JP3421219B2 - Lead frame separation and supply device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame separating / supplying device for separating stacked lead frames one by one and supplying them to a predetermined position. For example, a lead frame for mounting a semiconductor chip is The present invention relates to a lead frame separation / supply device for separating and supplying one by one to a mounting device.

[0002]

2. Description of the Related Art FIG. 15 is a perspective view showing a plurality of stacked lead frames M, and FIG. 16 is a perspective view showing a conventional frame magazine 101. As shown in FIG. 15, the lead frame M of the semiconductor chip has 50 to 2
The specified number of sheets such as 00 sheets are stacked and packed and received. The lead frame M is generally shown in FIG.
It is placed in the frame magazine 101 shown in FIG. The frame magazine 101 has a plurality of grooves, and one lead frame M is placed in each groove by hand in advance.
When mounting the semiconductor chips on the lead frames M, the lead frames M are supplied one by one from the frame magazine 101 to the mounting apparatus.

Further, for the purpose of cost reduction by labor saving and high efficiency, the lead frames M in a stacked state at the time of arrival are placed as they are, and the lead frames M are automatically separated one by one to be mounted. A separate feeding device for feeding to is used.

FIG. 17 is a side view showing a conventional adsorption / reversal type separation / supply device 102, and FIG. 18 is a side view of the separation / supply device 102 seen from another side. In the separation and supply device 102, the lead frames M that are still stacked are
It is placed on the bottom plate 105 in the frame magazine 103. The elevator 106 that supports the lead frame M via the bottom plate 105 is driven in the vertical direction based on the signals from the sensors 107a and 107b, and pushes up the lead frame M to a position where the lead frame M1 at the uppermost stage is detected. The lead frame M1 thus pushed up has a plurality of suction portions 10 provided on the plurality of suction arms 108, respectively.
Adsorbed by 9.

All the suction arms 108 have movable parts 12
5 extends perpendicularly to its longitudinal direction, and the movable portion 125 is rotatable about the arm shaft 108a along the longitudinal direction. When the movable part 125 is rotated in the Y direction from the suction position, all the suction arms 108 are simultaneously pulled up,
At the same time, all the suction portions 109 are also pulled up at the same time. As a result, the lead frame M1 sucked by the suction portion 109 is separated from the second-stage lead frame M and pulled up.

FIG. 19 is a side view showing the lead frame M1 placed on the rail 10 by the separating and supplying device 102, and FIG. 20 is a plan view thereof. Movable part 125
Is rotated 180 degrees from the suction position, the lead frame M
1 is inverted and placed on the rail 110. Rail 11
The lead frame M1 on 0 is pushed into a mounting device (not shown) by the pusher 111.

As described above, in the separating and supplying device 102, when the lead frame M1 is sucked and the movable portion 125 is rotated in the Y direction, all the sucking portions 109 are simultaneously pulled up, and the lead frame M1 retains its shape. Leave 2
It is separated from the lead frame M after the tier.

FIG. 21 is a side view showing a conventional adsorption / slide type separation / supply device 112, and FIG. 22 is a side view of the separation / supply device 112 seen from another direction. In the separation and supply device 112, the lead frame M placed is pushed up and the uppermost lead frame M1 is arranged at a predetermined suction position with the same configuration as the suction reversal method of FIG. The lead frame M1 located at the suction position has a plurality of suction heads 1
Adsorption is performed by a plurality of adsorption portions 119 provided on each of the 18 pieces. All the suction heads 118 are suspended at the same height from a single slide portion 135 that moves in parallel with the lead frame M, and a plurality of suction portions 1 are attached to the lower surface thereof.
Equipped with 19.

By the movement of the slide portion 135, the lower surface of the suction head 118 is opposed to the lead frame M1, and all the suction portions 119 are brought into contact with the lead frame M1 and sucked. After the suction portion 119 is sucked onto the lead frame M1, when the slide portion 135 is moved upward, all the suction heads 118 are pulled up at the same time.
At the same time, all the suction parts 119 are simultaneously pulled up. As a result, the lead frame M1 sucked by the suction portion 119 is separated from the second-stage lead frame M and pulled up. When the lead frame M1 is pulled up to a predetermined height, the slide portion 135 pulls up the rail 110.
After moving horizontally just above, the lead frame M1 is lowered and placed on the rail 110.

