JP3424522B2 - Infrared detector and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improving reliability of mounting an external electronic component and a signal processing circuit on a three-dimensional circuit block of an infrared detector for detecting infrared rays emitted from a human body.

[0002]

2. Description of the Related Art Infrared detectors that detect infrared rays emitted from a human body have been proposed that use three-dimensional circuit blocks.

FIG. 5 is a perspective view schematically showing an example of a mounted state of such a three-dimensional circuit block, where (a) is seen from the front side and (b) is seen from the back side. Is shown.

The three-dimensional circuit block A is integrally molded of a resin having a low thermal conductivity, and an infrared detecting element B is mounted on the upper surface 10E thereof, and the front surface 10A and the back surface 10B.
Includes a signal processing circuit C including an IC chip,
External electronic components D, which are chip components such as capacitors and resistors, are mounted.

Further, a plurality of grooves are provided in parallel on a side wall surface 10C which connects the upright surface 10A and the upright surface 10B, and the bottom surface of these grooves is provided with the upright surface 10A and the back surface. A conductive pattern 32 that connects the conductive patterns 34 and 37 formed on the upright surface 10B is formed.

Reference numeral 38 denotes a signal processing circuit C and a conductive pattern 34.
A wire for connecting to the electrode part 34a of the device, 36 a conductive adhesive for connecting the infrared detecting element B to the three-dimensional circuit block A, 37a an electrode part for conductively connecting the external electronic component D, Reference numeral 12 is a leg portion for attaching the three-dimensional circuit block A to a base portion (not shown), 12a is a mounting hole thereof, and 33 is a conductive connection with a pin terminal (not shown) of the base portion fitted in the mounting hole 12a. It is an electrode part for.

As described above, when the three-dimensional circuit block is used, necessary components such as the infrared detecting element, the external electronic component, and the signal processing circuit can be mounted three-dimensionally and compactly. A detector can be provided.

[0008]

However, in an infrared detector using such a three-dimensional circuit block, necessary components are mounted and housed inside a package, and then the performance of the detector is inspected. When a heat cycle test or PCT test is performed, the linear expansion coefficient of the resin-molded three-dimensional circuit block, external electronic components, signal processing circuits such as IC chips, and conductive patterns made of conductive metal are different. As a result, the circuit may float,
Occurrence of disconnection or cracks in the solder at the joint may cause malfunction.

In this way, it is possible to realize a small size and a low cost.
The characteristic of the dimensional circuit block will not be utilized.

The present invention has been made in view of this point, and an infrared detector having improved reliability in mounting external electronic components and a signal processing circuit on a three-dimensional circuit block, and the infrared detector. It is intended to provide a manufacturing method of.

[0011]

An infrared detector according to claim 1 of the present invention, which is proposed to solve the above-mentioned problems, has an infrared detecting element on its upper surface and its front and back surfaces. Has a structure in which a three-dimensional circuit block on which an external electronic component and a signal processing circuit are mounted is housed in a package, and the external electronic component excluding the mounting portion of the infrared detection element in the three-dimensional circuit block. parts, the area around including the signal processing circuit, has sealing with an insulating resin,
Cover the portion to be sealed with the insulating resin with a cylinder,
Insulating resin is filled between the cylinder and the 3D circuit block.
Therefore, it is characterized in that it is resin-sealed .

The infrared detector according to claim 2 is the following:
1 is characterized in that the cylindrical body is formed of a conductive material.

An infrared detector according to a third aspect is the infrared detector according to the first or second aspect, wherein the inside of the package is filled with an inert gas.

In the method for manufacturing an infrared detector according to claim 4, an infrared detecting element is provided on the upper surface of the three-dimensional circuit block.
When the external electronic components and the signal processing circuit are mounted on the front surface and the back surface and housed inside the package, the surroundings of the signal processing circuit and the external electronic components mounted on the three-dimensional circuit block are provided. Cover the part to be sealed with the cylinder,
Insulating resin is filled between the body and the 3D circuit block.
As a result, the signal processing circuit and the external electronic component
It is characterized in that the periphery of is sealed with a resin.

In the method of manufacturing an infrared detector according to claim 5 , an infrared detecting element is provided on the upper surface of the three-dimensional circuit block.
External electronic components and signal processing circuits are mounted on the front and back surfaces, and when housed inside a package, the above-mentioned three-dimensional circuit block is fixed to the base portion, and a cover with a hole is opened from above. It is characterized by covering the signal processing circuit and the external electronic component with resin by pouring insulating resin into the hole.

