JP3441651B2 - Package assembly equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a package assembling apparatus for assembling a package in which a semiconductor element such as an optical semiconductor module is sealed in a housing filled with an inert gas, and in particular, a metal cap is seam welded. The present invention relates to a package assembling apparatus that ensures the positioning and fixing of the metal cap with respect to the housing when the metal cap is welded to improve productivity as a metal cap welding operation.

In recent years, many optical semiconductor modules have been put to practical use in the field of optical communication, but in order to realize the characteristic stabilization as a module, such an optical semiconductor module is used in an atmosphere of an inert gas such as nitrogen. It is necessary to give special consideration to the configuration as a module, such as configuring

When the module is constructed in an inert gas atmosphere as described above, for example, a plate-shaped metal cap placed on a housing located in a nitrogen chamber is mounted by seam welding means or the like. However, since the cap is easily moved with respect to the housing during welding, a sealing failure is likely to occur, and it is strongly desired to deal with the problem.

[0004]

2. Description of the Related Art FIG. 12 is a view for schematically explaining the structure of a conventional package in an optical semiconductor module or the like.
FIG. 13 is a diagram for explaining a conventional package assembling apparatus together with a package assembling process.

FIG. 12 illustrates an example in which the optical semiconductor module is a normal inert gas hermetically sealed type. The package 1 is, for example, a square shape in plan view made of Kovar or the like whose surface is gold-plated. A case 11 in which a plurality of parts including an optical semiconductor element are mounted inside a box-shaped metal case 111 having a bottom, and the case 11 has an outer size equal to the plan view size of the case 11. The flat metal cap 12 made of Kovar or the like is fixed to the open end face of the.

The lead wire 112 connected to a plurality of parts including the semiconductor element in the housing 11 described above has an insulating bush 1 provided on the side wall 111a of the metal case 111.
It penetrates 13 and is led out outside.

Therefore, the housing 11 is, for example, vacuumed
100 ° C in a reduced pressure atmosphere of about 1 × 10 ^-1 Torr
The housing 11 is subjected to a vacuum baking process which is left for about 2 hours.
After sufficiently removing water inside the parts connecting portion and the like, the housing 11 is installed in a chamber filled with nitrogen, and the metal cap 12 placed on the housing 11 is further attached to the metal in the periphery thereof. The case 111 is integrated by seam welding to form the required package 1.

FIG. 13 illustrates the process of assembling the package 1 together with the package assembling apparatus.
3a) shows a state immediately before assembly, FIG. 13b shows a state during assembly, and FIG. 13c shows a state immediately after assembly.

That is, in (13a) of the figure, the base 1
The package assembling apparatus 16 disposed on the
An upper chamber 161, a rotary stage 162 mounted on the surface of the base 15, and a normal roller electrode 16 arranged in pairs at corresponding positions above the rotary stage.
3 is included.

The rotary stage 162 in this case is
While being mounted on the surface of the base 15, the base 15 can move along the surface of the base 15 and can rotate within an angle range of at least 90 degrees in the plane along the surface. There is.

Further, in this case, a pair of roller electrodes 163.
Are capable of reciprocating in the vertical direction in pairs. The movement and rotation of the rotary stage 162 and the vertical movement of the roller electrode 163 are all performed on the base 15.
It is configured so that it can be operated by a signal from a control unit (not shown) provided inside the.

The opposite side walls 1 of the chamber 161
Each of 61a has an opening window 16 for manual work.
1b is provided with a rubber glove 161c. Therefore, after the casing 11 on which the vacuum baking process described in FIG. 12 has been completed is installed on the rotary stage 162 by manual work through the rubber gloves 161c, the metal cap 12 is placed on the opening end surface of the casing 11. Place on.

Then, the manual work is released in the state shown in the drawing in which the outer circumference of the metal cap 12 is matched with the outer circumference of the housing 11. Then, as shown in FIG. 13B, after filling the chamber 161 with nitrogen gas, the roller electrodes 163 are lowered by a signal from a control unit (not shown),
The roller electrode slope 163a of each roller electrode 163 is brought into contact with the upper ridge of the upper metal cap 12.

