JP3380926B2 - Electron gun for cathode ray tube, method of manufacturing the same, and cathode ray tube - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electron gun of a cathode ray tube used for, for example, a projector tube, a color picture tube, an index tube and the like.

[0002]

2. Description of the Related Art Conventionally, as an electron gun for a cathode ray tube, for example, one shown in FIG. 38 has been known. This electron gun is of a unipotential type, and has a first to a first electrode as an accelerating and focusing electrode for the cathode K from which electrons are to be emitted.
The fifth grid is arranged coaxially (Z axis). Then, the electron beam emitted from the cathode K is emitted from the prefocus lens formed by the second and third grids G ₂ and G ₃ and the main lens formed by the _{third to} fifth grids G _{3 to} G _5. Is focused on the fluorescent screen by the action of. These cathodes K and the first to fifth grids G ₁ ~G ₅ is fixed by welding to the Bee dengue glass are assembled integrally. Further, first to fifth grids G ₁ ~G ₅ is composed of a metal such as stainless steel.

[0003]

However, in such a conventional example, the following problems have occurred. That is, the electrode in particular third to fifth grids G ₃ ~G the concentricity between ₅ tends to occur deviation in the structure described above, defocusing has occurred happening away axis therefore electron beam. Further, since the potential difference between the electrodes is stepwise, third to fifth grids G ₃ tends to occur discharge in between ~G _5, also, the beam spot diameter was larger by spherical aberration of the lens system becomes large .

The present invention has been made in view of the above points of the prior art, and an object of the present invention is to suppress the deviation of the concentricity of the main lens system to reduce the off-axis of the electron beam and to make the main lens. An object of the present invention is to provide an electron gun for a cathode ray tube, a method of manufacturing the same, and a cathode ray tube which can reduce the potential gradient between the electrodes for use to prevent the discharge between the electrodes and reduce the spherical aberration of the main lens.

[0005]

[Means for Solving the Problems] Of the cathode ray tube according to the present invention
The electron gun has a cathode and a first electrode coaxially arranged,
Has a plurality of electrodes that form the second electrode and the main electron lens
And a resistance cylinder, which is a
Multiple electrodes are deposited on the surface along the axial direction, and
Insulating cylindrical body corresponding to each electrode so that it overlaps even if it is displaced
A spiral resistance film is formed on the inner surface of the.

[0006] The electron gun of the cathode ray tube according to the present invention is
And a first electrode, a second electrode and a main electrode which are coaxially arranged.
And a resistance cylinder having a plurality of electrodes that form a child lens.
Equipped with a resistance cylinder axially on the inner surface of the cylinder of high resistance material
A plurality of electrodes are formed along each direction, and a pair of electrodes is
A conductive ring is formed on the inner surface of a cylindrical body of
It has a different configuration.

[0007] The electron gun of the cathode ray tube in this case is a resistance cylinder.
Form a conductive film along the axial direction on the outer wall surface of the body,
Holders for the electrodes formed on both ends of the resistor cylinder
Can be electrically connected by means of.

[0008] The cathode ray tube electron gun is the resistance cylinder body.
Of the multiple electrodes of the
The conductive pin electrically connected to the electrode
It can be configured to be led out of the cylindrical body.

[0009] The electron gun of the cathode ray tube is made of the high resistance material.
Cylinder is divided into 3 parts, and the middle is made of high resistance material.
The surface resistance of the cylindrical body of high resistance material
It can be configured to be greater than the value.

[0010] The electron gun of the cathode ray tube is made of the high resistance material.
The first high-resistance material cylindrical body obtained by dividing the cylindrical body of
Second high-resistance substance circle containing the first high-resistance substance cylinder
The middle of the first high resistance material cylindrical body
Surface resistance of the high resistance material cylinder Resistance value, high resistance material at both ends
The second high resistance material is set to a value larger than the surface resistance value of the cylindrical body.
The same material as the intermediate high resistance material cylinder, or
Is made of a material different from that of the first high-resistance substance cylinder.
can do.

[0011] Method for manufacturing electron gun of cathode ray tube according to the present invention
Mounts the main electron lens along the axial direction on the inner surface of the insulating cylinder.
The process of forming the multiple electrodes that make up the
A resistance sheet should be placed on the peripheral surface so that it overlaps any of the electrodes.
The process of forming the resistive film by the
The spiral resistance film is formed by trimming the spiral part in a spiral shape.
Forming the resistance cylinder, and the first electrode and the second electrode.
The pole and the resistance cylinder are arranged coaxially and the first electrode
And arranging the cathode adjacent to.

[0012] Method for manufacturing electron gun of cathode ray tube according to the present invention
Is the main electron along the axial direction on the inner surface of the cylinder of high resistance material.
Process of forming a plurality of electrodes constituting a lens and each electrode
A conductive ring is formed on the inner surface of the cylinder of high resistance material corresponding to
Forming the resistance cylinder, and the first electrode and the second electrode.
The pole and the resistance cylinder are arranged coaxially and the first electrode
And arranging the cathode adjacent to.

[0013] The cathode ray tube according to the present invention is the same as the cathode.
A first electrode, a second electrode and a main electron lens arranged on the axis
And a resistive cylinder having a plurality of electrodes forming
The resistance cylinder along the axial direction on the inner surface of the insulation cylinder.
Multiple electrodes are deposited and formed on any of these electrodes.
Inner surface of the insulating cylinder that corresponds to multiple electrodes so that they overlap
Equipped with an electron gun formed by forming a spiral resistance film
Become.

[0014] The cathode ray tube according to the present invention is the same as the cathode.
A first electrode, a second electrode and a main electron lens arranged on the axis
And a resistive cylinder having a plurality of electrodes forming
And the resistance cylinder is axially aligned with the inner surface of the cylinder of high resistance material.
A plurality of electrodes are deposited along the
Conductive ring is formed on the inner surface of the corresponding cylinder of high resistance material
And an electron gun configured as described above.

[0015] The cathode ray tube is a resistor that constitutes the electron gun.
A conductive film is formed along the axial direction on the outer wall surface of the anti-cylindrical body,
The electrolyte membrane and the electrodes formed on both ends of the resistor cylinder are respectively
Can be configured to be electrically connected by a ruder
It

[0016] The cathode ray tube has a resistance in the electron gun.
Of the multiple electrodes of the cylinder, the middle between the two ends of the resistance cylinder.
The conductive pin electrically connected to the electrode formed between
The configuration can be such that it is led out of the resistance cylinder.

[0017] The cathode ray tube has a high resistance in the electron gun.
Cylinder body of anti-substance is divided into 3 parts, cylinder body of high resistance substance in the middle
The surface resistance of the cylindrical body of high resistance material
The configuration can be set larger than the value.

[0018] The cathode ray tube has the high resistance in the electron gun.
A first high resistance material cylinder obtained by dividing the antibody cylinder into three parts.
And a second high resistance material containing the first high-resistance material cylinder.
Of the first high resistance material cylinder
The surface resistance value of the middle high resistance material cylinder is
Set it to a value larger than the surface resistance of the high-resistance material cylinder,
High resistance material cylinder is the same as the middle high resistance material cylinder
Made of material or material different from the first cylinder of high resistance material
It can be configured.