As described above, in the case of the suction slide type separation and supply device 112, by pulling up the slide portion 135, all the suction portions 119 are pulled up at the same time, and the lead frame M1 has the same shape as in the suction reversal type. While being held, it is separated from the lead frame M of the second and subsequent stages.

Further, in Japanese Patent No. 2507655, both ends of the lead frame are lifted by pressing the central portion of the stacked uppermost lead frame from above and applying a load, and the uppermost lead frame is placed below the lead frame. An apparatus is disclosed that is separated from and supplied.

[0012]

In the conventional suction reversal type and suction slide type separating and supplying apparatus, the suction error of the stacked lead frames M often occurs. 2 sheets, 3
It may be adsorbed while overlapping with a sheet, or even one sheet may not be adsorbed. This is because the stacked lead frames M are in close contact with each other and joined.

FIG. 23 is a side view showing the detailed shape of the lead frames M stacked. Lead frame M
Is punched and formed into a pattern by a mold, and therefore has a sagging surface 2 and a burr surface 3, and the stacked lead frame M is engaged with the sag surface 2 and the burr surface 3 as shown in FIG. This is one of the factors by which the frames M stick together. Further, the wider the planar portion of the lead frame M, the easier the lead frames M are in close contact with each other.

FIG. 24 is a process chart showing a step of consistently mounting semiconductor chips. In recent years, value engineering (VE) by increasing efficiency in mounting, shortening turn, and labor saving has become necessary, and a die bonding process of bonding a semiconductor chip with a tie bond paste, electrodes of the semiconductor chip and a lead frame. In the wire bonding process for electrically connecting the leads of the above, it is possible to heat cure the die bond paste for a short time due to the improvement of the die bond paste, which connects the heat curing furnace of the die bond paste and connects the die bond process and the wire bond process continuously. The production line is built. Furthermore, as shown in FIG. 24, an integrated production line has been constructed in which the next molding process is also connected.

In order to efficiently operate the integrated production line shown in FIG. 24, it is necessary to reduce errors in stopping the line in the apparatus used in each process.
In particular, in the lead frame separation and supply device arranged at the head of the integrated production line, it is necessary to reduce the error of stopping the line. In other words, in the line where the die bonder operates independently, even if the die bonder stops due to an error, it does not directly affect other equipment, the operator in charge of the die bonder is nearby, and recovery is immediately possible. it can. However, in the conventional separation and supply device, adsorption mistakes sometimes occur. In the integrated production line, it directly affects the subsequent equipment, and due to the labor saving, the operator may not be nearby, and the recovery may take time, which may not reach the desired VE result. Will end up. In addition, much time and cost are required to fundamentally modify the lead frame separation and supply device.

Further, in Japanese Patent No. 2507655, since the separating operation is performed while pressing the uppermost thin plate material from above, the thin plate materials of the second and subsequent stages are more strongly adhered to each other, and the load received at each separating operation is increased. The degree of contact between the thin plate materials is accumulated and progresses. Therefore, each time the thin plate material separating operation is repeated, the subsequent separation of the thin plate material becomes difficult.

The object of the present invention is to improve the conventional lead frame separating / supplying device by simply improving the cost-saving and ensuring that only the uppermost one of the stacked lead frames is separated. An object of the present invention is to provide a lead frame separation / supply device for efficiently operating an integrated production line by suppressing an error that stops the line.

[0018]

According to the present invention, a lead frame is punched by a mold and has a sag surface and a burr surface, and the sag surface and the burr surface are meshed with each other to form an uppermost lead frame. From the uppermost lead frame and the second and subsequent stages, and then the predetermined lead In a lead frame separation and supply device comprising: a transfer unit for moving a suction unit to a frame supply position to transfer a lead frame to a supply position, the transfer unit pulls up a plurality of suction units at different timings, and After pulling up the adsorption part that adsorbs to the part closest to the end of the lead frame, pull up the other adsorption parts and then pull up first. Suction force of the suction unit that is a separate feeder of the lead frame, wherein the non-stronger than the suction force of the suction portion of it.

