JP3395352B2 - Manufacturing method of lightweight dielectric - Google Patents
Manufacturing method of lightweight dielectricInfo
- Publication number
- JP3395352B2 JP3395352B2 JP11137594A JP11137594A JP3395352B2 JP 3395352 B2 JP3395352 B2 JP 3395352B2 JP 11137594 A JP11137594 A JP 11137594A JP 11137594 A JP11137594 A JP 11137594A JP 3395352 B2 JP3395352 B2 JP 3395352B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- foaming
- ceramic powder
- lightweight
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は軽量誘電体の製造方法に
関し、特にたとえば、アンテナ等の材料として使用され
る軽量誘電体の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a lightweight dielectric material, and more particularly to a method for manufacturing a lightweight dielectric material used as a material for an antenna or the like.
【０００２】[0002]
【従来の技術】従来、軽量誘電体の製造方法としては、
ポリスチロールやポリエチレン等を発泡させる技術があ
った。2. Description of the Related Art Conventionally, as a method for manufacturing a lightweight dielectric,
There was a technique for foaming polystyrene and polyethylene.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、樹脂単
体は、未発泡のものでも２．５程度の比誘電率のため、
発泡後の比誘電率は、１〜２の狭い範囲になってしま
う。このため、任意の比誘電率の誘電体を得るために
は、樹脂材料に高誘電率材料を混合して発泡させる必要
がある。さらに軽量化するためには、比誘電率の高い材
料を高発泡させるのが理論上最も効果的である。However, since the resin alone has a relative dielectric constant of about 2.5 even if it is unfoamed,
The relative permittivity after foaming is in a narrow range of 1-2. Therefore, in order to obtain a dielectric having an arbitrary relative dielectric constant, it is necessary to mix a resin material with a high dielectric constant material and foam it. In order to further reduce the weight, it is theoretically most effective to highly foam a material having a high relative dielectric constant.
【０００４】そのため、比誘電率の高いセラミック粉末
をあらかじめ発泡樹脂系誘電体材料と同一の材料でカプ
セル化した後、発泡樹脂系誘電体材料とカプセル化物質
とを混合することが提案されている。しかし、この技術
では、カプセル化の工程に手間がかかる。Therefore, it has been proposed that the ceramic powder having a high relative dielectric constant is previously encapsulated with the same material as the foamed resin-based dielectric material, and then the foamed resin-based dielectric material and the encapsulating substance are mixed. . However, with this technique, the process of encapsulation takes time.
【０００５】また発泡スチロールの原粒を作る際に、誘
電体セラミック粉を発泡剤とともに混入し、その後、原
粒を発泡型に入れ蒸気などで熱発泡させる方法も提案さ
れている。しかし、この技術では、原粒作製の工程に手
間がかかり、また発泡装置が大がかりになる欠点を有す
る。Further, there has been proposed a method of mixing dielectric ceramic powder together with a foaming agent when making the original particles of expanded polystyrene, and then putting the original particles into a foaming mold and thermally foaming them with steam or the like. However, this technique has the drawbacks that the steps for producing the original particles are troublesome and the foaming device is large.