[0019]

In the cathode ray tube electron gun of the present invention , a resistance cylinder having a plurality of electrodes forming a main electron lens is provided.
Therefore , the deviation of the concentricity of the electron lens system hardly occurs. In addition, a spiral resistor is placed between the electrodes that make up the main lens.
Due to the formation of the anti-membrane, the potential gradient between these electrodes is small.
This reduces the spherical aberration of the main lens system.
It

[0020] In the electron gun of the cathode ray tube of the present invention, the main
Equipped with a resistive cylinder with multiple electrodes that make up the lens
By forming the resistance cylinder with a high resistance material,
The main Almost no deviation of concentricity occurs. It
In addition, by providing a ring-shaped conductive layer between the electrodes,
The potential gradient between the poles is reduced, which results in a spherical surface of the main lens.
Aberration is reduced.

[0021] In the above electron gun, a conductive film and a resistance cylinder
The electrodes formed on both ends of the body are electrically charged by the holders.
The so-called unipotencia is possible because
The electrodes on both ends of the main lens of the Le type are made equipotential,
Minimizes the electron beam axis deviation by suppressing the concentric deviation of the main lens system.
You can do it.

[0022] In the above electron gun, the resistance cylinder
It is configured to lead out the conductive terminal of the fourth electrode from the position
This enables fine adjustment of the shaft potential.

[0023] In the above electron gun, a plurality of resistance cylinders are used.
Of the electrodes, the electrodes formed between both ends of the resistance cylinder
Conductive pin electrically connected to the outside of the resistance cylinder
Therefore, the resistance distribution can be made more sloping and
The child lens characteristics can be improved.

[0024] In the above electron gun, the first height of three divisions
A second cylinder of high-resistance material containing a cylinder of resistance material
By providing an inner first cylindrical body of high resistance material
Can be protected.

[0025] In the method of manufacturing an electron gun for a cathode ray tube according to the present invention,
The resistance page so that it overlaps any of the electrodes.
The part where the resistive film is formed by using a strike and the electrode of the resistive film is excluded
Is spirally trimmed to form a spiral resistance film,
In addition, the inner surface of the cylinder of high resistance material corresponding to each electrode is guided.
Since a resistance ring can be made by forming an electric ring,
The child gun can be easily manufactured.

[0026] In the method of manufacturing an electron gun for a cathode ray tube according to the present invention,
The inner surface of the cylinder of high resistance material along the axial direction.
Between the electrodes by forming multiple electrodes that make up the electron lens
Against A conductive ring is formed on the inner surface of a cylindrical body of high resistance material
Then, a resistance cylinder is prepared, and the first electrode, the second electrode and the resistor are formed.
The cylindrical body is arranged coaxially and adjacent to the first electrode.
Since the cathode is arranged, the above electron gun can be easily manufactured.
You can

[0027] Furthermore, in the cathode ray tube of the present invention,
Since it is equipped with the electron gun described above, increase the lens diameter
The lens characteristics are further improved and the image quality is improved.
Wear.

[0028]

Embodiments of the electron gun for a cathode ray tube according to the present invention will be described below with reference to FIGS. First in FIG.
1 shows the overall configuration of the embodiment. The electron gun of this embodiment is of a unipotential type. As shown in the figure, in the present embodiment, a cathode K for emitting electrons is provided in the vicinity of the stem 2 of the neck tube 1, and the first grid G ₁ and the second grid are adjacent to the cathode K. The cup member G _3A forming the G ₂ and the third grid G ₃ is coaxially arranged. Then, an insulating tube 3 described later for forming a main lens is provided at a position adjacent to the cup member G _3A . Further, the HV shield 4 and the H
The V spring 5 is fixed. A plurality of stem pins 6 are embedded in the stem 2.

A cutoff voltage for controlling the beam amount is applied to the first grid G ₁ . On the other hand, a voltage positively higher than the cathode K by about several hundreds V is applied to the second grid G ₂ adjacent to the first grid G ₁ . Then, the cup members G _3A forming the first grid G ₁ , the second grid G _2, and the third grid G ₃ are fixed to the pair of bead glasses 7 arranged on both sides thereof by fusion bonding to form a triode. To do.

The lead wire 24 of the first grid G ₁ and the lead wire 25 of the second grid G ₂ are connected to the stem pin 6, respectively, whereby the triode is fixed. The insulating tube 3 is made of, for example, an insulating ceramic (Al ₂ O ₃
96%) or glass and has a high roundness (for example, 5
(0 m or less) formed into a cylindrical shape. Ring-shaped electrode films 8, 9 and 10 made of RuO ₂ -glass paste are applied and formed on both ends and the center of the insulating tube 3. Here, the electrode film 8 constitutes the third grid G ₃ together with the cup member G _3A , and the electrode films 9 and 10 function as the fourth grid G ₄ and the fifth grid G ₅ , respectively. The resistance film 11 is formed so as to partially overlap the electrode films 8 and 10 at both ends and to entirely overlap the electrode film 9 at the central part. The resistance film 11 includes the electrode films 8 and 9 and the electrode films 9 and 1.
It is formed in a helical shape between 0s.
On the other hand, a conductive film 17 extending in the longitudinal direction is formed on one outer surface of the insulating tube 3.

At both ends of the insulating tube 3, a cylindrical holder 12 (12a, 1a) for electrically connecting with the electrode films 8, 10 is formed.
2b) is fixed. The cylindrical holder 12 is made of metal such as stainless steel, and as shown in FIGS. 2A to 2C, a ring-shaped flange portion 13 that fits into the insulating pipe 3.
have. A pair of opposed projections 14 are provided at three locations on the inner circumference of the flange portion 13, and the inner one of these projections 14 contacts the electrode films 10 and 12 formed on the inner surface of the insulating tube 3. To be configured. Further, the cylindrical holder 12a and the cylindrical holder 12b are electrically connected via the conductive film 17 formed on the outer surface of the insulating tube 3.

As shown in FIG. 1, a G ₄ pin 15 is provided at a substantially central portion of the insulating tube 3. The G ₄ pin 15 is preferably made of Kovar iron or Ti alloy having an expansion coefficient substantially equal to that of the insulating tube 3. And
The G ₄ pin 15 is attached so as to come into contact with the electrode film 9 through the hole 16 formed in the insulating tube 3. Also, G
_The lead wire 26 is connected to the _4- pin 15. Although not shown, the lead wire 26 is fixed to the stem pin 6.

As shown in FIG. 3, the HV shield 4 is a flat plate member made of, for example, SUS304 or the like, and a hole 18 for allowing an electron beam to pass therethrough is provided at the center thereof. This HV shield 4 is welded to the cylindrical holder 1
Fixed to 2.

