JP3411340B2 - Optical coupling device and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an optical coupling device and a manufacturing method thereof.

[0002]

2. Description of the Related Art Optical coupling device (photocoupler) of Conventional Example 1
The structure of FIG. 6 is shown in FIG. 6, the conventional example 2 is shown in FIG. 7, and the conventional example 3 is shown in FIG.

In the conventional example 1 shown in FIG. 6, a light emitting element (light emitting diode chip) 1 and a light receiving element (phototransistor chip) 2 are mounted on a light emitting lead frame 3 and a light receiving lead frame 4, respectively, and a gold wire 5 respectively. , 6 are wire-bonded to each other and are arranged to face each other. An optical path between the light emitting element 1 and the light receiving element 2 is formed between them by the light transmitting silicone resin 7 (light transmitting pre-resin). Further, the structure of the optical coupling device is shown in which the light-shielding resin 9 is resin-sealed by transfer molding or the like.

In the conventional example 2 of FIG. 7, the light emitting element 1 and the light receiving element 2 are mounted on the light emitting lead frame 3 and the light receiving lead frame 4, respectively, and are wire-bonded by gold wires 5 and 6, respectively. After being covered with a translucent silicone resin (translucent pre-resin) 7, the translucent semi-translucent resin 8 which is arranged facing each other is formed by transfer molding or the like to receive light from the light emitting element 1. The optical path between the elements 2 is secured. Further, the structure of an optical coupling device is shown in which the light-shielding resin 9 is resin-sealed by transfer molding or the like to shield ambient light.

In the conventional example 3 of FIG. 8, the light emitting element 1 and the light receiving element 2 are mounted on the light emitting element lead 3 and the light receiving element lead 4 of the same lead frame, respectively, and are connected by the gold wires 5 and 6, respectively. Bonded and arranged side by side in a plane. An oval translucent silicone resin 7 is formed to cover the light emitting element 1 and the light receiving element 2, and an optical path between the light emitting element 1 and the light receiving element 2 is secured. Furthermore, the structure of the optical coupling device in which the light-shielding resin 9 is formed by transfer molding or the like is shown.

[0006]

The characteristics of the above conventional example will be compared with reference to FIG.

First, as a characteristic of the optical coupling device, a high withstand voltage between the light emitting element 1 side and the light receiving element 2 side is required.

Here, the withstand voltage of the conventional examples 1 and 3 is determined by the interface distance between the translucent silicone resin 7 and the light shielding resin 9. Since the adhesion between the two is weak, the withstand voltage is at most AC 1.5 to 2.5 kV (effective value: rms). On the other hand, in Conventional Example 2, the interface between the semi-translucent resin 8 and the light-shielding resin 9 has strong adhesion between them, and there is almost no interfacial discharge inside. Therefore, the withstand voltage is as high as 5 kV AC or more.

Next, regarding the optical transmissivity, in Conventional Example 1,
Since the light emitting element 1 and the light receiving element 2 are arranged so as to face each other with the translucent silicone resin 7 interposed therebetween, the light transmittance is high.
On the other hand, in the conventional example 2, the semi-translucent resin 8 is provided between the light emitting element 1 and the light receiving element 2, and in the conventional example 3, both the elements 1 and 2 are arranged side by side in a plane. Therefore, the light transmission rate is not as high as that of the conventional example 1.

Regarding the processing accuracy of the lead frame, in the conventional examples 1 and 2, since the lead frames 3 and 4 are of the bending opposing type, the bending processing accuracy is required, while the conventional example 3 is used. Is a plane-mounted type, it is not necessary to bend the lead frames 3 and 4.

Further, in the conventional examples 1 and 2, since the lead frames 3 and 4 on the light emitting side and the light receiving side are formed, the lead frames 3 and 4 are leaded by a difference in thickness (about 30 μm) during transfer molding. Although a problem that thin burrs are formed on the frames 3 and 4 is likely to occur, the conventional example 3 does not have the fear of thin burrs as described above because it is composed of one lead frame.

However, in Conventional Example 3, it is considerably difficult in manufacturing to form the transparent silicone resin 7 that secures the optical path between the light emitting element 1 and the light receiving element 2 uniformly in an elliptical shape. ing. Under these circumstances, Conventional Example 2 is the mainstream as the structure of the optical coupling device. However, as described above, in Conventional Example 2, as shown in FIG. 5, it was not always ideal in terms of light transmittance, processing accuracy, thin burr, and the like.

