JP3448555B2 - Test equipment for optical element package - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test device for an optical device package, and more particularly to a test device applied to a characteristic test of a pin insertion type package in which a light emitting or light receiving device is packaged.

[0002]

2. Description of the Related Art Generally, an optical device package, for example, 1
μm band wavelength InGaAsP laser diode,
A light emitting device such as a 6 μm band to 0.8 μ band wavelength AlGaAs light emitting diode is packaged in, for example, a metal can, and a linear lead wire is arranged on the outer surface of the stem of the optical device package. In a mass production line of pin-insertion type optical element packages, for example, a high-frequency modulation signal suitable for practical conditions of the optical element package is applied to the manufactured optical element package to measure the modulation characteristic of the optical element package. An evaluation test is being conducted.

In the above-mentioned modulation characteristic test, for example, a high-frequency digital modulation signal of the order of several hundred Mbps to 1 Gbps is used. For this reason, conventionally, as shown in FIG. 10, basically, a circuit board 2 having a strip line formed therein and a socket for a manufactured optical element package to be tested, for example, 203-manufactured by 3M (3M) Co., Ltd. 65
A test device 1 including a 85-00-0602J type socket 3 is known. The circuit board 2 includes
A coaxial cable connector, which is connected to a modulation signal generator (not shown) via a high frequency coaxial cable (not shown),
For example, the SMA connector 4 is mounted, and is connected to the connector 4 via the matching resistor 5 at one end of the strip line 6, while the receptacle 7 connected to the other end of the strip line 6 is mounted and attached to the receptacle 7. The contact pin of the socket 3 can be inserted.

According to the above conventional type test device, by using the socket, the external lead wire of the sample optical element package is electrically connected to the signal input terminal from the high frequency modulation signal generator with a certain contact resistance. Can be connected.

However, a spring-like contact is attached to the insertion hole of the socket in the above-described conventional type test device, and a slight pressing force is applied when the external lead wire of the optical element package is inserted into the insertion hole of the socket. This has to be done while adding, and it takes a lot of time and effort for the insertion operation. On the other hand, if you insert it quickly, you may bend the external lead wire,
There is a risk that the outer appearance (plating layer) of the lead wire may be damaged and the appearance of the optical element package may be damaged, and it is difficult to put it into practical use as a test tool in the optical element package manufacturing line.

Further, in the above-mentioned test fixture, the contact of the socket comes into contact with the tip of the external lead wire of the optical element package pushed into the insertion hole of the socket, so that the external lead wire and the external lead wire are electrically connected to each other. The characteristic characteristic impedance of the signal transmission line portion, which is composed of the electrically connected contacts, causes a mismatch with the strip line of the circuit board electrically connected to the contact of the socket, and the other end of the strip line. The high-frequency test signal (modulated current signal) from the test signal generator connected to can not be supplied or transmitted to the optical element of the optical element package according to the output instruction, and highly accurate characteristic test evaluation or It's difficult to make measurements,
There were serious drawbacks.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in order to completely eliminate the problems in the above-described conventional type optical element package test fixture, and enables the test operation to be performed simply and efficiently, and to provide a test signal. The high-frequency test signal from the generator, as it is, is surely supplied or transmitted to the external terminal or the lead wire of the optical element package to be tested,
An object of the present invention is to provide a test device for an optical element package, which can perform highly accurate test evaluation or measurement.

[0008]

An optical device package testing instrument of the present invention is a columnar electrically insulating block member that can be fixed, and has an external terminal of an optical device package to be tested at one end face thereof. Is provided with a plurality of vertical holes, and a lateral hole is provided on a side surface portion thereof so as to intersect with the plurality of vertical holes, and the optical element inserted into the plurality of vertical holes is provided inside the horizontal hole. A sample support block member formed so as to expose the external terminals of the package;
A movable base member movable along the longitudinal direction of the lateral hole in the sample support block member; and a substrate member mounted on the movable base member, the matching resistor extending from one end to the other end of the substrate. And a pair of contact electrodes corresponding to the strip line on the end face of the one end of the substrate, and these contact electrodes are electrically connected to one end of the corresponding conductive layer in the strip line. On the other hand, while having a connection, a high-frequency coaxial connector is attached to the other end of the substrate, and the high-frequency coaxial connector is electrically connected to the other end of the strip line. Insert the external terminals of the optical device package to be tested into the plurality of vertical holes, and insert the external terminal of the sample support block member through the movable table member. By inserting one end of the substrate member into the hole and contacting the pair of contact electrodes on the substrate end face with the base end of the corresponding external terminal exposed inside the lateral hole with a predetermined pressure. The optical device via the strip line, the matching resistor, and the contact electrode in which an ultrahigh-frequency test signal from a signal generator connected to the high-frequency coaxial connector extends substantially orthogonally to an external terminal of the optical device package. It is characterized in that it is configured to be supplied to the optical element of the package.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical element package testing device of the present invention will be described with reference to the accompanying drawings showing one embodiment.

