JP3389813B2 - Mounting method of conductive ball - Google Patents

Description

BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to tower mounting method of the conductive ball using the suction head of a multi-chamber type. 2. Description of the Related Art As a method for manufacturing electronic components with bumps such as flip chips, a method using a suction head is known. In this method, a conductive ball provided in a supply unit such as a container is vacuum-adsorbed to a suction hole formed in a lower surface of a suction head, picked up, and mounted on an electrode of a work such as a chip. It is known to use a multi-chamber type suction head in order to increase productivity. In a multi-chamber suction head, a plurality of chambers are provided in the suction head so that conductive balls can be simultaneously mounted on a plurality of works, and the conductive balls are provided in suction holes formed in the lower surface of each chamber. In this method, a conductive ball is mounted on a plurality of works by vacuum suction. [0004] When a conductive ball is mounted on a work using a multi-chamber suction head, it is necessary to stop using one of the plurality of chambers. There is. Such a case is when, for example, one of the plurality of works is defective and the mounting of the conductive ball is to be stopped, or the number of chambers is smaller than the number of works positioned at the mounting position. There are many cases. In such a case, it is necessary to stop picking up the conductive balls by the chamber whose use is stopped. However, since it is difficult to make a plurality of chambers independent and complete airtight chambers, the inside of the chamber to be discontinued is slightly vacuumed due to the vacuum of the adjacent chamber during vacuum suction. As a result, the conductive ball is easily erroneously vacuum-sucked into the suction hole of the chamber and is easily picked up. Therefore, according to the present invention, a conductive chamber can be advantageously mounted on a workpiece by using a multi-chamber type suction head. In particular, the conductive ball is erroneously inserted into a suction hole of a chamber to be discontinued. and to provide a tower mounting method of the conductive balls can be reliably prevented from being vacuum suction is picked up. [0007] [0008] According to an aspect of the present invention, a vacuum suction to pick up conductive balls provided in the supply portion of the conductive ball suction holes of the suction head of a multi-chamber type,
A method for mounting a conductive ball to be transferred and mounted on a work positioned at a positioning unit, wherein when stopping the pickup of the conductive ball by any one of the multi-chambers, the chamber for picking up is performed. vacuum suction by the vacuum pump, also to the small positive pressure state by the air source to the chamber that was discontinued pickup
From the suction hole of the chamber so as to blow out air Te
When mounting conductive balls on a workpiece,
A large positive pressure is applied to the
The distance from the suction hole of the nozzle was improved . According to the present invention, when a conductive ball in a supply section is picked up by vacuum suction, a minute positive pressure is applied to a chamber whose use is to be discontinued. It is possible to reliably prevent the conductive ball from being erroneously vacuum-sucked into the suction hole of the chamber and picked up. When mounting conductive balls on a workpiece
Applies a large positive pressure to the chamber to break the vacuum
Improve the distance of the conductive ball from the suction hole and mount it on the work
Can be done . An embodiment of the present invention will be described below with reference to the drawings. 1 is a front view of a conductive ball mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the suction head and a work, and FIGS. 3, 4, and 5 are pneumatic systems of the suction head. FIG. 6 is a sectional view of the suction head, and FIGS. 7 and 8 are perspective views of the work. First, the overall structure of the conductive ball mounting device will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a conductive ball, which is stored in a large amount in a container 2 as a supply unit. The container 2 is placed on a base 3. Reference numeral 4 denotes a chip unit as a work, which is positioned by the positioning unit 5. Reference numeral 15 denotes a suction head,
It is attached to the front of. The frame 6 has a vertically moving mechanism 7 for vertically moving the suction head 15 and a cylinder 14 as a pressing means for pressing the suction head 15 downward.