According to the present invention, since the plurality of suction portions are pulled up at different timings, at the time of pulling up, the suction portion pulled up first is at a higher position than the suction portion pulled up later. In addition to the difference in the height of each suction portion, the height of each portion of the lead frame is also different.
It becomes impossible to remain in close contact with the lead frame positioned at the step. Therefore, the lead frame can be separated quickly, and the stop of the device due to an error such as a suction error can be prevented. Since the uppermost lead frame is only adsorbed, it is not pressed from above, and it is not difficult to separate the thin plate material after each separation operation. Further, since the suction portion closest to the end of the lead frame is pulled up first, the lead frame can be separated more quickly. In other words, the uppermost lead frame is closely attached and constrained to the second and subsequent lead frames, and the weakest restraining portion of the uppermost one lead frame is the end of the lead frame. Since the suction portion closest to the one end is pulled up first, the uppermost lead frame can be easily separated even if the burr surface and the sag surface are engaged with each other. Further, since the ends of the lead frames are pulled up first, air is present between the lead frames, and the separation of the lead frames is promoted. Further, the suction portion closest to one end of the lead frame is pulled up first, then the suction portion next to the lead frame is pulled up next, and then the suction portion is pulled up one after another at a stepwise timing. Therefore, as the lead frame is separated, it is possible to pull up the suction portion that is sucking the portion where the restraining force is weakened, and it is possible to accelerate the separation operation. Further, since the lead frame is pulled up from one end in order, deformation such as warpage can be reduced, and malfunctions such as conduction defects that occur when the semiconductor chip is mounted can be prevented. Furthermore, by the suction part that was pulled up first,
The part of the lead frame to which this is adsorbed is pulled up higher than other parts, and a repulsive force is applied to the adsorbing part to be pulled up. Since the suction force of this suction portion is the strongest among all the suction portions, the suction portion will not be separated from the lead frame by the repulsive force from the lead frame. Therefore, the suction portion can continue to suck the lead frame against the repulsive force from the lead frame, and the separating operation can be reliably performed. On the contrary, since the repulsive force from the lead frame is weak with respect to the suction parts other than the suction part that is first pulled up, the suction force can be set relatively weak accordingly. It is economical because it is necessary to use a strong attracting force only in a necessary part when it is composed of a pad or a magnet.

Further, the present invention is characterized in that the uppermost lead frame is provided with a stopper for suppressing a pressing force with which the suction portion abuts from above.

According to the present invention, the suction portion comes into contact with the uppermost lead frame from above and applies a downward pressing force. However, since the stopper is provided, the pressing force is suppressed and the lead frames are burrs and burrs. The strong engagement of the surfaces is suppressed, and the separation work is not hindered.

Further, according to the present invention, the carrying means is provided with a plurality of suction arm portions above the stacked lead frames and rotating at different timings, and the suction portions are attached to the suction arm portions. Characterize.

According to the present invention, by rotating the suction arm portion at different timings, the suction portion can be pulled up at a different timing, and the lead frame separation work can be reliably performed.

According to the present invention, the carrying device further comprises a slide portion which is above the stacked lead frames and which moves vertically and horizontally moves to a predetermined lead frame supply position, and the suction head is supported on the slide portion. The head support portion is supported by a vertically adjustable slide mechanism, and a plurality of suction portions are attached to the lower surface of the suction head so as to face the lead frame.

According to the present invention, if the slide mechanism of the suction head to which the suction portion is attached is appropriately adjusted, the suction portion can be pulled up at different timings by moving the slide portion up and down. Can be reliably performed.

[0026]

Further, the present invention is characterized in that it is provided with a vibrating means for vibrating the suction portion which is first pulled up.

According to the present invention, since the suction portion that is first pulled up is pulled up while vibrating, the thin plate material can be reliably separated. In other words, by simply vibrating the suction part, even if the edge of the uppermost lead frame is momentarily separated from the second lead frame due to the vibration, they will immediately come into contact again due to the vibration. By pulling up the part, the gap that is separated momentarily is expanded at a stretch. In this way, the lead frame can be reliably separated by incorporating the vibration operation in the pulling operation.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION The first embodiment of the present invention is an adsorption reversal type separation and supply device, and the second embodiment is an adsorption slide type separation and supply device. The first embodiment will be described below with reference to FIGS. 1 to 9, and the second embodiment will be described with reference to FIGS.

(First Embodiment) FIG. 1 is a side view showing an adsorption / inversion type separation / supply device 11 according to a first embodiment of the present invention, and FIG. 2 is a plan view thereof. The separating and supplying device 11 is the topmost one of the lead frames M stacked.
The lead frame M after adsorbing one sheet and the second and subsequent stages below it
Is a device for supplying the lead frame M to the outside through the rail 10.