In the method for manufacturing an infrared detector according to claim 6 , an infrared detecting element is provided on the upper surface of the three-dimensional circuit block.
When the external electronic components and the signal processing circuit are mounted on the front surface and the back surface and housed in the package, the three-dimensional circuit block is integrally molded in a state in which a plurality of the three-dimensional circuit blocks are arranged vertically and horizontally. The external electronic component and the signal processing circuit are mounted, and further, the periphery of the signal processing circuit and the external electronic component is sealed with an insulating resin, and then cut and produced as individual three-dimensional circuit blocks. Characterize.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an infrared detector of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram (reference example) showing an example of a method of manufacturing an infrared detector and a finished product. (A) is a state in which a signal processing circuit is mounted on a three-dimensional circuit block, and (b) is a diagram. External electronic components are mounted, (c) is an infrared detection element mounted, (d) is a three-dimensional circuit block mounted on the base portion, (e) is a signal processing circuit and external electronic components. A state in which the periphery is sealed with an insulating resin, (f) shows an internal vertical section of the finished product.

In the figure, a detailed description of the portions previously described with reference to FIG. 5 is omitted, but 1 is the infrared detector of the present invention, A is a three-dimensional circuit block, B is an infrared detecting element, and C is Signal processing circuit, D is various external electronic parts,
E is a base portion having the three-dimensional circuit block A mounted thereon and having pin terminals 41 for signal transmission to the outside, F is a resin sealing portion, 10A is an upright surface, 10B is an upright surface, 42 is a cover,
Reference numeral 43 is an infrared filter installed in the window portion of the cover 42. The base portion E and the cover 42 form a package of the infrared detector.

As conceptually illustrated by the figure,
In the present invention, the elevation surface 10 of the three-dimensional circuit block A is
After mounting the signal processing circuit C on A, the external electronic component D on the back surface 10B, and the infrared detection element B on the upper surface, the three-dimensional circuit block A is fixed to the base portion E, and the infrared detection of the three-dimensional circuit block A is performed. It is characterized in that the peripheral portion including the signal processing circuit C and the external electronic component D is sealed with an insulating resin to form the insulating sealing portion F, except for the mounting portion of the element B.

Thereafter, the infrared detector 1 is completed by covering the infrared detector B with a cover 42 having an infrared filter 43 at a position where the transmitted light is incident on the infrared detector B so that the inside is kept secret.

When the signal processing circuit and the external electronic component are resin-sealed as described above, the circuit floats, breaks, or breaks in the circuit, which may impair the reliability of mounting during a heat cycle test.
Cracks in the solder at the joint are less likely to occur, and mounting reliability is improved. In addition, it is easy to manufacture.

Further, if an inert gas is filled in the package in a sealed state, impurities in the atmosphere that cause noise are removed, and the reliability of the infrared detector is improved.

Here, the case where the signal processing circuit C is mounted on the front surface 10A and the external electronic component D is mounted on the back surface 10B has been described, but the present invention is not limited to this.

FIG. 2 is a schematic view showing another example of the manufacturing method of the infrared detector of the present invention and the finished product. FIG. 2 (a) shows an infrared detecting element, a signal processing circuit, and an external electronic component mounted 3 With the dimensional circuit block attached to the base,
(B) shows a state in which the tubular body is covered, (c) shows a state in which an insulating resin is filled between the tubular body and the three-dimensional circuit block, and (d) shows an internal longitudinal section of the finished product.

In the figure, the description of the same points as those in the manufacturing method described above with reference to FIG. 1 will be omitted. 1A is an infrared detector having other features of the present invention, G is a cylinder, and has a length that just covers the signal processing circuit C mounted on the three-dimensional circuit block A and the external electronic component D. It has a cross-sectional shape. Although the signal circuit C is not shown in FIG. 2A or the like, since it is mounted on the front surface 10A, which is the back side of the back surface 1OB shown in the drawing, This is because it cannot be seen in the figure.

In this example, the infrared detecting element B, the signal processing circuit C, and the three-dimensional circuit block A on which the external electronic component D is mounted are attached to the base portion E, and then the cylindrical body G is put on the cylindrical body G. An insulating resin is filled between the two-dimensional circuit block A and the three-dimensional circuit block A for sealing.

