JP3381305B2 - Photosensitive composition for microlenses - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a color solid-state image pickup device,
The present invention relates to a micro-condensing lens material formed on a color filter of a color liquid crystal display device, etc., and a photosensitive composition that can be used for applications using a micro-lens-shaped concavo-convex pattern and a heat-cured concavo-convex pattern.

[0002]

2. Description of the Related Art In recent years, with the spread of color video cameras using image pickup devices, the demand for high-quality image pickup devices is increasing. Then, in order to cope with high image quality, a micro condenser lens is formed. That is, the micro condenser lens is usually formed on the uppermost part of the color filter layer, the intermediate film, the protective film, etc. formed on the image pickup device,
This lens is disclosed in JP-A-1-91103 and JP-A-1-24.
6505, JP-A-1-257901, JP-A 1-2
As shown in Japanese Patent No. 63601 and the like, there are effects such as improvement in sensitivity of the element and reduction in aliasing distortion of an output signal of the element, and formation of a micro focusing lens is an indispensable condition for a color solid-state image pickup element. ing.

Further, in color liquid crystal display elements, the formation of microlenses is being studied, and in principle, the same function as that of the image pickup element is required.

Further, a reflector of a liquid crystal display element as described in JP-A-4-315129 and JP-A-5-34730, or an interlayer for a thin film magnetic head described in JP-A-4-63351 and the like. Insulation layer etc. are patterned,
The uneven shape formed after thermosetting can be used.
Although there is no regulation regarding transparency and refractive index, it is expected that the specifications will be the same or stricter with respect to other functions, especially durability such as chemical resistance and heat resistance.

There are various methods for forming a micro condenser lens, for example, Japanese Patent Laid-Open Nos. 1-246505 and 3-53.
No. 223702, a transparent photosensitive resin is applied on the surface protective film, exposed and developed so that the resin layer remains in the portion corresponding to the photodiode, and then the pattern is heat-treated.

By the way, the performance of the image pickup element is changing day by day, and the characteristics required for the micro condenser lens are becoming severer day by day. The basic required characteristics of lens forming materials are high refractive index, high transparency in the visible light range, excellent heat resistance after pattern deformation, chemical resistance, and light resistance. It has excellent resisting properties, high sensitivity and high resolution. In particular, regarding the lens forming ability, it is necessary to have a curvature with sufficient light collecting ability with the recent miniaturization of photodiodes. For example, in the forming method of heat-treating the above pattern, the dimension of the pattern changes. It is closer to the ideal to have roundness without doing it.

[0007]

For example, when a positive type photoresist for semiconductor integrated circuit is used as a microlens material, a micro condenser lens can be formed by coating, prebaking, exposing, developing and heat treatment.

However, practical use of this lens is impossible. There are various reasons for this, but problems such as poor chemical resistance, pattern flow when reheating after lens formation, and extremely low transparency can be considered.

Therefore, in order to solve this problem, an alkali-soluble resin, 1,2-naphthoquinonediazide sulfonic acid ester as a photosensitizer, and heat curing for imparting heat resistance and chemical resistance when forming a lens by heat treatment. Agent,
In particular, it provides a positive photosensitive material for microlenses, which comprises a melamine-based curing agent and a solvent (JP-A-3-223).
702).

However, this positive type photosensitive material also has some dissatisfaction with respect to durability such as chemical resistance and is not yet sufficient.

The present invention has been made in view of the above problems, and an object thereof is to provide a material which sufficiently satisfies the above-mentioned required characteristics.

[0012]

Means for Solving the Problems The inventors of the present invention have conducted extensive studies based on such a background, and as a result, when an alkali-soluble resin containing an epoxy group is used as a base polymer, the transparency is good, Heat-resistant after thermosetting, excellent in chemical resistance, and found that a positive photosensitive composition composed of a naphthoquinonediazide-based photosensitizer can solve the above-mentioned problems, and completed the present invention. Is. That is, the present invention is an alkali-soluble resin containing an epoxy group, in particular, a resin or a vinylphenol polymer, a vinylphenol copolymer, a polycondensate of phenols and aldehydes, which comprises a structural unit represented by a predetermined general formula. A resin obtained by epoxy-modifying a part of hydroxyl groups such as a novolac resin or a partial hydrogenated product of each resin, a 1,2-naphthoquinonediazide sulfonic acid ester as a photosensitizer and a solvent, and a curing aid and / if necessary. Alternatively, it is a photosensitive composition for microlenses containing a thermosetting agent.

The present invention will be described in more detail below.

The epoxy group-containing alkali-soluble resin in the present invention is soluble in a solvent and capable of forming a film,
There is no particular limitation as long as it contains an epoxy group. This is to impart a binder as a photosensitive composition, solubility in an alkali developing solution, and good thermosetting property by heat treatment after pattern formation. As the alkali-soluble component, for example, a resin containing a phenolic hydroxyl group or a carboxylic acid such as maleic acid or acrylic acid can be selected. In particular, in order to realize excellent durability at the time of heat curing and good stability of the photosensitive composition in a solution, it is preferable that the structural unit is represented by the following general formula (1). .

[0015]

[Chemical 5]

[Wherein R ₁ represents hydrogen or a methyl group,
A is the following general formula (2), general formula (3) or general formula (4)
And m and n each represent an integer of 1 or more. ]

[0017]

[Chemical 6]

[0018]

[Chemical 7]

[0019]

[Chemical 8]

[In the formula, R ₂ , R ₃ and R ₄ each represent hydrogen or a methyl group, and B is —OCH ₂ — or —CH ₂ OC.
H ₂ − is shown. The method for incorporating an epoxy group into the alkali-soluble resin is not particularly limited, and examples thereof include copolymerization of the monomer and polymer reaction of the polymer.

The epoxy group-containing alkali-soluble resin of the present invention includes vinylphenol polymers, vinylphenol copolymers, novolak resins which are polycondensates of phenols and aldehydes, or partial hydrogen of each resin. Resins obtained by epoxy-modifying a part of hydroxyl groups such as additives are also suitable.

The method for synthesizing the alkali-soluble resin containing an epoxy group in the present invention is not particularly limited, but it can be synthesized, for example, by the following method.

The alkali-soluble resin containing an epoxy group consisting of the structural unit represented by the general formula (1) can be synthesized by radical copolymerization with vinylphenol. Also,
The vinylphenol polymer can be synthesized by radical polymerization or cationic polymerization, and the novolac resin can be synthesized by polycondensation of phenol, cresols and aldehydes such as formaldehyde. The method for hydrogenating the vinylphenol polymer or the novolac resin is not particularly limited, but for example, JP-A-1-103604 and JP-A-2
-4254, JP-A-2-29751, JP-A-2-9
It can be synthesized by a method such as 752. The epoxy modification of the hydroxyl group of the vinylphenol polymer or the novolak resin can be synthesized, for example, by reaction with epichlorohydrin or the like under a basic catalyst.

Regarding the polymerization of vinylphenol, it is also possible to copolymerize it with another monomer having a double bond capable of copolymerization. Examples of the copolymerization component include (meth) acrylic acid esters such as methyl acrylate, methyl methacrylate and hydroxyethyl methacrylate, acid amides such as acrylamide and methacrylamide, acrylonitrile and styrene.

The molecular weight, copolymerization ratio and modification ratio of the alkali-soluble resin in the present invention are not particularly limited as long as the alkali-soluble resin having sufficient lithographic properties is maintained and heat flow and heat curing are well balanced. However, for example, the molecular weight is preferably 1,000 to 20,000, and the copolymerization ratio is 30 to 70 mol for the phenol component.
%, The epoxy modification rate is preferably 30 mol% or more, and the above characteristics can be sufficiently satisfied.

As the photosensitizer in the present invention, 1,2-
Naphthoquinone diazide sulfonic acid ester, which is for imparting a dissolution inhibiting effect to the alkali developing solution in the unexposed area and a dissolution promoting effect in the exposed area.

The ester component of 1,2-naphthoquinonediazide sulfonic acid ester is not particularly limited as long as it can maintain the characteristics, but for example, 2,4
-Dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,2 ', 3,4,4'-pentahydroxybenzophenone, phenol, 1,3-dihydroxy Examples thereof include benzene, 1,3,5-trihydroxybenzene, methyl gallate, ethyl gallate, and phenyl gallate.

In addition to the photosensitive composition of the present invention,
The addition of a curing aid for promoting thermal curing can complete the curing at a relatively low temperature and in a short time,
Further, it is preferable because the chemical resistance can be further improved.

The curing aid is not particularly limited as long as it has good storage stability and sufficient thermosetting property, and examples thereof include latent thermal acid generators and latent photoacid generators. Agents, polycarboxylic acid anhydrides, polycarboxylic acids, phenol compounds, amine compounds, imidazole compounds can be used. In particular, the latent thermal acid generator is effective in terms of storage stability, and polyvalent carboxylic acid anhydrides, polyvalent carboxylic acids, and phenol compounds are also effective. Specifically, as the thermal acid generator, an organic halogen compound,
Examples of the onium salt include an organohalogen compound such as a trihalomethyl group-containing triazine compound and an oxadiazole compound, and examples of the onium salt include an allyldiazonium salt, a (di) allyliodonium salt, (di,
Examples thereof include tri) allyl sulfonium salt. Further, carboxylic acid anhydrides include phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic anhydride, and the like as aromatics, and succinic anhydride, maleic anhydride, and the like as aliphatics. Examples of the alicyclic group include methyl nadic acid anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride and methyltetrahydrophthalic anhydride. Examples of the carboxylic acid include ring-opened products of the above acid anhydrides. Further, as the phenolic compound, (poly) hydroxybenzophenone, bis [(poly) hydroxyphenyl] sulfone, bis [(poly) hydroxyphenyl]
Examples thereof include sulfide, bisphenol A and bisphenol F.

Further, for the purpose of adjusting the lens shape at the time of forming a lens pattern using the photosensitive composition of the present invention and / or when further curing is required, within a range that does not deteriorate the characteristics, You may add a thermosetting agent, for example, an epoxy type, a melamine type, an isocyanate type, a polyfunctional unsaturated compound, a polyhydric alcohol, etc. to the photosensitive composition in this invention. In particular, epoxy type and melamine type are preferable in order to obtain sufficient curing characteristics. For example, as the epoxy type curing agent, n-butyl glycidyl ether, 2-ethoxyhexyl glycidyl ether,
Phenylglycidyl ether, allylglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, glycerol polyglycidyl ether, sorbitol polyglycidyl ether and other glycidyl ethers, adipic acid diglycidyl ester, o-phthalate Glycidyl esters such as acid diglycidyl ester, 3,4-epoxycyclohexylmethyl (3,4-epoxycyclohexane) carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl (3,4-epoxy-6-methylcyclohexane) Carboxylate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, dicyclopentadiene oxide, bis Alicyclic epoxy such as 2,3-epoxy cyclopentyl) ether and the like, also,
Examples of the melamine-based curing agent include hexamethylolmelamine, alkylated hexamethylolmelamine, partially methylolated melamine or an alkylated product thereof, tetramethylolbenzoguanamine, alkylated tetramethylolbenzoguanamine, partially methylolated benzoguanamine or an alkylated product thereof. .

The photosensitive composition of the present invention comprises an alkali-soluble resin containing an epoxy group as described above, a 1,2-naphthoquinonediazide sulfonic acid ester and a solvent as a photosensitizer, and, if necessary, a curing aid and And / or a thermosetting agent, and the combination thereof is characteristic.

That is, the alkali-soluble resin containing an epoxy group is, in particular, a copolymer of vinylphenol and an epoxy group-containing monomer, and / or a vinylphenol (co) polymer, a novolac resin or a part of each resin. By using a resin in which a part of hydroxyl groups such as a hydrogenated product is modified with an epoxy group, a system that is alkali-soluble, has a large refractive index, and has good transparency can be realized. Moreover, heat resistance,
It is characterized by excellent light resistance and no change in transparency.

By using 1,2-naphthoquinonediazide sulfonic acid ester as a photosensitizer and mixing it with the above alkali-soluble resin, a high-resolution resist which does not swell in an alkali developing solution can be realized. The epoxy group contained in the alkali-soluble resin is necessary for imparting heat resistance and chemical resistance by thermosetting. In particular, heat curing can be performed simultaneously with lens formation, which is extremely advantageous in the process.

With respect to the photosensitive composition of the present invention, the composition ratio of the resin and the photosensitizer can be variously changed within the range where the characteristics can be maintained. For example, the photosensitizer is 10 to 30 relative to the resin. Good weight%. Within this range,
Adhesiveness, transparency, sensitivity, resolution, and good lens forming ability can be exhibited with stable properties.