The test device of this embodiment is, for example, 1.55.
It is designed for a characteristic test of a pin insertion type optical element package 20 in which a μm wavelength InGaAsP laser diode chip is packaged, in particular, a high frequency modulation characteristic test. The length dimension of the external lead wire 21 of the optical element package 20 is, for example, 18 depending on the product standard.
mm.

1 to 4, generally, numeral reference 1
The test instrument of the present invention, which is indicated by 0, is generally configured by the sample support block member 14, the movable base member 22, and the substrate member 32.

The sample support block member 14 is a cylindrical block body made of a polypropylene resin material, and is fixed to the rectangular base 12 in an upright state using a fixing piece 18 and bolts and nuts 19. It The sample optical device package 20 is provided on the upper end surface of the sample support block member 14.
2 external lead wires 21 can be inserted freely
One vertical hole 15 is formed and these vertical holes 15 are formed.
A lateral hole 16 having a U-shaped cross section is formed so as to be orthogonal to. As shown in FIG. 4, the inner wall surface 17 of the lateral hole 16 is in contact with the circular opening peripheral edges of the both vertical holes 15. The diameter of each vertical hole 15 is made slightly larger than the outer diameter of the external lead wire 21 of the optical device package 20, and the external lead wire 21 is formed by the own weight of the optical device package 20.
It is possible to drop it in easily with a play inside.

The length (height) of the horizontal hole 16 in the vertical direction is about 25 mm, and a thick portion having a thickness of about 1 to 2 mm is formed from the upper end surface of the sample support block member 14, whereby the upper end surface is formed. Of the external lead wire 21 linearly extending from the lower surface of the optical element package 20 of the sample inserted in the vertical hole 15, except a portion hidden by the thick portion on the upper end surface side,
It is exposed in the space of the lateral hole 16 up to its tip (lowermost end). The sample support block member 14 is not limited to the polypropylene resin material, and can be made of another material having appropriate hardness and electric insulation.

The movable base member 22 is generally composed of an L-shaped arm member 23 and a strip-shaped guide member 24. A linear long groove 25 is provided over the entire length of the guide member 24, and shoulders 26 are formed at both corners of one end of the long groove 25 so as to hook the corners of the one end of the arm member 23. The elongated portion of the arm member 23 is slidably combined with the long groove 25 of the guide member 24. The guide member 24 is arranged in alignment with the direction in which the lateral hole 16 of the sample support block member 14 fixed to the base 12 extends (indicated by an arrow A in FIG. 3), and thus the long groove of the guide member 24 is formed. The movable base member 22, which is configured by combining the arm member 23 with the arm member 25, is movable along the arrow A direction. The arm member 23
Of the substrate member 3 in which a strip line 34, which will be described in detail later, is integrally formed at the tip portion bent at a right angle from the extension portion of
2 is attached.

The operating rod 2 is provided at one end of the L-shaped arm member 23.
7 is attached. A spring retaining hole 29 is provided in each of the overhanging portions 28 formed on both sides of one end of the arm member 23. Spring retaining pins 30 are provided on both sides of the arm member 23 on the base 12 so as to face the spring retaining holes 29. A coil spring 31 is hooked between a pair of spring hooking holes 29 and a spring hooking pin 30 which face each other along the longitudinal direction of the arm member 23.

