JP3384696B2 - LED print head - Google Patents
LED print headInfo
- Publication number
- JP3384696B2 JP3384696B2 JP24212596A JP24212596A JP3384696B2 JP 3384696 B2 JP3384696 B2 JP 3384696B2 JP 24212596 A JP24212596 A JP 24212596A JP 24212596 A JP24212596 A JP 24212596A JP 3384696 B2 JP3384696 B2 JP 3384696B2
- Authority
- JP
- Japan
- Prior art keywords
- driving
- led array
- light emitting
- array
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＬＥＤプリンタ等
の光源に用いられるＬＥＤプリントヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED print head used as a light source for an LED printer or the like.
【０００２】[0002]
【従来の技術】ＬＥＤプリントヘッドにおいては、ＬＥ
Ｄアレイとその駆動用ＩＣの接続をワイヤボンド配線に
よって行うのが一般的であるが、近年このワイヤボンド
配線に代わる実装技術が、例えば特開平７−６１０４０
号公報や特開平５−２２９１７４号公報にて提案されて
いる。In LED printheads, LE
It is common to connect the D array and its driving IC by wire bond wiring. In recent years, a mounting technique replacing this wire bond wiring has been disclosed in, for example, Japanese Patent Laid-Open No. 7-61040.
Japanese Patent Laid-Open Publication No. Hei 5-229174.
【０００３】前者の構造を図４を参照して説明すると、
配線基板１００の側方にＬＥＤアレイ１０１を配置し、
配線基板１００とＬＥＤアレイ１０１を跨ぐように駆動
用ＩＣ１０２をバンプ１０３による接続構造を用いて実
装するとともに、配線基板１００の下面から延出した導
体１０４をＬＥＤアレイ１０１の下面に接着して実装し
た構造となっている。このような構造によれば、ＬＥＤ
アレイ１０１と駆動用ＩＣ１０２の間のワイヤボンド配
線が不要となるので量産化に適しているが、基板１００
とＬＥＤアレイ１０１の接続構造が複雑となるととも
に、ＬＥＤアレイ１０１の固定が不安定となってＬＥＤ
アレイ１０１を精度良く配列することができないという
課題がある。The former structure will be described with reference to FIG.
The LED array 101 is arranged on the side of the wiring board 100,
The driving IC 102 is mounted using a connection structure using bumps 103 so as to straddle the wiring board 100 and the LED array 101, and a conductor 104 extending from the lower surface of the wiring board 100 is bonded and mounted on the lower surface of the LED array 101. It has a structure. According to such a structure, the LED
Since the wire bond wiring between the array 101 and the driving IC 102 is unnecessary, it is suitable for mass production.
The connection structure between the LED array 101 and the LED array 101 becomes complicated, and the fixation of the LED array 101 becomes unstable.
There is a problem that the array 101 cannot be arranged accurately.
【０００４】次に、後者の構造を図５を参照して説明す
ると、配線基板２００の上に駆動用ＩＣ２０１を導電性
接着剤によって接着固定し、この駆動用ＩＣ２０１の上
に発光部を下にしたＬＥＤアレイ２０２をバンプ２０３
による接続構造を用いて面実装した構造である。このよ
うな構造によれば、ＬＥＤアレイ２０２と駆動用ＩＣ２
０１の間のワイヤボンド配線が不要となるので量産化に
適しているが、ＬＥＤアレイ２０２の発光部が設けられ
た側を駆動用ＩＣ２０１に対面配置する必要があるの
で、ＬＥＤアレイ２０２の発光方向が駆動用ＩＣ２０１
の存在によって側面に限定されてしまい、設計の自由度
が少なくなる。また、ＬＥＤアレイ２０２を駆動用ＩＣ
２０１の上に配置するので、ドライバーＩＣ２０１の形
状や取付精度がＬＥＤアレイ２０２の取付精度に影響を
与える要因となるため、ＬＥＤアレイ２０１を精度良く
配列することができないという課題がある。Next, the latter structure will be described with reference to FIG. 5. The driving IC 201 is adhered and fixed onto the wiring board 200 with a conductive adhesive, and the light emitting portion is placed above the driving IC 201. Bumped the LED array 202
It is a structure that is surface-mounted using the connection structure according to. According to such a structure, the LED array 202 and the driving IC 2
This is suitable for mass production because the wire bond wiring between 01 is unnecessary, but since the side where the light emitting portion of the LED array 202 is provided needs to be face-to-face with the driving IC 201, the light emitting direction of the LED array 202 Is the driving IC 201
Is limited to the side, and the degree of freedom in design is reduced. In addition, the LED array 202 is a driving IC
Since the LED array 201 is arranged on the LED 201, the shape and the mounting accuracy of the driver IC 201 affect the mounting accuracy of the LED array 202, so that the LED array 201 cannot be accurately arranged.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記の点を
考慮して成されたもので、ＬＥＤアレイの配列精度を良
好に保ち、プリンタの印字品位を良好にすることを主な
課題とする。また、製品の歩留まりを高めること、設計
の自由度を確保すること、形状の小型化を図ること、組
立て作業性を良好にすること、など課題とするものであ
る。SUMMARY OF THE INVENTION The present invention has been made in consideration of the above points, and its main object is to maintain good LED array arrangement accuracy and to improve the printing quality of a printer. To do. Further, there are problems such as increasing the yield of products, ensuring the degree of freedom in design, downsizing the shape, and improving the workability in assembling.