【０００６】そこで、本発明の目的は、樹脂材料やセラ
ミック材料単体のものより軽量化を図った軽量誘電体
を、比誘電率を精度よく制御して、かつ、発泡等の軽量
化工程を簡略化して製造する方法を提供することにあ
る。Therefore, an object of the present invention is to control the relative permittivity of a lightweight dielectric material which is made lighter than a resin material or a ceramic material alone, and to simplify the weight reduction process such as foaming. It is to provide a method of manufacturing by converting.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明の誘電体セラミックス粉末を分散させた発泡
ウレタン樹脂からなる軽量誘電体の製造方法は、次の工
程からなる。
（ａ）ポリオール、誘電体セラミック粉末、硬化触媒、
整泡剤および発泡剤を混合する工程
（ｂ）前記混合したものにイソシアネートを混合する工
程
（ｃ）所定の温度に成型用金型を加熱する工程
（ｄ）前記混合したものを前記成型用金型に注型し、蓋
をして型締めをした後、発泡・硬化させる工程
（ｅ）発泡・硬化させた後、発泡成型品を取り出す工程
また、前記誘電体セラミック粉末として、ＢａＴｉ
Ｏ 3 、ＳｒＴｉＯ 3 、ＴｉＯ 2 、ＣａＴｉＯ 3 、ＰｂＴｉＯ
3 、ＬａＴｉＯ 3 のいずれかを用いることを特徴とする。 In order to achieve the above object, a method for producing a lightweight dielectric body made of urethane foam resin in which dielectric ceramic powder is dispersed according to the present invention comprises the following steps. (A) polyol, dielectric ceramic powder, curing catalyst,
A step of mixing a foam stabilizer and a foaming agent; (b) a step of mixing an isocyanate with the mixed material; (c) a step of heating a molding die to a predetermined temperature; (d) the mixed material; A step of pouring into a mold, closing the mold with a lid, and foaming / curing (e) a step of foaming / curing and taking out a foamed molded product. Further, as the dielectric ceramic powder, BaTi
O 3 , SrTiO 3 , TiO 2 , CaTiO 3 , PbTiO
3, is characterized by using any of the LaTiO 3.
【０００８】[0008]
【作用】本発明の方法に用いる材料を発泡・硬化させる
ことにより、同じ比誘電率の場合に、樹脂材料やセラミ
ック材料単体に比べてより比重の小さい軽量誘電体を得
ることができる。By foaming and curing the material used in the method of the present invention, it is possible to obtain a light-weight dielectric having a smaller specific gravity than a resin material or a ceramic material alone when the dielectric constant is the same.
【０００９】また、成形用金型に注型する発泡・硬化用
の混合物の誘電体セラミックス粉末添加量や注型量を調
節することにより、得られる軽量誘電体の比誘電率を精
度よく制御することができる。Further, the relative permittivity of the obtained light-weight dielectric material can be accurately controlled by adjusting the addition amount and the casting amount of the dielectric ceramic powder of the foaming / curing mixture which is cast in the molding die. be able to.
【００１０】そして、本発明の製造方法によれば、ポリ
スチレンやポリエチレンの場合のような複合ペレット化
や原粒作製などの前処理が不要であり、ポリオールと誘
電体セラミックス粉末の混合後にイソシアネートを混合
するだけでよい。また、射出成型機やスチーム発泡成型
機などの大規模な成型機も不要で、最低限、撹拌装置、
プレスおよび成型用金型を用いて容易に軽量誘電体を得
ることができる。Further, according to the production method of the present invention, pretreatment such as composite pelletization and preparation of raw particles as in the case of polystyrene or polyethylene is not required, and isocyanate is mixed after mixing the polyol and the dielectric ceramic powder. All you have to do is In addition, there is no need for a large-scale molding machine such as an injection molding machine or a steam foam molding machine.
A lightweight dielectric can be easily obtained using a press and a molding die.
【００１１】[0011]
【実施例】以下、本発明の軽量誘電体の製造方法につい
て、その実施例を説明する。まず、所定量のポリオー
ル、ＣａＴｉＯ3 系の誘電体セラミック粉末、アミン系
の硬化触媒、シリコン系の整泡剤、および発泡剤として
の水を秤量し、ミキサーで十分分散させた。以後、この
混合物をポリオール混合物と称す。次に、このポリオー
ル混合物に硬化剤として所定量のイソシアネートを添加
し、高速で攪拌して未発泡混合物を得た。EXAMPLES Examples of the method for manufacturing a lightweight dielectric material of the present invention will be described below. First, a predetermined amount of polyol, CaTiO 3 -based dielectric ceramic powder, amine-based curing catalyst, silicon-based foam stabilizer, and water as a foaming agent were weighed and sufficiently dispersed with a mixer. Hereinafter, this mixture is referred to as a polyol mixture. Next, a predetermined amount of isocyanate was added as a curing agent to this polyol mixture, and the mixture was stirred at high speed to obtain an unfoamed mixture.
