JP3444237B2 - Liquid epoxy resin composition for semiconductor encapsulation and semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid epoxy resin composition used for encapsulating a semiconductor element or the like, and a semiconductor device encapsulated with the liquid epoxy resin composition.

[0002]

2. Description of the Related Art Conventional epoxy resin compositions have been used for various applications in the electric and electronic fields because they have excellent electrical performance and adhesive strength. In particular, a powdery molding material or a liquid potting material is widely used as a sealing material because high sealing reliability can be ensured for sealing a semiconductor element.

As electronic devices have become more mobile and more sophisticated in recent years, it has become necessary to make semiconductor packages highly integrated, highly dense, thin, and lightweight. BGA that achieved high density with array connection
(Ball grid array), CSP (chip scale package), MCM (multi-chip module) and other new semiconductor package forms have been introduced.

For sealing of these new semiconductor packages, there is a limit to thinning with a conventional die molding method using a powdery and granular sealing material, and there are problems such as wire sweep caused by a large number of wires. For this reason, liquid encapsulants have begun to be used. In addition, since the die molding method requires an expensive die for each product type, the cost is increased, and the fine circuit on the BGA substrate may be cut by the die, so that a liquid sealing material is used. A liquid encapsulation method in which encapsulation is performed without using a mold is advantageous.

Although the liquid encapsulating system has such advantages, the liquid encapsulating material used is inferior to the powder-granular encapsulating material molded by a mold in terms of sealing workability and reliability. There was a drawback that This is because the powdery and granular encapsulating material uses a phenolic curing agent as a curing agent, and is therefore resistant to hydrolysis when subjected to a moisture resistance reliability test and has a high adhesive force with the element. Further, generally, the encapsulating material used for carrying out the transfer molding method is solid (powder-granular) at room temperature, and it is possible to increase the filling of the filler and the Tg of the resin. And heat shock resistance can be demonstrated.

On the other hand, the conventional liquid encapsulant is limited in that it is liquid at room temperature, and is one-part and has a long pot life. The selection is limited, and amine-based or acid anhydride is generally used. However, among amine-based curing agents, liquid aromatic amines have too high a reactivity with epoxy and have a short pot life.
The solid amines represented by (dicyandiamide) have the drawback of high viscosity. In addition, it has a high moisture absorption rate and inferior electrical characteristics. On the other hand, in the acid anhydride curing agent, the ester structure in the cross-linked structure of the cured product is easily hydrolyzed, so that the moisture resistance is inferior, and the chemical adhesion is low, so that the heat resistance tends to be low. In addition, since the phenolic curing agent used in the powder-molded encapsulant that is molded by a mold is solid at room temperature and has a very high viscosity when used in combination with liquid epoxy, a liquid encapsulant containing a filler is used. It is difficult to use for purposes. Although it is possible to reduce the viscosity by adding a solvent, voids are likely to occur in the cured product due to the solvent, resulting in poor appearance and reliability deterioration. It is difficult to exert the characteristics of.

Under these circumstances, a liquid which has good sealing workability and can exhibit sealing reliability equal to or higher than that of the powdery or granular sealing material to be mold-molded, corresponding to the liquid sealing method. Encapsulants are strongly desired.

[0008]

The present invention has been made in view of the above circumstances, and has the advantages of the conventional liquid encapsulant that is liquid at room temperature, has low viscosity, is excellent in handleability, and has a long pot life. It is an object of the present invention to provide a liquid epoxy resin composition for semiconductor encapsulation, which is capable of obtaining a cured product having excellent moisture resistance and heat resistance reliability of a semiconductor without losing the properties. It is also an object to provide a semiconductor device which is sealed with such a liquid epoxy resin composition.