By the way, as a structure of an optical coupling device conforming to a safety standard (IEC335) of which internal insulation distance is 2 mm or more, a prior art example 4 shown in FIG. 9 has been proposed. In the lead frame facing type as in the conventional examples 1 and 2, it is difficult to secure the internal insulation distance due to the thickness of the package. Therefore, the structure of the conventional example 3 is improved to have an elliptical variation and an optical path shape. It is proposed in consideration of the drawback that it is difficult to be uniform. That is, in the optical coupling device of the conventional example 4, the light emitting element 1 and the light receiving element 2 are mounted on the respective leads 3 and 4 in which the same inner insulation distance A2 is secured by the same lead frame, and the gold wires 5 and 6 are respectively mounted. Wire-bonded by
They are arranged side by side on a plane. Bent parts 3a and 4a bent downward are formed from the leads 3 and 4, respectively, and an electrically insulating polyimide tape 7a is stuck between the bent parts 3a and 4a. A translucent silicone resin 7 is applied in a semi-elliptical shape to secure an optical path between the light emitting element 1 and the light receiving element 2. Further, the light-shielding resin 9 is formed by transfer molding or the like to have a structure of an optical coupling device.

Here, the withstand voltage of the conventional example 4 is the degree of the interface adhesion between the translucent silicone resin 7 and the light-shielding resin 9, the silicone resin 7 and the polyimide tape 7a, and the polyimide tape 7a and the light-shielding resin 9. However, although the adhesiveness varies widely and the adhesiveness is generally weak, the withstand voltage is higher than that of Conventional Example 3 because the interface distance is longer.
But not enough.

In view of the above problems, it is an object of the present invention to provide a high withstand voltage type optical coupling device having a high withstand voltage and capable of solving the problems of lead frame processing accuracy and thin mold burr, and a method of manufacturing the same. And

[0016]

The means for solving the problems according to the present invention is, as shown in FIGS.
1, the light emitting element 12 is mounted on the upper surface of the light receiving side lead frame 13, and the light receiving element 14 is mounted on the upper surface of the light receiving side lead frame 13. The light emitting element 12 and the light receiving element 14 are arranged in a plane so as to be optically coupled to each other, and receive and emit light. In the optical path between the elements 12, 14
At the tip of each of the lead frames 11 and 13, the transparent
Light walls 16 are provided , and the periphery of each of the elements 12 and 14 is resin-sealed with a transparent pre-resin 17, and the transparent pre-resin 17 and the transparent wall 16 are made of a semi-transparent resin. The primary mold body 18 is resin-sealed to form a primary mold body 18, and the periphery of the primary mold body 18 is resin-sealed with a light-shielding resin to form a secondary mold body 19.
The upper end is matched to the upper end of the ToruHikarikabe 16, RyoToruHikarikabe 1
6 are spaced apart from each other, and are placed in the optical path between the translucent walls 16.
A translucent resin is interposed .

In this method of manufacturing the optical coupling device, the light emitting side lead frame 11 and the light receiving side lead frame 13 are formed side by side on a plane from a single metal plate, and the light emitting element 12 and the light receiving element 14 are optically coupled to each other. As shown in FIG.
Leaving the pair of ToruHikarikabe 16 in the optical path of the upper surface of the front end portion of 1,13
The elements 12 and 14 are sealed with a light-transmissive pre-resin 17 so that the upper end thereof matches the upper end of the light-transmissive wall 16. The periphery of the light-transmitting wall 16 is resin-sealed with a semi-translucent resin to form a primary mold body 18, and the periphery of the primary mold body 18 is resin-sealed with a light-shielding resin to form a secondary mold body 19. Is formed.

Then, the lead frames 11, 13 are formed.
The distance between the two transparent walls 16 is set to 2 mm or more.
Is projected from the tip portions of the lead frames 11 and 13
The distance between the two translucent walls 16 is such that the lead frames 1
It is made smaller than the separation dimension of 1 and 13 .

Each lead frame 11 is attached to the translucent wall 16.
A lower piece 31 is formed so as to wrap around from the tip of 13 to the lower surface and come into contact therewith.