The HV spring 5 is made of Inconel, for example. As shown in FIG. 1, the HV spring 5 is fixed to both ends of the HV shield 4 by welding, and its tip end portion presses the inner surface of the neck tube 1. The HV spring 5 is electrically connected to an anode button (not shown) via a conductive film made of carbon or the like.

Next, the manufacturing method of this embodiment will be described with reference to FIGS. First, G ₄ pin 1 to the insulating tube 3
A hole 16 for mounting the 5 is formed (FIG. 4 step (1), FIG. 5A), and the insulating pipe 3 is washed (FIG. 4 step (2)). Then, G ₄ in the hole 16 as shown in FIG. 6
The pin 15 and the frit glass g are set (step (3) in FIG. 4). Further, the G ₄ pin 15 is fixed by a jig (not shown), and frit firing is performed in this state (step (4) in FIG. 4, FIG. 5B).

Next, electrode films 8 to 10 are formed by coating on both ends and the center of the inner surface of the insulating tube 3 (step (5) in FIG. 4,
FIG. 5C). In this case, as the conductive paste, for example, R
Using uO ₂ -glass paste (trade name # 9516, manufactured by DuPont, etc.), coating is performed so that the film thickness is uniform.

Further, as shown in FIG. 5D, in order to electrically connect the electrode film 8 as the third grid G ₃ and the electrode film 10 as the fifth grid G ₅ , the G ₄ pin 15 of the insulating tube 3 is The conductive paste is applied in the longitudinal direction on the outer periphery of the side not provided to form the conductive film 17. Then, leveling drying is performed to planarize the electrode films 8 to 10 and the conductive film 17 (step (6) in FIG. 4).

Thereafter, as shown in FIG. 5E, the electrode films 8 on the entire inner surface of the insulating tube 3, that is, at both ends of the insulating tube 3,
Resistive film 11 is formed by coating, leaving a portion where 10 is formed (step (7) in FIG. 5). In this case, the resistance paste is, for example, RuO ₂ -glass paste (trade name # 9).
518, manufactured by DuPont Co., Ltd.) and applied so that the film thickness becomes uniform by the method described later.

FIG. 7 shows an example of the method of applying the resistance paste. As shown in the figure, the insulating tube 3 is rotated about the Z axis, that is, the tube axis direction, and a fixed amount of the resistance paste 18 is applied to the inner surface of the insulating tube 3 from the nozzle 20 connected to the tank 19 of the resistance paste 18. Supply.

After the resistance film 11 is leveled and dried (step (8) in FIG. 4), the resistance film is trimmed and washed by the method shown in FIG. 8 (step (9) in FIG. 4).

FIG. 8 shows an example of the trimming method. That is, while rotating the insulating tube 3 around the Z axis, the insulating tube 3 is moved in the X axis direction, and the tip of the scribing needle 21 is brought into contact with the surface of the resistive film 11.
Scribing 1 in a spiral shape. In this case, only the portion not overlapping with the electrode films 8 to 10 is marked. By this step, the resistance film 11 is spirally formed between the electrode films 8 and 9 and the electrode films 9 and 10 (FIG. 5F). Chips generated by trimming are completely removed (cleaned) from the insulating pipe by air blow or the like. The scribing needle 21 may be moved.

On the other hand, the resistance film 11 may be spirally formed by the following method instead of the above method.
That is, after the leveling drying in the step (6) of FIG. 4, as shown in FIG. 9, the insulating tube 3 is moved in the X axis direction while rotating around the Z axis, and the tank 1 of the resistance paste 18 is moved.
It is also possible to supply the resistance paste 18 from a dispenser 22 (injection needle) connected to 9. In this case, it is preferable to keep the distance between the dispenser 22 and the insulating tube 3 constant. Further, the dispenser 22 may be moved.

After forming the spiral resistance film 11 by the above steps, the insulating tube 3 is baked at a temperature of 850 ° C. for 10 minutes (step (10) in FIG. 4). Thereby, the electrode film 8
10 and the resistance film 11 are melted and fixed to the insulating tube 3 to be stabilized.

After cleaning and drying the insulating tube 3 (step (11) in FIG. 4), the insulating tube 3 is centered by a positioning jig,
Vertically set and set the cylindrical holder 12 on the insulating tube 3 (step (12) in FIG. 4), and as shown in FIG. 5G, arrange the frit 23 at the connecting portion between the cylindrical holder 12 and the insulating tube 3,
Firing is performed (FIG. 4 step (13)).

After that, the HV shield 4 and the HV spring 5 are assembled and welded to one of the cylindrical holders 12a using a positioning jig. Also, the other cylindrical holder 12
A triode (cathode K, first grid G ₁ , second grid G ₂ , cup member G _3A ) assembled in advance by a known beading method is assembled and welded to b using a positioning jig. 4 steps (14)).

Furthermore, the first and second grids G ₁ , G ₂
Lead wires 24 and 25 and lead wire 26 of G ₄ pin 15
Is connected to the stem pin 6 embedded in the stem 2 to complete the electron gun as shown in FIG.

In this embodiment having such a configuration,
Third to fifth grids G ₃ ~G for forming a main lens
_Since the electrode films 8 to 10 corresponding to ₅ are formed on the insulating tube 3 integrally formed with high accuracy,
The axis deviation between the Z axis and the Z axis becomes small. Therefore, according to this embodiment, the off axis of the electron beam can be suppressed small.

In the present embodiment, the electrode films 8-1
Since the spiral resistance film 11 is formed between 0, the potential gradient between the electrode films 8 to 10 (electric field intensity change rate).
Becomes smaller than the conventional example, and as a result, the electrodes 8 to 10
Discharging during that time is less likely to occur. Further, since the spherical aberration is reduced, the beam spot diameter can be reduced and the resolution can be improved.

In the above embodiment, the conductive film 17 is used.
And the electrode films 8 and 1 via the cylindrical holders 12a and 12b.
However, the present invention is not limited to this, and for example, the cylindrical holders 12a and 12b may be connected by lead wires.

In the above embodiment, the frit glass 23 is used to fix the cylindrical holders 12a and 12b to the insulating tube 3 as shown in FIG. 5G, but the present invention is not limited to this. Instead of, for example, Figure 1
It is also possible to form a concave portion 3a on the outer surface of the insulating tube 3 as shown in FIG. 0 and to fit the concave portion 3a and the protrusion 14 of the cylindrical holder 12 together. In this case, the HV shield 4 and the cylindrical holder 12 may be welded in advance. Further, the HV shield 4 and the HV spring 5 can also be fitted and fixed without welding.

Furthermore, the present invention can be applied not only to the above-mentioned unipotential type electron gun but also to a bipotential type electron gun. In this case, the second shown in FIG.
The electrode film 31 is formed on the insulating tube 30 by the method described above as in the embodiment.
(G ₄ ) and 32 (G ₅ ) are formed, and the resistance film 33 is formed thereon.
To form. Then, a plurality of spiral portions 33a to 33e are formed on the resistance film 33 by the method described above.

In addition, the projection 1 provided on the cylindrical holder 12
The number of 4 is not limited to the number in the above embodiment, and any number can be selected as long as it is plural.

Furthermore, in the above embodiment, the first
Only the grid G ₁ , the second grid G ₂ and the third grid member G _3A are fixed by the bead glass 7, but the present invention is not limited to this. For example, the bead glass 7 may be extended and the HV shield 4 may be extended. Can also be fixed together. Thereby, the electron gun can be assembled more firmly. In this case, the fixing with the bead glass is performed at the end of the assembly of the electron gun.

Next, a third embodiment of the electron gun of the cathode ray tube according to the present invention will be described with reference to FIGS.
The parts corresponding to those in the first embodiment are designated by the same reference numerals, and the duplicated description will be omitted. FIG. 12 shows the overall configuration of this embodiment. The electron gun of this embodiment is of a unipotential type. As shown in the figure, in the present embodiment, a cathode K for emitting electrons is provided in the vicinity of the stem 2 of the neck tube 1, and the first grid G ₁ and the second grid are adjacent to the cathode K. The cup member G _3A forming the G ₂ and the third grid G ₃ is coaxially arranged. Then, a high resistance tube 3A, which will be described later, for forming a main lens is provided at a position adjacent to the cup member _G3A . Further, the HV shield 4 and the HV spring 5 are fixed to the upper end of the high resistance tube 3A. A plurality of stem pins 6 are embedded in the stem 2.

A cutoff voltage for controlling the beam amount is applied to the first grid G ₁ . On the other hand, a voltage positively higher than the cathode K by about several hundreds V is applied to the second grid G ₂ adjacent to the first grid G ₁ . Then, the cup members G _3A forming the first grid G ₁ , the second grid G _2, and the third grid G ₃ are fixed to the pair of bead glasses 7 arranged on both sides thereof by fusion bonding to form a triode. To do.

The lead wire 24 of the first grid G ₁ and the lead wire 25 of the second grid G ₂ are connected to the stem pin 6, respectively, whereby the triode is fixed.

The high resistance tube 3A is made of, for example, alumina (Al ₂
O ₃ ) is mixed with oxides of Ti, W, Cu, etc. and sintered to obtain an electrically conductive material, or an electrically conductive material such as ferrite, titania-based ceramics, etc. The main component.

The high resistance tube 3A is formed in a cylindrical shape having a high roundness (for example, 20 m or less), and the ring-shaped electrode films 8 and 9 made of, for example, RuO ₂ -glass paste are formed at both end portions and the central portion thereof. , 10 are formed by coating. Here, the electrode film 8 is formed on the third grid G together with the cup member G _3A .
₃ and the electrode films 9 and 10 are the fourth grid G, respectively.
Play the role of the _4th and 5th grid G ₅ . On the other hand, a plurality of ring-shaped portions (hereinafter referred to as “conductive rings”) 11A made of the same material as the electrode films 8 to 10 are formed between the electrode films 8, 9 and 10. Here, the electrode films 8 to
10 and the conductive ring 11A are both formed in the longitudinal direction of the high resistance tube 3, that is, in the direction perpendicular to the tube axis (Z axis) direction.

Regarding the resistance value of the high resistance tube 3A, if the diameter of the high resistance tube 3A and the distance between the electrode films 8, 9 and 9, 10 are respectively about 12 mm, the electrode films 8, 9 and 9,
100 MΩ (mega ohm) to 10 Ter between 10
It is preferable to set it to be aΩ (teraohm), and it is particularly preferable to set it to about 1 Gl. When it is smaller than this value, heat is easily generated, and when it is larger than this value, charging is easy. When the resistance value is set to 1 GΩ, the volume resistivity of the high resistance tube 3A is 10 ⁸ Ω · cm.

Further, on one outer surface of the high resistance tube 3A,
A conductive film 17 extending in the longitudinal direction is formed. A cylindrical holder 12 (12a, 12b) for electrically connecting the electrode films 8 and 10 is fixed to both ends of the high resistance tube 3A. The cylindrical holder 12 has the same structure as that of the first embodiment.

Next, the manufacturing method of this embodiment will be described with reference to FIG.
And FIG. 14 will be described. First, G on the high resistance tube 3A
A hole 16 for mounting the _4- pin 15 is formed (see FIG. 13).
Step (1), FIG. 14A), this high resistance tube 3A is washed and dried (FIG. 13 step (2)).

Then, the electrode films 8 to 10 and the conductive ring 11A are applied and formed on the inner surface of the high resistance tube 3A by the following method (FIG. 13 step (3), FIG. 14B). In this case, for example, RuO ₂ -glass paste (trade name # 9516, manufactured by DuPont) is used as the conductive paste, and coating is performed so that the film thickness is uniform.

FIG. 15 shows the electrode films 8 to 10 and the conductive ring 1.
1A shows a first example of a method for forming 1A. Figure 15A
Shows the method of applying the conductive paste. High resistance tube 3A
A rotatable rubber roller 68 having a length substantially the same as that of the high resistance tube 3A is arranged inside, and the rubber roller 68 is pressed against the inner surface of the high resistance tube 3A by a pair of springs 69. In this case, as shown in FIG. 15B, a certain amount of the conductive paste 70 is placed in the longitudinal direction of the rubber roller 68 and then set as shown in FIG. 15A, and the high resistance tube 3A is rotated about the rotation axis O ₁ . As a result, the rubber roller 68 also rotates about the rotation axis O ₂ , and the conductive paste 70 is spread and applied to the inner surface of the high resistance tube 3A. After that, pull out the rubber roller 68 from the high resistance tube 3A,
The high resistance tube 3A is dried, for example, by heating with hot air while rotating. This is to prevent the conductive paste 70 from dripping.

FIG. 15C shows a method of trimming the conductive paste 70. As shown in FIG.
A scribe plate 72 made of cemented carbide is attached to the tip of the eccentric disc so as to be eccentric.
Is configured to be pulled in a direction orthogonal to the longitudinal direction. Then, in the trimming step, the high resistance tube 3A is rotated in the direction of the arrow a to move the support rod 71 to the high resistance tube 3A.
Place in A. Then, when the support rod 71 is moved in the direction of arrow b or c and the conductive paste 70 comes to an unnecessary position, the spring 73 is operated to press the scribe plate 72 against the conductive paste 70 to perform trimming. On the other hand, for the portion where the conductive paste 70 is required, the spring 73 is released to leave the conductive paste 70. The conductive paste 70 may be evaporated and removed by the heat of absorbing the laser light.

FIG. 16 shows the electrode films 8 to 10 and the conductive ring 1.
It shows a second example of a method for forming 1A. This method is used for negative type resist materials (for example, PVA-ADC).
Etc.).

In the case of this method, first, as shown in FIG. 16A, while rotating the high resistance tube 3A, the resist material 80 is applied to the inner surface thereof. Then, as shown in FIG. 16B,
The mask 81 is inserted into the high resistance tube 3A and the alignment is performed. This mask 81 has the same pattern 8 as the electrode films 8 to 10 and the conductive ring 11A on the outer periphery of an ultraviolet-transparent glass (eg, quartz) having an outer diameter equal to the inner diameter of the high resistance tube 3A.
2 is formed.

Then, as shown in FIG. 16C, the mask 8
An ultraviolet irradiation lamp 83 is arranged inside 1 to perform exposure.
Further, the mask 81 is removed from the high resistance tube 3A, and water is sprayed on the high resistance tube 3A to develop it, thereby forming an electrode pattern of the resist 84 as shown in FIG. 17A.

Next, as shown in FIG. 16D, the high resistance tube 3A is placed in the vacuum pump 85, and, for example, Al, Au is used.
By heating the wire 86 made of a metal such as a metal by the heater 87, the metal film 88 is formed on the inner surface of the high resistance tube 3A.
Is vapor-deposited (FIG. 17B). Further, reversal development with H ₂ O ₂ and baking (430 ° C., 30 minutes) are performed to perform electrode film 8-10 and conductive ring 11 as shown in FIG. 17C.
Form A.

FIG. 18 shows the electrode films 8 to 10 and the conductive ring 1.
3A shows a third example (metal mask vapor deposition method) of a method for forming 1A. In the case of this method, a metal ring-shaped mask 88 is inserted so as to be in close contact with the inner surface of the high resistance tube 3A, and the high resistance tube 3 is placed in a container 89 connected to a vacuum pump.
Place A. Then, the inside of the container 89 is evacuated, and the vapor deposition metal 90 is heated by the heater 89a to vapor deposit the vapor deposition metal 90 on the inner surface of the high resistance tube 3A.

FIG. 19 shows the electrode films 8 to 10 and the conductive ring 1.
It shows a fourth example of the forming method of 1A (thermal transfer method). In the case of this method, first, a base film 91 for heat transfer made of polyester is formed into a cylindrical shape (see FIG. 1).
9A). Then, a release layer (not shown), a conductive layer 92, and an adhesive layer (not shown) are sequentially formed on the base film 91 by coating to complete the thermal transfer sheet 93 (FIG. 19B). Next, as shown in FIG. 19C, this thermal transfer sheet 93 is positioned and inserted into the high resistance tube 3A. Then, the thermal transfer sheet 92 is brought into close contact with the inner surface of the high resistance tube 3A by air pressure, and further heated and pressed by the silicon roller 94 having a heater built therein (FIG. 19D). As a result, the conductive layer 92 on the thermal transfer sheet 93 becomes the high resistance tube 3
Transferred to the inner surface of A, the electrode layers 8 to 10 and the conductive ring 1
1A is formed. After that, the base film 91 is peeled and removed as shown in FIG. 19E.

Further, as shown in FIGS. 20A and 20B, the recesses 3a and 3b are formed in advance on the inner wall of the high resistance tube 3A, and the conductive paste 70 is applied to the solid surface by using the rubber roller 68 shown in FIG. Thus, the electrode films 8 to 10 and the conductive ring 11A having a predetermined pattern can be formed.

FIG. 21 shows a sixth example of the method of forming the electrode films 8 to 10 and the conductive ring 1A. In this example,
As shown in FIG. 21A, first, as shown in FIG. 21A, the conductive paste 102 is placed on the end portion of the base 100 on which a predetermined pattern 101 is formed, and the inking roller 103 is moved in a direction orthogonal to the pattern 101, for example. By rolling, the conductive paste 102 is filled in the recesses between the patterns 101.

Then, as shown in FIG. 21B, the same roller 104 as that used in the first example (see FIG. 15A) is
By rolling in the longitudinal direction of the pattern 101, as shown in FIG.
As shown in C, the conductive paste 102 is attached to the roller 104.

Further, as shown in FIG. 15A, similarly to the first example, the roller 104 is pressed against the inner surface of the high resistance tube 3A to rotate the high resistance tube 3A. Thereby, the conductive paste 102 adheres to the inner surface of the high resistance tube 3A, and the electrode films 8 to
10 and the conductive ring 11A are formed.

Besides, in addition to the above, a predetermined pattern is formed on the base by a screen printing method, and then, as shown in FIG.
The electrode films 8 to 10 and the conductive ring 11A can be formed on the inner surface of the high resistance tube 3A in the same manner as in the methods shown in FIGS.

The above-mentioned electrode films 8 to 10 and the conductive ring 11A can also be formed by spraying a conductive paste onto the high resistance tube 3 by an ink jet method.

Further, the electrode films 8 to 10 and the conductive ring 11A of this embodiment can be formed by the method using the dispenser of the first embodiment (see FIG. 9). In this case, the conductive paste 68 for forming the conductive ring 11A can be solidly applied by slowing down the moving speed of the high resistance tube 3A when supplying the conductive paste 68. When the movement of the high resistance tube 3A is stopped when the final end of each conductive ring 11A is applied, the high resistance tube 3A is stopped at that portion.
The conductive paste 68 can be applied in the direction perpendicular to the tube axis A. Incidentally, instead of moving the high resistance tube 3A, the dispenser 22 may be moved to perform the same coating.

After forming the electrode films 8 to 10 and the conductive ring 11A by the method described above, leveling drying is performed to keep the film thickness uniform (step (4) in FIG. 13), and then at a temperature of 850 ° C., for example. Firing in air for 10 minutes (step (5) in FIG. 13), the electrode films 8 to 10 and the conductive ring 11A are fixed to the inner surface of the high resistance tube 3A made of ceramics. Incidentally, the above-mentioned electrode films 8 to 10 and the conductive ring 1
When the third method (metal mask vapor deposition method) is used among the formation methods of 1A, such firing is unnecessary.

Thereafter, as shown in FIG. 14C, in order to electrically connect the electrode film 8 serving as the third grid G ₃ and the electrode film 10 serving as the fifth grid G ₅ , G of the high resistance tube 3A is connected.
The conductive paste 70 is applied in the longitudinal direction of the outer periphery on the side where the ₄ pins 15 are not provided to form the conductive film 17.

Then, the high resistance tube 3A is centered by a positioning jig and vertically aligned to set the cylindrical holder 12 on the high resistance tube 3A, and the G ₄ pin 15 is attached to the hole 16 and fixed by the jig. As shown in FIG. 14D, a frit glass g is arranged, for example, at a temperature of 850 ° C.
Baking is performed for a minute (steps (6) and (7) in FIG. 13).

The electrode films 8 to 10 and the conductive ring 11A.
After forming, the leveling drying (step (4)) and the firing (step (5)) are not performed, the cylindrical holder 12 and the G ₄ pin 15 are set, the frit glass g is applied, and the firing is performed at once (step ( 7)) can also be performed.

After that, the HV shield 10 and the HV spring 5 are assembled and welded to one of the cylindrical holders 12a by using a positioning jig. Also, the other cylindrical holder 1
2b, a triode (cathode K, first grid G ₁ , second grid 2) preassembled by a known beading method.
The grid G ₂ and the cup member G _3A ) are assembled using a positioning jig and welded (FIG. 13 step (8)).

Furthermore, the first and second grids G ₁ , G ₂
Lead wires 24 and 25 and lead wire 16 of G ₄ pin 15
Is connected to the stem pin 6 embedded in the stem 2 to complete the electron gun as shown in FIG.
3 steps (9)).

By the way, the conductive ring 11A formed by the above-mentioned steps plays the following role. That is, as shown in FIG. 22 and FIG. 23A, the resistance of the inner wall surface of the high resistance tube 3A varies between the upper portion 45a and the lower portion 45b thereof. By providing the conductive ring 11A in the direction (Y-axis direction) perpendicular to the (Z-axis direction), equipotentialization in the Y-axis direction is achieved, and variations in such resistance can be suppressed. For example, as shown in FIG. 23B, when the electrode film 8 is provided at the location of Z = 0 mm and the conductive ring 11A is provided at the location of Z = 100 mm, the value of the variation in the resistance between the electrode films 8 to 10 and the conductive ring 11A. Is
It becomes smaller when the conductive ring 11A is provided (R ₁
> R ₂ , R ₄ > R ₅ ). When the conductive ring 11A is provided also at the position of Z = 50 mm, the value of the variation of the resistance is further reduced (R ₂ > R ₃ , R ₅ > R ₆ = 0) as shown in FIG. 23C. ). As a result, when the conductive ring 11A is provided between the electrode films 8 to 10 as in this embodiment, the spherical aberration of the electron lens system formed by the electrode films 8 to 10 can be reduced. The more accurately the conductive ring 11A is provided, the same effect as in the case where the roundness of the member forming the electron gun becomes smaller in the conventional device.

By changing the pitch and width of the conductive ring 11A, the electric potential between the electrodes can be finely adjusted as shown in FIG. 23D, and as a result, a lens system with smaller spherical aberration can be designed. be able to. In the present embodiment having such a configuration, the electrode film 8-1 corresponding to the third to fifth grids G ₃ ~G ₅ for forming a main lens
Since 0 is formed in the high resistance tube 3A integrally formed with high precision, the misalignment between these electrodes 8 to 10 with respect to the Z axis becomes small. Therefore, according to this embodiment, the off axis of the electron beam can be suppressed small.

In addition, in the present embodiment, the electrode films 8 to 1
Since the plurality of conductive rings 11A are formed between 0, the potential gradient (electric field intensity change rate) between the electrode films 8 to 10 is smaller than that in the conventional example as shown in FIG. The discharge between the electrodes 8 to 10 is less likely to occur. Further, since the spherical aberration is reduced, the beam spot diameter can be reduced and the resolution can be improved. In this case, since a substance having a high resistance exists between the electrode films 8 to 10, for example, the electrode films 8 to 10 are formed on the insulating tube 3 having a low resistance and the spiral resistance film is formed between the electrode films 8 to 10. Compared with the case where 11 is provided, the _{third to} fifth grids G _{3 to} G ₅ forming a desired main lens can be obtained by providing only a small number of conductive rings 11A, and as a result, the electron gun can be easily obtained. Can be manufactured.

The conductive ring 11A in this embodiment is also used.
Is formed in the direction perpendicular to the Z axis, the electrode films 8 to 1
The potential between 0 can be stabilized. And
According to the configuration of the present embodiment, since the current flows in the high resistance tube 3A in parallel with the Z axis, no magnetic field is generated in the tube and the eccentricity of the electron beam can be prevented.

In the above embodiment, for example, FIG.
As shown in D, the frit glass g is used to fix the cylindrical holders 12a and 12b to the high resistance tube 3A, but the present invention is not limited to this, and for example, FIG.
As shown in FIG. 5, a concave portion 3c may be formed on the outer surface of the high resistance tube 3A, and the concave portion 3c and the protrusion 14 of the cylindrical holder 12 may be fitted together. In this case, H
The V shield 4 and the cylindrical holder 12 may be welded in advance. Further, the HV shield 4 and the HV spring 5 can also be fitted and fixed without welding.

Even if the bead glass 7 is not extended to the HV shield 4, as shown in FIG. 26, the high resistance tube 3A is sandwiched by a pair of band-shaped bands B and the bead glass 7 is extended partway along the high resistance tube 3A. However, the high resistance tube 3A and the triode may be fixed by fusing the band B to the bead glass 7.

Further, the present invention can be applied not only to the above-mentioned unipotential type electron gun but also to a bipotential type electron gun.

FIG. 27 shows the essential parts of the fourth embodiment of the present invention. In the following description, parts corresponding to those in the above embodiment are designated by the same reference numerals. In the case of this embodiment, the high resistance tube 3
A substantially rectangular high-resistance ceramic member 46 made of the same material as A is provided with holes 47 for transmitting red, green, and blue electron beams.
~ 49 are formed. Then, a metal member 50 having the same shape as these is stacked and fixed between the two high resistance ceramic members 46. In this case, the corresponding holes 47-49, 5
It is preferable that the axes 1 to 53 are not displaced. The metal member 50 plays the role of the fourth grid G ₄ , and a lead wire (not shown) is connected thereto. Further, third and fifth grids G ₃ and G _{5 (} not shown) are provided on the upper surface and the lower surface of the high resistance ceramic member 46. These third
The fifth grids G ₃ and G ₅ are composed of a metal plate or a plane conductive film. The conductive ring 1 is formed on the inner surface of each of the holes 47 to 49 of the high resistance ceramic member 46 by the above-described method.
1A is formed. Other configurations and operations are the same as those of the above-described embodiment, and detailed description thereof will be omitted.

FIG. 28 shows the essential parts of the fifth embodiment of the present invention. In this embodiment, a ring-shaped member 54 made of the same high-resistance ceramic as described above is laminated, and a disc-shaped metal plate 55 is sandwiched therebetween. Here, holes 56 to 58 for transmitting electron beams are formed in the metal plate 55. Although this example is for a three-beam electron gun, such a configuration is also applicable to the single-beam electron gun shown in FIG.

By the way, in the above-mentioned embodiment, the electrode films 8 to 10 of the high resistance tube 3A made of high resistance ceramics.
When forming, the conductive paste 70 needs to be applied and dried, and then baked, which may increase the cost. Further, the conductive paste 70 made of RuO ₂ -glass paste may be damaged during sparking, which may deteriorate the lens characteristics. in addition,
To further improve the lens characteristics, it is necessary to make the resistance distribution more inclined, but this is a limitation because the resistance distribution inside the high resistance tube 3A is uniform. Therefore, in the sixth embodiment of the present invention, the following configuration is adopted.

FIG. 29 shows the main structure of this embodiment. As shown in FIG. 29A, in the high resistance tube 105 used in this embodiment, the low resistance portions 106 are formed at both ends of the integrally formed main body, and the high resistance portions 107 are formed therebetween. In this case, the resistance value of the low resistance portion 106 is
The surface resistance is preferably about 10 KΩ / □. On the other hand, the resistance value of the high resistance portion 107 is preferably 100 MΩ to 10 TeraΩ, as in the above embodiment. The high resistance portion 107 is preferably configured so that the resistance continuously changes at the boundary with the low resistance portion 106. This further reduces the potential gradient.

The high resistance tube 105 of this embodiment is, for example, a known document (Jady Chu, Ishibashi, Hayashi, Takebe, Morinaga SliP Castin).
t of Continuous Funcfionally Gradient Material Jou
rnalof the Ceramic Society of Japan 101 [7] 841-8
44, 1993). It can be obtained by a method or the like.
That is, this method is applicable to conductive materials (W, Ni-Cr, etc.)
The high resistance tube 10 is prepared by using a slurry in which the particles are mixed to give a concentration difference in the tube axis direction by utilizing the difference in the sedimentation velocity of particles.
The resistance of 5 is graded.

FIG. 29B shows a high resistance tube 1 according to this embodiment.
08 shows another example of No. 08. As shown in the figure, in this example, the second high resistance portion 109 is provided around the high resistance tube 105 shown in FIG. 29A. The second high resistance portion 109 is provided for the purpose of protecting the low resistance portion 106 and the like, and as the material thereof, the same material as the inner high resistance portion 107 or another insulator may be used. it can.

Further, it is possible to reduce the resistance only in the vicinity of the surface of the resistance cylindrical body (not shown) made of integral ceramics. For example, a low resistance portion similar to that shown in FIG. 29B can be formed by applying a conductive material to the inner surfaces of both ends of the ceramic of the cylinder that has been fired and then firing the ceramic.

FIG. 30 shows the overall construction of this embodiment. As shown in the figure, in the case of the present embodiment, the two high resistance tubes 105A and 105B having different diameters are used, and the metal member forming the fourth grid G ₄ is connected to the high resistance tubes 105A and 10B.
Fix these by inserting into 5B. And
The third grid G ₃ and the fifth grid G ₅ are attached to each of the high resistance tubes 105A and 105B. Each high resistance tube 1
The above-mentioned conductive ring 11A is provided on 05A and 105B. Furthermore, the third and fifth grids G ₃ and G ₅ are connected by a lead wire l ₁ , and the fourth grid G ₄ is connected.
And the stem pin 110 are connected using the lead wire l ₂ . The cathode K and the first and second grids G ₁ and G ₂ are provided between the stem pin and the third grid G ₃ .

According to the present embodiment having the above-described structure, the resistance distribution can be made more inclined, and as a result, discharge is less likely to occur, and a lens system with even smaller lens aberration is formed to achieve high resolution. The screen can be realized.

Further, according to this embodiment, the conductive paste 70 is used.
Since the process of coating, drying and baking is unnecessary, the process can be simplified and the cost can be reduced.

Further, according to this embodiment, sparking is likely to occur, so that the breakdown voltage can be improved.

In the above embodiment, the high resistance tube 10 is used.
5A, but so as to constitute the third to fifth grids G ₃ ~G ₅ in combination two 105B, the present invention is not limited thereto, third to fifth grids one resistor cylinders it may be a low resistance portion corresponding to G ₃ ~G _5.

The high resistance tube is not limited to the cylindrical one,
For example, a tubular body having an elliptical or rectangular cross section can be used.

Further, the present invention is not limited to the main lens system,
It can also be applied to a prefocus lens system. In this case, for example, as shown in FIG. 30, two high resistance tubes 1
05A, 105B combined, one high resistance tube 105
A low resistance portion 105B is formed at two locations on A, and a low resistance portion 112 for a prefocus lens system is formed on the other high resistance tube 105B as shown in FIG. It is configured to attach the first and second grids G ₁ and G ₂ . Incidentally, 114 is a spacer.

According to the seventh embodiment having such a configuration,
The configuration near the _first and second grids G ₁ and G ₂ can be simplified. On the other hand, the low resistance portion 112 for the prefocus lens system may not be formed on the high resistance tube 105B, and the high resistance tube 105B may function only as a support. In that case, discharge prevention becomes easy.

Next, examples of the cathode ray tube according to the present invention will be described. The spherical aberration of the lens system constituted by the electron gun becomes smaller as the lens diameter becomes larger, but this lens diameter cannot be made larger than the inner diameter of the high resistance tube 3A in the above-mentioned embodiment. Therefore, as shown in FIG. 32, the maximum lens diameter that can be formed is A = D-C2-B2 in consideration of the wall thickness B and the clearance C of the high resistance tube 116. Therefore, in this embodiment, the lens diameter is increased by the following configuration.

FIG. 33 shows the principle of this embodiment. As shown in the drawing, in the cathode ray tube of the present embodiment, at least the inner wall of the neck portion 116 of the funnel 117 has a high resistance, and the inner wall of the neck portion 116 has the _{third to} fifth grids G _{3 to} G that form the main lens. _Five are provided.

FIG. 34 shows a specific essential structure of this embodiment. In this example, a bipotential electron gun is constructed. The funnel 117 of this embodiment is mainly composed of ceramics described later. As shown in FIG. 35, the insulating layer 116A is formed on the outer side of the neck portion 116 and the high resistance layer 116B is formed on the inner side thereof. Then, the conductive paste 70 described above is formed on the high resistance layer 116B.
Is applied to form electrode films G _3a and G _4a forming the third and fourth grids, and a conductive ring 118 is formed between them. Here, the electrode film G _4a is connected to the inner wall carbon 121. In this case, for example, HV
= 32 kV, the focus potential of the third grid G ₃ is 6 k
When V is set, for example, the resistance between the electrode films G _3a and G _4a is preferably about 100 MΩ to 10 TeraΩ as in the above embodiment.

The third grid G ₃ is connected to the electrode film G _3a . In this case, as shown in FIG. 37, the third grid G ₃
The rim portion G _3b is provided with a plurality of rim portions G _3b.
The third grid G ₃ and the electrode film G _3a are connected via the. In this case, as shown in FIG. 37B, the third grid G
_A plurality of springs G _3c may be provided in ₃ .

The third grid G ₃ is attached to the bead glass 119 by the pin 120. Further, the bead glass 119 is similarly pinned to the first and second pins 120.
The grids G ₁ and G ₂ are attached. Further, a known cathode K and heater H are provided near the first grid G ₁ .

FIG . 36 shows the manufacturing process of this embodiment. In this embodiment, as the base material powder forming the insulating layer 116A, forsterite (main crystal) that is a ceramic having an expansion coefficient (40 to 400 ° C., = 10210 ⁶ 1 / ° C.) similar to that of the panel glass is used. 2Mg
O.SiO ₂ ) is used. On the other hand, as the additive powder forming the high resistance layer 116B, TiO ₂ , M, which is a conductive material, is used.
nO ₂ , SiC or W, Cu metal or its oxide is used. Then, using these forsterites and conductive materials, a funnel having an insulating layer 116A and a high resistance layer 116B having a structure as shown in FIG. 35 is formed by a known powder molding method or the like (steps (1) and (2)). .

Then, the above-mentioned conductive paste is applied to the inner wall of the neck portion 116 (step (3)), and dried and baked to form the electrode films G _3a and G _4a and the conductive ring 118 (step (4) ( 5)).