In this way, the outer side of the place to be sealed with the insulating resin is defined by the cylindrical body, and it is only necessary to fill the inside with the resin, so that the resin sealing becomes easier. Further, the resin sealing can be made more reliable, and the effect of the present invention can be more reliably exhibited.

The cylindrical body is usually formed of a polymer resin or the like, but it may be formed of a conductive material.
By doing so, this cylindrical body also has a function as a radio wave shield, and the radio wave shield property of the infrared detector is improved.

FIG. 3 is a schematic view showing another example of the manufacturing method of the infrared detector of the present invention and the finished product. FIG. 3 (a) shows an infrared detecting element, a signal processing circuit, and an external electronic component mounted 3 With the dimensional circuit block attached to the base,
(B) is a state in which a cover with holes is covered, (c) is a state in which insulating resin is filled from a hole in the cover with a nozzle, (d) is a state after filling, (e) is a hole in the cover The internal longitudinal section of the closed product is shown.

In the drawings, the description of the same points as those of the parts described with reference to FIGS. 1B
Is an infrared detector having other features of the present invention, 42A is a cover having holes 44 for filling the insulating resin, and 45 is a nozzle for filling the insulating resin.

In this example, the infrared detecting element B, the signal processing circuit C, and the three-dimensional circuit block A on which the external electronic component D is mounted are attached to the base portion E, and then the cover 42A having the hole 44 is put on to cover the hole. Nozzle 45 is inserted in 44, and between the cover 42A and the three-dimensional circuit block A,
It is characterized in that an insulating resin is filled and sealed so as to cover the signal processing circuit C and the external electronic component D.

In this case, since the cover also serves as the cylinder shown in FIG. 2, the outside of the place to be sealed by the insulating resin is defined by the cover, and the resin only needs to be filled therein. , Resin sealing becomes easier.
In addition, the resin sealing can be made more reliable, the effect of the present invention can be more reliably exhibited, and the cylindrical body is not required, so that the cost can be reduced.

FIG. 4 is a schematic view showing another example of the manufacturing method of the infrared detector of the present invention and the finished product. (A) is a signal processing circuit in a three-dimensional circuit block integrally molded in a plurality of arrayed states. Is mounted, (b) is mounted with external electronic components, (c) is mounted with a plurality of arrays and sealed with resin,
(D) shows a three-dimensional circuit block cut and produced after resin sealing, (e) shows a state in which an infrared detection element is mounted and attached to a base portion, and (f) shows an internal vertical section of the finished product.

In the figure, the description of the same points as those in the manufacturing method described above with reference to FIGS.
1C is an infrared detector having another feature of the present invention.

In this example, as will be described later with reference to FIGS. 14 and 15, a plurality of three-dimensional circuit blocks A are integrally molded in a vertically and horizontally arranged state, and an external electronic component D and a signal processing circuit C are in that state. In the case of cutting and generating as individual blocks after mounting on the front surface 10A and the back surface 10B by, the mounted signal processing circuit C and the external electronic component D It is characterized in that the surroundings are sealed with an insulating resin to form a resin sealing portion F, and then cut and produced as individual three-dimensional circuit blocks A.

In this way, not only the signal processing circuit and the external electronic component can be mounted but also the resin sealing around them can be done at once for a large number of three-dimensional circuit blocks, which saves a great deal of labor. be able to.

Now, the basic structure, characteristics, manufacturing method and the like of the infrared detector utilizing the three-dimensional circuit block which is the basis of the present invention will be described with reference to the drawings.

FIG. 5 has already been described.

FIG. 6 is an external perspective view of the three-dimensional circuit block after integral molding. FIG. 6A is a view seen from the front side.
(B) shows the part viewed from the back side. The same parts as those in FIG.

Reference numeral 11 is a support receiving portion for bridging and supporting the infrared detecting element B, 11a is a recess for thermally isolating the infrared detecting element B, and 13 is a front surface 10A and a back surface 10.
It is a plurality of groove lines provided on the side wall surface 10C communicating with B.

FIG. 7 is a schematic view of a conductive pattern formed in a three-dimensional circuit block. (A) is a top surface, (b) is an upright surface, (c) is a bottom surface, (d) is a right wall surface, ( e) shows the back side. The same parts as those in FIGS.