In the method of manufacturing the optical coupling device, the light emitting element 12 is mounted on the light emitting side lead frame 11, the light receiving element 14 is mounted on the light receiving side lead frame 13, and both lead frames 11 and 13 emit light. The element 12 and the light-receiving element 14 are arranged so as to be optically coupled to each other, and the lower piece 31 of the light-transmitting wall 16 is brought into contact with the lower surface of each lead frame 11 and 13 so that the periphery of each element 12 and 14 transmits light. Pre-resin 1
At 7, the resin is sealed so that its upper end matches the upper end of the light transmitting wall 16, and the light transmitting pre-resin 17 and the light transmitting wall 16 are provided.
A primary mold body 18 is formed by sealing the periphery of the resin with a semi-transparent resin, and a secondary mold body 19 is formed by sealing the periphery of the primary mold body 18 with a light-shielding resin. Is.

The distance between the two transparent walls 16 is 50 to 200.
That is, the definition is made by adapting to a desired optical transmissivity in the range of μm.

[0022]

In the above means for solving the problems, by arranging the light emitting element 12 and the light receiving element 14 side by side in a plane, the lead frames 11 and 13 can be formed by one sheet, which is a problem due to the bending accuracy and thin burrs during transfer molding. Can be prevented. Also, since it is a double transfer mold type, a high withstand voltage can be guaranteed. The light transmittance of the optical path can be adjusted by the distance between the light-transmitting pre-resins 17 on both sides of light reception and emission, and therefore the light transmittance can be stabilized at a desired level. Then, at the time of manufacturing, the upper end of the light-transmissive pre-resin 17 in the optical path is provided with the light-transmitting wall 16 or the light-transmitting wall 16
Since it can be applied so as to match the upper end of the transparent pre-resin 17, its thickness is stabilized by the surface tension of the translucent pre-resin 17, and thus the shape and shape of the optical path can be easily stabilized.

Further, since the distance between the two lead frames 11 and 13 is set to 2 mm or more, and the light transmitting walls 16 are projected from the tips of the lead frames 11 and 13, the distance between the light transmitting walls 16 is increased. While keeping B3 small, the internal insulation distance A3 can be secured, and a stable optical path can be secured even if the distance between the light emitting and receiving elements is long, so that a desired light transmissivity can be obtained. Further, since the lower piece 31 of the transparent wall 16 is fixed to the lower side of each lead frame 11, 13, the transparent wall 16
Need not be placed on the tip of each lead frame 11, 13.

[0024]

(First Embodiment) FIG. 1 is a side sectional view of an optical coupling device according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view seen from the upper surface.

Optical coupling device (photocoupler) of this embodiment
Is mounted on a light emitting side lead frame 11 with a light emitting element 12 such as a light emitting diode, and on a light receiving side lead frame 13 with a light receiving element 14, which are arranged side by side in a plane so as to be optically coupled to each other. 11, 13
A light-transmitting wall 16 is erected in the optical path of each of the elements 12, 1
The periphery of 4 is resin-sealed with a translucent pre-resin 17, and these are resin-sealed with a semi-translucent resin.
8 is formed, and its periphery is resin-sealed with a light-shielding resin to form a secondary molded body 19.

As shown in FIGS. 1 and 2, the light emitting side lead frame 11 is connected to the light emitting side mounting lead 21 on which the light emitting element 12 is mounted and the light emitting element 12 via a bonding wire 22 such as a gold wire. Light emitting side connection lead 2
3 and 3.

The light-receiving side lead frame 13 includes a light-receiving side mounting lead 24 on which the light-receiving element 14 is mounted, and a light-receiving side connecting lead 25 connected to the light-receiving element 14 via a bonding wire 22 such as a gold wire. Consists of.

The lead frames 11 and 13 are punched from a single metal plate so as to be juxtaposed in a plane.

The light-transmitting wall 16 is for adjusting the thickness of the semi-light-transmitting resin of the primary mold body 18 in the optical path, and faces each other where the optical paths of the lead frames 11 and 13 are formed. The lead frames 11 and 13 are vertically provided at predetermined positions on the leading ends thereof. The translucent wall 16 is formed in a U shape in a plan view. The light transmittance of the light path between the light emitting element 12 and the light receiving element 14 is determined by the distance between the light transmitting walls 16, that is, the thickness of the semi-translucent resin of the primary molded body 18 in the light path. The distance between the light-transmitting walls 16 is adjusted, and specifically, the distance between the light-transmitting walls 16 is set to an arbitrary value of 50 to 200 μm.

The translucent pre-resin 17 is a translucent silicone resin, and as shown in FIG.
1 and 13 are arranged separately, and are formed in a substantially hemispherical shape by utilizing surface tension between each light-transmitting wall 16 and each lead frame 11, 13. The thickness of the transparent pre-resin 17 is set to be equal to the height of the transparent wall 16.