In the movable base member 22 having the above structure, the finger of the operator's hand for operating the test device 10 is operated by the operating rod 27.
And the operating rod 27, the sample support block member 14
By moving the arm member 23 in the direction away from the lateral hole 16 against the spring repulsive force of the coil springs 31, the arm member 23 follows the groove 25 of the guide member 24, and both corners of one end of the arm member 23 are shouldered. It is movable until it is hooked on the portion 26.
On the other hand, when the operator's finger is removed from the operation rod 27, the arm member 23
While being subjected to a pressing force corresponding to the restoring force of the extended coil spring 31, the tip end portion which is bent and extends at a right angle to the longitudinal axis of the arm member 23 is movable toward the opening of the lateral hole 16.

The substrate member 32 has, for example, a thickness of 1.6.
mm rectangular glass epoxy resin substrate with thickness of 35
It is formed by using a so-called printed circuit board (Japanese Industrial Standard FR-4) to which a copper foil of μm is attached. Copper foil on one side of this circuit board member, by a known etching method,
As shown in FIG. 5, a strip pattern 33 extending linearly is formed between both ends. In this way, the strip line 34 is formed in which the strip pattern (copper foil) portion serves as the positive electrode signal line and the copper foil portion on the other surface facing the strip pattern portion serves as the negative electrode or the ground wire. The characteristic impedance of the strip line 34 was about 50Ω when the width dimension of the strip pattern 33 was set to 2.7 mm, for example.

A positive electrode contact electrode or contact 35, which is soldered to one end surface portion of the substrate member 32 and one end portion (the left end portion in FIG. 5) of the positive electrode signal line of the strip line 34.
-1 is arranged and a negative contact electrode or contact 35-2 soldered to one end of the ground line portion of the strip line 34 is arranged. Strip pattern 3 above
A matching resistor 37 matching the input impedance of the optical element (LD element) in the optical element package 20 to be tested is soldered to the line dividing section 36 formed at the left end of 3. On the other hand, the other end of the substrate member 32 is connected to the other end of the strip line 34 (the right end in FIG. 5).
A connector for a high frequency coaxial cable, for example, an SMA high frequency coaxial connector 38 is attached.

In carrying out a high frequency modulation characteristic test of the optical device package 20 using the test fixture 10 having the above-described structure, first, a modulation signal suitable for the optical modulation of the optical device of the optical device package 20, for example, on the order of 300 Mbps to 1 Gbps. Connector of the board member 32 is connected to the output terminal of the digital modulation (rectangular current pulse train) signal generator of FIG.
Connect with 8.

Next, the operator hooks the finger of one hand on the operation rod 27 of the movable base member 22 to move the arm member 23 away from the sample support block member 14 against the repulsive force of the coil spring 31. Direction of the arm member 23, one end of the substrate member 32 attached to the tip of the arm member 23 is separated from the lateral hole 16 of the sample support block member 14 with the other hand, and the optical element package to be tested is tested. 20 is picked up and inserted into the vertical hole 15 in the upper end surface of the support block member 14 so that the external lead wire 21 of the optical element package 20 to be tested is dropped, and the lower surface of the package 20 (the lower surface of the stem) is the sample. The support block member 14 is brought into contact with the upper end surface of the support block member 14.

Next, the fingers of the hand hooked on the operating rod 17 are removed. As a result, the arm member 23 receives the restoring force of the expanded coil spring 31 and the long groove 25 of the guide member 24.
Along with the sample support block member 14, the substrate member 32 attached to the tip of the arm member 23.
Of the positive electrode and the negative electrode contact electrodes 35-1 and 35-2 on the one end surface of the substrate member 32 substantially correspond to the restoring force of the coil spring 31. With a certain pressing force, the contact with the root portion of the external lead wire of the optical element package 20 exposed in the lateral hole 16 of the block member 14, that is,
The movable base member 22 returns to the original position. In this embodiment, the mounting height position of the substrate member 32 on the movable base member 22 is adjusted so that both contact electrodes 35-1 and 35-2 provided on the substrate member 32 are located in the space of the lateral hole 6. The package 20 on the exposed external lead wire 21
It comes into contact with an exposed surface portion 6 mm apart from the lower surface of the. This completes the preparation for the predetermined high frequency digital modulation characteristic test.