Next, when a predetermined potential is applied between the roller electrodes 163 in response to a signal from the control section, the roller electrodes 163 are moved from the front side to the back side of the paper so that they can rotate in the direction of arrow A _1. , As indicated by arrow A ₂ by means of an electric current passing through the metal cap 12
The two opposite sides that contact the roller electrode 163 of
It can be seam welded to one metal case 111.

Then, as shown in (13c) of the figure, the rotary stage 162, which has been returned to its original position by a signal from the control section while the roller electrodes 163 have been raised to their original positions, is rotated by 90 °. After the pressing, each roller electrode 163 is lowered in the same manner as above.

Further, the remaining two metal cases 111 of the metal cap 12 facing each other are seam-welded by the same method as described with reference to FIG. 13B, so that the cap 12 is seam-welded to the casing 11 at the periphery. The required package 1 thus obtained can be obtained.

[0017]

However, in the seam welding method described above, since all manual work in the chamber is performed through the rubber gloves 161c, the metal cap 12 is not aligned with the metal case 111 and then the housing 11. Since it takes time and the metal cap 12 cannot be manually pressed during welding, the metal cap 12 is welded only by being placed on the metal case 111. There is a problem that the metal cap may be welded while being displaced from the metal case, resulting in a lot of man-hours for the welding work and a tendency to be defective in terms of characteristics and appearance.

[0018]

SUMMARY OF THE INVENTION The above object is to provide a package assembly apparatus for seam welding a metal cap to an open end surface of a bottomed box-shaped case on which a semiconductor element is mounted in an inert gas atmosphere. A rotary stage disposed on the upper surface of the base, a cap sealing device fixed to the upper surface of the rotary stage, and a roller electrode that can descend from above the cap sealing device. The sealing device is attached to the sealing device body through a sealing device body on which the casing is mounted and springs fitted to guide pins standing upright at a plurality of locations around the sealing device body. It consists of a guide plate,
The guide plate is made of an insulating material, and is formed so that the surface of the housing when mounted on the main body of the sealing device positions the housing and the upper surface is located at a height higher than the housing. Solved by the assembly device.

Further, a package assembling apparatus for seam welding a metal cap to an open end surface of a bottomed box-shaped case on which a semiconductor element is mounted is disposed on a base and an upper surface of the base. The rotary stage, a cap sealing device fixed to the upper surface of the rotary stage, and a roller electrode that can descend from above the cap sealing device,
The cap sealing device includes a guide piece that can be elastically warped in a moving direction of the roller electrode by abutting on the roller electrode at a plurality of locations around a region where the housing is mounted, and the guide piece, This is solved by a package assembling apparatus in which the housing is positioned by the side surface on the housing side and a guide made of an insulating material whose upper surface is located at a height higher than the housing is provided at the tip.

If the cap sealing device is constructed so that the metal cap can be welded while being positioned with respect to the metal case, the mounting work of the metal cap on the metal case can be facilitated and the metal at the time of welding Since displacement of the cap can be suppressed, reliable seam welding between the metal cap and the metal case can be realized without using a special welding electrode or the like.

Therefore, in the present invention, a guide is provided in a region corresponding to each side wall peripheral surface of the metal case so as to project from the upper surface of the metal case and contact the roller electrode so that the roller electrode can contact the metal cap. The cap sealing device is configured to be provided.

Therefore, since the guide can position the metal cap with respect to the metal case and thus the housing, the manual work in the chamber can be facilitated, and the displacement of the metal cap during the welding work by the roller electrode can be suppressed. .

Therefore, the simplification of manual work and the suppression of characteristic and external defects can be realized at the same time, and it can be expected that the productivity of the package assembling work is improved.