Stacked lead frames M
Is the frame magazine 13 as it is stacked.
It is placed on the inner bottom plate 15. Frame magazine 13
Is fixed on the magazine set base 14 of the device,
The stacked lead frames M are supported from the side. The lead frame M placed in the frame magazine 13 is
It is supported from below by an elevator 16 driven up and down via a bottom plate 15. Sensors 17a and 17b are provided on both sides of the upper end of the frame magazine 13,
It is sensed whether the uppermost lead frame M1 is in a predetermined suction position. The elevator 16 has a sensor 17a,
According to the signal from 17b, the lead frame M is pushed up until the lead frame M1 reaches a predetermined suction position.

The arm unit 24 includes a single movable part 25.
And a plurality of suction arms 18, and the lead frame M
It is a mechanism for conveying 1. The movable portion 25 is a tubular member that encloses the arm shaft 26 and is rotatable around the arm shaft 26. The arm shaft 26 is used for the frame magazine 13
It is fixed to the side of the upper end of and extends in one direction. All the suction arms 18 extend perpendicularly to the arm shaft 26 from the movable portion 25. The arm shaft 26 at the upper end of the frame magazine 13
A stopper 23 is fixed to the opposite side, and when the movable portion 25 rotates in the X direction, the tip of the suction arm 18 contacts the stopper 23. The suction arm 18 is a stopper 23.
When the movable part 25 is rotated until it abuts on the suction arm 18, all the suction arms 18 are bridged over the frame magazine 13 and the movable part 25 cannot rotate in the X direction any more.

A plurality of suction portions 19 are provided on the surface of the suction arm 18 facing the lead frame M1 when the suction arm 18 is bridged over the frame magazine 13. When the suction arm 18 is bridged over the frame magazine 13, the suction portion 19 is connected to the lead frame M1.
Abut and adsorb to it.

The suction portion 19 is composed of a vacuum suction pad or a magnet. A magnet is used when the lead frame M made of a magnetic material such as iron is used, and a vacuum suction pad is used when the lead frame M made of a material other than a magnetic material such as copper is used. When the vacuum suction pad is used, the suction can be performed without using the lead frame M made of a magnetic material, and a vacuum pump for vacuuming or a pipe connecting the vacuum suction pad and the vacuum pump is required. On the other hand, when a magnet is used, the magnet can be attracted by itself, and the device can be downsized and simplified.

Of the plurality of suction arms 18, the suction arm 18a closest to the end surface Sa of the lead frame M1.
Are integrally connected to the movable part 25, and the other suction arms 18 are connected to the movable part 25 via hinges 21, respectively. The hinge 21 is provided so that its axis is parallel to the arm shaft 26, and when the suction arm 18 is bridged over the frame magazine 13,
The end surface 218 of the movable portion 25 on the side thereof and the end surface 225 of the movable portion 25 on the suction arm 18 side contact each other. When the end surface 218 and the end surface 225 come into contact with each other, the movable portion 25 that tries to rotate in the X direction and the suction arm 18 that tries to rotate in the Y direction around the stopper 23 as a fulcrum are prevented from rotating, and the suction arm is prevented. 18 is maintained parallel to the lead frame M1.

The movable portion 25 is provided with a jaw portion 27 extending in parallel with the suction arm 18, and the jaw portion 27 has a stopper 22.
Is provided. The stopper 22 is a screw-shaped member that is fastened to the jaw 27 from the suction arm 18 side.
When the suction arm 18 rotates about the hinge 21 in the direction of approaching the jaw 27, the suction arm 18 contacts the stopper 22 and is locked at that position. That is, the stopper 22 limits the amount by which the suction arm 18 can rotate in the X direction around the hinge 21 with the movable portion 25 as a reference.

FIG. 3 is a side view showing the separating operation by the separating / supplying device 11, and FIG. 4 is a side view of the separating / supplying device 11 seen from another direction. First, as shown in FIG. 3A, when the movable portion 25 is slightly rotated in the Y direction from the state in which the suction arm 18 is hung over the frame magazine 13, the movable portion 25 is rotated in the Y direction. As shown in FIG. 5, the suction arm 18a is lifted together with the suction portion 19a by the amount of rotation. The movable part 25 rotates around the hinge 21 while leaving the suction arms 18 other than the suction arm 18a without lifting. Thereby, the end surface 1 of the lead frame M1
Only the vicinity of “a” is separated from the second-stage lead frame M and lifted.