[0009]

In order to solve the above problems, a liquid epoxy resin composition for semiconductor encapsulation according to the present invention comprises (A) cyanate ester, (B) epoxy resin and (C) inorganic material. A filler, (D) a metal chelate and / or a metal salt, and (E) an acid anhydride, and (4) ' -ethylidene bisphenylene as a component (A)
Ncyanate (A1), the blending ratio is by weight
And (A1) / (A) component = 0.1-1, and (B) component has two or more glycidyl groups in the molecule.
Which has an epoxy resin which is liquid at room temperature, at least one of (A) component and (B) component is liquid at room temperature, (E) component is liquid at room temperature, and the mixing ratio of each component is By weight ratio, (C) component / composition total amount = 0.60 to 0.95 (A) component / (B) component = 0.76 to 1.43 (E) component / (composition total amount- (C) Component) = 0.01-
It is characterized in that it is 0.3. Further, the semiconductor device according to the present invention has a semiconductor element sealed with the liquid epoxy resin composition.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin composition of the present invention comprises
(A) cyanate ester, (B) epoxy resin, (C) inorganic filler, (D) metal chelate and / or metal salt, and (E). It contains a liquid acid anhydride.

In the present invention, when the component (A) and the component (B) are mixed in order to make the resin composition liquid, it is necessary that the resin composition be liquid at room temperature. Therefore, at least one of the component (A) and the component (B) needs to be liquid at room temperature .

The cyanate ester of the component (A) is cyanate.
A compound having an alkyl group (-OCN group). (A) Success
As the cyanate ester of the minutes, specifically, at room temperature
Liquid 4,4'-ethylidene bisphenylene cyane
It is necessary to include the gateway (A1). 4,4′-ethylidene bisphenylene cyanate (A1) has the following chemical formula:

[0013]

[Chemical 1]

It has a structure having cyanate groups at both ends of the bisphenol E skeleton, and is a liquid of about 100 cps (centipoise) at room temperature. As other cyanate ester
Is 2,2-bis (4-cyanana) which is crystalline and solid at room temperature.
Tophenyl) propane, bis (4-cyanato-3,5-
Dimethylphenyl) methane, bis (4-cyanato-phen)
Nyl) thioether, etc. cyanate ester polymers
And pre-reacting these monomers to form prepolymer
Examples thereof include 2,2-bis (4-cyanatophenyl) propane having a bisphenol A skeleton and bis (4-cyanato-) having a dimethylphenyl skeleton.
Etc. 3,5-dimethylphenyl) methane, rich in highly crystalline, in itself is a solid at room temperature. These crystalline cyanate esters have a drawback that crystals are likely to precipitate and solidify after cooling even if they are liquefied by being heated and dissolved in a liquid epoxy resin. However, it has been found that solidification can be prevented by using together with 4,4′-ethylidene bisphenylene cyanate (A1) having a bisphenol E skeleton. Therefore, the (A) component cyan
As the acid ester, 4,4'-ethylidene bisphenyl
Includes Lencyanate (A1) and other shears as needed
Mixing with (B) component epoxy resin as acid ester
If it does, use a liquid that becomes liquid at room temperature.
You can

[0015] In the present invention, the mixing ratio of 4,4'-ethylidene-bis-phenylene cyanate (A1), in weight ratio, Ri (A1) / (A) component = 0.1 der, 0.5
It is good Mashiku is to 1, more preferably from 0.7 to 1. If the blending ratio is less than 0.1, it becomes difficult to prevent the solidification of the crystalline cyanate ester.

The epoxy resin as the component (B) has 2 in the molecule.
It is a compound having one or more glycidyl groups. The epoxy resin as the component (B) includes a liquid one at room temperature.
And are required. A single liquid at room temperature may be used, or a mixture of liquid and liquid, or liquid and solid epoxy resin may be used. Specifically, bisphenol A
Type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, heterocyclic epoxy resin, etc. However, the invention is not limited to these. Among these epoxy resins, bisphenol A and bisphenol F, in which n in the following formula is 0 to 1, obtained by molecular distillation
Type epoxy resins are preferred because of their low viscosity and very low ionic impurities.