[0024]

1 is a diagram for explaining a package assembling apparatus according to the present invention, FIG. 2 is a diagram for explaining a cap sealing device in FIG. 1, and FIG. 3 is a diagram showing a sealing device main body in FIG. FIG. 4 is a diagram for explaining the guide plate in FIG. 2, FIG. 5 is a diagram for explaining a package assembling process in the package assembling apparatus of FIG. 1, and FIG. 6 is a diagram for explaining a state during metal cap welding. FIG. 7 is a diagram for explaining the operational effects of the package assembling apparatus of FIG.

In each of the figures, the case where the package is applied to the package described in FIG. 12 is taken as an example.
The same target members and parts as those in FIG. 13 are designated by the same reference numerals, and duplicate explanations are omitted.

The package assembling apparatus 2 according to the present invention, which is arranged on the base 15 in FIG. 1, is installed on the chamber 161, the rotary stage 162 fixed to the base 15, and the rotary stage 162. It includes a cap sealing device 21 and the roller electrodes 163 arranged in pairs at corresponding positions above the cap sealing device 21.

FIG. 2 shows the package assembling apparatus 2 shown in FIG.
It is the figure which showed the cap sealing device inside, Drawing (2a) is the whole perspective view, and Drawing (2b) is the side view which carried out the partial cross section. That is, the cap sealing device 21 in this case is as shown in FIG.
As shown in FIG. 3, it is composed of a sealing device main body 211 serving as a base, a coil spring 212 attached to the sealing device main body 211, and a guide plate 213 assembled to the sealing device main body 211 via the coil spring 212. There is.

To facilitate understanding, the main body of the sealing device and the guide plate will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram for explaining the sealing device body in FIG.
(a) is an overall perspective view, and FIG. (3b) is a side view showing a partial cross-section.

In FIG. 3, the sealing device main body 211 is formed by projecting a square frame 211b, which is smaller than the substrate in plan view, on one surface (upper surface in the figure) of a substrate 211a which is made of an insulating material and has a rectangular shape in plan view. At the same time, guide pins 211c are provided at a total of 8 locations, that is, two locations near each of the four corners on the outside of the corner frame 211b.
Is constructed by standing upright.

The inner method of the square frame 211b is shown in FIG.
The guide pin 211c is formed to match the outer shape of the metal case 111 described above, and the length or height of the guide pin 211c is set lower than the height of the metal case 111.

Further, the coil spring 212 is formed so that the diameter of the compressible winding portion substantially corresponds to that of the guide pin 211c. On the other hand, FIG. 4 is a view for explaining the guide plate in FIG. 2, FIG. 4A is an overall perspective view, and FIG. 4B is a side view with a partial cross-section.

In FIG. 4, a guide plate 213 made of an insulating material is used.
Is a rectangle having a length shorter than the length of each side of the metal case 111 described in FIG. 12 as a longitudinal direction, and one side (lower surface in the figure) 213a in the thickness direction thereof.
Is provided with a concave step surface 213b in the central region in the longitudinal direction.

The length a ₅ in the longitudinal direction of the concave step surface 213b is formed so as to at least exceed the length a ₆ of the insulating bush 113 in the housing 11 described with reference to FIG.

Further, long holes 213c which are long in the longitudinal direction are formed so as to penetrate on both sides in the longitudinal direction excluding the concave step surface forming region. Each of the elongated holes 213c has a width a ₁ substantially corresponding to the diameter a ₂ of the guide pin 211c in the main body 211 of the sealing device described in FIG. 3, and both ends thereof are formed in a semicircular shape corresponding to the guide pin. At the same time, the pitch p ₁ between the centers of the semicircles located on the outer sides of the two elongated holes 213c is set to be slightly larger than the pitch p ₂ between the guide pins in the main body 211 of the sealing device.

Further, one side surface 213 of the guide plate 213 is provided.
The distance a ₃ from d to the center line of the elongated hole 213c matches the distance a ₄ of the guide pin 211c in the sealing device main body 211 from the square frame inner surface 211b '.