Is mounted, and when the motor 8 is driven, the suction head 1 is
5 moves up and down. The frame 6 is held on a horizontal moving table 9, and moves in the horizontal direction along the moving table 9 when the motor 10 is driven. Between the base 3 and the positioning unit 5, there is provided a flux application unit 12 for applying a flux 11 to the conductive ball 1 vacuum-adsorbed on the lower surface of the adsorption head 15. In FIG. 1, the suction head 15
Is simply described. In FIG. 2, the chip unit 4 is a multi-chamfer, and has two chips 4a in the horizontal direction and four chips 4a in the vertical direction. The chip 4a is obtained. In addition, the suction head 15
As will be described later, it has two chambers, and the conductive balls 1 are mounted on electrodes (not shown) of the two chips 4a in one operation. The chip unit 4 is subjected to a product inspection in a previous process. A bad mark 13 is marked on a defective chip 4a such as a chip. As will be described later, mounting of the conductive ball 1 on the chip 4a on which the bad mark 13 is marked is stopped. Next, the suction head 15 and its pneumatic system will be described. FIG. 3 shows a piping state when the suction head 15 picks up the conductive ball 1 in the container 2 by vacuum suction. FIG. 4 shows a piping state when the suction head 15 mounts the conductive balls 1 on the chip unit 4. FIG. 5 shows a piping state when the use of the right chamber 22 is stopped. First, the structure of the suction head 15 will be described with reference to FIG. The suction head 15 is composed of an upper box 16 and a lower box 17 and is connected by fitting a clamper 20 to each of the flanges 18 and 19 (see also FIG. 2). A partition wall 21 is provided inside the suction head 15, whereby the inside of the suction head 15 is divided into two chambers 22. A seal 23 is provided at an appropriate position on the upper box 16. A suction hole 24 is formed on the lower surface of the lower box 17. One chamber 22
Are formed with suction holes 24 corresponding to the electrodes of one chip 4a. Therefore, the suction head 15 mounts the conductive balls 1 on the two chips 4a in one operation. Next, the pneumatic system will be described. In FIG. 3, 31 is a first vacuum valve, 32 is a first vacuum break valve, 33 is a second vacuum valve, and 34 is a second vacuum break valve. 35 is a first pressure regulating valve, 36
Is a second pressure regulating valve, 37 is a vacuum pump, and 38 is a high-pressure air source. The pipes 26 (see also FIG. 2) erected on the two chambers 22 are each provided with a first vacuum valve 31.
And a vacuum pump 37 via a second vacuum valve 33, so that the first vacuum valve 31 and the second vacuum suction valve 33 are turned on and off (passages a and b).
, The vacuum suction of each chamber 22 can be individually controlled independently of each other. When the path a is connected, the chamber 22 is turned on and the chamber 22 is vacuum-sucked. When the path b is connected, the chamber 22 is turned off and connected to the vacuum break valves 32 and 34. The first vacuum break valve 32 and the first pressure regulating valve 35 are connected in parallel. The input side is connected to an air source 38, and the output side is connected to the first vacuum valve 31. I have. The second vacuum break valve 34 and the second pressure regulating valve 36 are also the same piping. Accordingly, when the passage c is connected, the air is turned ON and air is fed to the chamber 22 through the passage b of the vacuum valves 31 and 33, and the inside of the chamber 22 is broken by a positive pressure. As will be described later, by lowering the suction head 15, the conductive ball 1 vacuum-sucked in the suction hole 24 lands on the chip 4a, and then the suction head 15 is raised to move the conductive ball 1 to the chip 4a. When mounted on the chamber 22, a large positive pressure is applied to the chamber 22 to instantaneously break the vacuum state in the chamber 22, thereby improving the separation of the conductive ball 1 from the suction hole 24. When picking up the conductive balls 1 by moving the suction head 15 up and down with respect to the container 2, the vacuum break valve 3 is provided to the chamber 22 where the picking up of the conductive balls 1 is stopped.
By turning off the pressure control valves 35, 3
A small amount of air is sent from 6 to make a small positive pressure state. Thus, by slightly blowing air from the suction hole 24, the conductive ball 1 is reliably prevented from being vacuum-sucked to the suction hole 24 and picked up. Note that the magnitude of the minute positive pressure is adjusted by the pressure adjusting valves 35 and 36. This conductive ball mounting apparatus has the above-described configuration, and the entire operation will be described next. First,
The operation of mounting the conductive balls 1 on all the chips 4a of the chip unit 4 will be described. In FIG. 1, the suction head 15 moves above the container 2 and moves up and down there to pick up the conductive ball 1 by vacuum suction in the suction hole 24. FIG. 3 shows a pipe state at this time. In this case, the first vacuum valve 31 and the second vacuum valve 33 are connected to the passage a and are ON, and the two chambers 22 are suctioned by the vacuum pump 37 through the passage a (see arrows A1 and A2). ). Next, the suction head 15 is connected to the flux coating unit 1.
2 and move up and down there,
The flux 11 is attached to the conductive ball 1. Next, the suction head 15 moves above the chip unit 4, where it moves up and down to mount the conductive ball 1 on the chip 4a. FIG. 4 shows a pipe state at this time. In this case, as described above, the first vacuum valve 31 and the second vacuum valve 33 are turned off to connect the passage b,
The vacuum break valve 32 and the second vacuum break valve 34
N and the passage c is connected. Then, a large amount of air is sent from the air source 38 to instantaneously break the inside of the chamber 22 under vacuum (arrows B1 and B2). It is detached and mounted on the chip 4a. Next, the operation in the case where the bad mark 13 is present on one of the chips 4a and the use of one of the chambers 22 is stopped will be described. The information of the defective chip 4a on which the bad mark 13 is marked is registered in advance in a memory of a control unit (not shown) such as a computer. FIG. 5 shows the state of the piping at this time. The suction head 15 moves above the container 2 and moves up and down to pick up the conductive ball 1 by vacuum suction. In FIG. 5, the left chamber 22 is used and the right chamber 22 is stopped.
In this case, the air pressure control of the left chamber 22 to be used is the same as that in the case of FIG. 3, and the chamber 22 is vacuum-evacuated to pick up the conductive ball 1 as shown by an arrow A1. The control of the air pressure in the right side chamber 22 where the use is stopped is performed as follows. In FIG. 5, the second vacuum valve 33 is turned off to connect the passage b. Also, the second vacuum breaking valve 34 is turned off. Then, a small amount of air is pressure-fed from the air source 38 to the right chamber 22 through the second pressure regulating valve 36, and the inside of the chamber 22 becomes a minute positive pressure and slightly blows out the air from the suction hole 24 (arrow c). . The magnitude of this minute positive pressure is adjusted by the second pressure adjusting valve 36. Therefore, the suction hole 2 of the left chamber 22
4, the conductive ball 1 is vacuum-adsorbed and picked up. However, the conductive ball 1 is not picked up by suction in the suction hole 24 of the right chamber 22. If this positive pressure is not applied, a broken arrow K in FIG.
As shown in the figure, a vacuum leak occurs from the joint between the partition walls 21 of the upper box 16 and the lower box 17, and the inside of the left chamber 22 is also in a vacuum state, whereby the conductive balls 1 are erroneously vacuum-sucked into the suction holes 24. Is picked up. The following operation is the same as the above case.
The suction head 15 moves above the flux application section 12 and performs an up-down operation to attach the flux 11 to the conductive balls 1. Then, the suction head 15 moves above the chip unit 4, where the up-down operation is performed. Then, the conductive ball 1 is mounted on the chip 4a. Of course, since the conductive ball 1 is not vacuum-sucked in the suction hole 24 of the right chamber 22, the conductive ball 1 is not mounted on the defective chip 4a on which the bad mark 13 is marked. Next, control of the magnitude of the pressure applied to the suction head 15 will be described with reference to FIG. FIG.
(A) shows two chip units 4 in two chambers 22.