[0017]

[Chemical 2]

From the viewpoint of the physical properties of the cured product and the sealing reliability, the mixing ratio of the components (A) and (B) is (A) component / (B) component = 0.76-1. 0.43, preferably 0.91 to 1.43, and 0.9
It is more preferably 1 to 1.25. It is known that cyanate ester alone undergoes a trimerization reaction in the presence of a metal catalyst to form a triazine ring. However, this reaction is mainly a reaction at a high temperature of 180 ° C. or higher. Also, in the composite resin system of cyanate ester and epoxy resin, the reaction of the cyanate group and the epoxy group also occurs,
It is speculated that multiple reactions occur as competitive reactions.
If component (A) / component (B) is greater than 1.43, the epoxy resin will be insufficient, and in the case of curing at 160 ° C. or lower, cyanate groups that have not reacted will remain. The unreacted cyanate group is hydrolyzed into a carbamate group during a moisture resistance reliability test such as PCT (pressure cooker test) and further causes a decarboxylation reaction, resulting in poor moisture resistance reliability. Conversely, component (A) /
When the component (B) is less than 0.76, the epoxy resin becomes excessive, and unreacted epoxy groups remain. The remaining unreacted epoxy group lowers the crosslink density of the cured product, which lowers the glass transition temperature and increases the moisture absorption rate. Therefore, the coefficient of thermal expansion of the cured product becomes large, which causes deterioration of heat cycle and reflow reliability.

As the inorganic filler as the component (C), crystalline silica, fused silica, alumina, calcium carbonate, zinc oxide or the like can be used. In particular, the fused silica is preferably non-cornered or spherical in order to prevent damage to the passivation film on the surface of the semiconductor chip, and it is desirable that the maximum particle size is 100 μm or less. It is not limited to this.

The mixing ratio of the component (C) is a weight ratio,
(C) component / composition total amount = 0.60 to 0.95 is preferable, 0.70 to 0.90 is more preferable, and 0.75 to 0.85 is further preferable. If the mixing ratio of the component (C) is less than 0.60, the ratio of the resin component becomes high, so that the shrinkage amount of the resin composition at the time of encapsulating the semiconductor becomes large and the coefficient of thermal expansion also becomes large, so that the substrate The amount of warp becomes large, and defects such as chip cracks when heat stress is applied are likely to occur. Further, since the moisture absorption rate becomes large, it also causes cracks during reflow. The mixing ratio of the component (C) is 0.95
If more, the liquid component is insufficient and the viscosity becomes high,
It is difficult to handle as a liquid and cannot be sealed.

The metal chelate and / or metal salt of the component (D) is a curing catalyst for the cyanate ester of the component (A). Specific examples of the metal chelate include nonionic or ionic metal chelates having 1 to 6 or more chelate rings.
Examples include iron, cobalt, zinc, tin, aluminum and manganese. Examples of the ligand of the metal chelate include acetylacetonate, salicylaldehyde, and benzoylacetone. Further, examples of the metal salt include naphthenate and octenoate.

In the present invention, iron (III) is used as the component (D).
By using the chelate (D1) of (1) or the chelate (D2) of cobalt (III), the following effects can be obtained. It is known that cyanate ester forms a triazine skeleton by causing a trimerization reaction at a high temperature of about 180 ° C. or higher with a metal chelate as a nucleus, and various metal chelates do not act as a catalyst for independent curing of cyanate ester. It is known. Since the suction of the cyanate group of the curing catalyst differs depending on the type of metal, the speed of this trimerization reaction differs depending on the metal chelate used, and in general, zinc,
Metal chelates of tin, copper, manganese, titanium, aluminum and the like are known. However, when an epoxy resin is included as a resin component in addition to the cyanate ester as in the present invention, the reaction mechanism becomes very complicated. This is because a reaction between the cyanate group and the epoxy group to form an oxazoline skeleton also occurs in parallel with the trimerization reaction of the cyanate group.

As described below, when the epoxy resin composition contains a gel silicone resin as a low elasticity component,
A resin system containing this gel-like silicone resin tends to exhibit thixotropic viscosity. A thixotropic liquid substance has a large surface tension and is likely to have a convex shape. Therefore, it is necessary that the sealing resin has a flat shape like the cavity-down type BGA in the semiconductor package sealing applications. It is a disadvantage as an encapsulant for some packages. However, at this time, by using the iron (III) chelate (D1) as the metal chelate, the thixotropy becomes extremely small, and high fluidity is exhibited. The ligand of the metal chelate is not particularly limited,
Acetylacetonate, salicylaldehyde, benzoylacetone, etc. can be exemplified. Since the amount of the curing catalyst used depends on the amount of the cyanate ester, the weight ratio is (D1).
/ (A) component = 0.0001 to 0.01 is preferable, 0.0005 to 0.005 is more preferable, and 0.001 to 0.003 is further preferable. When the amount of the curing catalyst used is in the above range, good curability and long pot life are exhibited.