The main body of the sealing device and the guide plate are assembled as follows. That is, first, the coil spring 212 is fitted into each of the guide pins 211c of the sealing device body 211 described with reference to FIG.

Next, the side surface 2 of the guide plate 213.
The guide plate 213 arranged so that 13d faces inward.
Is mounted on the sealing device main body 211 by fitting the long hole 213c and the guide pin 211c, so that the guide plate 213 is mounted on the sealing device main body 211 via the coil spring 212. The cap sealing device 21 is shown in FIG.
Can be configured as shown in.

In this state, the upper surface 213e of the guide plate 213 has the package 1 mounted on the main body of the sealing device.
The height of the housing 11 and the height of the housing 11 plus the thickness of the metal cap 12 are at least projected.

In the cap sealing device 21, since the guide plate 213 is mounted on the sealing device main body 211 via the coil spring 212 as described above, the cap sealing device 21 can move up and down by being pressed and released from above. The side surface 213d of the guide plate 213 is in a state of being aligned with the inner side surface of the square frame 211b, in other words, the side surface of the housing 11 when it is mounted.

Therefore, by mounting and fixing the cap sealing device 21 on the rotary stage 162 of FIG. 1, the required package assembling device 2 can be constructed. 5A and 5B are views for explaining a process of assembling the package by the package assembling apparatus 2. FIG. 5A shows a state before the package is assembled, FIG. 5B shows a state when the guide plate is attached, and FIG. The figure shows the states when the metal cap is attached.

That is, in FIG. 5 (a), the sealing device body 211 described in the cap sealing device 21 is provided on the rotary stage 162 in the chamber 161 arranged on the base 15.
Is equipped with the coil spring 212, and the casing 11 on which the same vacuum baking process as that described in FIG. 12 is completed is positioned and mounted on the sealing device main body 211 by the rectangular frame 211b. ing.

In this case, when the casing 11 is manually placed, the casing 11 itself is the sealing device body 211.
It is easy because it is positioned by the corner frame 211b provided on the.

Next, as shown in FIG. 5B, the above-mentioned guide plate 213 is manually attached. At this point, the side surface 213d of the guide plate 213 is positioned almost in contact with the side wall surface of the housing 11, and at the same time, The upper surface 213e of the guide plate 213 is in a state of protruding from the housing 11.

Further, as shown in FIG. 5C, the package before seam welding can be assembled by manually dropping the metal cap 12 into the area surrounded by the guide plate 213.

In this state, the casing 11 itself has the square frame 2
11b and the side surface 213d of the guide plate 213, and the metal cap 12 itself is also positioned by the side surface 213d of the guide plate, so there is no relative displacement.

Subsequently, as shown in FIG. 6, the roller electrode 163 is formed.
Is lowered, the slope 163a of each roller electrode 163 is lowered.
Since the guide plate 213 is pushed down against the coil spring 212, the slope 163a can be brought into contact with the upper ridge of the metal cap 12.

Then, as in the case described with reference to FIG.
Roller electrodes 1 paired with a signal from a control unit (not shown)
While the predetermined potential is applied between 63, the rotary stage 162 is moved by the signal from the controller so that each roller electrode 163 rotates in the direction of the arrow A ₁ so that one of the caps 12 faces each other. Two sides can be seam-welded to the housing 11.

Further, after the roller electrode 163 is raised to its original position, the rotary stage 162 is returned to its original position by a signal from the control unit and then rotated by 90 °.
By lowering each of the roller electrodes 163, it is possible to obtain the required package 1 in which the cap 12 is seam welded to the casing 11 at the periphery.

7A and 7B are views for explaining the action and effect at the time of welding by the cap sealing device 21, FIG. 7A shows a state when the roller electrode 163 is not lowered, and FIG. 7B shows the state. FIG. 7C shows a state in which the roller electrode is located on one end side of the metal cap 12, and FIG. 7C shows a state in which the roller electrode moves to the other end side.