【００１２】なお、一度にポリオール、誘電体セラミッ
ク粉末、イソシアネートおよび各種添加剤を混合可能で
あるが、ポリオールとイソシアネートとの反応速度は速
く、反応前の短時間で誘電体セラミック粉末を均一に分
散させるのは困難である。そのため、誘電体セラミック
粉末をポリオール側に均一分散させておき、その後イソ
シアネートを添加して反応させた方が誘電特性のばらつ
きが少なく、機械強度のある発泡体が得られる。Although the polyol, the dielectric ceramic powder, the isocyanate and various additives can be mixed at once, the reaction rate of the polyol and the isocyanate is high, and the dielectric ceramic powder is uniformly dispersed in a short time before the reaction. It's difficult to get it done. Therefore, when the dielectric ceramic powder is uniformly dispersed in the polyol side, and then isocyanate is added and reacted, the variation in the dielectric properties is less and a foam having mechanical strength can be obtained.
【００１３】一方、６０℃に加温した発泡成型用金型を
準備しておいた。金型を加熱するのは、短時間に発泡・
硬化させるためで、これにより金型に近い部分での冷却
効果による発泡反応の抑制を防止し、高密度層（スキン
層）の生成を少なくできる。On the other hand, a mold for foam molding heated to 60 ° C. was prepared. The mold is heated in a short time
Since it is cured, it is possible to prevent the foaming reaction from being suppressed by the cooling effect in the portion close to the mold, and to reduce the generation of the high-density layer (skin layer).
【００１４】次に、得られた未発泡混合物を即座に気泡
を巻き込まぬように金型に注型した。そして、この型に
設定容積を保持できる蓋をし、プレスにより約２０ｋｇ
／ｃｍ2 で加圧して蓋が開かないようにした。なお、こ
の成形用金型には、発泡材料は漏れないが空気が逃げる
ことが可能なエアベントを配置してある。Next, the obtained unfoamed mixture was immediately cast into a mold so as not to entrap air bubbles. Then, cover the mold with a set volume and press about 20 kg.
The pressure was applied at / cm 2 to prevent the lid from opening. The molding die is provided with an air vent that does not leak the foam material but allows air to escape.
【００１５】その後、約１０分間発泡・加圧硬化させ
た。その後、成型用金型を冷却して除圧した後、蓋を開
け発泡成型した軽量誘電体を取り出した。After that, foaming and pressure curing were carried out for about 10 minutes. Then, the molding die was cooled and depressurized, the lid was opened, and the foamed lightweight dielectric material was taken out.
【００１６】以上の方法により、ＣａＴｉＯ3 セラミッ
クス粉末の添加量が、全量に対して３０ｗｔ％，４０ｗ
ｔ％および５０ｗｔ％からなる軽量誘電体を得た。By the above method, the added amount of CaTiO 3 ceramic powder is 30 wt% and 40 w with respect to the total amount.
A lightweight dielectric consisting of t% and 50 wt% was obtained.
【００１７】次に、比較例として、ポリエチレン単体に
発泡剤を練り込んだポリエチレンマスタバッチを少量混
合し、射出成型にて金型内で発泡させて軽量誘電体を作
製した。Next, as a comparative example, a small amount of a polyethylene masterbatch prepared by kneading a foaming agent into a simple substance of polyethylene was mixed and foamed in a mold by injection molding to produce a lightweight dielectric.
【００１８】次に、これら軽量誘電体について、共振法
により１２ＧＨｚでの比誘電率を測定し、さらに比重を
測定した。これらの結果を表１に示す。Next, the relative permittivity of these lightweight dielectrics was measured at 12 GHz by the resonance method, and the specific gravity was further measured. The results are shown in Table 1.
