェニル13.
52g(0.030mol)及び2,2−ビス〔4−
(4−アミノフェノキシ)フェニル〕プロパン4.10
g(0.010mol)をN,N−ジメチルホルムアミ
ドに溶解させた。次にピロメリット酸二無水物8.72
g(0.040mol)を加え、25℃で3時間反応さ
せた後、実施例1と同様の方法によりフィルムを得た。
そのフィルムの特性を表1に示す。
Example 5 A 500 ml flask was charged with N,
237.1 g of N-dimethylformamide (DMF) was added, and 4,4′-bis (4-aminobenzamide) -3,3′-dimethylbiphenyl was added while flowing nitrogen gas.
52 g (0.030 mol) and 2,2-bis [4-
(4-Aminophenoxy) phenyl] propane 4.10
g (0.010 mol) was dissolved in N, N-dimethylformamide. Next, pyromellitic dianhydride 8.72
After adding g (0.040 mol) and reacting at 25 ° C. for 3 hours, a film was obtained by the same method as in Example 1.
The characteristics of the film are shown in Table 1.

【0039】〔比較例1〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)210.6gを入
れ、窒素ガスを流しながら4,4’−ビス(4−アミノ
ベンズアミド)−3,3’−ジメチルビフェニル15.
68g(0.035mol)を加え、DMFに溶解させ
た。次にピロメリット酸二無水物7.63g(0.03
5mol)を加え、25℃で3時間反応させた後、実施
例1と同様の方法によりフィルムを得た。そのフィルム
の特性を表1に示す。
Comparative Example 1 A 500 ml flask was charged with N,
210.6 g of N-dimethylformamide (DMF) was added, and 4,4'-bis (4-aminobenzamide) -3,3'-dimethylbiphenyl 15.
68 g (0.035 mol) was added and dissolved in DMF. Next, 7.63 g (0.03 g of pyromellitic dianhydride)
5 mol) was added and reacted at 25 ° C. for 3 hours, and then a film was obtained by the same method as in Example 1. The characteristics of the film are shown in Table 1.

【0040】〔比較例2〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)232.1gを入
れ、窒素ガスを流しながら2,2−ビス〔4−(4−ア
ミノフェノキシ)フェニル〕ヘキサフルオロプロパン1
8.15g(0.035mol)を加え、DMFに溶解
させた。次にピロメリット酸二無水物7.63g(0.
035mol)を加え、25℃で3時間反応させた後、
実施例1と同様の方法によりフィルムを得た。そのフィ
ルムの特性を表1に示す。
Comparative Example 2 A 500 ml flask was charged with N,
232.1 g of N-dimethylformamide (DMF) was added, and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane 1 was added while flowing nitrogen gas.
8.15 g (0.035 mol) was added and dissolved in DMF. Next, 7.63 g of pyromellitic dianhydride (0.
(035 mol) and reacted at 25 ° C. for 3 hours,
A film was obtained by the same method as in Example 1. The characteristics of the film are shown in Table 1.

【0041】〔比較例3〕500mlのフラスコにN,
N−ジメチルホルムアミド(DMF)197.9gを入
れ、窒素ガスを流しながら2,2−ビス〔4−(4−ア
ミノフェノキシ)フェニル〕プロパン14.36g
(0.035mol)を加え、DMFに溶解させた。次
にピロメリット酸二無水物7.63g(0.035mo
l)を加え、25℃で3時間反応させた後、実施例1と
同様の方法によりフィルムを得た。そのフィルムの特性
を表1に示す。
Comparative Example 3 A 500 ml flask was charged with N,
N-Dimethylformamide (DMF) (197.9 g) was added, and 2,2-bis [4- (4-aminophenoxy) phenyl] propane (14.36 g) was introduced while flowing nitrogen gas.
(0.035 mol) was added and dissolved in DMF. Next, 7.63 g of pyromellitic dianhydride (0.035 mo
l) was added and reacted at 25 ° C. for 3 hours, and then a film was obtained by the same method as in Example 1. The characteristics of the film are shown in Table 1.