Next, as shown in FIGS. 3 (c) and 4 (b), when the movable portion 25 further rotates in the Y direction around the arm shaft 26, the suction arms 18 other than the suction arm 18a.
Is also supported by abutting against the stopper 22, and the suction arm 18a
After that, rotation about the arm shaft 26 is started. Here, the remaining portion other than the vicinity of the end surface 1a of the lead frame M1 is 2
It is separated from the lead frame M at the stage, and the separation of the lead frame M1 is completed.

FIG. 5 is a side view showing the supply operation by the separation supply device 11, and FIG. 6 is a plan view thereof. Figure 5
As indicated by the broken line, when the suction arms 18 other than the suction arm 18a rotate 90 degrees in the Y direction from the suction position, the load of the suction arm 18 does not act on the lead frame M1 via the hinge 21. The lead frame M1 that does not receive the load of the suction arms 18 eliminates the delay amount between the suction arms 18 by its elasticity. Then, as shown in FIG. 5, the suction arm 18 rotates 180 degrees from the suction position and mounts the inverted read frame M1 on the rail 10. The suction arm 18 rotates in the Y direction until the rotation angle exceeds 180 degrees, and with the lead frame M1 placed on the rail 10, the suction portion 19 is separated from the lead frame M1.

After this, the lead frame M on the rail 10
1 is swept away by the pusher 29 and is pushed along the rail 10 into a die bonder (not shown). Then, the movable portion 25 rotates the suction arm 18 from the rail 10 in the X direction by 180 degrees, returns to the suction position of the lead frame M, and sucks the next lead frame M. At this time, the uppermost stage of the stacked lead frames M is pushed up to the suction position.

As described above, by providing the hinges 21 on the suction arms 18 other than the suction arm 18a, the vicinity of the end surface Sa of the lead frame M1 is first pulled up, and the uppermost lead frame M1 can be easily and surely arranged in two steps. It can be separated from the lead frame M below the eyes.

The stopper 22 is screwed into the jaw 27 from the suction arm 18 side, and the stopper 2
By further tightening 2, the distance between the stopper 22 and the suction arm 18 is increased, and the delay amount of the suction arm 18 with respect to the suction arm 18a can be increased. vice versa,
By loosening the stopper 22, the distance between the stopper 22 and the suction arm 18 becomes smaller, and the delay amount can be reduced. In this way, the amount of delay in the timing of pulling up the suction arms 18 can be adjusted depending on the material and thickness of the lead frame M.

FIG. 7 is a side view showing the separating operation when the setting of the tightening amount of the stopper 22 is changed. The other end surface Sb opposite to the end surface Sa of the lead frame M1
The stopper 22 is fully loosened for the suction arm 18b closest to the suction arm 18b so that the suction portion 19 does not rotate around the hinge 21 based on the movable portion 25. That is, as for the suction arm 18b, the movable portion 2 is the same as the suction arm 18a.
It is interlocked with 5, and it is equal to without hinge 21. If the stopper 22 is set in this way, FIG.
As shown in FIG. 7C, the lead frame M1 can be pulled up from both ends.

First, in FIG. 7 (a), the suction portion 19 is brought into contact with the lead frame M1 for suction. Next, when the movable portion 25 is slightly rotated in the Y direction around the arm shaft 26, the suction arm 18a and the suction arm 18b near the end surface Sb are also rotated in the Y direction as shown in FIG. Lift near both ends of M1. next,
As shown in FIG. 7C, when the movable portion 25 is further rotated in the Y direction, the suction arms 18 other than the suction arms 18a and 18b pull up the lead frame M1 with a delay.

Thus, by loosening the stopper 22 to the suction arm 18b as much as possible, the lead frame M1
It is possible to pull up the areas near both end surfaces Sa and Sb first of all and to further surely separate the lead frame M1.

FIG. 8 is a side view showing the separating operation when the stopper 22 is set with a tightening amount different from that shown in FIG. Here, the tightening amount of the stopper 22 is increased in order of the suction arm 18 closer to the end surface Sa of the lead frame M1. In other words, if the tightening amount of the stopper 22 is set stepwise, the suction arm 18a that is pulled up first
After that, the suction arm 18 is pulled up step by step. Along with this, the suction portion 19a that is first pulled up
Since the suction part 19 is pulled up step by step after
The lead frame M1 is also gradually pulled up from the portion close to the end surface Sa.

