JP3417028B2 - Component mounting apparatus and method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting apparatus and method for mounting electronic parts such as ICs on a circuit board with high accuracy.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus and method will be described below with reference to the drawings. FIG. 4 is an explanatory diagram of the position regulation of the component in the mounting portion of the conventional component mounting apparatus, and FIG. 5 is an enlarged explanatory diagram of the component regulating portion in the mounting portion.

As shown in FIGS. 4 and 5, the mounting portion in the conventional component mounting apparatus is composed of a component regulating portion 15 having a component regulating claw 17, a recognizing means 16 and a component mounting portion 18. The component 5 is mounted on the circuit board 4.

The operation of the mounting unit in the conventional component mounting apparatus will be described below. The electronic components 5 supplied to the mounting unit are individually regulated by the component regulating claws 17 in the component regulating unit 15. At this time, in consideration of the relative position amount between the circuit board 4 and the electronic component 5, it is the X and Y directions of the electronic component 5 and the angle between the surface direction of the circuit board 4 and the X and Y directions of the electronic component 5. The electronic components 5 are regulated by adjusting θ _X and θ _Y. After that, in order to further mount the electronic component 5 on the circuit board 4 with high accuracy, the regulated electronic component 5 is sucked and gripped by a suction nozzle or a mounting head, and the circuit is detected by the recognition means 16 such as a component recognition camera. The relative position amount between the circuit board 4 and the electronic component 5 is precisely calculated with respect to the position on the board 4 to be mounted. Then, θ _X and θ _Y , which are the X and Y directions of the electronic component 5 and the angles between the surface direction of the circuit board 4 and the X and Y directions of the electronic component 5, are further adjusted according to the amount of change in the relative position amount. Then, the electronic component 5 is adjusted to a proper position, and the electronic component 5 is mounted on the circuit board 4.

[0005]

However, in the mounting portion of the conventional component mounting apparatus described above, replacement is required when the model of the electronic component 5 mounted on the circuit board 4 is switched or when the component regulating claw 17 is damaged. When this component regulating claw 17 is replaced, the X and Y directions and θ _X and θ _Y of the electronic component to be regulated are adjusted so that the position of the electronic component 5 becomes proper. Until it becomes a part
It is necessary to adjust the mounting state of No. 7 and it is difficult to cope with the positional regulation of various kinds of electronic components 5, especially irregular-shaped components, which the standard component regulating pawl 17 cannot cope with. It was

Also, the electronic component 5 sucked by the suction nozzle
If the mounted surface of the circuit board 4 and the mounted surface of the circuit board 4 are not kept parallel to each other with high accuracy, the mounting position accuracy may be changed depending on the contact between the electronic component 5 and the circuit board 4 as the mounting starts as shown in FIG. It may cause deterioration.

Even if a parallelism adjusting mechanism is provided in the suction nozzle portion in order to keep the mounting surfaces of the electronic components 5 sucked by the suction nozzles parallel, the adjustment of the mounting position presses the electronic components 5. Since the swing center point of the pressure head is moved and adjusted, the swing center point A is not positioned accurately above the mounting center point of the electronic component 5 on the circuit board 4 vertically. This causes a displacement of the mounting position when mounting the electronic component 5 on the circuit board 4, and is a factor of deterioration of the mounting position accuracy.

Further, as shown in FIG. 7, a straight line connecting the mounting head portion center point C of the mounting head portion on which the electronic component 5 is sucked and the swinging center point A of the pressure head is an electron on the circuit board 4. When the component 5 is not positioned vertically above the mounting center point B with high accuracy, the deterioration of the mounting position accuracy is further increased.

As a result, the parallelism adjustment and the electronic component 5 are performed.
In addition to the X, Y-direction and θ _X , θ _Y position regulation, the mounting position accuracy cannot be ensured with high accuracy unless the mounting position is repeatedly adjusted.
When the mounting position accuracy is set to be less than μm and the positional accuracy of the electronic components 5 in the X and Y directions and θ _X and θ _Y is several μm or less, the adjustment of the mounting position accuracy is very complicated, and the adjustment is not possible. There is also a problem that it becomes possible or that adjustment takes a lot of time.