This is a case where the conductive balls 1 are mounted on the individual chips 4a. In this case, the pressing force F1 of the cylinder 14 is increased. FIG. 6B shows a case where the use of one of the chambers 22 is stopped. In this case, the number of the conductive balls 1 is as shown in FIG.
6A, the conductive ball 1 is pressed against the chip 4a with an excessive force when a pressing force having the same magnitude as that in FIG. 6A is applied. As a result, the conductive ball 1 1 may be deformed or may not fit into the suction hole 24 and fall out of the suction hole 24. Therefore, in this case, the pressing force F2 of the cylinder 14 is reduced. As described above, the conductive ball 1 is always attached to the tip 4a with an appropriate force.
It can be mounted by pressing it. In the above embodiment, the case where the mounting of the conductive ball 1 on the chip 4a with the bad mark 13 is stopped has been described as an example. Next, another operation method will be described. FIG. 7 shows a case where a single chip 4 a is mounted on the positioning section 5. In this case, 2
Of course, use of one of the two chambers 22 is stopped. The work 4A shown in FIG. 8 has a plurality of chips 4a in a row, and is cut along a broken line in a later step. Also in this case, use of one of the chambers 22 is stopped. Of course, if the arrangement direction of the two chambers 22 is the same as the arrangement direction of the chips 4a, the two chambers 22
Thus, the conductive ball 1 can be mounted. Further, in the above-described embodiment, an example in which two chambers are provided as a multi-chamber suction head has been described. However, the number of chambers may be any number as long as it is two or more. According to the present invention, in the case where the conductive balls of the supply section are vacuum-adsorbed and picked up by the multi-chamber suction head, the use of the chamber is stopped.
By applying the minute positive pressure, it is possible to reliably prevent the conductive ball from being erroneously vacuum-sucked into the suction hole of the chamber and picked up. Also a conductive bow
When mounting the tool on a workpiece, apply a large positive pressure to the chamber.
In addition, the vacuum is broken and the conductive balls separate from the suction holes.
It can be mounted on a work with better quality.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a conductive ball mounting apparatus according to an embodiment of the present invention; FIG. FIG. 3 is a block diagram of a pneumatic system of a suction head of a conductive ball mounting apparatus according to one embodiment of the present invention. FIG. 4 is a conductive ball mounting apparatus of one embodiment of the present invention. FIG. 5 is a block diagram of a pneumatic system of the suction head. FIG. 5 is a block diagram of a pneumatic system of the suction head of the conductive ball mounting device according to one embodiment of the present invention. FIG. 6 is a conductive ball of one embodiment of the present invention. FIG. 7 is a cross-sectional view of a suction head of a mounting device of the present invention. FIG. 7 is a perspective view of a work of a conductive ball mounting device of one embodiment of the present invention. FIG. 8 is a conductive ball mounting device of one embodiment of the present invention. [Description of References] 1 Conductive ball 2 Container 3 Arrangement parts 4, 4A Work 4a Chip 9 Moving table 14 Cylinder 15 Suction head 22 Chamber 24 Suction hole 31 First vacuum valve 32 First vacuum break valve 33 Second vacuum valve 34 Second vacuum break valve 35 First pressure regulating valve 36 Second pressure regulating valve 37 Vacuum pump 38 Air source

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/60 B23P 21/00 305

Claims (1)

(57) Claims 1. A conductive ball provided in a conductive ball supply unit is vacuum-sucked into a suction hole of a multi-chamber type suction head, picked up, and positioned at a positioning unit. A method of mounting a conductive ball to be transferred and mounted on a workpiece, wherein when the picking up of the conductive ball by any one of the multi-chambers is stopped, the chamber for picking up is vacuum suctioned by a vacuum pump. and, also as is the chamber was discontinued pick then blowing the air from the suction hole of the chamber and the small positive pressure state by the air source and word conductive balls
When mounting on a workpiece, apply a large positive pressure to the chamber.
Breaks vacuum state and improves separation of conductive balls from suction holes
A method for mounting a conductive ball, characterized in that the conductive ball is mounted.