Thus, by setting the tightening amount of the stopper 22 stepwise, the lead frame M1 has an end surface S.
Since it is gradually pulled up from the vicinity of a, it is possible to suppress the deformation of the lead frame M1 during the separating operation.

Although not shown, the lead frame M1 may be pulled up with a stepwise delay from both ends.

FIG. 9 is a side view showing an example in which the separating / supplying device 11 of FIG. 1 is provided with a vibration mechanism. Here, a cam 28 is provided at the same position instead of the stopper 23 that limits the rotation of the suction arm 18a in the X direction. The cam 28 rotates about its axis of rotation, so that the suction arm 18
vibrate a. The vibration of the suction arm 18a is vertical vibration with the suction position as the lower limit. As a result, the uppermost lead frame M1 and the second lead frame M are more reliably separated.

(Second Embodiment) FIG. 10 shows a second embodiment of the present invention.
It is a side view which shows the adsorption | suction slide type | mold separation supply apparatus 31 which is embodiment. Similarly to the separating and supplying apparatus 11 of the first embodiment, the separating and supplying apparatus 31 also adsorbs the uppermost one of the stacked lead frames M and separates it from the second and subsequent lead frames M below it. , A device for supplying the lead frame M to the outside through the rail 10. The difference from the first embodiment is that the uppermost lead frame M1 is separated and supplied by a slide method. The configuration for the slide system will be described below.

The head unit 34 includes a suction portion 39, a suction head 35, a head support portion 36, a stopper 37 and a slide portion 38. Like the suction unit 19, the suction unit 39 is a vacuum suction pad or a magnet for suctioning the lead frame M. The suction head 35 has a plurality of suction portions 19 on the surface facing the lead frame M. A plurality of suction heads 35 are opposed to a single lead frame M, and a plurality of suction portions 39 are suctioned. Head support 3
6 has a vertically elongated shape that is integrated with each suction head 35 and supports the suction head 35 from above.
The stopper 37 is a screw-like member provided on the upper portion of the head support portion 36 in order to lock the head support portion 36 on the slide portion 38.

The lower surface of the slide portion 38 is provided with a through hole 41 through which the head support portion 36 passes. Through hole 41
The hole diameter of is approximately the same as the outer diameter of the head support portion 36.
Since the head portion of the stopper 37 is larger than the hole diameter of the through hole 41 and this portion cannot pass through the through hole 41, the head support portion 36 is locked to the slide portion 38. Head support 3
6 supports the suction head 35 by hanging it downward from the slide portion 38. The slide portion 38 is driven in the vertical direction or the horizontal direction, and is interlocked with the slide portion 38.
7, head support portion 36, suction head 35, and suction portion 3
The lead frame M can be conveyed via the connector 9.

FIG. 11 is a side view showing stepwise the separating and supplying operation of the lead frame M by the separating and supplying apparatus 31 of FIG. In FIG. 11A, the slide portion 38 is lowered to move all the suction portions 39 to the uppermost lead frame M1.
Abut and adsorb. At this time, the suction surfaces of the suction portions 39 are all in the same plane, and only the head portion of the stopper 37a, which is the closest to the end surface Sa of the stopper 37 heads, is positioned low.

The stopper 37 is fastened to the suction head 35. By further tightening the stopper 37, the portion of the head supporting portion 36 that hangs downward from the slide portion 38 is reduced, and the suction surface of the suction portion 39 is a slide portion. 38 approaches the lower surface. On the contrary, by loosening the stopper 37, the portion of the head supporting portion 36 that hangs downward from the slide portion 38 increases,
The suction surface of the suction portion 39 moves away from the lower surface of the slide portion 38. In this way, by appropriately selecting the tightening amount of the stopper 37, the distance from the lower surface of the slide portion 38 to the suction surface of the suction portion 39 can be arbitrarily set. Here, the head support portion 3 closest to the end surface Sa of the lead frame M1.
The stopper 37a tightened to 6a is replaced with another stopper 37a.
The distance is set shorter by increasing the tightening amount.

Then, as shown in FIG. 11B, when the slide portion 38 is slightly pulled up, only the stopper 37a is first locked in the through hole and pulled up. As a result, only the vicinity of the end surface Sa of the lead frame M1 is lifted. Next, as shown in FIG. 11C, when the slide portion 38 is further pulled up, the stoppers 37 other than the stopper 37a are also locked by the slide portion 38 and the suction portion 19a.
Other suction portions 19 also pull up the lead frame M1 after the suction portion 19a.