【0042】得られたフィルムについて、機械的特性、
線膨張係数は下記のようにして測定した。その結果を表
1に示す。機械的特性(引張強度、弾性率、伸度) ASTM D882−88に基づき測定した。線膨張係数 真空理工(株)製熱分析計TMA−7000を用い、昇
温速度5(℃/分)で150〜200℃での線膨張係数
の平均値を求めた。吸水率 ポリイミドフィルムを90%RHで24時間放置し、そ
の前後の重量を測定して吸水率を求めた。対数粘度 ポリアミド酸濃度が0.5g/100mlDMFであっ
て、測定温度が30℃である測定条件で測定した結果よ
り、次の計算式で算出した。
Mechanical properties of the obtained film,
The linear expansion coefficient was measured as follows. The results are shown in Table 1. Mechanical Properties (Tensile Strength, Elastic Modulus, Elongation ) Measured based on ASTM D882-88. Linear expansion coefficient Using a thermal analyzer TMA-7000 manufactured by Vacuum Riko Co., Ltd., an average value of linear expansion coefficients at 150 to 200 ° C was obtained at a temperature rising rate of 5 (° C / min). Water absorption rate The polyimide film was left at 90% RH for 24 hours, and the weight before and after that was measured to determine the water absorption rate. Logarithmic viscosity The polyamic acid concentration was 0.5 g / 100 ml DMF, and the measurement temperature was 30 ° C.

【0043】[0043]

【数1】 [Equation 1]

【0044】[0044]

【表1】 [Table 1]

【0045】表1の結果より、本発明のポリイミド共重
合体は、優れた機械的強度を有する上、低い線膨張係数
及び吸水率、高い弾性率と柔軟性を有することが確認さ
れた。
From the results shown in Table 1, it was confirmed that the polyimide copolymer of the present invention has excellent mechanical strength, low linear expansion coefficient and water absorption, high elastic modulus and flexibility.

フロントページの続き (72)発明者 杉谷 厚志 茨城県鹿島郡神栖町大字東和田1番地 信越化学工業株式会社 高分子機能性材 料研究所内 (72)発明者 湯山 昌弘 茨城県鹿島郡神栖町大字東和田1番地 信越化学工業株式会社 高分子機能性材 料研究所内 (56)参考文献 特開 昭57−181146(JP,A) 特開 昭58−157190(JP,A) 特開 昭61−143434(JP,A) 特開 昭62−70424(JP,A) 特開 昭63−199237(JP,A) 特開 昭63−221126(JP,A) 特開 昭63−239998(JP,A) 特開 平5−247210(JP,A) 特開 平6−175138(JP,A) 特開 平6−345868(JP,A) 特開 平7−33876(JP,A) 特開 平7−62095(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08G 73/00 - 73/26 CAPLUS(STN) REGISTRY(STN)Front page continuation (72) Inventor Atsushi Sugitani, Higashiwada, Kamisu-cho, Kashima-gun, Ibaraki Prefecture Shin-Etsu Chemical Co., Ltd., Polymer Functional Materials Research Laboratory (72) Inventor Masahiro Yuyama, Kamisu-cho, Kashima-gun, Ibaraki Prefecture Wada No. 1 Shin-Etsu Chemical Co., Ltd. Polymer Functional Materials Research Laboratory (56) Reference JP-A-57-181146 (JP, A) JP-A-58-157190 (JP, A) JP-A-61-143434 ( JP, A) JP 62-70424 (JP, A) JP 63-199237 (JP, A) JP 63-221126 (JP, A) JP 63-239998 (JP, A) JP JP-A-5-247210 (JP, A) JP-A-6-175138 (JP, A) JP-A-6-345868 (JP, A) JP-A-7-33876 (JP, A) JP-A-7-62095 (JP , A) (58) Fields investigated (Int. Cl. 7 , DB name) C08G 73/00-73/26 CAPLUS (STN) REGISTRY (STN)

