JP3411960B2 - Microwave passive device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave passive element in a microwave band multilayer wiring board.

[0002]

2. Description of the Related Art A columnar conductor having a through hole filled with a metal has been used as a vertical feeding element for connecting two different layers in a multilayer wiring board.

FIG. 11 shows 1996 Microwave.
Workshops and Exhibition
(MWE 96), "Microwave MCM u
sing Ceramic Multilayer F
The vertical feed element described in "Unctional Substrate" is shown. Reference numeral 90 in the figure denotes a multilayer wiring board.
91 and 92 are upper conductors of the microstrip line, and 9
3, 94 are ground conductors of the microstrip line, and 95 is a via hole whose inside is filled with metal. In the multilayer wiring board, vias 95 connect microstrip lines made up of 91 and 93 and microstrip lines made up of 92 and 94.

[0004]

The conventional vertical feed element in the multilayer wiring board is used only for obtaining electrical conduction, and when forming a desired circuit on the board, its constituent elements are used. Were all arranged two-dimensionally on each layer. Therefore, when the number of constituent elements of the circuit is large, there is a problem that the area occupied by the circuit becomes large and the substrate becomes large.

The present invention has been made to solve the above problems, and realizes circuit miniaturization by three-dimensionally forming resistors, inductors, and capacitors in through holes used as vertical power supply elements. The purpose is to

[0006]

In a microwave passive element according to the present invention, a through hole is provided between arbitrary points on different conductor surfaces in a wiring board having a plurality of conductor surfaces, and the inside of this through hole is one conductor surface. To the other conductor surface, one is an inductor and the other is a different impedance element, and the impedances are connected in parallel.

[0007]

[0008] In addition, the division of the through hole is divided into radial through-hole, the divided inductor than
The outer portion is configured as a resistor or a capacitor element, and the different conductor planes are configured as parallel impedance elements.

[0009] or a wiring board odor with multiple conductive surfaces
Through holes that connect arbitrary points on different conductor surfaces
The inside of the through hole from one conductor surface to the other conductor
Parallel to each other by dividing into three divided regions continuous up to the plane and applying different impedance elements to each divided portion.
An impedance element configuration is used.

[0010]

[0011]

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. The configuration of the microwave passive element according to the first embodiment of the present invention will be described with reference to the drawings. Here, in order to simplify the explanation, it is assumed that a through hole is formed in a single-layer double-sided board as a board and a resistor and a capacitor are provided in the through hole. FIG. 1 is a view showing a sectional structure of a resistor provided in a through hole portion of a double-sided board. In the figure, 1 is an insulating substrate portion of a wiring board,
Reference numeral 2 denotes a conductor surface provided on one surface, which serves as a connection end at one end for resistance. Reference numeral 3 is a conductor surface provided on the other surface and serves as a connection end at the other end for resistance. Reference numeral 4 is an annular resistor which is in contact with the through hole of the insulating substrate portion 1. 5
Is air or a low-dielectric substance, and is a portion regarded as an insulator having a very high impedance value.

Assuming that the resistivity of the resistor 4 is ρ, the annular cross-sectional area of the resistor 4 is S, and the length of the through hole (which is also the thickness of the substrate portion 1) is h, the conductor surfaces 2 and 3 on both sides are The resistance value R of the resistor 4 connected is R = ρh / S, and ρ = 5 × 10 ⁻⁷ [Ωm] (resistivity of tantalum nitride), h = 0.4 [mm], S = 5 × 10 ^-9 [m ² ]
Assuming (a circular cross-sectional area of 50 μm and 30 μm of inner diameter), R = 40 [Ω], and a practical value effectively used for an oscillation prevention circuit of a filter or an amplifier can be obtained. Although the resistor 4 is annular in FIG. 1, the entire through hole may be a cylindrical resistor. By thus forming the passive elements three-dimensionally by providing the resistors in the direction between the multilayer substrates, the substrate circuit can be effectively used and the occupied area can be reduced.