【０００６】[0006]
【課題を解決するための手段】本発明のＬＥＤプリント
ヘッドは、発光部に接続した個別電極並びにＩＣ入力用
の配線電極を上面に有し、主出光部を上面に設定したＬ
ＥＤアレイと、下面に入出力端子を有して前記ＬＥＤア
レイ上面に実装される駆動用ＩＣを備え、前記ＬＥＤア
レイの主出光部が前記駆動用ＩＣと平面的に重ならない
ように前記駆動用ＩＣを配置したことを特徴とする。An LED printhead according to the present invention has an individual electrode connected to a light emitting portion and a wiring electrode for inputting an IC on the upper surface, and a main light emitting portion set on the upper surface.
An ED array and a driving IC having an input / output terminal on the lower surface and mounted on the upper surface of the LED array are provided, and the main light emitting portion of the LED array is not overlapped with the driving IC in plan view. It is characterized by arranging an IC.
【０００７】[0007]
【０００８】また、本発明のＬＥＤプリントヘッドは、
発光部に接続した個別電極並びにＩＣ入力用の配線電極
を上面に有し、主出光部を側面に設定したＬＥＤアレイ
と、下面に入出力端子を有して前記ＬＥＤアレイ上面に
実装される駆動用ＩＣを備え、前記ＬＥＤアレイの発光
部と前記駆動用ＩＣの平面的な重なり持たせて前記駆動
用ＩＣを配置したことを特徴とする。Further, the LED print head of the present invention is
An LED array having individual electrodes connected to the light emitting section and wiring electrodes for IC input on the upper surface, and a main light emitting section set on the side surface, and an input / output terminal on the lower surface mounted on the upper surface of the LED array A driving IC, and the driving IC is arranged such that the light emitting portion of the LED array and the driving IC overlap each other in a plane.
【０００９】[0009]
【発明の実施の形態】以下本発明の実施例を図面を参照
して説明する。まず、図１，２を参照して第１の実施例
を説明する。この実施例の光プリントヘッド１は、長尺
の配線基板２の上に複数個のＬＥＤアレイ３をその長手
方向に沿って配列固定し、このＬＥＤアレイ３の上に駆
動用ＩＣ４を実装して構成している。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment will be described with reference to FIGS. In the optical print head 1 of this embodiment, a plurality of LED arrays 3 are arrayed and fixed on a long wiring board 2 along the longitudinal direction thereof, and a driving IC 4 is mounted on the LED array 3. I am configuring.
【００１０】配線基板２は、絶縁基材の上にＬＥＤアレ
イ２配置用の共通電極２１、電源や信号の供給を行うた
めの電極配線２２を有している。The wiring board 2 has a common electrode 21 for arranging the LED array 2 and an electrode wiring 22 for supplying power and signals on an insulating base material.