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 下記一般式(1)で表される反復単位
(A)と下記一般式(2)で表される反復単位(B)と
の合計量が100モル%であり、反復単位(A)と反復
単位(B)とをモル比で(A)/(B)=10/90〜
90/10の割合で含むポリイミド共重合体。 【化1】 (但し、式中R1は4価の芳香族基を示し、R2はCH3
又はCF3を示す。)
1. The total amount of the repeating unit (A) represented by the following general formula (1) and the repeating unit (B) represented by the following general formula (2) is 100 mol%, and the repeating unit ( (A) and the repeating unit (B) in a molar ratio of (A) / (B) = 10 / 90-
A polyimide copolymer containing 90/10. [Chemical 1] (However, in the formula, R 1 represents a tetravalent aromatic group, and R 2 represents CH 3
Or CF 3 is shown. )
【請求項2】 4,4’−ビス(4−アミノベンズアミ
ド)−3,3’−ジメチルビフェニルと2,2−ビス
〔4−(4−アミノフェノキシ)フェニル〕ヘキサフル
オロプロパン又は2,2−ビス〔4−(4−アミノフェ
ノキシ)フェニル〕プロパンとを主成分とする芳香族ジ
アミンと、テトラカルボン酸二無水物とを重合してポリ
アミド酸共重合体を得、次いで該ポリアミド酸共重合体
を熱的又は化学的に脱水閉環することを特徴とする請求
項1記載のポリイミド共重合体の製造方法。
2. 4,4′-bis (4-aminobenzamido) -3,3′-dimethylbiphenyl and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane or 2,2- Aromatic diamine containing bis [4- (4-aminophenoxy) phenyl] propane as a main component and tetracarboxylic dianhydride are polymerized to obtain a polyamic acid copolymer, and then the polyamic acid copolymer. The method for producing a polyimide copolymer according to claim 1, wherein the dehydration ring closure is carried out thermally or chemically.
JP13134694A 1994-05-20 1994-05-20 Polyimide copolymer and method for producing the same Expired - Fee Related JP3456256B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13134694A JP3456256B2 (en) 1994-05-20 1994-05-20 Polyimide copolymer and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13134694A JP3456256B2 (en) 1994-05-20 1994-05-20 Polyimide copolymer and method for producing the same

Publications (2)

Publication Number Publication Date
JPH07316292A JPH07316292A (en) 1995-12-05
JP3456256B2 true JP3456256B2 (en) 2003-10-14

Family

ID=15055796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13134694A Expired - Fee Related JP3456256B2 (en) 1994-05-20 1994-05-20 Polyimide copolymer and method for producing the same

Country Status (1)

Country Link
JP (1) JP3456256B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI320046B (en) * 2002-02-26 2010-02-01 Polyamide-imide resin, flexible metal-clad laminate and flexible print substrate
JP5804314B2 (en) * 2011-06-10 2015-11-04 日立化成株式会社 Polyamideimide resin for insulated wires, insulating paint for insulated wires, and insulated wires using the same
CN109679095A (en) * 2018-12-18 2019-04-26 苏州予信天材新材料应用技术有限公司 A kind of high temperature resistant type polyamide-polyether acid imide toughening polymer and preparation method thereof

Also Published As

Publication number Publication date
JPH07316292A (en) 1995-12-05

Similar Documents

Publication Publication Date Title
JP5027416B2 (en) Aromatic polyamic acid and polyimide
JPH07179605A (en) Polyimide and its production
JPH1036506A (en) New polyimide composition and polyimide film
JPH0848773A (en) Polyamic acid, polyimide and their production
US6068932A (en) Thermosetting resin composition
JPH08157597A (en) Copolyimide and its production
JP2955724B2 (en) Method for producing polyimide film
JP3079867B2 (en) Polyimide copolymer, method for producing the same, and polyimide film
JP3048703B2 (en) Polyamic acid copolymer and polyimide film comprising the same
JP3456256B2 (en) Polyimide copolymer and method for producing the same
JP3168827B2 (en) Polyimide copolymer and method for producing the same
JP3339205B2 (en) Method for producing polyimide copolymer
US5478914A (en) Polyimides and processes for preparaing the same
JP2004285364A (en) Base film for flexible printed circuit board, polyimide film usable for carrier tape for tab
JP3168806B2 (en) Polyimide copolymer and method for producing the same
JP3855327B2 (en) Polyimide coating material
JPS62185715A (en) Colorless polyimide film
JP4017034B2 (en) New polyimide film
JP3344101B2 (en) Method for producing polyimide copolymer
JP3299777B2 (en) Polyimide film and method for producing the same
JP3375346B2 (en) Polyamic acid and polyimide film and their production method
JPH07292103A (en) Polyimide copolymer and method for producing the same
JP2729708B2 (en) New polyimide polymer film
JPH08143668A (en) New aromatic polyamic acid copolymer and copolyimide
JP2653401B2 (en) Method for producing polyamidoimide silicone polymer

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090801

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120801

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees