JP3386204B2 - Manufacturing method of lead-based ceramic electronic components - Google Patents
Manufacturing method of lead-based ceramic electronic componentsInfo
- Publication number
- JP3386204B2 JP3386204B2 JP25184193A JP25184193A JP3386204B2 JP 3386204 B2 JP3386204 B2 JP 3386204B2 JP 25184193 A JP25184193 A JP 25184193A JP 25184193 A JP25184193 A JP 25184193A JP 3386204 B2 JP3386204 B2 JP 3386204B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- based ceramic
- ceramic electronic
- mesh
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】この発明は、鉛系セラミック電子
部品の製造方法に関するもので、特に、このような電子
部品に備える部品本体を得るための焼成工程の改良に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a lead-based ceramic electronic component, and more particularly to an improvement in a firing process for obtaining a component body for such an electronic component.
【０００２】[0002]
【従来の技術】鉛系セラミック電子部品を製造すると
き、鉛系セラミックとなる組成を含む成形体を焼成して
部品本体を得る工程を伴う。鉛系セラミックの場合、そ
の焼成において、鉛が蒸発されやすく、このような鉛の
蒸発を抑制するため、鉛リッチの雰囲気で焼成すること
が行なわれている。また、鉛の蒸発を見込んで、鉛を過
剰に含んだ組成をもって成形体を用意することも行なわ
れている。2. Description of the Related Art When manufacturing a lead-based ceramic electronic component, a step of firing a molded body containing a composition to be a lead-based ceramic to obtain a component body is involved. In the case of lead-based ceramics, lead is easily vaporized during firing, and firing is performed in a lead-rich atmosphere in order to suppress such vaporization of lead. In addition, in consideration of the evaporation of lead, a molded body having a composition containing lead in excess is also prepared.
【０００３】上述した鉛系セラミックのための焼成は、
通常、鉛を吸収しない材質（緻密質）の台、あるいは、
鉛を積極的に吸収する材質（多孔質）の台の上に成形体
を載せた状態で行なわれている。他に、鉛化合物の粉体
の中に成形体を埋めた状態で焼成する方法、等もある。Firing for the lead-based ceramics described above is
Normally, a base (dense material) that does not absorb lead, or
It is performed in a state where the molded body is placed on a base (porous material) that actively absorbs lead. In addition, there is also a method in which a molded body is embedded in a powder of a lead compound and baked.
【０００４】[0004]
【発明が解決しようとする課題】特に鉛が過剰な鉛系セ
ラミック材料の場合、焼成中に過剰な鉛を蒸発させる必
要がある。しかしながら、緻密質の台を用いる場合、台
と接触する部分において、鉛を蒸発させることが困難で
ある。他方、多孔質の台を用いる場合、台と接触する部
分においても、台が鉛を吸収するので、鉛を良好に蒸発
させることができる。しかしながら、多孔質の台であっ
ても、焼成回数を重ねるとともに、鉛の吸収能力が飽和
し、やがて鉛を吸収しなくなる。その結果、鉛の過剰な
鉛系セラミック焼結体が得られてしまう。Particularly in the case of lead-based ceramic materials having an excessive amount of lead, it is necessary to evaporate the excessive amount of lead during firing. However, when a dense base is used, it is difficult to vaporize lead at the portion that comes into contact with the base. On the other hand, when a porous table is used, the table absorbs lead even in a portion that comes into contact with the table, so that lead can be vaporized well. However, even with a porous base, as the number of firings increases, the lead absorption capacity saturates and eventually does not absorb lead. As a result, a lead-based ceramic sintered body containing excess lead is obtained.
【０００５】上述のように、鉛系セラミック焼結体にお
いて、過剰な鉛が含まれていると、鉛系セラミック電子
部品のたとえば絶縁抵抗のような特性が悪くなる。この
ように、鉛系セラミック電子部品では、鉛系セラミック
からなる部品本体に含まれる鉛の量が問題であり、その
ような鉛の量は、焼成時における鉛の蒸発量によって大
きく左右される。しかしながら、上述したように、緻密
質の台を用いる場合には、鉛を所望のごとく蒸発させに
くく、また、多孔質の台を用いる場合には、繰返し実施
される焼成の各々において、同じ蒸発量を得るのが困難
であり、したがって、得られた鉛系セラミック電子部品
の品質も一致させるのが困難である。As described above, when the lead-based ceramic sintered body contains an excessive amount of lead, the characteristics such as insulation resistance of the lead-based ceramic electronic component deteriorate. As described above, in the lead-based ceramic electronic component, the amount of lead contained in the component body made of the lead-based ceramic is a problem, and the amount of such lead is greatly influenced by the amount of lead evaporated during firing. However, as described above, when a dense base is used, it is difficult to evaporate lead as desired, and when a porous base is used, the same evaporation amount is obtained in each of the repeated firings. Is difficult to obtain, and it is therefore difficult to match the quality of the obtained lead-based ceramic electronic components.
【０００６】それゆえに、この発明の目的は、焼成回数
にかかわらず、鉛の蒸発量を一定化できる焼成工程を備
える鉛系セラミック電子部品の製造方法を提供しようと
することである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method of manufacturing a lead-based ceramic electronic component including a firing process that can keep the amount of lead evaporation constant regardless of the number of firings.
【０００７】[0007]
【課題を解決するための手段】この発明は、鉛系セラミ
ックとなる組成を含む成形体を焼成して得られる部品本
体を備える鉛系セラミック電子部品の製造方法に向けら
れるものであって、上述した技術的課題を解決するた
め、成形体が、孔が貫通するメッシュ上の、その孔を有
する領域に置かれた状態で焼成されることを特徴として
いる。メッシュは、たとえば、Ａｌ 2 Ｏ 3 、ＺｒＯ 2 、
ＭｇＯ、ＴｉＯ 2 、およびＢａＯから選ばれる１成分ま
たは２成分の混合系のセラミックにより構成されるか、
あるいは、金属を基材として構成される。 The present invention is directed to a method of manufacturing a lead-based ceramic electronic component including a component body obtained by firing a molded body containing a composition to be a lead-based ceramic. In order to solve the above technical problem, the molded body has a hole on the mesh through which the hole penetrates.
It is characterized in that it is fired in a state where it is placed in the area to be heated. The mesh is, for example, Al 2 O 3 , ZrO 2 ,
One component selected from MgO, TiO 2 and BaO
Or, it is composed of two-component mixed ceramics,
Alternatively, a metal is used as a base material.
【０００８】[0008]
【作用】この発明において、成形体は、孔が貫通するメ
ッシュ上の、その孔を有する領域に置かれた状態で焼成
されることから、メッシュに対してわずかな部分におい
て接触するにすぎず、また、この接触部分において、鉛
の蓄積がほとんど生じない。In the present invention, the molded product is a member through which the holes penetrate.
Baked on the ash in the area with the holes
As a result, only a slight portion of the mesh is brought into contact with the mesh, and lead is hardly accumulated in this contact portion.
【０００９】[0009]
【発明の効果】したがって、この発明によれば、焼成回
数を重ねても、鉛の蒸発量をほとんど一定とすることが
できるので、特性を実質的に一定に保ちながら、所望の
鉛系セラミック電子部品を常時製造することができる。Therefore, according to the present invention, the amount of lead vaporized can be made almost constant even if the number of firings is increased, so that the desired lead-based ceramic electronic material can be obtained while keeping the characteristics substantially constant. The parts can always be manufactured.
【００１０】[0010]
【実施例】図１は、この発明の一実施例による鉛系セラ
ミック電子部品の製造方法に含まれる焼成工程を実施し
ている状態を示す図解的断面図である。1 is a schematic sectional view showing a state in which a firing step included in a method of manufacturing a lead-based ceramic electronic component according to an embodiment of the present invention is being carried out.
【００１１】鉛系セラミック電子部品に備える部品本体
を得るために用意された、鉛系セラミックとなる組成を
含む成形体１は、メッシュ２上に置かれ、このメッシュ
２は、たとえばジルコニアのようなセラミックからなる
台３の上に置かれる。この状態で、成形体１が焼成され
る。A molded body 1 containing a composition to be a lead-based ceramic, which is prepared to obtain a component body for a lead-based ceramic electronic component, is placed on a mesh 2, which is made of, for example, zirconia. It is placed on a table 3 made of ceramic. In this state, the molded body 1 is fired.