The blackened portions are conductive patterns 32, 33, 34 formed of a good conductive material such as gold or silver.
37 and the electrode parts 34a and 37a are shown. Front elevation 10
A ground pattern 31 is formed in the recess 10F formed in the center of A. The ground pattern 31 is
It is connected to one ground pattern 39 formed on the bottom surface 10D.

Each of the conductive patterns 33 formed on the inclined upper surfaces of the two legs 12 and 12 provided at the base of the three-dimensional circuit block A is, as will be described later, each of the legs 1.
The terminal pins fitted into the two holes 12a are connected by a conductive adhesive. Also, the back surface 10
B is a flat surface, and a large number of conductive patterns 37 and electrode portions 37a are formed according to the electronic components to be mounted.

A recess 11a is formed in the upper surface 10E of the three-dimensional circuit block A, and a pair of support receiving portions 11 are formed in steps on both sides of the recess 11a. Further, an electrode pattern 11b is formed so that it can be mounted on the three-dimensional circuit block A in a state in which only both ends of the infrared detection element B are bridged and supported.

Therefore, when the infrared detecting element B is mounted on the three-dimensional circuit block A, it is possible to more reliably make an electrical connection between the two, and in this structure, the infrared detecting element B has the central portion thereof. Since it is mounted on the three-dimensional circuit block A so as to float, the contact surface between the two is small, thermal isolation from the three-dimensional circuit block A can be improved, and noise due to an unbalanced voltage can be prevented.

FIG. 8 is a diagram for explaining how to mount electronic components on the three-dimensional circuit block. The same parts as those in FIGS. 5 to 7 are designated by the same reference numerals and the description thereof will be omitted.

Next, the structure of the internal circuit of the infrared detector using the three-dimensional circuit block will be described.

FIG. 9 is a diagram showing the structure of an internal circuit in which the signal processing circuit is formed as an IC circuit. After the output of the infrared detecting element B is amplified by the current amplifying circuit 51, the band pass amplifier 5 is shown.
2 shows a type in which a signal of a predetermined frequency is taken out and the H and L level signals are output from the window comparator 53 in which a threshold value is set in advance.

In this figure, a portion C surrounded by a wavy line
Is a part built in the IC chip as a signal processing circuit. When the current amplification circuit 51, the bandpass pipe 52, and the window comparator 53 are configured as an IC chip, the current amplification circuit 51 includes the light collector 50.
As a result of detecting the infrared rays collected by the infrared detecting element B,
The value obtained by amplifying the actual capacity of the capacitor becomes the apparent capacity, so a relatively large capacitor such as an aluminum electrolytic capacitor or a tantalum capacitor is not required, and a small or small capacitor such as a chip ceramic capacitor is equivalent. The action of can be obtained.

In this example, the parts to be integrated into an IC circuit are the current amplifier circuit 51, the bandpass amplifier 52 and the window comparator 53, but a timer 54 may be further added to form an IC circuit.

Further, the signal processing circuit may be impedance-converted by using a conventional FET and a high resistance instead of the current amplification. In this case, the front surface 10A of the three-dimensional circuit block A is An IC chip in which the bandpass amplifier 52 and the window comparator 53 are integrated into an IC circuit may be mounted, and an FET and a high resistance (not shown) may be mounted on the back surface 10B.

Further, only the current amplifier circuit 51 and the bandpass amplifier 52 may be integrated into an IC circuit so that an analog signal can be output from the output terminal of the base portion of the package. In this way, the signal processing circuit can be formed into an IC circuit according to the purpose of use, and thereby the signal output pattern taken out from the package can be variously changed.

Next, the overall structure of the infrared detector using the three-dimensional circuit block will be described.

10 to 12 show a three-dimensional circuit block A on which an infrared detecting element B and electronic parts are mounted on a metal base (SPC, Kovar, etc.) base E having three terminal pins. The infrared detector is shown fixed and housed in the cover of a tubular package.

Three terminal pins 41 project from the base portion E, one terminal of which is GND (for ground), and inside the bottom plate 40 to which the three-dimensional circuit block A is mounted, This terminal does not protrude and is directly attached to the base portion E. The conductive pattern 39 formed on the bottom surface 10D of the three-dimensional circuit block A is adhered to the bottom plate 40 by applying a conductive adhesive.

To fix the three-dimensional circuit block A to the bottom plate 40 of the base portion E, the holes 12a formed in the two legs 12 of the three-dimensional circuit block A are projected on the upper surface of the bottom lid 40. After fitting the two pin terminals 41, the conductive adhesive 36 is used as shown in FIG.