The light-transmitting pre-resin 17 is not formed in the space between the light-transmitting walls 16 in the optical path between the light-emitting element 12 and the light-receiving element 14. Resin is filled. Here, the reason why the semi-translucent resin is interposed in the optical path is to ensure a high breakdown voltage. By the way, the light transmittance is determined by the thickness of the semi-transparent resin of the primary molded body 18 in the optical path, and the light transmittance becomes larger as the thickness of the semi-transparent resin is as thin as the withstand voltage allows. In order to secure and stabilize the characteristics of the light transmissivity, the thickness of the semi-transparent resin in the optical path is set within a range of 50 to 200 μm so as to be adapted to the desired light transmissivity.

The primary mold body 18 and the secondary mold body 19 are molded by transfer molding.

The above optical coupling device is manufactured as follows. First, the light emitting side lead frame 11 and the light receiving side lead frame 13 are formed side by side in a plane from a single metal plate. Then, the light emitting element 12 and the light receiving element 14 are mounted side by side on the upper surfaces of the lead frames 11 and 13 so as to be optically coupled, and wire-bonded by the gold wires 22 respectively.

Next, the light-transmitting walls 16 are provided in the optical paths on the upper surfaces of the lead frames 11 and 13 at intervals defined between 50 and 200 μm in accordance with the desired light transmittance. And
The periphery of each of the elements 12 and 14 is resin-sealed with a transparent pre-resin 17 so that the thickness thereof is the same as the height of the transparent wall 16.

Thereafter, the periphery of these is sealed with a semi-translucent resin to form a primary molded body 18, and the periphery thereof is further sealed with a light-shielding resin to form a secondary molded body 19.
To form. After that, the lead frames 11 and 13 extending from the secondary mold body 19 are lead-cut formed into a desired shape to complete the optical coupling device.

By adopting such a manufacturing method, it is possible to eliminate the work of bending each lead frame, so that it is possible to prevent problems due to the bending accuracy and thin burrs during transfer molding. Also, since it is a double transfer mold type, high withstand voltage can be guaranteed.

Then, the transparent pre-resin 17 in the optical path
Since the upper end of the transparent resin is applied so as to match the upper end of the transparent wall 16, its thickness is stabilized by the surface tension of the transparent pre-resin 17, and thus the shape and shape of the optical path can be easily stabilized.

In use, the light from the light emitting element 12 is emitted into the light transmitting side transparent pre-resin 17, and the light emitting side transparent wall 16 and the semi-transparent resin adjacent thereto, the light receiving side. The light enters the light receiving element 14 through the light transmitting wall 16 and the light receiving side transparent pre-resin 17.

At this time, since the light passes through the semitransparent resin,
The light transmissivity depends on the thickness, but it is 50 to 200.
The translucent wall 16 is provided at intervals corresponding to a desired light transmissivity between μm.
Is set, and a desired stable light transmissibility can be obtained.

From the above, according to the present embodiment, it is possible to obtain an optical coupling device which is better in general than the conventional examples 1 to 4 (see FIG. 5).

(Second Embodiment) In the first embodiment, in order to secure the translucency of the light path between the light receiving and emitting and to ensure the high withstand voltage, the distance between the two light transmissive walls 16 is set as described above. It is desirable to set the thickness to about 50 to 200 μm, but if the transparent wall 16 is arranged on the upper surface of each lead frame 11 and 13 as in the first embodiment, both transparent walls 16 are close to each other. Therefore, the tip portions of the lead frames 11 and 13 are also close to each other. Then, the space between the lead frames 11 and 13 cannot be sufficiently secured, and the internal withstand voltage becomes low.
There is a safety standard (IEC335), for example, as a condition for securing a general level of internal insulation breakdown voltage, but an internal insulation distance (distance between the lead frames 11 and 13 in this embodiment) that meets this standard is 2 mm. That is all. Therefore, when trying to comply with this standard, both transparent walls 1
It is desirable that the distance between the two lead frames 11 and 13 be set to 2 mm or more while the distance between the six lead frames 11 and 13 is set to 50 to 200 μm.