Another configuration in the present embodiment will be described. FIG. 2 is a diagram showing a configuration in which capacitors are three-dimensionally provided instead of the resistors of FIG. In the figure, 10 is an insulating substrate portion of the wiring board, and 11 is a conductor surface provided on one surface, which is a connection end for one end with respect to the resistance. Reference numeral 12 is a conductor surface provided on the other surface and serves as a connection end at the other end for resistance. Reference numeral 13 is a capacitor in which the through hole of the insulating substrate portion 1 is filled with a high dielectric material. Assuming that the dielectric constant of the capacitor 13 is ε, the disk cross-sectional area of the through hole is S, and the length of the through hole is h, the capacitance C of the capacitor 13 to which the conductor surfaces 11 and 12 on both sides are connected is C = εS / h 2. , Ε = 3000 × ε ₀ = 2.66 × 10 ⁻⁸ [F /
m] (assuming barium titanate, and ε ₀ is a vacuum dielectric constant of 8.85 × 10 ⁻¹² [F / m]), h = 0.2 [m
m], S = 2.5 × 10 ⁻⁷ [m ² ] (one side is 0.5 [m
m] square area), C = 33 [pF], and a practical value effectively used for a filter or the like is obtained in the microwave region. In this case as well, effects such as effective use of the substrate circuit and reduction of the occupied area are similarly obtained.

Embodiment 2. The through hole can be configured not only as a single resistor or capacitor, but also as a parallel impedance element. In this embodiment, a case where such a parallel type impedance is configured will be described. Figure 3
FIG. 4 is a diagram showing a sectional structure of a resistor and a capacitor provided in a through hole portion of a double-sided board. In the figure, reference numeral 15 is an insulating substrate portion of the wiring board, and 16 is a conductor surface provided on one surface, which is a connecting end of one end for the resistor and the capacitor.
Reference numeral 17 denotes a conductor surface provided on the other surface and serves as a connection end of the other end for the resistor and the capacitor. 18 is the insulating substrate portion 1
The ring-shaped resistor is in contact with the through hole. Reference numeral 19 is a high dielectric material, which constitutes a capacitor. Therefore, they constitute a parallel impedance with respect to the conductor surfaces 16 and 17. It can be seen that these concrete numerical values are sufficiently useful considering the values in the first embodiment. According to this configuration, the effects of effectively using the substrate circuit and reducing the occupied area can be obtained more effectively.

Another configuration in this embodiment will be described. FIG. 4 is a diagram showing a configuration in which an inductor is three-dimensionally provided instead of the capacitor of FIG. In the figure, 20 is an insulating substrate portion of a wiring board, and 21 is a conductor surface provided on one surface, which is a connecting end of one end for parallel impedance. Reference numeral 22 is a conductor surface provided on the other surface and serves as a connection end at the other end for parallel impedance. Reference numeral 23 is an annular resistor in contact with the through hole, 25 is a conductor as an effective inductor, and 24 and 26 are air or a low dielectric material. In the microwave region, it is known that the conductor is substantially an inductor. If the radius of the conductor 25 is r, the length of the through hole is h, and the magnetic permeability of the vacuum is μ ₀ , its value L is

[0017]

[Equation 1]

And h = 0.635 mm, r = 0.
When it is set to 05 mm, L = 0.235 nH. This structure constitutes a parallel impedance element including a resistor and an inductor.

Another configuration in the present embodiment will be described. FIG. 5 is a diagram showing a configuration in which a capacitor is provided instead of the resistor and an inductor is provided three-dimensionally instead of the capacitor in FIG. In the figure, 30 is an insulating substrate portion of the wiring board, 31 is a conductor surface provided on one surface, and is a connecting end of one end for parallel impedance. A conductor surface 32 is provided on the other surface and serves as a connection end of the other end for parallel impedance. Reference numeral 33 is an annular high dielectric material that is in contact with the through hole, 34 is a conductor as an effective inductor, and 35 is air or a low dielectric material. Specific values of capacitors and inductors are in the ranges shown in other figures, and this structure is
A parallel impedance element composed of a capacitor and an inductor will be configured. The positions of the capacitor and the inductor may be exchanged.