After the completion of the test preparation, the digital modulation signal generator (not shown) connected to the connector 38 of the substrate member 32 via the high frequency coaxial cable (not shown) is turned on. As a result, a predetermined high-frequency digital modulation (current pulse train) signal from this modulation signal generator passes through the connector 38, the strip line 34, the matching resistor 37, the positive contact electrode 35-1, and the external lead wire 21, and the optical device package 20. Is supplied to the optical element and the optical element operates to emit the modulated laser beam. Optical device package 20
The emitted light (modulated light) is transmitted by a known method through a light receiving element (not shown) and an optical cable to, for example, a modulation characteristic measuring device using a spectrum analyzer (not shown), and the emitted light is measured.

The test device 10 of the present invention (hereinafter abbreviated as the device of the present invention) and the conventional type test device 1 of FIG.
(Abbreviated as conventional device) is used to apply two kinds of pulse patterns, that is, a rectangular pulse pattern of 622 Mbps and 1.25 Gbps to a distributed feedback laser diode (DFB-LD) pin insertion type package. The measurement results of the output pulse waveform showing the characteristics are shown in FIGS. 6 and 7. As is clear from FIG. 6 and FIG. 7, the tail (wave tail) of the output pulse when the device of the present invention is used is smaller than that of the conventional device, that is, tf (falling edge) in the conventional device with respect to the pulse pattern of 622 Mbps. Time) = 220p
s (picosecond), tf = 191 ps, 1.2 in the present invention
In the conventional device, tf = 2 for a pulse pattern of 5 Gbps
17 ps, which is as small as tf = 194 ps in the device of the present invention, and in any case, the response of the device of the present invention is excellent.

Using the device of the present invention and the device of the related art, three types of pulse patterns, that is, 622 Mbps, 1.2
Side mode suppression ratio (SMSR) and −20 dBm modulation spectrum width (ΔΔ) of a DFB-LD pin insertion type package of the same sample during modulation and no modulation by NRZ pseudo-random pattern of 5 Gbps and 2.5 Gbps.
The results of measuring λ) are shown in FIG. 8 and Table 1. As is clear from FIG. 8 and Table 1, there is no significant difference between the present invention device and the conventional device at the time of no modulation, at the time of 622 Mbps modulation and at the time of 25 Gbps modulation. As for the device of the present invention, the SMSR
Is small and Δλ is large. From this, it can be seen that the device of the present invention has a smaller insertion loss in high-frequency signal transmission and is superior in high-frequency transmission characteristics.

[Table 1]

Using the device of the present invention and the device of the prior art described above, a DFB
-The optical response characteristics of the LD pin insertion type package, which shows the cutoff frequency fc and the insertion loss S1 when a small signal is input.
The result of measuring 1 is shown in FIG. In this case, in the device of the present invention, the height position of the substrate member 32 on the movable base member 22 is adjusted, and the positive and negative contact electrodes or contacts 35-1 and 35- on one end face portion of the substrate member 32 are adjusted.
2 is the DF inserted in the sample support block member 14
Side hole 16 of external lead wire 21 of B-LD package 20
It was made to come into contact with the exposed lead wire surface portion 6 mm apart from the lower surface of the package 20 inside. As is clear from FIG. 9, the cutoff frequency of the optical output is higher when the device of the present invention is used than that of the conventional device, that is, 1 dB attenuation cutoff frequency fc = 1.04 GHz, 3 dB by the conventional device.
Attenuation cutoff frequency fc = 1.26 GHz, 1 dB attenuation cutoff frequency fc = 1.85 GHz according to the present invention, 3
It can be seen that the transmission loss of the input signal is small at the dB cutoff frequency fc = 2.02 GHz, and therefore the device of the present invention is superior to the conventional device in terms of transmission characteristics.

In the test apparatus 10 of the present invention, the movable base member 22 is manually operated and can be returned to the original position by the restoring force of the coil spring 31. An air cylinder or a cylinder means similar to this can be attached to the movable base member 22, and the movable base member can be moved in a predetermined direction by operating the cylinder means by a push button operation. With this configuration, the loading operation of the sample to the sample support block member 14 can be automated.

Further, the connector 38 of the substrate member 32 is not limited to the digital modulation signal generator described above, but a network analyzer for optical communication is connected to carry out a test suitable for practical use of the optical element package 20. be able to.