Therefore, the optical coupling device of the second embodiment is designed to meet the above safety standards, and the light emitting element 12 is mounted on the upper surface of the light emitting side lead frame 11 as shown in FIGS. 3 and 4. The light receiving element 14 is mounted on the upper surface of the lead frame 13 on the light receiving side.
Further, it is similar to the first embodiment in that the light transmitting wall 16 for adjusting the light transmitting property of the light path between the light receiving and emitting is provided, and the periphery of each of the elements 12 and 14 is the light transmitting pre-resin 17. After being resin-sealed, the translucent pre-resin 17 and the translucent wall 16 are resin-sealed with a semi-translucent resin to form a primary mold body 18, and the periphery of the primary mold body 18 is shielded from light. This is the same as the first embodiment in that the secondary mold body 19 is formed by resin-sealing with a conductive resin.

However, in consideration of its shape, the transparent wall 16 of the optical coupling device of this embodiment differs from that of the first embodiment in that the lower piece 31 is projectingly formed on the lower side surface thereof. To That is, the translucent wall 16 and the lower piece 31 are integrally molded using translucent glass, engineering plastic, or the like, so that the side wall is L-shaped in side view. When the lower piece 31 is attached to each of the lead frames 11 and 13, the lower piece 31 wraps around from the tip of each lead frame 11 and 13 to the lower surface and contacts the lower surface. Here, the translucent walls 16 on both sides of the light receiving and emitting are spaced apart by a dimension B3. The reason why the two light-transmitting walls 16 are not in close contact is that the interface between the light-transmitting wall 16 and the semi-light-transmitting resin for the primary mold is divided between light reception and light emission to prevent internal interface discharge.

The translucent pre-resin 17 is formed in a substantially hemispherical shape by utilizing surface tension between each translucent wall 16 and each lead frame 11, 13, and the translucent pre-resin is also used. The thickness dimension of 17 is the same as that of the first embodiment in that it is set to be equal to the height dimension of the transparent wall 16.

In this structure, at the time of manufacturing, first,
The light emitting element 12 is mounted on the light emitting side lead frame 11,
The light receiving element 14 is mounted on the light receiving side lead frame 13. Next, the lower piece 31 of the translucent wall 16 is brought into contact with the lower surfaces of the lead frames 11 and 13. After that, each element 12, 1
The periphery of 4 is resin-sealed with a transparent pre-resin 17 so that the upper end thereof matches the upper end of the transparent wall 16. Thereafter, the lead frames 11 and 13 are arranged so that the light emitting element 12 and the light receiving element 14 are optically coupled to each other. After that, the surroundings of the light-transmissive pre-resin 17 and the light-transmissive wall 16 are resin-sealed with a semi-translucent resin to form a primary mold body 18.
Then, the periphery of the primary mold body 18 may be resin-sealed with a light-shielding resin to form the secondary mold body 19.
The light shielding property adjusting wall 16 may be adhered to the lead frames 11 and 13 by pressure contact or the like before mounting the light emitting element 12 or the light receiving element 14, or after wire bonding.
It may be before the resin is sealed with the translucent pre-resin 17. In this case, the translucent pre-resin 17 can also serve as a fixing agent for the translucent wall 16.

If the lower piece 31 of the light transmitting wall 16 is fixed to the lower side of each lead frame 11, 13 by such a procedure, it is necessary to mount the light transmitting wall 16 on the tip of each lead frame 11, 13. Disappear. Therefore, it is possible to secure the distance between the lead frames 11 and 13 while maintaining the light-transmitting property of the light path between the light receiving and emitting by reducing the distance B3 between the light transmitting walls 16. Specifically, the distance B3 between the light transmitting side light receiving wall 16 and the light receiving side light transmitting side 16 is set to a small value of about 50 to 200 μm.
At the same time, the separation distance A between the lead frames 11 and 13
3 can be set to 2 mm or more to comply with the safety standard (IEC335).

The present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

[0048]

As is apparent from the above description, according to the present invention, since the light emitting side lead frame and the light receiving side lead frame are formed side by side in a plane from a single metal plate, the bending accuracy and the transfer mold are improved. Problems due to thin burrs can be prevented.

Further, a light transmitting wall is provided in the optical path on the upper surface of each lead frame, and the light emitting element and the light receiving element are mounted side by side so as to be optically coupled to the upper surface of each lead frame. Depending on the position of the translucent wall for adjusting the light transmittance,
The thickness of the semi-translucent resin of the primary mold body in the optical path can be defined and set to a value adapted to a desired light transmittance. Further, at the time of manufacturing, since the upper end of the transparent pre-resin in the optical path is aligned with the upper end of the transparent wall, the surface tension of the transparent pre-resin stabilizes its thickness, thus stabilizing the shape of the optical path. , The homogenization becomes easy, and the light transmission rate becomes stable.