On the other hand, when there is no dam around the chip like a COB (chip on board) package,
On the contrary, in order to efficiently seal a small area, it is required that the sealing resin has high thixotropy and does not flow as much as possible.
This is because if they flow, the chips and wires are exposed, causing defects. In this case, high thixotropy can be realized by using the cobalt (III) chelate (D2) as the metal chelate. The metal chelate ligand is not particularly limited, and examples thereof include acetylacetonate, salicylaldehyde, and benzoylacetone. Since the amount of the curing catalyst used depends on the amount of the cyanate ester, the weight ratio of (D2) / (A) component = 0.000.
It is preferably 1 to 0.01, and 0.0005 to
0.005 is more preferable, and 0.001-
It is more preferably 0.003. When the amount of the curing catalyst used is in the above range, good curability and long pot life are exhibited.

The acid anhydride as the component (E) is a co-curing agent for the reaction between the cyanate ester as the component (A) and the epoxy resin as the component (B). By using an acid anhydride together, the thixotropy of the epoxy resin composition can be reduced, and a great effect can be seen in improving the fluidity at the time of sealing. Since the epoxy resin composition of the present invention is liquid, the acid anhydride as the component (E) needs to be liquid at room temperature.

The mixing ratio of the component (E) is such that the component (E) / (the total amount of the composition-the component (C)) = 0.01 to 0.3, and preferably 0.05 to 0.2. Preferably 0.1
It is more preferably 0 to 0.15. If the blending ratio of the component (E) is less than 0.01, it is difficult to obtain the above effect. When the blending ratio of the component (E) is more than 0.3, the reactivity decreases and the moisture resistance reliability deteriorates. In addition,
Although a reaction hardly occurs only with the acid anhydride of the component (E) and the epoxy resin of the component (B), a system containing a cyanate ester of the component (A) and a metal chelate and / or a metal salt of the component (D). Then, it was found that it showed good reactivity. Although the details of the reaction mechanism are unknown, it is presumed that the hydroxyl group and active hydrogen in the process of producing oxazoline in the reaction between the cyanate ester and the epoxy resin promote the reaction with the acid anhydride.

The epoxy resin composition of the present invention may further contain a gel silicone resin as the component (F). The sealing material is BGA or CSP on the printed circuit board.
It is used by mounting a semiconductor chip such as the above on an overcoat and encapsulating it, but if the elastic modulus of the encapsulating resin is high, the warp of the substrate becomes large and it cannot be put to practical use.
Therefore, it is preferable to include a gel silicone resin as the low elasticity agent.

Polybutadiene rubber, silicone powder, silicone oil, etc. are known as general low-elasticity agents. However, these have the following drawbacks. Polybutadiene rubber has low long-term heat resistance due to thermal deterioration (oxidation) of double bonds. Silicone-based resins are thermally stable and excellent, but powder-type resins have problems of particle aggregation, floating on the upper layer of the liquid, and separation. Further, since the viscosity is so high that the particles cannot be uniformly dispersed, the low elasticity effect is small. Silicone oil is poorly compatible with epoxy resin and has a small specific gravity, so that it is likely to be phase-separated in the upper part of the encapsulant. In addition, bleeding out easily occurs at the interface between the encapsulant and the package substrate, and the component acts as a release agent, so that the adhesive force is reduced and the interface easily peels off.