【００１２】上述したメッシュ２は、たとえば、セラミ
ックから構成されたり、金属からなる基材をセラミック
でコートしたものから構成されたりすることができる。The mesh 2 described above can be made of, for example, ceramic or a metal base material coated with ceramic.
【００１３】メッシュ２がセラミックから構成される場
合、セラミックとして、Ａｌ2 Ｏ3、ＺｒＯ2 、Ｍｇ
Ｏ、ＴｉＯ2 、およびＢａＯから選ばれる１成分または
２成分の混合系が好ましく、特に、ＺｒＯ2 およびその
混合系がより好ましい。When the mesh 2 is made of ceramic, Al 2 O 3 , ZrO 2 , Mg is used as the ceramic.
A mixed system of one component or two components selected from O, TiO 2 and BaO is preferable, and ZrO 2 and a mixed system thereof are particularly preferable.
【００１４】また、メッシュ２が金属を基材としてセラ
ミックでコートされたもので構成される場合、基材とな
る金属として、Ｍｏ、Ｗ、Ｃｏ、Ｎｉ、Ｆｅ、Ｃｒ、Ｔ
ｉ、Ｃｕ、Ｐｄ、Ｔａ、およびＭｎから選ばれる１成分
またはこれらの合金が好ましく、特に、Ｆｅ、Ｃｏおよ
びＮｉおよびそれらの合金がより好ましい。また、コー
トのためのセラミックとして、Ａｌ2 Ｏ3 、ＺｒＯ2 、
ＭｇＯ、ＴｉＯ2 、およびＢａＯから選ばれる１成分ま
たは２成分の混合系が好ましく、特に、ＺｒＯ 2 および
その混合系がより好ましい。Further, the mesh 2 is made of a metal as a base material and is made of ceramic.
When it is composed of Mick coated material,
Mo, W, Co, Ni, Fe, Cr, T
One component selected from i, Cu, Pd, Ta, and Mn
Or these alloys are preferable, especially Fe, Co and
And Ni and their alloys are more preferred. Also,
Al as a ceramic for2O3, ZrO2,
MgO, TiO2, And one component selected from BaO
Or a mixed system of two components is preferable, and ZrO is particularly preferable. 2and
The mixed system is more preferable.
【００１５】また、メッシュ２は、成形体１が落下しな
い大きさを上限として、オープニング面積が広いほどよ
く、また、線径（またはそれに相当する寸法）が小さい
ほど好ましい。また、メッシュ２の形式としては、平
織、クリンプ織、綾織、エキスパンド、パンチング等、
任意であるが、図１におけるメッシュ２と台３との間に
より広い間隔が形成される点で、クリンプ織、エキスパ
ンド等が特に好ましい。The mesh 2 preferably has a larger opening area with a size at which the molded body 1 does not drop as an upper limit, and a wire diameter (or a dimension corresponding thereto) is preferably smaller. The mesh 2 may be of any type such as plain weave, crimp weave, twill weave, expand, punching, etc.
Although it is optional, crimp weave, expanded and the like are particularly preferable in that a wider space is formed between the mesh 2 and the base 3 in FIG.
【００１６】以下に、この発明による効果を確認するた
め実施した実験例について記載する。The experimental examples carried out to confirm the effects of the present invention will be described below.
【００１７】鉛系セラミック材料として、鉛複合ペロブ
スカイト構造の誘電体を用い、平面寸法が３．２ｍｍ×
２．５ｍｍの積層セラミックコンデンサのための成形体
を準備した。これを、以下の表１に示した材質で構成さ
れた多孔質の台、緻密質の台およびメッシュの上にそれ
ぞれ載せ、大気中や酸素雰囲気中において８００〜１０
００℃で焼成した。また、同じ多孔質の台、緻密質の台
およびメッシュを用いて、上述したような焼成を繰返し
た。このような焼成を経て得られたそれぞれの積層セラ
ミックコンデンサの絶縁抵抗（ＩＲ）を測定した。表１
には、その結果も併わせて示されている。As the lead-based ceramic material, a lead composite perovskite structure dielectric is used, and the plane dimension is 3.2 mm ×
A molded body for a 2.5 mm laminated ceramic capacitor was prepared. This was placed on a porous base, a dense base and a mesh made of the materials shown in Table 1 below, and 800 to 10 in the air or oxygen atmosphere.
It was baked at 00 ° C. Further, the firing as described above was repeated using the same porous base, dense base and mesh. The insulation resistance (IR) of each monolithic ceramic capacitor obtained through such firing was measured. Table 1
The results are also shown in.
【００１８】[0018]
【表１】 [Table 1]
【００１９】上記表１において、焼成回数１〜１０の下
方の欄に記載された「０／２１」等の数字は、試料総数
５０における不良発生試料数を示し、特に、「／」によ
って分けられた２つの数字の前者は、log IR≦７．８７
となる試料数を示し、後者は、７．８７≦log IR≦９．
００となる試料数を示している。In Table 1 above, the numbers such as "0/21" written in the lower columns of the firing times 1 to 10 indicate the number of defective samples in the total number of samples of 50, and are particularly divided by "/". The former of the two numbers is log IR ≤ 7.87.
And the latter is 7.87 ≦ log IR ≦ 9.
The number of samples is 00.
【００２０】表１からわかるように、多孔質、緻密質お
よびメッシュのいずれにおいても、ジルコニアを用いた
ものは、他の材料を用いたものに比べて、優れた結果を
示している。しかしながら、多孔質および緻密質を用い
た場合には、焼成回数が増えるにつれて、絶縁抵抗が悪
くなる傾向がある。これに対して、メッシュを用いたも
のについては、いずれにおいても、焼成回数が増えて
も、絶縁抵抗の劣化を招いていない。As can be seen from Table 1, the use of zirconia in all of the porous, dense and mesh shows excellent results as compared with the use of other materials. However, when porous and dense materials are used, the insulation resistance tends to deteriorate as the number of firings increases. On the other hand, in any of those using the mesh, the insulation resistance is not deteriorated even if the number of firings is increased.
【図１】この発明の一実施例による鉛系セラミック電子
部品の製造方法に含まれる焼成工程を実施する状態を示
す図解的断面図である。FIG. 1 is a schematic sectional view showing a state in which a firing step included in a method for manufacturing a lead-based ceramic electronic component according to an embodiment of the present invention is performed.
１ 成形体 ２ メッシュ ３ 台 1 molded body 2 mesh 3 units
Claims (2)
を焼成して得られる部品本体を備える鉛系セラミック電
子部品の製造方法であって、 前記成形体は、孔が貫通するメッシュ上の、前記孔を有
する領域に置かれた状態で焼成されることを特徴とす
る、鉛系セラミック電子部品の製造方法。1. A method of manufacturing a lead-based ceramic electronic component, comprising a component body obtained by firing a molded product containing a composition to be a lead-based ceramic, wherein the molded component is on a mesh through which holes penetrate , With the hole
A method for manufacturing a lead-based ceramic electronic component, comprising: firing in a state where the lead-based ceramic electronic component is placed.
Ｏ 2 、ＭｇＯ、ＴｉＯ 2 、およびＢａＯから選ばれる１
成分または２成分の混合系のセラミックにより構成され
るか、または、金属を基材として構成されることを特徴
とする、請求項１記載の鉛系セラミック電子部品の製造
方法。 2. The mesh comprises Al 2 O 3 and Zr
1 selected from O 2 , MgO, TiO 2 , and BaO
Consisted of single-component or two-component mixed ceramics
Or is composed of metal as a base material
The manufacture of the lead-based ceramic electronic component according to claim 1.
Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25184193A JP3386204B2 (en) | 1993-10-07 | 1993-10-07 | Manufacturing method of lead-based ceramic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25184193A JP3386204B2 (en) | 1993-10-07 | 1993-10-07 | Manufacturing method of lead-based ceramic electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07106182A JPH07106182A (en) | 1995-04-21 |
| JP3386204B2 true JP3386204B2 (en) | 2003-03-17 |
Family
ID=17228727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25184193A Expired - Lifetime JP3386204B2 (en) | 1993-10-07 | 1993-10-07 | Manufacturing method of lead-based ceramic electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3386204B2 (en) |
-
1993
- 1993-10-07 JP JP25184193A patent/JP3386204B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07106182A (en) | 1995-04-21 |
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