In this case, the conductive pattern 3 is formed on the leg portion 12.
Since the inclined upper surface formed with 3 is formed, the pin 4
Since the connection area when the 1 and the leg are fixed by the conductive adhesive 36 or the like can be made sufficiently large, the electric conductivity is excellent and the strong adhesion can be achieved.

After fixing the three-dimensional circuit block A to the bottom plate 40 of the base portion E in this manner, the bottom plate 40 is covered with a cylindrical cover 42 having an infrared filter 43 for transmitting infrared rays on the upper surface, and welded. Then, the infrared detector is completed.

FIG. 13 shows another example of an infrared detector using a three-dimensional circuit block. It is possible to mount an IC component having a more complicated signal processing function or to reduce the number of external chip components. It is applied when it increases. Even in such a case, the mounting surface of the electronic component is defined in the vertical direction of the three-dimensional circuit block A. Therefore, as shown in the drawing, the three-dimensional circuit block A is enlarged in the vertical direction and the package cover is raised. So you can put them in the same diameter package.

Next, a method of manufacturing the three-dimensional circuit block A will be described.

The three-dimensional circuit block A has a plurality of three-dimensional circuits formed by forming concavities and convexities, holes, and notches when forming one resin molding block, and further forming necessary conductive patterns and through holes. After the circuit blocks A are arranged in a matrix and formed, they can be cut by a dicing process to be manufactured as individual independent blocks.

FIG. 14 shows the front surface of one resin molding block S, and FIG. 15 shows the back surface. The resin molding block S has horizontal and vertical cut surfaces Lx ..., Ly.
... is specified, so the necessary external electronic component D
After mounting the signal processing circuit C and the cut surface Lx
.., Ly ... are diced and cut, and individual three-dimensional circuit blocks A ... Are taken out.

In such a resin molding block S, when at least one of the upright surface 10A and the upright surface 10B is formed to be a flat surface, the flat surface has an outer surface like a normal printed circuit board. Electronic components can be easily mounted. In this example, the three-dimensional circuit blocks A are arranged in a matrix in a matrix of only one resin molding block S, and the predetermined cut surfaces Lx ..., Ly ... Are cut. As a result, 54 three-dimensional circuit blocks A can be manufactured at one time.

Reference numeral 13A is a through hole which connects the conductive pattern of the front surface 10A and the conductive pattern of the back surface 10B and is symmetrically cut when the three-dimensional circuit block A is cut and formed. Then, as shown in FIG. 5, FIG. 6, and FIG. 7, a plurality of groove strips 13 having the conductive pattern 32 are formed on the groove bottom.

[0066]

As can be understood from the above description, according to the infrared detector of claim 1 of the present invention, the infrared detecting element is provided on the upper surface and the upright surface and the upright surface are provided. A structure in which a three-dimensional circuit block on which an external electronic component and a signal processing circuit are mounted is housed inside a package, and the external electronic component excluding the mounting portion of the infrared detection element in the three-dimensional circuit block, Since the surrounding area including the signal processing circuit is sealed with insulating resin, circuit float, disconnection, and solder cracks at the joint that may cause deterioration of mounting reliability during heat cycle tests, etc. Etc. are less likely to occur and the reliability of mounting is improved.

[0067] Further, according to the infrared detector according to claim 1, covered with a cylindrical body portion to be sealed with the insulating resin, filling the insulating resin between the cylindrical body and a three-dimensional circuit block Since it is resin-sealed, the resin is more reliably sealed, and during the heat cycle test, circuit floating, disconnection, and solder cracks at the joints that cause deterioration of the reliability of mounting are more likely to occur. It is less likely to occur and the reliability of mounting is further improved.

The infrared detector according to claim 2 is the infrared detector according to claim 1.
In addition to the effect of the infrared detector described in 1 , the tubular body is made of a conductive material, so that it also functions as a radio wave shield, and the radio wave shield property of the infrared detector is improved.

[0069] Infrared detector according to claim 3, in addition to the effect of an infrared detector according to 2 claim 1, inside the package since the inert gas is filled, causing noise The impurities in the atmosphere are removed, and the reliability of the infrared detector is improved.