On the other hand, the gel silicone resin used as the component (F) in the present invention is located between powder and oil. Mix the silicone oil, which is the main component of the gel-like silicone resin, and the silicone oil, which is the curing agent, add this to the epoxy resin that has been heated, and stir while applying a strong share with a mixer,
A sea-island structure can be formed by finely dispersing the gel component. As a result, the low elasticity effect can be effectively exhibited without agglomeration of particles, floating to the upper layer, and the problem of phase separation. The size of the island having a sea-island structure is preferably 10 μm or less. For that purpose, the mixing ratio of the component (F) is (F) component / (total amount of composition−).
(Component (C)) <0.3 is preferable, and less than 0.2 is more preferable. When the blending ratio of the component (F) is 0.3 or more, the viscosity of the epoxy resin composition becomes high and the handleability deteriorates.

The gel silicone resin as the component (F) preferably comprises a silicone polymer represented by the following formula and a self-curing silicone rubber or gel.

[0031]

[Chemical 3]

In the above formula, R represents an alkyl group such as a methyl group or an ethyl group, or a phenyl group. X represents a polyoxyalkylene group-containing group such as a polyoxyethylene group, a polyoxypropylene group, or a copolymerization group thereof. l, m, and n are integers of 1 or more. l / (l + m +
n) = 0.05 to 0.99 is preferable, and m / (l + m +
n) = 0.001 to 0.5 is preferable, and n / (l + m +
n) = 0.001 to 0.8 is preferable. This silicone polymer may be a block copolymer or a random copolymer.

As the self-curing silicone rubber or gel, it is sufficient that it contains a vinyl group or the like which can undergo an SiH group addition reaction, and an addition reaction type one is preferable. It does not matter whether it is a one-component system or a multi-component system. By including this silicone polymer, it is possible to help disperse the self-curing silicone rubber or gel and form a fine sea-island structure. In addition, a part of the reaction with the self-curing silicone rubber or gel is also expected. .

The epoxy resin composition of the present invention may further contain a titanate coupling agent as the component (G). Generally, a silane coupling agent having Si as a core metal such as epoxysilane or aminosilane is used as the coupling agent for the epoxy resin sealing material. However, in a system containing a cyanate ester and an epoxy resin, by using a titanate-based coupling agent having Ti as a core metal, the present inventors have found that it is possible to improve fluidity and develop low-temperature fast-curing property. Found. The mixing ratio of the component (G) is a weight ratio,
(G) component / (total amount of composition- (C) component) = 0.001
Is preferably 0.1 to 0.005 to 0.05
Is more preferable, and 0.01 to 0.03 is further preferable. When the blending ratio is less than 0.001, it is difficult to obtain the effect of adding the component (G). 0.1
If it exceeds, the cross-linking density of the cured product will decrease and the reliability will deteriorate. Also, the pot life will be shortened.

Further, in the epoxy resin composition of the present invention, a flame retardant, a pigment, a dye, a release agent, a defoaming agent, a surfactant, an ion trap agent, a diluent, and a Si-based coupling, if necessary. Agents and the like can be added. The epoxy resin composition of the present invention can be produced by uniformly mixing the above-mentioned components with a mixer, a blender or the like, kneading them with a roll, a kneader or the like, and finally defoaming under vacuum. The order of mixing the components is not particularly limited.

The liquid epoxy resin composition thus obtained can seal a semiconductor element by liquid sealing without using a mold, whereby a semiconductor device of the present invention can be obtained. it can.