That is, in FIG. 7A, the guide plate 213 is provided with the coil spring 212 and the substrate 2 of the sealing device main body 211.
It is mounted in the area 11a. And in this state,
The upper surface of the metal cap 12 (not shown) is located lower than the upper surface 213e of the guide plate 213, as indicated by the chain line B.

Therefore, as shown in FIG. 6, the guide plate 2
When the roller electrode 163 located in the vicinity of one side end portion (C _{1 in the} drawing) of 13 is lowered, the region of the guide plate 213 in contact with the roller electrode, that is, the one guide pin side is lowered against the coil spring 212. Since the vicinity of the other end (C _{2 in the} drawing) is pushed up by the coil spring 212, the guide plate 213 is tilted, resulting in the state shown in FIG. 7B.

The inclination of the guide plate depends on the guide plate 2
This can be realized by making the hole for the guide pin provided in 13 into the elongated hole 213c (see FIG. 4). However, since the width of this elongated hole 213c substantially corresponds to the diameter of the guide pin 211c as described above, the guide plate In the vicinity of C _{2 in the} drawing, the upper surface 213e of the guide plate is the upper and lower side of the guide plate 2 and the dashed line B is the upper surface 2 of the guide plate.
Since it is located lower than 13e, the positioning as the metal cap 12 continues.

Then, as the rotary stage 162 moves, the inclination of the guide plate 213 changes in the opposite direction, and when the roller electrode 163 is located on the other end side, the two sides facing each other are in the state shown in FIG. 7C. The seam welding of can be completed.

This means that the metal cap 12 is positioned at least by the guide plate 213 until immediately after the start of seam welding by the roller electrode 163, and as a result, the housing 1 of the metal cap 12 is positioned.
There is an advantage that the deviation from 1 can be surely suppressed.

Since the housing 11 can be positioned by the four guide plates 213 in the cap sealing device 21 described above, the rectangular frame 211 provided in the sealing device main body 211.
Even if b is removed, the same effect can be obtained.

Therefore, there is an advantage that the cost reduction as the sealing device main body 211 can be realized by eliminating the square frame 211b. 8 is a view for explaining another package assembling apparatus according to the present invention, FIG. 9 is a view for explaining the cap sealing apparatus in FIG. 8, and FIG. 10 is a package assembling process in the package assembling apparatus of FIG. 11 is a diagram for explaining FIG.
FIG. 9 is a diagram for explaining a metal cap welding state in the package assembling apparatus of FIG. 8.

In another package assembling apparatus 3 according to the present invention shown in FIG. 8, the chamber 161 fixed to the base 15 is provided.
And the rotary stage 162 and the rotary stage 162.
It includes a cap sealing device 31 installed on the top and the roller electrode 163 arranged in a pair at a corresponding position above the cap sealing device 31.

The cap sealing device 31 according to the present invention will be described with reference to FIG. FIG. 9A is an overall perspective view, and FIG. 9B is a side view in which a partial cross section is shown. That is, in the cap sealing device 31 in this case, L-shaped projections 31b corresponding to the four corners of the rectangular frame 211b in the sealing device body 211 are formed on one surface (the upper surface in the figure) of the substrate 31a made of an insulating material and having a quadrangular shape in plan view. A guide piece 31c that is elastically displaced with respect to the moving direction of the roller electrode 163 that is in contact with each position corresponding to the guide pin 211c in the main body 211 of the sealing device is planted in an upright state. It has been configured.

In the guide piece 31c in this case, a guide 31e made of an insulating material is fixed to the tip of a tongue-shaped metal plate 31d having elasticity such as a phosphor bronze plate by, for example, press fitting. , The guide electrode 31c is connected to the roller electrode 163 in the thickness direction of the tongue-shaped metal plate 31d.
The cap sealing device 31 is constructed by implanting the tongue-shaped metal plate on the other end of the tongue-shaped metal plate in the substrate 31a so as to face the moving direction.