The present invention solves the above-mentioned problems, and easily positions the electronic components 5 of various shapes, and
An object of the present invention is to provide a component mounting apparatus and a component mounting method capable of easily performing highly accurate adjustment of the mounting position accuracy.

[0011]

In order to achieve the above object, in a component mounting apparatus of the present invention, a mounting section having a component mounting means for mounting a component on a circuit board, and a control section for controlling the mounting section. The mounting unit includes a mounting head unit that mounts a component on a circuit board by a pressure head, a swing stage that adjusts the position of the pressure head with the mounting head unit as a fulcrum, and a component and a circuit board that are mounted. And a moving stage that moves below the mounting head portion, the moving stage having a first base on a moving base and a second base on the first base. And the first substrate has a first recess having an outer shape larger than the outer shape of the component and a second recess having an outer shape larger than the outer shape of the circuit board, and the second substrate has the outer shape of the component. First aperture with a larger profile than And it includes a second opening having a larger outer shape than the outer shape of the circuit board, a first further of the first base, first the second recess the second base, the second
The structure has means for sliding the second base on the first base so as to correspond to the openings of the first base.

[0012]

In the component mounting apparatus of the present invention having the above structure, the second base is slid to form the first and second recesses of the first base and the first and second openings of the second base. Since the electronic parts and the circuit board are sandwiched between the parts and the position is regulated, the position of the parts can be easily regulated without the trouble of adjusting the mounting state of the component regulating claws when the positions of the components are regulated. is there.

At this time, the first substrate formed on the same plane
Since electronic parts and circuit boards are installed in the recesses of the board,
X and Y directions of parts and θ_X, Θ_YProper position of the first
The first and second recesses of the base and the first and second openings of the second base
X and Y direction of the hole and θ _X, Θ_YOf electronic parts in advance
X, Y direction and θ_X, Θ_YTo match the proper position of
If this is done, the mounting accuracy of the electronic components on the circuit board will be improved.
Can be more advanced.

Further, in order to switch the model of the electronic component mounted on the circuit board, the first substrate and the second substrate in which a concave portion or an opening portion suitable for various kinds of electronic components and odd-shaped components are prepared in advance. The position of the electronic components can be adjusted very easily.

Further, since the mounting position of the electronic component is adjusted while adjusting the swing center point of the pressure head on the swing stage with the mount head center point as a fulcrum, the mount head center point and the swing center are adjusted. If the straight line connecting the points is made vertical, the straight line connecting the swing center point and the mounting center point of the electronic component will also be vertical, and the mounting position can be adjusted easily and highly accurately. It is a thing.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an enlarged view of a moving stage in a mounting portion of a component mounting apparatus of the present invention, FIG. 2 is a schematic view of the mounting mounting, and FIG. 3 is an enlarged view of the mounting portion in the mounting mounting. is there.

As shown in FIGS. 1, 2 and 3, the component mounting apparatus according to the present invention is mounted on a base 11 and has a component mounting means for mounting an electronic component 5 on a circuit board 4. The mounting head unit 1 includes a unit 13 and a control unit 12 that controls the mounting unit 13. The mounting unit 13 includes a suction nozzle 14 that mounts a component on the circuit board 4 by a pressure head 15.
6, the swing stage 9 for adjusting the position of the pressure head with the center point of the mounting head portion 16 as a fulcrum, the electronic component 5 to be mounted and the circuit board 4, and the motor is installed below the mounting head portion 16. It has a moving stage 7 that moves. The moving stage 7 includes a lower plate 2 on a moving base 17, an upper plate 3 on the lower plate 2, and the lower plate 2 has a first concave portion 21 having an outer shape larger than that of the electronic component 5 and a circuit. The second recess 22 having an outer shape larger than the outer shape of the board 4, the upper plate 3 has an outer shape larger than the outer shape of the electronic component 5, and the outer shape larger than the outer shape of the circuit board 4. The second opening portion 20 having the second opening portion 20 is provided, and the first and second recesses 2 of the lower plate 2 are further provided
1, 22 and the first and second openings 19, 2 of the upper plate 3
The upper plate 3 is slid on the lower plate 2 by the plate driving means 1 and the return spring so that 0 corresponds to each other.