The test device 10 is a 0.6 μm band to 0.8 μm band wavelength AlGaAs laser element or 1 μm band.
Not limited to an optical device package such as an m-wavelength band InGaAsP laser device, for example, a 0.6 μm band to 0.8 μm band wavelength AlGaAs light emitting diode or a 1.0 μm wavelength band I
A light emitting device such as an nGaAsP light emitting diode, or, for example, Si, Ge, In cooperating with these light emitting devices.
It can also be applied to various operating characteristic tests for optical element packages of light receiving elements such as GaAs or InGaAsP avalanche photodiodes and PIN photodiodes.

[0029]

In the test device for an optical device package of the present invention, in place of the socket for the optical device package in the conventional type, the external terminal or the lead wire of the optical device package can be inserted vertically with a play. A column-shaped sample support block member having a hole and a horizontal hole extending in a direction intersecting with the vertical hole is used, and the external lead wire portion of the optical element package to be tested is inserted into the vertical hole of the block member, and The movable base member provided at a predetermined position in the vicinity of the block member is actuated to expose the external lead wire in the lateral hole and the signal input contact electrode or contact provided on one end surface of the substrate member mounted on the movable base member. Since the electric connection operation with is performed by substantially one-touch operation,
The test or inspection man-hours of the optical element package can be effectively shortened as compared with the conventional type test equipment.

Further, in the test device of the present invention, the test support block member is provided at a predetermined position in the root portion of the external lead wire exposed in the lateral hole of the sample support block member, at one end surface portion of the substrate member mounted on the movable base member. Since the lead signal transmission path from the contact to the optical element of the optical element package is made to have a minimum constant length by pressing the signal input contact electrode or contact thus obtained,
Stable transmission impedance, in particular, effectively suppresses waveform distortion with a minimum reactance, high-frequency output from the test signal generator, according to its output instruction, supply or transmit to the optical element package of the test object, Therefore, highly accurate test evaluation or measurement can be performed.

[Brief description of drawings]

FIG. 1 is an external perspective view of a test device for an optical element package according to the present invention.

2 is a side view of the test device of FIG. 1. FIG.

3 is a plan view of the test device of FIG. 1. FIG.

4 is a cross-sectional view taken along line 4-4 of FIG.

FIG. 5 is a strip pattern 3 of the strip line 34.
3 is a plan view of the substrate member 34 in which FIG.

FIG. 6 is a distributed feedback laser diode (D
FB-LD) 622 Mb for pin insertion type package
It is output pulse waveform evaluation data showing the response characteristic by a ps rectangular pulse pattern, (a) when the test device of this invention (FIG. 1) is used, (b) is a conventional type test device (FIG. 10). 7 shows a measured modulated pulse waveform when is used.

FIG. 7 is output pulse waveform evaluation data showing the response characteristics of a 1.25 Gbps rectangular pulse pattern for the DFB-LD pin insertion type package of the same sample as in FIG. 6, and (a) is a test of the present invention. When the instrument (FIG. 1) is used, (b) shows the measured modulated pulse waveform when the conventional type test instrument (FIG. 10) is used.

FIG. 8: When the DFB-LD pin insertion type package of the same sample is modulated by three kinds of NRZ pseudo random patterns using the test device of the present invention (FIG. 1) and the conventional test device (FIG. 10). 3 is a graph showing a result of measuring a side mode suppression ratio (SMSR) and a −20 dBm modulation spectrum width (Δλ) at the time of no modulation.

FIG. 9 is evaluation data of small signal response characteristics of a DFB-LD pin insertion type package of the same sample, where (a) is the test instrument of the present invention (FIG. 1) and (b) is the conventional format. 10 shows the measurement results when the test device of FIG.