Therefore, when the laterally moving roller electrode comes into contact with the tip region of the guide 31e of the guide piece 31c, the guide piece 31c is displaced in the exposed region of the tongue-shaped metal plate, and Arrow D ₁ in the moving direction of the roller electrode,
It is elastically displaced like D ₂ .

The guide piece 31c in this case is
By appropriately setting the thickness, width, and exposed length of the tongue-shaped metal plate 31d according to the size of the roller electrode, the amount of displacement corresponding to the roller electrode used can be determined.

Further, the height b ₁ from the surface of the substrate 31a as the cap sealing device 31 to the guide upper surface 31e 'of the guide 31e is slightly higher than the height including the metal cap of the package 1 described in FIG. The inner end surface 31e ″ of the guide 31e is
Is located in the rectangular frame inner surface 2 of the sealing device body 211.
11b 'In other words, the inner side surface 31 of the L-shaped projection 31b
It is set to match b '.

Therefore, the housing 11 described with reference to FIG. 12 is positioned by the L-shaped projection 31b so that the cap sealing device 3 can be positioned.
The upper surface 31e 'of the guide 31e when placed on
Is positioned so as to project from the housing 11 and the guide 31
The inner end surface 31e ″ of e can be brought into contact with the side wall surface of the housing 11.

Therefore, by mounting and fixing the cap sealing device 31 on the rotary stage 162 of FIG. 1, the required package assembly device 3 can be constructed as shown in FIG.

In order to assemble a package by the package assembling apparatus 3, as shown in FIG. 10, first, the housing 11 is placed on the cap sealing device 31 using the L-shaped projection 31b as a guide, and then the guide piece 31c. Guide 3
The package before seam welding can be assembled by manually dropping the metal cap 12 using 1e as a guide.

At this point in time, the housing 11 itself has the substrate 31.
Since it is positioned with respect to a by the L-shaped projection 31b and the metal cap 12 itself is also positioned by the guide 31e, there is no relative displacement.

Therefore, as described with reference to FIG. 13, when the roller electrode 163 is lowered as shown in FIG. 11 by the signal from the control unit (not shown), the slope 16 of each roller electrode 163 is lowered.
3a can be brought into contact with the upper ridge of the metal cap 12.

Therefore, similarly to the above, the rotary stage 162 is moved so that the roller electrodes 163 rotate in the direction of the arrow A ₁ while the predetermined potential is applied between the roller electrodes 163. The guide piece 31
Since the guide piece 31c shifts and passes the roller electrode 163 as it is when it comes into contact with c, as a result, the two opposite sides of the cap 12 can be seam welded to the housing 11.

Further, in a state where the roller electrode 163 is returned to the original position in response to a signal from the control section, the rotary stage 162 is rotated by 90 ° and then the roller electrodes 163 are lowered in the same manner as above. As with the case described with reference to FIG. 13, it is possible to obtain the required package 1 in which the cap 12 is seam welded to the casing 11 at the periphery.

In the cap sealing device 31, since the man-hours for mounting the guide plate required in the process of assembling the package by the cap sealing device 21 are unnecessary, there is an advantage that productivity can be improved by reducing the man-hours for assembling.

Also in the cap sealing device 31 described above,
Since the housing 11 can be positioned by the eight guide pieces 31c like the cap sealing device 21 described above, the same effect can be obtained even if the L-shaped projection 31b provided on the cap sealing device 31 is removed. it can.

Therefore, there is an advantage that the cap sealing device 31 can be further reduced in cost by eliminating the L-shaped projection 31b. In the cap sealing devices 21 and 31 described above, both the upper surface 213e of the guide plate 213 and the upper surface 31e 'of the guide 31e are set at positions exceeding the total height of the package 1.
It is obvious that the same effect can be obtained by slightly projecting 13e and 31e 'from the upper surface of the housing 11 to the extent that the metal cap 12 mounted on the housing 11 can be positioned.

[0073]

As described above, according to the present invention, it is possible to provide a package assembling apparatus which realizes reliable positioning and fixing of the cap with respect to the casing during seam welding and improves productivity as a cap welding operation. .