As a three-dimensional parallel impedance structure, a case where it is composed of three elements of a capacitor, an inductor and a resistor will be described. FIG. 6 is a diagram showing a configuration in which a resistor and then a capacitor are three-dimensionally provided on the outermost layer in contact with the through hole and an inductor is three-dimensionally provided on the innermost layer. In the figure, 40 is an insulating substrate portion of the wiring board, 41 is a conductor surface provided on one surface, and is a connecting end at one end for parallel impedance. Reference numeral 42 is a conductor surface provided on the other surface and serves as a connection end at the other end for parallel impedance. 43 is an annular resistor in contact with the through hole, 44 is a high-dielectric-constant capacitor, and 46 is a conductor as an effective inductor, 4
5 is air or a low dielectric. The specific numerical values of the resistor, the capacitor, and the inductor are in the ranges shown in other figures, and this structure constitutes a parallel impedance element including the capacitor, the inductor, and the resistor. The position of each element may be exchanged.

Embodiment 3. The through hole can be configured not only as a single resistor or capacitor, but also as a series impedance element. In the present embodiment, a case where such series impedance is configured will be described. Figure 7
FIG. 3 is a diagram showing a cross-sectional structure of a resistor and an inductor having a serial structure provided in a through hole portion of a double-sided board. In the figure,
Reference numeral 50 is an insulating substrate portion of the wiring board, and reference numeral 51 is a conductor surface provided on one surface, which serves as one end connection end for resistance. 5
Reference numeral 2 is a conductor surface provided on the other surface and serves as a connection end of the other end with respect to the inductor. Reference numeral 53 is a ring-shaped resistor provided in the upper part of the insulating substrate portion 50 in contact with the through hole, and is connected to the inductor. 56 is a conductor as an effective inductor, and 54 and 55 are air or a low dielectric. It can be seen that these concrete numerical values are sufficiently useful considering the values in the first embodiment. This structure constitutes a series impedance element including an inductor and a resistor. According to this configuration, the effects of effectively using the substrate circuit and reducing the occupied area can be obtained more effectively.

Another configuration in this embodiment will be described. FIG. 8 is a diagram showing a configuration in which capacitors are three-dimensionally provided in place of the inductor of FIG. In the figure, reference numeral 60 is an insulating substrate portion of the wiring board, and 61 is a conductor surface provided on one surface, which is a connecting end of one end for series impedance. Reference numeral 62 denotes a conductor surface provided on the other surface and serves as a connection end at the other end with respect to series impedance. Reference numeral 63 denotes an annular resistor provided in the upper part of the insulating substrate 60 in contact with the through hole, and is connected to the capacitor. 6
4 is air or a low dielectric. Reference numeral 65 is a high dielectric material, which constitutes a capacitor. 66 is a conductor that connects the resistor 63 and the capacitor.

Another configuration in the present embodiment will be described. FIG. 9 is a diagram showing a configuration in which capacitors are three-dimensionally provided instead of the resistors in FIG. In the figure, 70 is an insulating substrate portion of the wiring board, 71 is a conductor surface provided on one surface,
One end is connected to the series impedance. 7
Reference numeral 2 is a conductor surface provided on the other surface and serves as a connection end at the other end for series impedance. 73 is the insulating substrate portion 7
In FIG. 0, a capacitor filled in a ring shape in contact with the through hole is connected to the inductor at the upper part. 75
Is a conductor as an effective inductor, and 74 is air or a low dielectric material. Reference numeral 76 is a conductor that connects the capacitor and the conductor 75 as an effective inductor.