【００１１】ＬＥＤアレイ３は、例えば、ＧａＡｓＰ／
ＧａＡｓなどのＮ型の化合物半導体基板３１の表面に保
護膜３２を形成し、この保護膜３２に整列して開けた孔
からＰ型不純物を拡散させてＰ層３３を形成し、ＰＮ接
合による発光部３４を整列して形成している。ＬＥＤア
レイ３の上面には、各発光部３４のＰ層３３に個別に接
続する個別電極３５と、駆動用ＩＣ４に外部から印字デ
ータに対応する信号を入力するＩＣ入力用の配線電極３
６を保護膜３２の上に設け、ＬＥＤアレイ３の下面に
は、共通電極３７を設けている。個別電極３５と入力用
の配線電極３６は、同じ厚みに設定され、例えばアルミ
ニウム配線で構成される。発光部３４から発せられた光
は等方向に出てくるが、内部吸収により図１に矢印で示
すように上向きの光が最大となるように、すなわち、主
出光部がＬＥＤアレイ３の上面となるように設定されて
いる。The LED array 3 is, for example, GaAsP /
A protective film 32 is formed on the surface of an N-type compound semiconductor substrate 31 such as GaAs, and P-type impurities are diffused from holes formed in the protective film 32 aligned with each other to form a P layer 33. The parts 34 are formed in alignment. On the upper surface of the LED array 3, an individual electrode 35 that is individually connected to the P layer 33 of each light emitting unit 34, and a wiring electrode 3 for IC input that inputs a signal corresponding to print data to the driving IC 4 from the outside.
6 is provided on the protective film 32, and the common electrode 37 is provided on the lower surface of the LED array 3. The individual electrode 35 and the input wiring electrode 36 are set to have the same thickness and are made of, for example, aluminum wiring. The light emitted from the light emitting portion 34 is emitted in the same direction, but the internal light is absorbed so that the upward light is maximized as shown by the arrow in FIG. 1, that is, the main light emitting portion is located on the upper surface of the LED array 3. Is set to.
【００１２】駆動用ＩＣ４は、ＬＥＤアレイ３よりも幅
が狭いもので構成され、下面の一側に前記配線電極３６
に対応した入力端子部、他側に前記個別電極３５に対応
した出力端子部（いずれも図示せず）を有している。The driving IC 4 has a width smaller than that of the LED array 3, and the wiring electrode 36 is formed on one side of the lower surface.
And an output terminal (not shown) corresponding to the individual electrode 35 on the other side.
【００１３】この駆動用ＩＣ４は、ＬＥＤアレイ３の上
面に位置決め配置され、ＬＥＤアレイ３もしくは駆動用
ＩＣ４に予め設けた導電接続材、例えばバンプ５（金や
ハンダ等で構成される）を介して接続される。ここで、
ＬＥＤアレイ３から発せられる上向きの光が駆動用ＩＣ
４によって阻害されないように、駆動用ＩＣ４は、前記
ＬＥＤアレイ３の発光部３４上に位置する主出光部と平
面的に重ならないように実装されている。The driving IC 4 is positioned and arranged on the upper surface of the LED array 3, and via a conductive connecting material such as a bump 5 (composed of gold or solder) provided in advance on the LED array 3 or the driving IC 4. Connected. here,
The upward light emitted from the LED array 3 is a driving IC.
The driving IC 4 is mounted so as not to overlap the main light emitting portion located on the light emitting portion 34 of the LED array 3 in plan view so as not to be obstructed by the light emitting portion 4.
【００１４】ＬＥＤアレイ３と駆動用ＩＣ４の実装体
は、配線基板２への実装前に容易に特性検査を行うこと
ができるので、検査によって良品と判断されたもののみ
を配線基板２に実装することができ、ＬＥＤプリントヘ
ッド１の歩留まりを高めることができる。Since a characteristic inspection can be easily performed on the mounting body of the LED array 3 and the driving IC 4 before mounting on the wiring board 2, only those which are judged to be non-defective by the inspection are mounted on the wiring board 2. Therefore, the yield of the LED print head 1 can be increased.
【００１５】ＬＥＤアレイ３と駆動用ＩＣ４の実装体
は、位置決めされて導電性接着剤６によって配線基板２
の共通電極２１に実装される。そして、電極配線２２と
駆動用ＩＣ４のＩＣ入力用の配線電極３６の間にワイヤ
ボンド装置（図示せず）によってボンディングワイヤ７
が接続される。The mounting body of the LED array 3 and the driving IC 4 is positioned and the wiring board 2 is formed by the conductive adhesive 6.
Mounted on the common electrode 21. Then, a bonding wire 7 is formed between the electrode wiring 22 and the wiring electrode 36 for IC input of the driving IC 4 by a wire bonding device (not shown).
Are connected.