The operation of the component mounting apparatus of the present invention will be described below. After the electronic component 5 is supplied to the regulated position of the electronic component 5 formed by the upper plate 3 and the lower plate 2, the plate driving means 1 drives the upper plate 3,
The electronic component 5 is set by the lower plate 2 and the upper plate 3.
Then, the suction nozzle 14 sucks the electronic component 5 and retracts it upward. Then, after supplying the circuit board 4 to the regulated position of the circuit board formed by the upper plate 3 and the lower plate 2, the upper plate 3 is driven by the plate driving means 1 and the circuit board 4 is moved by the lower plate 2 and the upper plate 3. Rectify. Next, the electronic component 5 sucked by the moving motor
Moves the moving stage 7 to the position above the mounting position of the circuit board 4 and lowers the suction nozzle 14 by the pressure head 15 to press the electronic component 5 to the circuit board 4 and complete the mounting. Further, in the present embodiment, the moving direction of the moving stage 7 is set to one direction, which is the setting of the circuit board 4 and the electronic component 5 provided on the lower plate 2 and the upper plate 3 in advance. This is because the relative positions of the parts are set to be suitable for alignment in only one direction, and the moving stage 7 may be movable in two directions.

In particular, since the lower plate 2 and the upper plate 3 are formed by etching by a photo process, the relative positions of the regulation portions of the circuit board 4 and the electronic component 5 are suitable for alignment in only one direction. It is also very easy to set to, and the plate can be processed with high accuracy, so even if the model of the electronic component 5 mounted on the circuit board 4 is switched, the upper plate 3 and the lower plate 2 can be By exchanging, the position of the electronic component can be easily maintained in a suitable state. As a result, it is not necessary to use the moving board 17, and it is possible to deal with the position regulation of various kinds of electronic parts 5, especially the odd-shaped parts, which the moving board 17 cannot cope with.

Further, since the swing stage 9 can freely move the swing center point of the pressure head 15, the parallelism between the mounting plane of the electronic component 5 and the mounting plane of the circuit board 4 is determined by the electronic component 5. Can be adjusted independently of the X and Y directions and the positioning of θ _X and θ _Y.

Further, when the electronic component 5 is mounted, the suction nozzle 14 is moved in the same direction as the normal line direction of the electronic component 5 sucked by the suction nozzle 14 in the mounting head portion 16 so that the electronic components are transferred to the circuit board 4. By mounting the component 5 under pressure, it is possible to eliminate the displacement of the mounting position due to the vertical movement of the suction nozzle 14.

Thus, the adjustment of the parallelism and the positioning of the electronic component 5 in the X and Y directions and θ _X and θ _Y as well as the adjustment of the mounting position can be greatly simplified.

[0024]

As described above, according to the present invention, the following effects can be obtained.

That is, by sliding the second base,
When the electronic component and the circuit board are sandwiched by the first and second recesses of the first board and the first and second openings of the second board to perform position adjustment, the position of the part is adjusted. The position of the parts can be easily adjusted without the trouble of adjusting the mounting state of the parts setting claws.

At this time, since the electronic component and the circuit board are installed in the concave portion of the first substrate formed on the same plane, the proper positions of the electronic component in the X and Y directions and θ _X and θ _Y are the first. The X and Y directions and θ _X and θ _Y of the first and second concave portions of the board and the first and second opening portions of the second board are previously defined as X and Y of the electronic component.
If it is created so as to match the direction and the proper positions of θ _X and θ _Y, the accuracy of the mounting position of the electronic component on the circuit board can be made higher.