FIG. 10 is a diagram showing a schematic configuration of a test fixture for a conventional type optical element package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Conventional type optical element package test instrument (conventional instrument) 3 Socket 10 Optical element package test instrument of the present invention (invention instrument) 12 Base 14 Sample support block member 15 Vertical hole 16 Horizontal hole 17 Back wall surface 20 test Target (sample) optical element package 21 External lead wire 22 Movable base member 23 L-shaped arm member 27 Operation rod 31 Coil spring 32 Substrate member 34 Strip line 35-1 (Signal side) Positive electrode contact electrode (contact) 35-2 ( Ground side) Negative contact electrode (contact) 37 Matching resistor 38 High frequency coaxial connector

Claims (9)

(57) [Claims] 1. Columnar that can be fixedElectrical insulationBlock
The light to be tested is
Multiple vertical holes into which external terminals of the device package can be inserted
And the side of thethe aboveIntersection with multiple vertical holes
SendTo extendSidewaysProvided inside the side hole,
pluralInserted in the vertical holeWasThe external terminals of the optical element package
ExposureFormed toSample support block member; Of the lateral holes in the sample support block memberAlong the longitudinal direction
WhatIt can be movedAndMovable base member; and Attached to the movable base memberRuA substrate member,Basis
Includes a matching resistor that extends from one end of the plate to the other.
WhatForm the strip line and above the substrateofOne endEnd face
ToStrip line aboveA pair of contact electrodes corresponding to
In addition, each of these contact electrodes is
Of the corresponding conductive layer in theWith one endElectricalConnecting
on the other hand,the abovesubstrateofAttach a high frequency coaxial connector to the other end
Along withThe high frequency coaxial connector is the strip line
And the other end ofElectricalConnectBeen formed, Having a substrate member, A plurality of vertical holes in the sample support block member are provided with light to be tested.
Insert the external terminals of the element package and attach the movable base member.
ThroughSide hole of the sample support block memberInside the above
Insert one end of the plate member into a pair on the end face of the board.
The contact electrodes of each were exposed inside the lateral holes, respectively.
Corresponding external terminalProximal end ofWhenContact with a predetermined pressure
By doingHigh frequency same as aboveaxisThe signal connected to the connector
From the generatorSuperHigh frequency test signalOptical device package
Extend substantially orthogonal to the external terminalThe above stripline,
The matching resistor and the contact electrodeViaThe above optical device
To the optical element of the packageSuppliedSpecially configured
A test device for optical device packages. 2. A rear wall section of the lateral hole of the sample support block member is substantially in contact to the outer peripheral surface of the external terminal along the longitudinal direction of the external terminals of the optical element package was exposed to the inside of the lateral bore
The end surface of the substrate member allows the inner side of the lateral hole
When pressed, it supports the external terminals without deforming them.
The test device according to claim 1, which is designed to be held . 3. A further, mounting at least one coil spring in variable Dodai member, the substrate attached to the movable base member
When the member is inserted into the lateral hole of the sample support block member, the coil spring causes the end of one end portion of the substrate member to move.
The contact electrode attached to the surface is connected to the external terminal of the optical element package exposed inside the lateral hole of the sample support block member.
Press it against the inner wall surface of the side hole with a certain pressing force.
Uni configured, testing device according to claim 1 or claim 2. 4. Furthermore, the mounting of the air cylinder or its similar in the cylinder means into variable Dodai member, taken on the carriage member
Attach the attached substrate member to the side hole of the sample support block member .
When allowed to enter the section, by the cylinder member, the substrate
A contact electrode attached to an end surface of one end of the member exposes the external terminal of the optical device package exposed inside the lateral hole of the sample support block member to a predetermined pressing force on the inner wall surface of the lateral hole.
Claim 1 or Claim 2 constituted so that it may be pressed against.
Test equipment described in. 5. An optical device package having a 0.6 μm band to 1 μm
2. A pin insertion type package incorporating a semiconductor laser diode element (LD device) of m band wavelength.
~ The test device according to claim 4. 6. A test signal supplied to a high frequency coaxial connector attached to a substrate member is about 400 Mbps to about 2.
The test device according to claim 5, which is a digitally modulated signal of 5 Gbps. 7. An optical device package to be tested is 0.6 μm.
Semiconductor light-emitting diode element (LE with wavelengths in the m band to 1 μm band)
The test device according to any one of claims 1 to 4, which is a pin insertion type package incorporating a D device). 8. A test signal supplied to a high frequency coaxial connector attached to a substrate member is about 30 MHz to about 100 M.
8. The test device according to claim 7, which is an ultra high frequency modulation signal of Hz. 9. The optical device package to be tested is 0.6 μm.
2. A pin insertion type package incorporating a light receiving element capable of cooperating with a semiconductor light emitting element having a wavelength of m band to 1 μm band.
~ The test device according to claim 4.