According to the method of manufacturing an infrared detector of claim 4 , an infrared detecting element is provided on the upper surface of the three-dimensional circuit block, and external electronic parts and a signal processing circuit are provided on the front and back surfaces thereof. In case of mounting and housing in the package, the signal processing circuit mounted on the three-dimensional circuit block and the periphery of the external electronic component are sealed with an insulating resin, so that the mounting is highly reliable. The infrared detector can be easily manufactured.

[0071] Further, according to the method for manufacturing an infrared detector according to claim 4, covered with a cylindrical body portion to be sealed with the insulating resin, the insulation between the tubular body and the three-dimensional circuit block Since the resin sealing is performed by filling the resin, the outside of the place to be sealed by the insulating resin is defined by the cylindrical body, and the resin only needs to be filled in the inside, so that the resin sealing is more effective. Certainly and easily.

According to the infrared detector manufacturing method of the fifth aspect, the infrared detecting element is provided on the upper surface of the three-dimensional circuit block, and the external electronic parts and the signal processing circuit are provided on the front and back surfaces thereof. When mounting and accommodating inside the package, fix the above three-dimensional circuit block to the base part, cover the holed cover from above, pour the insulating resin into the hole, and attach those signal processing circuits and external Since the area around the electronic components is sealed with resin, the cover also serves as a cylinder, so the outside of the place to be sealed with the insulating resin is defined by the cover, and it is only necessary to fill the inside with resin. Since it is good, the resin sealing becomes more reliable and easy, and the cylindrical body becomes unnecessary, so that the cost can be reduced.

According to the method of manufacturing an infrared detector of claim 6 , an infrared detecting element is provided on the upper surface of the three-dimensional circuit block, and external electronic parts and a signal processing circuit are provided on the front and back surfaces thereof. In the case of mounting and housing in a package, the three-dimensional circuit block is integrally molded in a state in which a plurality of the three-dimensional circuit blocks are arranged vertically and horizontally, the external electronic component and the signal processing circuit are mounted, and After the processing circuit and the external electronic components are sealed with insulating resin, they are cut and generated as individual three-dimensional circuit blocks. Therefore, in addition to mounting the signal processing circuit and external electronic components, the resin around them Since the sealing can be performed once for a large number of three-dimensional circuit blocks, it is possible to greatly save labor.

[Brief description of drawings]

FIG. 1 is a schematic diagram (reference example) showing an example of a method for manufacturing an infrared detector and a completed product, (a) showing a state in which a signal processing circuit is mounted on a three-dimensional circuit block, and (b) showing an external electronic device. Parts mounted, (c) mounted infrared detection element, (d) mounted three-dimensional circuit block on base, (e) insulating signal processing circuit and surroundings of external electronic components The state of being sealed with resin, (f) shows the internal vertical section of the finished product.

FIG. 2 is a schematic view showing another example of the manufacturing method of the infrared detector of the present invention and the finished product, (a) an infrared detecting element,
A state in which a signal processing circuit and a three-dimensional circuit block on which an external electronic component is mounted are attached to a base portion, (b) is a state in which a tubular body is covered, and (c) is an insulating resin between the tubular body and the three-dimensional circuit block. And (d) shows the internal longitudinal section of the finished product.

FIG. 3 is a schematic view showing another example of a method for manufacturing an infrared detector of the present invention and a finished product, wherein (a) is an infrared detecting element,
A signal processing circuit and a three-dimensional circuit block on which external electronic components are mounted are attached to the base portion, (b) is a state in which a cover with holes is covered, and (c) is an insulating resin by a nozzle from a hole in the cover. The state of filling, (d) shows the state after filling, and (e) shows the internal longitudinal section of the finished product with the cover hole closed.

FIG. 4 is a schematic view showing another example of the method for manufacturing an infrared detector of the present invention and a finished product, and FIG. 4 (a) is a three-dimensional circuit block integrally formed in a plurality of arrayed states and mounted with a signal processing circuit. State, (b) state with external electronic components mounted,
(C) is a state in which a plurality of arrays are resin-sealed, (d) is a three-dimensional circuit block produced by cutting after resin sealing, (e) is a state in which an infrared detection element is mounted and attached to a base portion,
(F) shows an internal vertical section of the finished product.

FIG. 5 is a perspective view schematically showing an example of a mounted state of a three-dimensional circuit block, FIG.
(B) shows what is seen from the back surface side.

6A and 6B are external perspective views of a three-dimensional circuit block after integral molding, where FIG. 6A is a view from the front side and FIG. 6B is a view from the back side.