Another configuration in the present embodiment will be described. It is also possible to use three elements as the series impedance. FIG. 10 is a diagram showing an example thereof. In the figure, 80 is an insulating substrate portion of the wiring board, and 81 is a conductor surface provided on one surface, which is a connecting end at one end for series impedance. Reference numeral 82 denotes a conductor surface provided on the other surface, which serves as a connection end at the other end for series impedance. Reference numeral 83 denotes a capacitor having a through hole filled in the uppermost portion in the figure of the insulating substrate portion 80, which is connected to the inductor. Reference numeral 85 is a conductor as an effective inductor, and 89 is a resistor provided at the bottom in the figure. Reference numerals 84 and 87 are connection conductors between series impedances, and reference numerals 86 and 88 are air or a low dielectric material. According to this configuration, the effects of effectively using the substrate circuit and reducing the occupied area can be obtained more effectively.

[0025]

As described above, according to the present invention, a through hole is provided between different conductor layers of a multilayer substrate to form an inductor.
Since a plurality of impedance elements including is constructed, the base circuit can be effectively used and the occupied area can be reduced.

Further, since the parallel or series impedance circuit is formed in the through hole, there is an effect that the substrate circuit can be effectively used and the occupied area can be further reduced.

[Brief description of drawings]

FIG. 1 is a configuration cross-sectional view of a microwave passive element according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing the configuration of another microwave passive element according to the first embodiment.

FIG. 3 is a configuration cross-sectional view of a microwave passive element according to the second embodiment of the present invention.

FIG. 4 is a sectional view showing the configuration of another microwave passive element according to the second embodiment.

FIG. 5 is a sectional view showing the configuration of another microwave passive element according to the second embodiment.

FIG. 6 is a sectional view showing the configuration of another microwave passive element according to the second embodiment.

FIG. 7 is a configuration cross-sectional view of a microwave passive element according to a third embodiment of the present invention.

FIG. 8 is a sectional view showing the configuration of another microwave passive element according to the third embodiment.

FIG. 9 is a sectional view showing the configuration of another microwave passive element according to the third embodiment.

FIG. 10 is a sectional view showing the configuration of another microwave passive element according to the third embodiment.

FIG. 11 is a diagram showing a configuration example of a conventional vertical power supply circuit.

[Explanation of symbols]

1, 10, 15, 20, 30, 40, 50, 60, 7
0,80,90 Multilayer wiring board, 2,11,16,2
2, 31, 41, 51, 61, 71, 81 upper electrode,
3, 12, 17, 22, 32, 42, 52, 62, 7
2,82 lower electrode, 4,18,23,43,53,6
3,89 resistor, 5,24,26,35,45,5
4,55,64,74,86,88 Air or low dielectric, 13,19,33,44,65,73,83 High dielectric, 4,25,34,46,56,57,66,7
5,76,84,85,87 conductor, 91,92 microstrip line upper conductor, 93,94 microstrip line ground conductor, 95 via hole.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-49-56167 (JP, A) JP-A-51-147763 (JP, A) JP-A-8-37355 (JP, A) JP-A-4- 313297 (JP, A) JP-A 4-299889 (JP, A) JP-A 5-55761 (JP, A) JP-A 2-239697 (JP, A) JP-A 1-298796 (JP, A) JP 63-119593 (JP, A) JP 64-64394 (JP, A) Actual development Sho 58-39001 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01P 1/00 H01C 7/00 H01P 3/08

Claims (3)

(57) [Claims] 1. In a wiring board having a plurality of conductor surfaces, a through hole is provided between arbitrary points on different conductor surfaces, and the inside of the through hole is continuous from one conductor surface to the other conductor surface, one is an inductor, A microwave passive element, characterized in that the others are formed by different impedance elements, and the conductor surfaces are connected by parallel impedance. 2. The through hole is divided in the radial direction of the through hole, and a portion other than the divided inductor is formed as a resistor or a capacitor element, and different conductor surfaces are formed as parallel impedance elements. The microwave passive element according to claim 1, wherein: 3. A wiring board having a plurality of conductor surfaces is different.
A through hole that connects arbitrary points on the conductor surface is provided, and the inside of the through hole is connected from one conductor surface to the other conductor surface.
In successive 3 is divided into divided regions, and parallel in directing different impedance elements in each of the divided portions
A microwave passive element characterized by having a pedestal element configuration.