The photosensitive composition of the present invention is obtained by dissolving a resin and a photosensitizer in an appropriate solvent so that the solid content is 10 to 40 parts by weight. Examples of the solvent include ethylene glycol monoalkyl ether or its acetates,
Propylene glycol monoalkyl ether or its acetates, diethylene glycol mono- or dialkyl ethers, alkyl propionate or its alkoxys, methyl ethyl ketone, methyl isobutyl ketone, ketones such as cyclohexanone, ethyl acetate, acetic acid esters such as butyl acetate, toluene, Examples thereof include aromatic hydrocarbons such as xylene, ethyl lactate, diacetone alcohol, dimethylacetamide, dimethylformamide, N-methylpyrrolidone and the like. These solvents can be used alone or in combination of two or more.

If necessary, in order to improve the coating property, a nonionic, fluorine-based or silicon-based surfactant may be added. Furthermore, if necessary, other compatible additives may be added.

The photosensitive composition of the present invention can be used for forming a resist pattern by ultraviolet rays, far ultraviolet rays, electron beams, X-rays and the like, and has excellent sensitivity and resolution. In particular, by performing a baking process after pattern formation,
A condenser lens can be formed. The formed lens has a large refractive index and is excellent in transparency, heat resistance, and chemical resistance.

The method of using the photosensitive composition of the present invention to form a resist pattern by irradiation with radiation is not particularly limited and may be a conventional method. Further, the lens pattern can be obtained by performing a heat treatment after forming the resist pattern.

For example, first, the photosensitive resin solution is prepared by dissolving the epoxy group-containing alkali-soluble resin of the present invention and the photosensitizer in a solvent, and filtering (for example, using a filter having a pore size of about 0.2 μm) to remove insolubles. Prepared by removing. A photosensitive resin film is obtained by spin-coating a photosensitive resin solution on a substrate such as a silicon wafer or a resin hard-baked on a silicon wafer and pre-baking. Then, a resist pattern can be formed by performing exposure with a reduction projection exposure device, a proximity aligner, a mirror projection, an electron beam exposure device, etc., and developing and rinsing. As a developer,
Sodium hydroxide, potassium hydroxide, sodium carbonate,
Inorganic alkaline aqueous solutions such as sodium silicate, sodium metasilicate and ammonia, primary amines such as ethylamine and n-propylamine, secondary amines such as diethylamine and di-n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, Alcohol amines such as dimethylethanolamine and triethanolamine, and organic alkaline aqueous solutions such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline can be used. Furthermore, alcohols and surfactants may be added in appropriate amounts to the above alkaline aqueous solution before use. Other techniques such as coating, baking, exposure, development, and rinsing can follow conventional methods for forming resist patterns for manufacturing integrated circuits and the like.

The resist pattern can be formed as described above. Next, for the lens pattern, the formed resist pattern is first exposed to UV light over the entire surface to impart transparency, and then 100 to 200 ° C., preferably 130 to 18 on a hot plate or in a convection oven.
It can be formed by heat treatment at a predetermined temperature of 0 ° C. for a predetermined time of about 1 to 30 minutes. The shape and curvature of the lens can be arbitrarily selected depending on the setting conditions.

[0041]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.

Example 1 Vinylphenol / glycidyl methacrylate copolymer (copolymerization ratio 1/1, weight average molecular weight 8000 (GPC measured value, converted to polystyrene)) 25 g, 1,2,2,3,4-trihydroxybenzophenone -Naphthoquinone diazide sulfonic acid ester (triester form) 6.0 g,
Benzyl-p-hydroxyphenylmethylsulfonium hexafluoroantimonate (curing aid, Sanshin Chemical Co., Ltd.,
SI-100) (0.2 g) and diethylene glycol dimethyl ether (72 g) were mixed and dissolved, and then filtered through a 0.2 μm filter to prepare a resist solution.

Next, a resist solution having a thickness of 2.0 μm was formed by spin coating a resist solution on a silicon substrate.
Prebaking was performed on a hot plate at 0 ° C. for 90 seconds. After that, a g-line reduction projection exposure apparatus (DSW-6300
A, GCA) and exposed with a 2.4% tetramethylammonium hydroxide aqueous solution. The patterning could resolve 0.8 μmL / S at 550 mJ / cm ² .

Next, the obtained 6 μmL / S pattern was used for U
Whole surface exposure with V light (PLA-501, Canon) (LI
= 30), and then heated on a hot plate at 140 ° C. for 10 minutes to flow and cure simultaneously to form a lens pattern. After forming the lens pattern, no deformation of the pattern was observed even if heat treatment was performed at 200 ° C.

The refractive index of the lens pattern was 1.57, which was a good value as a lens material. In addition, the transparency of the lens pattern in the visible light range is good, for example, 4
It was 95% at 00 nm. No change in transparency was observed even after heating at 200 ° C.

Chemical resistance is water, isopropyl alcohol,
When it was dipped in a solvent of xylene or methyl ethyl ketone, no surface roughness was observed. Further, the samples heated at 200 ° C. for 1 hour had good resistance to mineral acids such as nitric acid and hydrochloric acid, and no change was observed. Furthermore, 2
It was confirmed that even the sample heated at 50 ° C. for 1 hour had good chemical resistance, no heat shrinkage and no pattern deformation, and very high heat resistance.

Example 2 Methacrylic acid ester containing vinylphenol / alicyclic epoxy group (manufactured by Daicel Chemical Industries, Cyclomer (trademark))
M-100) copolymer (copolymerization ratio 60/40, weight average molecular weight 5000 (GPC measurement value, polystyrene conversion))
After 25 g, 6.0 g of 1,2-naphthoquinone diazide sulfonic acid ester of 2,3,4-trihydroxybenzophenone (triester form) and 63 g of diethylene glycol dimethyl ether were mixed and dissolved, filtration was performed with a 0.2 μm filter to form a resist. A solution was prepared.

Next, patterning and lens formation were carried out in the same manner as in Example 1. When developed with a 2.4% tetramethylammonium hydroxide aqueous solution, 6
It was possible to resolve 0.8 μm at 00 mJ / cm ² . Curing conditions: 160 ° C, 10 minutes (hot plate)
The lens shape at that time was also good. The chemical resistance was also good.

Example 3 Methacrylic acid ester containing vinylphenol / alicyclic epoxy group (manufactured by Daicel Chemical Industries, Cyclomer (trademark))
M-100) copolymer (copolymerization ratio 60/40, weight average molecular weight 10000 (GPC measurement value, converted to polystyrene)) 25 g, 2,3-naphthoquinonediazide sulfonic acid ester of 2,3,4-trihydroxybenzophenone ( Triester body) 6.0 g, 4,4'-bis (4-
2.0 g of hydroxyphenyl) sulfone (curing aid) and 77 g of diethylene glycol dimethyl ether were mixed and dissolved, and then filtered with a 0.2 μm filter to prepare a resist solution.

Next, patterning and lens formation were performed by the same method as in Example 1. When developed with a 2.4% aqueous solution of tetramethylammonium hydroxide, 4
It was possible to resolve 0.8 μm at 00 mJ / cm ² . Curing conditions: 150 ° C, 10 minutes (hot plate)
The lens shape at that time was also good. The chemical resistance was also good.

Example 4 Methacrylic acid ester containing vinylphenol / alicyclic epoxy group (manufactured by Daicel Chemical Industries, Cyclomer (trademark))
M-100) copolymer (copolymerization ratio 60/40, weight average molecular weight 10000 (GPC measurement value, converted to polystyrene)) 25 g, methyl gallate 1,2-naphthoquinonediazide sulfonate (triester) 6. 0
4.0 g of polyfunctional alicyclic epoxy resin (thermosetting agent, manufactured by Daicel Chemical Industries, Epolide (trademark) GT-400)
And 85 g of diethylene glycol dimethyl ether were mixed and dissolved, and then filtered with a 0.2 μm filter,
A resist solution was prepared.

Next, patterning and lens formation were performed by the same method as in Example 1. When developed with a 2.4% aqueous solution of tetramethylammonium hydroxide, 3
It was possible to resolve 0.8 μm at 00 mJ / cm ² . Curing conditions: 140 ° C, 10 minutes (hot plate)
The lens shape at that time was also good. The chemical resistance was also good.

Example 5 Methacrylic acid ester containing vinylphenol / alicyclic epoxy group (manufactured by Daicel Chemical Industries, Cyclomer (trademark))
M-100) copolymer (copolymerization ratio 60/40, weight average molecular weight 10000 (GPC measurement value, converted to polystyrene)) 25 g, methyl gallate 1,2-naphthoquinonediazide sulfonate (triester) 6. 0
g, polyfunctional alicyclic epoxy resin (thermosetting agent, manufactured by Daicel Chemical Industries, Epolide (trademark) GT-400) 4.0
g, 2.0 g of 4,4′-bis (4-hydroxyphenyl) sulfone (curing aid) and 90 g of diethylene glycol dimethyl ether were mixed and dissolved, and then filtered with a 0.2 μm filter to prepare a resist solution.

Next, patterning and lens formation were performed by the same method as in Example 1. When developed with a 2.4% tetramethylammonium hydroxide aqueous solution, 2
It was possible to resolve 0.8 μm at 00 mJ / cm ² . The curing conditions were 140 ° C. and 5 minutes (hot plate), and the lens shape at that time was also good.
The chemical resistance was also good.

Comparative Example Vinylphenol polymer (Maruzen Petrochemical, Maruka Linker (trademark) -M, weight average molecular weight 8000 (GPC measured value, converted to polystyrene)) 25 g, methyl gallate 1,2-naphthoquinonediazide sulfonic acid 6.0 g of ester (triester form) and 90 g of diethylene glycol dimethyl ether were mixed and dissolved, and then filtered through a 0.2 μm filter to prepare a resist solution.

Next, patterning and lens formation were performed by the same method as in Example 1. When developed with a 1.0% tetramethylammonium hydroxide aqueous solution, 4
It was possible to resolve 0.9 μm at 00 mJ / cm ² . The subsequent heat treatment was sufficient to form lenses, but when heated at 200 ° C, the pattern flowed,
The shape of the lens could not be maintained. Regarding the chemical resistance, for example, it was dissolved when immersed in methyl ethyl ketone.

[0057]

As is clear from the above description, the photosensitive composition of the present invention comprises an epoxy group-containing alkali-soluble resin, a photosensitizer and a solvent consisting of 1,2-naphthoquinonediazide sulfonic acid ester, and a further essential component. In this case, since it is a positive photosensitive composition containing a curing aid and / or a thermosetting agent, a highly sensitive and high-resolution resist pattern can be created, and a concavo-convex pattern having a lens function is obtained by heat treatment after patterning. Can be formed. The formed lens has a large refractive index, and has excellent properties such as transparency in the visible light range, heat resistance, light resistance, and chemical resistance, so that it can be used in color solid-state image pickup devices, color liquid crystal display devices, etc. It is suitable as a micro condenser lens material formed on a color filter. Furthermore, since it also has a high heat resistance of 250 ° C., it can be used as, for example, a reflection plate or an interlayer insulating film for a thin film magnetic head using a cured uneven pattern.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ identification code FI G03F 7/022 G03F 7/022 7/039 7/039 (58) Fields investigated (Int.Cl. ⁷ , DB name) G02B 1 / 04 G02B 3/00

Claims (4)

(57) [Claims] 1. A Ri alkali-soluble resin containing epoxy groups Do a structural unit represented by the general formula (1), a photosensitive agent
1,2-naphthoquinonediazide sulfonic acid ester
Le and features and to luma microlenses photosensitive composition that you contain a solvent. [Chemical 1] [In the formula, R ₁ represents hydrogen or a methyl group, A represents the following general formula (2), general formula (3) or general formula (4), m,
Each n is an integer of 1 or more. ] [Chemical 2] [In the formula, R ₂ , R ₃ and R ₄ each represent hydrogen or a methyl group, and B represents —OCH ₂ — or —CH ₂ OCH ₂ —. ] 2. An epoxy group-containing alkali-soluble resin is a vinylphenol polymer, a vinylphenol copolymer, a novolak resin which is a polycondensation product of phenols and aldehydes, or one of the hydroxyl groups of hydrogenated products of each resin. The resin is a resin whose part is modified with epoxy.
The photosensitive composition for microlenses according to item 1. 3. The photosensitive composition for microlenses according to claim 1 or 2 , further comprising a curing aid and / or a thermosetting agent. object. 4. A coagent is latent heat acid generator, polycarboxylic acid anhydrides, polycarboxylic acids, according to claim 3, characterized in that it consists of at least one selected from a phenolic compound Photosensitive composition for microlenses.