FIG. 7 is a schematic view of a conductive pattern formed on a three-dimensional circuit block, where (a) is a top surface, (b) is an upright surface,
(C) shows a bottom surface, (d) shows a right side wall surface, and (e) shows a back surface.

FIG. 8 is a diagram illustrating a procedure for mounting electronic components on a three-dimensional circuit block.

FIG. 9 is a diagram showing a configuration of an internal circuit in which a signal processing circuit is integrated into an IC circuit.

FIG. 10 is a diagram illustrating a mounting procedure of a three-dimensional circuit block (three-dimensional circuit block and base portion).

FIG. 11 is a diagram illustrating a mounting procedure of a three-dimensional circuit block (a base portion and a cover to which the three-dimensional circuit block is mounted).

FIG. 12 is an external configuration diagram of an infrared detector (assembly completed).

FIG. 13 is an external view showing another example of the infrared detector.

FIG. 14 is a front view of a resin block for cutting and generating a three-dimensional circuit block.

FIG. 15 is a rear view of a resin block for cutting and generating a three-dimensional circuit block.

[Explanation of symbols]

A 3D circuit block B Infrared detector C signal processing circuit D External electronic components E Base part F resin sealing part G cylinder 1, 1A, 1B, 1C infrared detector 10A front elevation 10B back side 10C Side wall surface 10D bottom 10E upper surface 42A cover S resin molding block

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Jun Matsuyama 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) Reference JP-A-8-128891 (JP, A) JP-A-62-104075 (JP, A) JP 4-104118 (JP, A) JP 6-260622 (JP, A) JP 7-146176 (JP, A) JP 9-288004 (JP, A) (JP 58) Fields investigated (Int.Cl. ⁷ , DB name) G01J 1/02 H01L 27/14-27/148 H01L 29/762-29/768 H04N 5/335

Claims (6)

(57) [Claims] 1. An infrared detector having a structure in which an infrared detecting element is provided on an upper surface thereof, and a three-dimensional circuit block having external electronic components and a signal processing circuit mounted on its front and back surfaces is housed inside a package. a vessel, out of the three-dimensional circuit block, except for the mounting portion of the infrared detection element, the external electronic component, the area around including the signal processing circuit, and sealed with the insulating resin, the In the sealing with the insulating resin, the portion to be sealed with the insulating resin is covered with a cylindrical body, and the insulating resin is filled between the cylindrical body and the three-dimensional circuit block. . 2. The infrared detector according to claim 1, wherein the cylindrical body is made of a conductive material. 3. An infrared detector Oite to any of claims 1 2, inside the package, characterized in that the inert gas is filled. 4. An infrared detector having a structure in which an infrared detecting element is provided on an upper surface thereof, and a three-dimensional circuit block having external electronic components and a signal processing circuit mounted on its front and back surfaces is housed inside a package. A method of manufacturing a container, comprising: covering a portion to be sealed around a signal processing circuit mounted on the three-dimensional circuit block and an external electronic component with a cylindrical body.
The insulating resin between the cylindrical body and the three-dimensional circuit block.
By filling the signal processing circuit and the external
A method for manufacturing an infrared detector, characterized by encapsulating a resin around an electronic component . 5. An infrared detecting device having a structure in which an infrared detecting element is provided on the upper surface thereof, and a three-dimensional circuit block having external electronic components and a signal processing circuit mounted on the front and back surfaces thereof is housed inside a package. A method for manufacturing a container, comprising: fixing the above-mentioned three-dimensional circuit block to a base portion, covering a cover having a hole from above, pouring an insulating resin through the hole, and performing signal processing mounted on the three-dimensional circuit block. A method for manufacturing an infrared detector, characterized in that the circuit and the periphery of an external electronic component are resin-sealed. 6. An infrared detector having a structure in which an infrared detecting element is provided on the upper surface and a three-dimensional circuit block having external electronic components and a signal processing circuit mounted on the front and back surfaces thereof is housed inside a package. A method for manufacturing a container, wherein the three-dimensional circuit block is integrally molded in a state in which a plurality of the three-dimensional circuit blocks are arranged vertically and horizontally, and the external electronic component and the signal processing circuit are the front and back sides. Infrared detection, which is mounted on an upright surface, and is further cut and produced as the individual three-dimensional circuit block after sealing the surroundings of the mounted signal processing circuit and external electronic components with an insulating resin. Manufacturing method.