[0037]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto. (1) The compounds used in Examples and Comparative Examples are as follows. [(A) component: cyanate ester] "L10" (AroCy L-10 manufactured by Asahi Ciba Co., Ltd.) 4,4'-ethylidene bisphenylene cyanate (having a bisphenol E skeleton and being liquid at room temperature) "B10" ( AroCy B-10 manufactured by Asahi Ciba Co., Ltd. 2,2-bis (4-cyanatophenyl) propane (having a bisphenol A skeleton and solid at room temperature) “M30” (AroCy M-30 manufactured by Asahi Ciba Co., Ltd.) ) (Has a bisphenol F skeleton and is solid at room temperature) [(B) component: epoxy resin] "YD8125" (manufactured by Toto Kasei Co., Ltd.) Epoxy equivalent bisphenol A of viscosity 40 poise at 175, 25 ° C Type epoxy resin "Epicoat 828" (manufactured by Yuka Shell Co., Ltd.) Bisphenol A type epoxy resin [(C) component: inorganic filler] Commercially available spherical melt It was used Rica. [Component (D): Metal Chelate and / or Metal Salt] Iron (III) acetylacetone (CH ₃ COC)
HCOCH ₃ ) ₃ Fe Cobalt (III) acetylacetone (CH ₃ COC
HCOCH ₃ ) ₃ Co Manganese naphthenate [(E) component: acid anhydride] "B650" (Epiclone B650 manufactured by Dainippon Ink and Chemicals, Inc.) Methyl hexahydrophthalic anhydride, molecular weight 168 "B570" (Dainippon Nihon) Ink Chemical Industry Co., Ltd.) Methyl tetrahydrophthalic anhydride [(F) component: gel silicone resin] XE5818
(RTV silicone resin manufactured by Toshiba Silicone Co., Ltd.) was used.

A predetermined amount of this was added to the epoxy resin "YD8125", and the mixture was heated and dispersed at 80 ° C. for 3 hours in a disper to prepare. [(G) component: coupling agent] "KR-TTS" (Plainact KR-TTS manufactured by Ajinomoto Fine-Techno Co., Inc.) A titanate coupling agent represented by the following chemical formula.

[0039]

[Chemical 4]

Specific gravity 0.95, reddish brown liquid "A187" (manufactured by Nippon Unicar Co., Ltd.) Epoxy silane coupling agent represented by the following chemical formula

[0041]

[Chemical 5]

(2) Preparation of Epoxy Resin Composition Liquid raw resin compositions were prepared by blending the respective raw materials in the blending ratios (parts by weight) shown in Tables 1 to 4 and uniformly mixing with a mixer, followed by vacuum defoaming. A product was obtained (Examples 1 to 23, Comparative Example 1 to
6). (3) Various liquid properties, curability, and physical properties were measured using each epoxy resin composition obtained in the performance evaluation (2). Moreover, the silicon chip mounted on the circuit board and wire-bonded was sealed, heated at 120 ° C. for 1 hour, and then heated at 150 ° C. for 3 hours to be cured. Various reliability evaluations were also performed using this.

The evaluation method of each performance is as follows. Viscosity The viscosity (initial viscosity) of the obtained liquid epoxy resin composition at 25 ° C. was measured using a B-type viscometer. In the thixotropic viscosity measurement method, the viscosity at a value at which the rotation speed ratio of the viscometer rotor became 1/10 was obtained, and the value calculated by dividing the low-speed viscosity by the high-speed viscosity was used. Pot life: The liquid epoxy resin composition obtained was stored at 5 ° C. for 1 month, and the viscosity at 25 ° C. was measured using a B-type viscometer. The value calculated by dividing by was used. 0.5 g of the obtained liquid epoxy resin composition was applied on a hot plate kept at a gel time of 150 ° C., and the time until the stringing disappeared was measured while mixing with a spatula. 3 of glass epoxy board (0.5mm thickness) with flat warpage
Silicon rubber dam (height 1m
m) is formed, 2.0 g of the liquid epoxy resin composition is applied to the inside, and cured. The amount of warpage of the cured substrate was measured with a surface roughness meter. Place a ceramic substrate with a flat flow height on a hot platen at 70 ° C,
0.65 g of the obtained liquid epoxy resin composition is applied,
Cure for 5 minutes. The height of this cured product was measured. A test board obtained by sealing and heating a 9 mm × 9 mm silicon chip (3 μm width Al pattern circuit) mounted and mounted on a PCT reliable glass epoxy substrate with a liquid epoxy resin composition at 121 ° C. 2 atmospheric pressure, relative humidity 100%
Under the PCT (pressure cooker test) conditions, and the time until the occurrence of a circuit defect was evaluated. Note that n =
Conducted at 10. A test board similar to TCT reliability was tested in the vapor phase at -55 ° C for 30 minutes.
A temperature cycle of 5 minutes at room temperature and 30 minutes at 125 ° C. was set as one cycle, and 1000 cycles were performed. 100
The rate of occurrence defects at the end of the 0 cycle treatment was determined. In addition, it implemented by n = 10. A test board having the same reflow reliability is left to stand in a constant temperature bath at 30 ° C. and 60% relative humidity for 192 hours to absorb moisture. Then, the infrared reflow furnace (peak temperature of 240 ° C., 10 seconds) was treated twice, and the rate of occurrence defects at that time was obtained. Note that n = 1
It was carried out at 0.