【００１９】[0019]
【表１】 [Table 1]
【００２０】表１に示す通り、本発明の軽量誘電体の製
造方法によれば、比較例の場合のポリエチレン単体を発
泡させたものと比較して、比誘電率を同じに維持しなが
ら比重の小さい、即ち、より軽量化したものが得られ
る。As shown in Table 1, according to the method for producing a lightweight dielectric material of the present invention, compared with the case of foaming polyethylene alone in the case of the comparative example, the specific gravity of the polyethylene is maintained while maintaining the same relative dielectric constant. Smaller, i.e. lighter weight is obtained.
【００２１】なお、本発明の軽量誘電体の製造方法で使
用する材料は、上記実施例に限定されるものではない。
即ち、高誘電率のセラミック粉末としては、ＢａＴｉＯ
3 、ＳｒＴｉＯ3 、ＴｉＯ2 、ＣａＴｉＯ3 、ＰｂＴｉ
Ｏ3 、ＬａＴｉＯ3 等を用いることができる。また、ポ
リオールとしては、ポリエーテルやポリエステルなどか
ら適宜選択し、イソシアネートとしてはＭＤＩやＴＤＩ
などから適宜選択して反応させることにより、使用目的
に応じて硬質、半硬質、軟質の発泡ウレタン樹脂からな
る軽量誘電体を得ることができる。また、硬化触媒とし
ては、オクテン酸錫やトリメチレンジアミンなどが好ま
しく、発泡剤としては、水、フレオン、メチレンクロラ
イドなどが好ましい。さらに、カップリング剤や滑剤等
を添加してもよい。The material used in the method of manufacturing the lightweight dielectric material of the present invention is not limited to the above-mentioned embodiment.
That is, as the high dielectric constant ceramic powder, BaTiO 3 is used.
3 , SrTiO 3 , TiO 2 , CaTiO 3 , PbTi
O 3 , LaTiO 3 or the like can be used. The polyol is appropriately selected from polyether and polyester, and the isocyanate is MDI or TDI.
By appropriately selecting from the above and reacting, a lightweight dielectric material made of a hard, semi-hard, or soft urethane foam resin can be obtained according to the purpose of use. The curing catalyst is preferably tin octenoate or trimethylenediamine, and the foaming agent is preferably water, freon or methylene chloride. Further, a coupling agent, a lubricant or the like may be added.
【００２２】また、上記軽量誘電体の製造方法におい
て、発泡後の気泡の大きさを均一にするためには、ポリ
オール混合物を作る際に気泡を巻き込まないように真空
混合機を用いるか、または混合後に脱泡をすることが好
ましい。さらにポリオール混合物とイソシアネートの混
合も気泡を巻き込まないようにし、成型金型への注型量
も定量混合吐出機を用いて定量化することが好ましい。Further, in the above method for producing a lightweight dielectric material, in order to make the size of the bubbles after foaming uniform, a vacuum mixer is used so that the bubbles are not entrained when forming the polyol mixture, or the mixture is mixed. It is preferable to defoam later. Further, it is preferable that the polyol mixture and the isocyanate are also mixed so that air bubbles are not entrained, and the casting amount into the molding die is quantified by using a quantitative mixing and discharging machine.
【００２３】さらに、成型用金型の構造は、発泡時には
金型内の空気のみが出るものがよく、発泡誘電体材料が
金型外に出るのは好ましくない。これは、所望の比誘電
率を得るための制御を、発泡誘電体材料の成型用金型へ
の注型量によって行なうことを可能とするためである。
そのため、エアベントの厚みは、５００μｍ以下が好ま
しい。Further, the structure of the molding die is preferably one in which only the air in the die comes out at the time of foaming, and it is not preferable that the foamed dielectric material comes out of the die. This is because the control for obtaining the desired relative permittivity can be performed by the casting amount of the foamed dielectric material into the molding die.
Therefore, the thickness of the air vent is preferably 500 μm or less.