[Brief description of drawings]

FIG. 1 is a diagram illustrating a package assembly apparatus according to the present invention.

FIG. 2 is a diagram illustrating a cap sealing device in FIG.

FIG. 3 is a diagram illustrating a sealing device body in FIG.

FIG. 4 is a diagram illustrating a guide plate in FIG.

5 is a diagram illustrating a package assembling process in the package assembling apparatus of FIG.

FIG. 6 is a diagram illustrating a state at the time of welding a metal cap.

7A and 7B are views for explaining the operational effects of the package assembling apparatus of FIG.

FIG. 8 is a diagram illustrating another package assembling apparatus according to the present invention.

9 is a diagram illustrating the cap sealing device in FIG.

10 is a diagram illustrating a package assembling process in the package assembling apparatus in FIG.

FIG. 11 is a view for explaining a metal cap welding state in the package assembling apparatus of FIG.

FIG. 12 is a diagram schematically illustrating a configuration of a conventional package.

FIG. 13 is a view for explaining a conventional package assembling apparatus together with a package assembling process.

[Explanation of symbols]

2,3 Package assembly equipment 11 housing 12 metal caps 15 bases 21,31 Cap sealing device 31a substrate 31b L-shaped protrusion 31b 'inner slope 31c guide piece 31d Tongue-shaped metal plate 31e guide 31e 'Guide upper surface (upper surface) 31e ″ Inner end surface (side surface) 161 chamber 162 rotation stage 163 Roller electrode 163a Roller electrode slope (slope) 211 Sealing device body 211a substrate 211b square frame 211b 'inner slope 211c Guide pin 212 coil spring 213 Guide plate 213a One side 213b concave step surface 213c long hole 213d side 213e upper surface

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/02 B23K 11/06 540 B23K 11/36 B23K 37/04

Claims (6)

(57) [Claims] 1. A package assembling apparatus for seam-welding a metal cap to an open end surface of a box-shaped box having a bottom on which a semiconductor element is mounted is provided on a base and an upper surface of the base. Is a rotating stage,
A cap sealing device fixed to the upper surface of the rotary stage,
The cap sealing device comprises a roller electrode that can be lowered from above the cap sealing device, and the cap sealing device stands on a sealing device main body on which the casing is mounted and at a plurality of locations around the sealing device main body. A guide plate that is attached to the sealing device body via a spring that is fitted into a guide pin that is provided, and the guide plate is made of an insulating material, A package assembling apparatus, wherein a surface is formed so as to position the housing and an upper surface is positioned at a height exceeding the housing. 2. The package assembling apparatus according to claim 1, wherein the main body of the sealing apparatus includes means for positioning the casing on the bottom surface. 3. The package assembling apparatus according to claim 1, wherein each of the guide plates is configured so as to be lowered by a pressing force associated with the lowering of the roller electrode. 4. The guide plate is configured to incline due to a pressure applied as the roller electrode descends, and the inclination to change in accordance with a lateral movement of the roller electrode. The package assembly apparatus according to claim 1. 5. A package assembly apparatus for seam-welding a metal cap to an open end surface of a bottomed box-shaped housing on which a semiconductor element is mounted in an inert gas atmosphere is provided on a base and an upper surface of the base. and Tei Ru rotation stage is,
A cap sealing device fixed to the upper surface of the rotary stage,
A roller electrode that can descend from above the cap sealing device, wherein the cap sealing device is configured to contact the roller electrode at a plurality of locations around a region where the housing is mounted by contact with the roller electrode. A guide piece made of an insulating material which is elastically warped in the moving direction of the guide piece, wherein the guide piece positions the case on the side surface on the case side and the upper surface is located at a height exceeding the case, A package assembling apparatus characterized by being provided at the tip. 6. The package assembling apparatus according to claim 5, wherein the cap sealing device includes means for positioning the casing on the bottom surface.