Thereafter, returning to FIG. 10, the slide portion 38
Are moved in parallel to move the lead frame M1 to just above the rail 10. Lead frame M1 is rail 10
When it reaches right above, the slide portion 38 is lowered and the lead frame M1 is mounted on the rail 10.

When the suction unit 19 is a vacuum suction pad,
By stopping evacuation, all suction parts 19
Separate from the lead frame M1. Also, the suction unit 19
Is a magnet, only the mounted lead frame M1 is pressed by a clamp (not shown). When the slide portion 38 is pulled up while the lead frame M1 is being pressed, all the suction portions 19 are attached to the lead frame M.
Forcibly separated from 1, leaving only the leadframe M1 on the rail 10. In either case, only the lead frame M1 remains mounted on the rail 10.

The lead frame M1 on the rail 10 is guided to the mounting apparatus by a pusher (not shown) as in the suction reversal method. The slide portion 38 returns to the suction position through the original path and sucks the next lead frame M. At this time, the uppermost stage of the stacked lead frames M is pushed up by the elevator 16 to the suction position by the sensors 17a and 17b.

Thus, by tightening the stopper 37a more tightly than the other stoppers 37, the vicinity of the end surface Sa of the lead frame M1 is first pulled up, and the lead frame M1 can be separated easily and surely.

FIG. 12 is a side view showing the separating operation of the separating / supplying device 31 in which the setting of the tightening amount of the stopper 37 is changed. Here, the tightening amount of the stopper 37b closest to the end surface Sb of the lead frame M1 among the stoppers 37 is set to the same tightening amount as the stopper 37a. If the tightening amount of the stopper 37 is set in this way,
As shown in FIGS. 12A to 12C, the lead frame M1 can be pulled up from both ends.

First, in FIG. 12A, the suction portion 39 is brought into contact with the lead frame M1 to be sucked. next,
When the slide portion 38 is slightly pulled up, as shown in FIG. 12 (b), the suction portion 39a and the suction portion 39b closest to the end surface Sb are also pulled up, and the lead frame M1 is lifted near both ends. Next, as shown in FIG.
When the slide portion 38 is further pulled up, the suction portion 39a,
The suction portions 39 other than 39b are pulled up with a delay, and the lead frame M1 sucked by these is also pulled up with a delay.

By thus tightening the stoppers 37a and 37b more than the other stoppers 37, both end surfaces Sa and Sb of the lead frame M1 are first pulled up, and the lead frame M1 can be separated more reliably. .

FIG. 13 is a side view showing the separating operation when the stopper 37 is set with a tightening amount different from that shown in FIG. Here, the tightening amount of the stopper 37 is reduced in order of the head support portion 36 near the end surface Sa of the lead frame M1. In this way, if the tightening amount of the stopper 37 is set stepwise, the suction head 35a is pulled up first, and then the suction head 35 is pulled up step by step. Along with this, the suction portion 39a is pulled up first, and then the suction portion 39 is pulled up step by step. Therefore, the lead frame M1 is also pulled up gradually from the portion close to the end surface Sa.

Thus, by setting the tightening amount of the stopper 37 in stages, the lead frame M1 has an end surface S.
Since it is gradually pulled up from the vicinity of a, it is possible to suppress the deformation of the lead frame M1 during the separating operation.

Although not shown, the lead frame M1 may be pulled up with a stepwise delay from both ends.

FIG. 14 is a side view showing an example in which the separating / supplying device 31 of FIG. 10 is provided with a vibration mechanism. Stopper 37a
Are shaped to extend longer than the ends of the slide 38. The cam 43 is provided at a position where the slide portion 38 comes into contact with the extended portion of the stopper 37a when the slide portion 38 is arranged at the suction position. The cam 43 vibrates the stopper 37a by rotating itself around the rotation axis.
The vibration of the stopper 37a is vertical vibration with the suction position as the lower limit. The stopper 37a is used for the head support portion 36.
Since it is interlocked with the suction portion 39a via a and the suction head 35a, the portion of the lead frame M1 sucked by the suction portion 39a also vibrates along with the vibration of the stopper 37a. As a result, the uppermost lead frame M1 and the second lead frame M are more reliably separated.

[0067]

As described above, according to the present invention, a lead frame is punched by a mold and has a sag surface and a burr surface. Only one sheet in the upper stage can be reliably separated and conveyed, the die-bonding device stop error related to this can be eliminated, and an efficient operating state of the integrated production line can be realized, which greatly contributes to VE. it can.