【００１６】光プリントヘッド１は上記のように、配線
基板２の上にＬＥＤアレイ３を配置し、その上に駆動用
ＩＣ４をバンプ５を介して接続配置しているので、全体
の幅を短くすることができるとともに、配線基板２の上
にＬＥＤアレイ３を配置するので、駆動用ＩＣ４を介在
して基板２に配置する従来方式に比べて、駆動用ＩＣ４
の形状や駆動用ＩＣ４を接続するための接続構造（導電
性接着剤やバンプ等）に起因する取付誤差を少なくで
き、配線基板２に沿ったＬＥＤアレイ２全体の配置精度
を高めることができる。よって、プリンタの印字品を良
好に保つことができる。As described above, in the optical print head 1, the LED array 3 is arranged on the wiring board 2, and the driving IC 4 is connected and arranged thereon via the bumps 5, so that the overall width is shortened. In addition, since the LED array 3 is arranged on the wiring board 2, the driving IC 4 is arranged in comparison with the conventional method in which the driving IC 4 is arranged on the board 2.
It is possible to reduce the mounting error due to the shape and the connection structure (conductive adhesive, bumps, etc.) for connecting the driving IC 4, and it is possible to improve the placement accuracy of the entire LED array 2 along the wiring board 2. Therefore, the printed product of the printer can be kept good.
【００１７】また、ＬＥＤアレイ３はその発光部３４を
上部に位置させて装着することができるので、発光部を
下部に位置させた従来方式のように側面発光方式に限定
されることがなく、上面発光方式と側面発光方式を必要
に応じて設計することができる。Further, since the LED array 3 can be mounted with the light emitting portion 34 positioned above, the LED array 3 is not limited to the side light emitting type as in the conventional method in which the light emitting portion is positioned below. The top emission method and the side emission method can be designed as needed.
【００１８】ここで、側面発光方式の実施例について、
図３を参照して説明する。図１に示す上面発光方式との
主な相違点は、ＬＥＤアレイ３の発光部３４からそれに
隣接する側面までの距離を短くして側面に主出光点を設
定した点、ＬＥＤアレイ３の発光部３４と駆動用ＩＣ４
の平面的な重なりを持つように、ＬＥＤアレイ３の幅を
狭くした点で、その他の基本的な構成は第１実施例とほ
ぼ同じである。側面発光を助長するために、図３に示す
ようにＰ層３３が側面に露出するようにしてもよいし、
上面発光を抑えるために、発光部３４の上を個別電極３
５によってより広く覆うこともできる。側面発光方式に
することによって、駆動用ＩＣ４の配置に要するＬＥＤ
アレイ３上の領域が少なくて済み、ＬＥＤアレイ３や配
線基板２の幅を狭く設定することができる。Here, regarding the embodiment of the side surface emission type,
This will be described with reference to FIG. The main difference from the top emission method shown in FIG. 1 is that the distance from the light emitting portion 34 of the LED array 3 to the side surface adjacent thereto is shortened and the main light emitting point is set on the side surface. 34 and driving IC 4
The other basic configuration is almost the same as that of the first embodiment in that the width of the LED array 3 is narrowed so as to have a planar overlap. In order to promote side surface light emission, the P layer 33 may be exposed on the side surface as shown in FIG.
In order to suppress the top emission, the individual electrode 3 is placed on the light emitting portion 34.
It can also be covered more broadly by 5. LEDs required for arranging the driving IC 4 by adopting the side surface emission method
The area on the array 3 is small, and the width of the LED array 3 and the wiring board 2 can be set narrow.
【００１９】[0019]
【発明の効果】以上のように、本発明のＬＥＤプリント
ヘッドによれば、ＬＥＤアレイと駆動用ＩＣの接続のた
めのワイヤが不要となり、組立て作業性を高めることが
できるとともに、ＬＥＤアレイと駆動用ＩＣを接続した
状態で特性検査ができるので、歩留まりの向上を図るこ
とができる。また、基板にＬＥＤアレイを配置しその上
に駆動用ＩＣを配置するので、ＬＥＤアレイの取付誤差
の発生要因を最小限にでき、ＬＥＤアレイの組立て精度
（発光点の配列精度）を高めることができる。さらに、
ＬＥＤプリントヘッドの幅を狭くすることができる。ま
た、上面発光方式と側面発光方式の両方に対応すること
ができるので、ＬＥＤヘッドの設計自由度を高めること
もできる。As described above, according to the LED print head of the present invention, the wire for connecting the LED array and the driving IC is not necessary, the assembling workability can be improved, and the LED array and the driving can be improved. Since the characteristics can be inspected in the state where the IC for use is connected, the yield can be improved. Further, since the LED array is arranged on the substrate and the driving IC is arranged on the LED array, it is possible to minimize the cause of the LED array mounting error and improve the LED array assembling accuracy (light emitting point arrangement accuracy). it can. further,
The width of the LED print head can be reduced. Further, since it is possible to support both the top emission method and the side emission method, it is possible to increase the degree of freedom in designing the LED head.