Further, in order to switch the model of the electronic component mounted on the circuit board, the first substrate and the second substrate in which a concave portion or an opening portion suitable for various kinds of electronic components and odd-shaped components are prepared in advance. It is only necessary to prepare, and it is very easy to position the electronic components.

Furthermore, since the mounting position of the electronic component is adjusted while adjusting the swing center point of the pressure head on the swing stage with the mount head center point as a fulcrum, the mount head center point and swing center are adjusted. If the straight line connecting the points is made vertical, the straight line connecting the swing center point and the mounting center point of the electronic component will also be vertical, and the mounting position can be adjusted easily and highly accurately. It is a thing.

Also, the same effect can be obtained by changing the first and second recesses of the second base to the first and second openings.

Therefore, the present invention can provide a component mounting apparatus and method for easily positioning the electronic components of various shapes and easily adjusting the mounting position with high precision. It is a thing.

[Brief description of drawings]

FIG. 1 is a perspective view of a moving stage in a mounting portion of a component mounting apparatus of the present invention.

FIG. 2 is a perspective view of the mounting apparatus.

FIG. 3 is a perspective view of a mounting unit in the mounting apparatus.

FIG. 4 is a perspective view showing a component mounting method in a conventional component mounting apparatus.

FIG. 5 is a perspective view of a component regulating claw in the mounting apparatus.

FIG. 6 is a front view showing the principle of a component mounting method in the mounting apparatus.

FIG. 7 is a front view showing the same principle.

[Explanation of symbols]

1 Plate drive means 2 Lower plate 3 upper plate 4 circuit board 5 electronic components 6 Return spring 7 moving stages 17 Mobile platform 19 First opening 20 Second hole 21 first recess 22 Second recess

Continuation of the front page (56) Reference JP-A-5-13991 (JP, A) JP-A-62-191149 (JP, A) JP-A-56-160098 (JP, A) JP-A-3-202232 (JP , A) Furukai Hira 2-116800 (JP, U) Furukai Sho-22-22274 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 13/00-13/04

Claims (4)

(57) [Claims] 1. A mounting unit including a component mounting means for mounting a component on a circuit board, and a control unit for controlling the mounting unit, wherein the mounting unit mounts the component on the circuit board by a pressure head. It has a head part, a swinging stage for adjusting the position of the pressure head with the mounting head part as a fulcrum, and a moving stage on which parts to be mounted and a circuit board are installed and which moves below the mounting head part. The moving stage includes a first base on a moving base and a second base on the first base, and the first base has a contour larger than a contour of a component. A second recess having an outer shape larger than that of the first recess and the circuit board; and a second opening having a second outer surface having an outer shape larger than that of the component and an outer shape larger than the outer shape of the circuit board. Each having a second aperture with a In addition, the second base is placed on the first base so that the first and second recesses of the first base and the first and second openings of the second base correspond to each other. A device for mounting a component having means for sliding. 2. A first unit having a first recess and a second recess.
The component mounting apparatus according to claim 1, further comprising a first board having a first opening and a second opening instead of the board. 3. The component mounting apparatus according to claim 1, further comprising a first substrate and a second substrate created by a photo process. 4. A component and a circuit board are placed in the first recess and the second recess of the first board through the first opening and the second opening of the second board. By the first step of installing and by sliding the second base, the parts are formed by the first and second recesses of the first base and the first and second openings of the second base. And the circuit board are sandwiched and the position is adjusted, a second step is performed, the position-adjusted component is adsorbed by the mounting head portion, and the third step is to take out the component from the first concave portion of the first substrate, and the component is adsorbed. A fourth step of moving the moving stage so that the component mounting position on the circuit board fits under the mounting head part, and the mounting head part that picks up the component mounts the component at the component mounting position on the circuit board. And a fifth step of mounting the component.