[0044]

[Table 1]

[0045]

[Table 2]

[0046]

[Table 3]

[0047]

[Table 4]

[0048]

The epoxy resin composition according to the present invention is
It is possible to obtain a cured product that is liquid at room temperature, has low viscosity, is excellent in handleability, and has the advantages of a conventional liquid encapsulant that has a long pot life, and that is also excellent in moisture resistance and heat resistance reliability of a semiconductor. Further, the epoxy resin composition of the present invention
Since comprises a specific ratio of 4,4'-ethylidene-bis-phenylene cyanate liquid at room temperature, even if in combination at room temperature and cyanate ester solid, it is possible to prevent the solidification of the resin composition.

[0049] According to the epoxy resin composition of the invention 請 Motomeko 2, because it contains iron (III) chelate, thixotropy becomes very small, it shows high fluidity. Therefore, BG
This is advantageous in applications where the shape of the sealing resin needs to be flat, such as A.

[0050] According to the epoxy resin composition of the invention 請 Motomeko 3, because it contains a titanate coupling agent, it is possible to realize an improvement and low-temperature rapid curability of fluidity.

The semiconductor device according to the invention of 請 Motomeko 4, for performing a liquid seal type semiconductor encapsulation using epoxy resin composition according to the present invention, higher integration of semiconductor packages, high density Can be made thinner and lighter, and
Excellent in moisture resistance and heat resistance of semiconductors.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI H01L 23/31 (56) References JP-A-10-287809 (JP, A) JP-A-9-100349 (JP, A) Special Kaihei 11-124487 (JP, A) JP 9-124898 (JP, A) JP 9-100393 (JP, A) JP 9-12685 (JP, A) JP 9-52941 ( JP, A) JP 8-53602 (JP, A) JP 62-185720 (JP, A) JP 56-112923 (JP, A) JP 12-336246 (JP, A) (58) ) Fields surveyed (Int.Cl. ⁷ , DB name) C08L 63/00-63/10 C08L 79/04-79/08 C08G 59/42 C08G 59/68-59/70 H01L 23/29

Claims (4)

(57) [Claims] 1. An epoxy resin composition comprising (A) cyanate ester, (B) epoxy resin, (C) inorganic filler, (D) metal chelate and / or metal salt, and (E) acid anhydride. At least one of the component (A) and the component (B) is a liquid at room temperature, and as the component (A), 4,4′-ethylidenebisphenylene
Ncyanate (A1), the blending ratio is by weight
And (A1) / (A) component = 0.1-1, and (B) component has two or more glycidyl groups in the molecule.
It has an epoxy resin which is liquid at room temperature, the component (E) is liquid at room temperature, the mixing ratio of each component is a weight ratio, and the component (C) / total amount of composition = 0.60-0. 95 (A) component / (B) component = 0.76 to 1.43 (E) component / (total amount of composition− (C) component) = 0.01 to
The liquid epoxy resin composition for semiconductor encapsulation is 0.3. 2. An iron (III) chelate (D1) is contained as the component (D), and the mixing ratio thereof is (D).
The liquid epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein 1) / (A) component = 0.0001 to 0.01. 3. A titanate coupling agent is further included as the component (G), and the compounding ratio thereof is (G) by weight.
Ingredient / (total amount of composition- (C) ingredient) = 0.001 to 0.
1, according to claim 1 or for semiconductor encapsulation liquid epoxy resin composition according to 2. 4. A semiconductor device in a semiconductor device comprising sealed with the epoxy resin composition, a semiconductor sealing liquid epoxy resin composition according to any of claims 1 3 is used as the epoxy resin composition A semiconductor device characterized by being provided.