[Brief description of drawings]

FIG. 1 is a side view showing an adsorption / reversal type separation / supply device 11 according to a first embodiment of the present invention.

FIG. 2 is a plan view showing an adsorption / inversion type separation / supply device 11 according to a first embodiment of the present invention.

FIG. 3 is a side view showing the separation operation by the separation supply device 11 in stages.

FIG. 4 is a side view of the separating operation by the separating / supplying device 11 viewed from a direction different from that in FIG.

FIG. 5 is a side view showing a supply operation by the separation supply device 11.

FIG. 6 is a plan view showing a supply operation by the separation supply device 11.

FIG. 7 is a side view showing the separation operation stepwise when the setting of the tightening amount of the stopper 22 is changed.

FIG. 8 is a side view showing a separating operation when the stopper 22 is set with a tightening amount different from that in FIG.

9 is a side view showing the separation and supply device 11 of FIG. 1 provided with a vibration mechanism.

FIG. 10 is a side view showing an adsorption slide type separation / supply device 31 according to a second embodiment of the present invention.

FIG. 11 is a side view showing the separation and supply operation by the separation and supply device 31 in stages.

FIG. 12 is a side view showing the separating operation stepwise when the setting of the tightening amount of the stopper 37 is changed.

13 is a side view showing the separating operation when the stopper 37 is set with a tightening amount different from that in FIG.

14 is a side view showing the separation and supply device 31 of FIG. 10 provided with a vibration mechanism.

FIG. 15 is a perspective view showing a plurality of lead frames M stacked.

16 is a perspective view showing a conventional frame magazine 101. FIG.

FIG. 17 is a side view showing a conventional adsorption reversal type separation and supply device.

FIG. 18 is a plan view showing the separation and supply device 102.

FIG. 19 is a side view showing a separating operation by the separating and supplying device.

20 is a plan view showing a separating operation by the separating and supplying device 102. FIG.

FIG. 21 is a conventional suction slide type separation and supply device 11;
It is a side view which shows 2.

FIG. 22 is a side view of the separation / supply device 112 viewed from another direction.

FIG. 23 is a side view showing a detailed shape of the stacked lead frames M.

FIG. 24 is a process chart showing a step of consistently mounting semiconductor chips.

[Explanation of symbols]

11,31 Separate supply device 18, 18a, 18b Adsorption arm 19, 19a, 19b, 39, 39a, 39b Adsorption part 21 Hinge 22,23,37,37a, 37b, 42 Stopper 24 arm unit 25 Moving part 26 arm axis 27 jaw 28,43 cam 34 head unit 35, 35a, 35b suction head 36, 36a, 36b Head support part 38 Slide part 41 through hole M, M1 lead frame Sa, Sb end face

Claims (5)

(57) [Claims] 1. A lead frame is punched by a mold to have a sag surface and a burr surface, and the sag surface and the burr surface are brought into contact with the uppermost lead frames stacked from above, respectively. After pulling up a plurality of suction parts for suction and the suction parts sucked on the lead frame to separate the uppermost lead frame and the second and subsequent stages, move the suction part to a predetermined lead frame supply position. In the lead frame separation and supply device including a transfer unit for transferring the lead frame to the supply position, the transfer unit pulls up the plurality of suction portions at different timings and is a portion closest to the end of the lead frame. After pulling up the suction part to be sucked in, the other suction parts are pulled up. A lead frame separation / feed device characterized by being stronger than the suction force of other suction units. 2. The lead frame separation and supply apparatus according to claim 1, wherein the uppermost lead frame is provided with a stopper for suppressing a pressing force with which the suction portion abuts from above. 3. The suction means is provided with a plurality of suction arm portions above the stacked lead frames and rotating at different timings, and the suction portions are attached to the suction arm portions. The lead frame separation and supply device according to claim 1. 4. The head support for supporting the suction head on the slide unit, wherein the transport unit includes a slide unit which is above the stacked lead frames and which moves vertically and horizontally moves to a predetermined lead frame supply position. 3. A portion is supported by a vertically adjustable slide mechanism, and a plurality of the suction portions are attached to the lower surface of the suction head so as to face the lead frame. The lead frame separation and supply device according to any one of 1. 5. The lead frame separation / supply device according to claim 1, further comprising a vibrating means for vibrating an adsorption portion that is first pulled up.