【図１】本発明の一実施例を示す要部断面図である。FIG. 1 is a sectional view of an essential part showing an embodiment of the present invention.
【図２】同実施例の要部平面図である。FIG. 2 is a plan view of a main part of the embodiment.
【図３】本発明の他の実施例を示す要部断面図である。FIG. 3 is a cross-sectional view of an essential part showing another embodiment of the present invention.
【図４】従来例を示す断面図である。FIG. 4 is a cross-sectional view showing a conventional example.
【図５】他の従来例を示す断面図である。FIG. 5 is a cross-sectional view showing another conventional example.
１ ＬＥＤプリントヘッド ２ 配線基板 ３ ＬＥＤアレイ ４ 駆動用ＩＣ ５ バンプ 1 LED print head 2 wiring board 3 LED array 4 Driving IC 5 bumps
フロントページの続き (56)参考文献 特開 平２−3354（ＪＰ，Ａ) 特開 平７−61040（ＪＰ，Ａ) 特開 平２−278893（ＪＰ，Ａ) 特開 昭63−249669（ＪＰ，Ａ) 実開 平５−5463（ＪＰ，Ｕ) 実開 昭62−167645（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B41J 2/44 B41J 2/45 B41J 2/455 H01L 33/00 H04N 1/036 Continuation of the front page (56) Reference JP-A-2-3354 (JP, A) JP-A-7-61040 (JP, A) JP-A-2-278893 (JP, A) JP-A-63-249669 (JP , A) Actually open 5-5463 (JP, U) Actually open 62-167645 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) B41J 2/44 B41J 2/45 B41J 2/455 H01L 33/00 H04N 1/036
Claims (2)
力用の配線電極を上面に有し、主出光部を上面に設定し
たＬＥＤアレイと、下面に入出力端子を有して前記ＬＥ
Ｄアレイ上面に実装される駆動用ＩＣを備え、前記ＬＥ
Ｄアレイの主出光部が前記駆動用ＩＣと平面的に重なら
ないように前記駆動用ＩＣを配置したことを特徴とする
ＬＥＤプリントヘッド。 [Claim 1, wherein a wiring electrode of the individual electrodes and the IC input connected to the light emitting portion has a top surface, a LED array is set to the upper surface of the main light exit portion, the input and output terminals on the lower surface LE
The LE is provided with a driving IC mounted on the upper surface of the D array.
An LED print head in which the driving ICs are arranged so that the main light emitting portion of the D array does not overlap the driving ICs in plan view.
力用の配線電極を上面に有し、主出光部を側面に設定し
たＬＥＤアレイと、下面に入出力端子を有して前記ＬＥ
Ｄアレイ上面に実装される駆動用ＩＣを備え、前記ＬＥ
Ｄアレイの発光部と前記駆動用ＩＣの平面的な重なり持
たせて前記駆動用ＩＣを配置したことを特徴とするＬＥ
Ｄプリントヘッド。2. The LE having an LED array having an individual electrode connected to a light emitting portion and a wiring electrode for inputting an IC on the upper surface, and a main light emitting portion set on the side surface, and an input / output terminal on the lower surface.
The LE is provided with a driving IC mounted on the upper surface of the D array.
The LE is characterized in that the driving IC is arranged such that the light emitting portion of the D array and the driving IC overlap each other in a plane.
D print head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24212596A JP3384696B2 (en) | 1996-09-12 | 1996-09-12 | LED print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24212596A JP3384696B2 (en) | 1996-09-12 | 1996-09-12 | LED print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1086439A JPH1086439A (en) | 1998-04-07 |
| JP3384696B2 true JP3384696B2 (en) | 2003-03-10 |
Family
ID=17084680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24212596A Expired - Fee Related JP3384696B2 (en) | 1996-09-12 | 1996-09-12 | LED print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3384696B2 (en) |
-
1996
- 1996-09-12 JP JP24212596A patent/JP3384696B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1086439A (en) | 1998-04-07 |
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