【００２４】[0024]
【発明の効果】以上の説明で明らかなように、本発明の
誘電体セラミックス粉末を分散した発泡ウレタン樹脂か
らなる軽量誘電体の製造方法によれば、樹脂材料やセラ
ミック材料単体のものより軽量化を図った軽量誘電体
を、比誘電率を精度よく制御して得ることができる。As is apparent from the above description, according to the method of manufacturing a lightweight dielectric body made of urethane foam resin in which the dielectric ceramic powder is dispersed according to the present invention, the weight is lighter than that of the resin material or the ceramic material alone. It is possible to obtain a light-weight dielectric material that achieves the above by accurately controlling the relative dielectric constant.
【００２５】また、複合ペレット化や原粒作製等の前処
理が不要であり、射出成型機やスチーム発泡成型機等の
大規模な成型機も不要である。したがって、発泡等の軽
量化工程が簡略になる。Further, no pretreatment such as composite pelletizing or raw grain production is required, and a large-scale molding machine such as an injection molding machine or a steam foam molding machine is also unnecessary. Therefore, the weight reduction process such as foaming is simplified.
【００２６】さらに、成型用金型は、注型後に蓋がで
き、さらにエアベントを有するのみの簡単な構造のもの
でよい。Further, the molding die may have a simple structure in which a lid can be formed after casting and only an air vent is provided.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 19/00,3/00,3/30 B29C 39/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01B 19 / 00,3 / 00,3 / 30 B29C 39/02
Claims (2)
末を分散させた発泡ウレタン樹脂からなる軽量誘電体の
製造方法。 （ａ）ポリオール、誘電体セラミック粉末、硬化触媒、
整泡剤および発泡剤を混合する工程 （ｂ）前記混合したものにイソシアネートを混合する工
程 （ｃ）所定の温度に成型用金型を加熱する工程 （ｄ）前記混合したものを前記成型用金型に注型し、蓋
をして型締めをした後、発泡・硬化させる工程 （ｅ）発泡・硬化させた後、発泡成型品を取り出す工程1. A method for producing a lightweight dielectric body comprising a urethane foam resin in which a dielectric ceramic powder is dispersed, comprising the steps of: (A) polyol, dielectric ceramic powder, curing catalyst,
A step of mixing a foam stabilizer and a foaming agent; (b) a step of mixing an isocyanate with the mixed material; (c) a step of heating a molding die to a predetermined temperature; (d) the mixed material; Step of pouring into mold, closing lid and closing, then foaming / curing (e) Step of taking out foamed molded product after foaming / curing
ＴｉＯ 3 、ＳｒＴｉＯ 3 、ＴｉＯ 2 、ＣａＴｉＯ 3 、ＰｂＴ
ｉＯ 3 、ＬａＴｉＯ 3 のいずれかを用いることを特徴とす
る、請求項１に記載の軽量誘電体の製造方法。 2. Ba as the dielectric ceramic powder
TiO 3 , SrTiO 3 , TiO 2 , CaTiO 3 , PbT
Characterized by using one of iO 3 and LaTiO 3
The method of manufacturing a lightweight dielectric according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11137594A JP3395352B2 (en) | 1994-05-25 | 1994-05-25 | Manufacturing method of lightweight dielectric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11137594A JP3395352B2 (en) | 1994-05-25 | 1994-05-25 | Manufacturing method of lightweight dielectric |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07320537A JPH07320537A (en) | 1995-12-08 |
| JP3395352B2 true JP3395352B2 (en) | 2003-04-14 |
Family
ID=14559600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11137594A Expired - Fee Related JP3395352B2 (en) | 1994-05-25 | 1994-05-25 | Manufacturing method of lightweight dielectric |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3395352B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3638889B2 (en) | 2000-07-27 | 2005-04-13 | 大塚化学ホールディングス株式会社 | Dielectric resin foam and radio wave lens using the same |
| CN101057370B (en) | 2004-09-10 | 2011-03-09 | 住友电气工业株式会社 | Luneberg dielectric lens and method of producing same |
| CN116922656A (en) * | 2023-02-03 | 2023-10-24 | 广东福顺天际通信有限公司 | Method for producing foaming electromagnetic wave lens |
-
1994
- 1994-05-25 JP JP11137594A patent/JP3395352B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07320537A (en) | 1995-12-08 |
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