Further, there is no interface between both elements in the primary mold body, and the secondary mold body is doubly molded. The interface between the primary mold body and the secondary mold body has good adhesion. Therefore, there is almost no internal interface discharge. Therefore, a high withstand voltage can be guaranteed.

Further, while keeping the distance between the two lead frames in conformity with the safety standard, the distance between the two translucent walls is made small so that the light transmitting property of the light path between the light receiving and emitting is ensured and the high dielectric strength is achieved. There is an excellent effect of getting.

[Brief description of drawings]

FIG. 1 is a side sectional view of an optical coupling device according to a first embodiment of the present invention.

FIG. 2 is a sectional plan view of the optical coupling device according to the first embodiment of the present invention.

FIG. 3 is a side sectional view of an optical coupling device according to a second embodiment of the present invention.

FIG. 4 is a sectional plan view of an optical coupling device according to a second embodiment of the present invention.

FIG. 5 is a characteristic comparison table of the optical coupling devices of the present invention and conventional examples 1 to 4.

FIG. 6 is a side sectional view of an optical coupling device of Conventional Example 1.

FIG. 7 is a sectional side view of an optical coupling device of Conventional Example 2.

FIG. 8 is a cross-sectional side view of an optical coupling device of Conventional Example 3.

FIG. 9 is a side sectional view of an optical coupling device of Conventional Example 4.

[Explanation of symbols]

11 Light emitting side lead frame 12 Light emitting element 13 Light receiving side lead frame 14 Light receiving element 16 translucent wall 17 Translucent pre-resin 18 Primary mold 19 Secondary mold body 31 Lower piece

Claims (6)

(57) [Claims] 1. A light emitting element is mounted on an upper surface of a light emitting side lead frame, a light receiving element is mounted on an upper surface of a light receiving side lead frame, and the light emitting element and the light receiving element are arranged in a plane so as to be optically coupled to each other. , In the optical path between the light emitting and receiving elements
At the tip of each lead frame, there is a transparent wall.
Re respectively provided, the periphery of each element is resin-sealed by the translucent pre resins, primary molded body light-transmitting pre resins and ToruHikarikabe is resin-sealed by translucent resin Is formed, the periphery of the primary mold body is resin-sealed with a light-shielding resin to form a secondary mold body, and both transparent walls are separated from each other.
The semi-translucent resin is placed in the optical path between the translucent walls.
Optical coupling device being characterized in that the. 2. A light emitting side lead frame and a light receiving side lead frame are formed side by side on a plane from a single metal plate, and the light emitting element and the light receiving element are mounted on the upper surface of each lead frame so as to be optically coupled to each other, A pair of translucent walls are spaced from each other in the optical path between the tip parts of the lead frames, and the periphery of each element is sealed with a translucent pre-resin so that its upper end is aligned with the upper end of the translucent wall. Then , the surroundings of the transparent pre-resin and the transparent wall are resin-sealed with a semi-transparent resin to form a primary mold body, and the periphery of the primary mold body is resin-sealed with a light-shielding resin. The method for manufacturing an optical coupling device according to claim 1, wherein the secondary molding body is formed by stopping. 3. The distance between the lead frames is 2 mm.
The above settings are made, and both translucent walls are
The distance between the two translucent walls is
The optical coupling device according to claim 1 , wherein the distance between the lead frames is smaller than that of the lead frame . 4. The optical coupling device according to claim 3 , wherein a lower piece is formed on the light- transmitting wall so as to wrap around and abut on the lower surface from the tip portion of each lead frame. 5. A light emitting element is mounted on a light emitting side lead frame, a light receiving element is mounted on a light receiving side lead frame, and both lead frames are arranged so that the light emitting element and the light receiving element are optically coupled to each other. Transparent on the bottom surface of the lead frame
Is brought into contact with the lower piece of the light wall, the periphery of each element, the upper end in translucent pre resin resin sealing to meet the upper end of ToruHikarikabe, the translucent pre resins and ToruHikarikabe A primary mold body is formed by resin-sealing the periphery of the primary mold body with a semi-transparent resin, and a secondary mold body is formed by resin-sealing the periphery of the primary mold body with a light-shielding resin. The method for manufacturing the optical coupling device according to claim 4. 6. A distance between RyoToruHikarikabe is 50 to 200
5. The optical coupling device according to claim 1, wherein the optical coupling device is defined so as to be suitable for a desired optical transmissivity in the range of μm. [0001]