Furthermore, after applying the interior carbon 121 (step (6)), the panel (not shown) and the funnel 1 are formed.
17 is hermetically sealed using frit glass (step (7)).

Then, the portion of the electron gun attached to the stem is hermetically sealed to the neck portion 116 (step (8)).
After exhausting (step (9)), known steps of getter flash, knocking, and aging (not shown) are performed to complete the cathode ray tube.

According to the present embodiment having the above-mentioned structure, since the lens diameter becomes large, spherical aberration can be made small, and as a result, a high resolution screen can be realized.

In addition, when taking in high voltage (anode), HV
Since no spring is used, carbon does not drop due to contact between the HV spring and the interior carbon, and the pressure resistance can be improved.

Further, since the discharge of the beading glass 119 with respect to the anode voltage is prevented by the electrode film G _3a connected to the third grid G ₃ , the withstand voltage characteristic can be improved in that respect as well. This is particularly effective when a bipotential type electron gun is constructed.

Further, according to this embodiment, the HV spring, the high resistance tube and its connecting member, the fourth grid and its connecting pin, etc. can be omitted, so that the number of parts can be reduced, resulting in cost reduction and It is possible to improve reliability.

As described above, in the electron gun according to the above embodiment,
According to this, whether the electronic lens component is formed of a resistance cylinder
Of the electron beam by suppressing the deviation of the concentricity of the electron lens system.
A small amount of misalignment can be achieved, and high quality images can be realized. Well
In addition, the main lens for focusing the electron beam
Since it has a resistance cylinder with poles,
Minimize the deviation of the electron beam axis by suppressing the concentricity deviation
be able to. In this case, the cathode lens and the prefo
The electrodes that make up the lens are integrated with bead glass
Fix and fix these electrodes to the other end of the resistive cylinder
To further reduce the axis deviation of the electron beam.
You can The potential gradient of the electrode tube that constitutes the main lens is small
Therefore, the discharge between the electrodes can be prevented. Addition
Therefore, the spherical aberration of the main lens can be reduced.
To improve the resolution by reducing the beam spot diameter
be able to. In addition, the main focus for focusing the electron beam
A resistive cylinder having electrodes forming a lens is made of a high resistance material.
Since it is formed with, the deviation of the concentricity of the main lens system is suppressed.
As a result, the axis deviation of the electron beam can be reduced. Well
Further, according to the present invention, the potential between the electrodes forming the main lens is
Since the gradient is small, it is possible to prevent discharge between the electrodes.
it can. In addition, reduce spherical aberration of the main lens
Therefore, the beam spot diameter can be reduced to improve the resolution.
Can be improved. In addition, the resistance cylinder
Configured to derive the conductive terminal of the fourth grid from the position
By doing so, it becomes possible to finely adjust the shaft potential and
The spherical aberration of the lens can be reduced. On the other hand,
By forming the poles integrally with the resistance cylinder, the conductive pole
Cost is reduced by eliminating the need for a host,
Since it is difficult to spark, the pressure resistance is improved. This place
In this case, the composition of the boundary between the electrode and the high resistance material is continuously changed.
This reduces the potential gradient between the electrodes and
The characteristics of the lens can be improved. And the resistance cylinder
If the electrode is formed only on the inner surface of the body, the electrode is protected
Therefore, reliability can be increased. On the other hand, the electronic lens
It is configured to be a main lens or a prefocus lens.
If this is the case, the electronic lens component can be simplified and cost can be reduced.
You can Furthermore, the resistance cylinder is an electron gun constituent member.
If it doubles as a support, it will be easier to prevent discharge.
Reliability increases. In addition, the cathode ray tube according to the present invention
If this is the case, the electron lens component is made up of a resistance cylinder that constitutes the tube.
By increasing the lens diameter,
The image quality can be improved and high image quality can be realized. And
The present invention uses rollers or dispensers to make conductive paper.
By applying the strike to the inner surface of the resistance cylinder,
The electronic lens component can be formed by transfer or tacho printing.
By, the cathode ray tube and its electron gun can be easily manufactured.
It is a thing.

The present invention is not limited to the above-mentioned embodiment, but various structures described in FIGS. 1 to 31 can be applied. For example, the electrode film and the conductive ring can be integrally formed on the neck portion, and the various methods described above can be adopted as the forming method.

[0121]

According to the electron gun of the cathode ray tube of the present invention, a plurality of main electron lenses are formed to form a main electron lens.
Because it forms a resistor cylinder with the electrode, the main electron lens
It is possible to reduce the deviation of the electron beam axis by suppressing the deviation of the concentricity of the pixel system, and it is possible to realize a high-quality image.

Furthermore, the resistance cylinder is attached to the inner surface of the insulating cylinder.
A structure in which a spiral resistance film is formed so as to overlap the electrodes, or
Is a structure made of a cylinder of high resistance material.
As a result, the potential gradient between the electrodes forming the main lens becomes small, and the discharge between the electrodes can be prevented. In addition, since the spherical aberration of the main lens can be reduced, the resolution for reducing the beam spot diameter can be improved.

[0123] Conductive along the axial direction on the outer wall surface of the resistance cylinder
A film is formed on the conductive film and the resistance cylinder.
With the configuration in which the poles are electrically connected by the holders respectively
Configure a so-called unipotential type main lens
The electrodes on both ends are made equipotential to suppress the concentric shift of the main lens system.
Therefore, the axis deviation of the electron beam can be reduced.

Form the resistance cylinder from the middle position to the middle position.
It is easy to apply a voltage to the 4th grid by arranging the electrode that leads to the conductive terminal of the 4th grid.
In addition, the axial potential can be finely adjusted , and the spherical aberration of the main lens can be further reduced.

[0125] The high resistance cylinder that constitutes the resistance cylinder is 3
Divide the surface resistance value of the intermediate high resistance material cylinder into
When set to be higher than the surface resistance value of the high-resistance material cylinder of
Can make the resistance distribution more inclined, the main electron lens
It is possible to improve the characteristics. 1st high resistance of 3 divisions
A second cylinder of high resistance material is housed that contains the cylinder of material.
The inner cylindrical body of the high resistance material by
Can be protected.

[0126] Method for manufacturing electron gun of cathode ray tube according to the present invention
According to the method, the main electron record is formed along the axial direction on the inner surface of the insulating cylinder.
The multiple electrodes that make up the
A resistance sheet should be placed on the peripheral surface so that it overlaps any of the electrodes.
A part where the resistance film is formed using a strike and the electrodes of the resistance film are excluded
Form a spiral resistance film by trimming the part into a spiral shape
And by having the process of making a resistance cylinder,
Easy to manufacture the above mentioned electron gun can do.

[0127] Method for manufacturing electron gun of cathode ray tube according to the present invention
According to the axial direction along the inner surface of the cylinder of high resistance material
Form multiple electrodes that make up the main electron lens, and
A conductive ring is formed on the inner surface of the cylinder of high resistance material corresponding to
Then, by having the step of creating the resistance cylinder,
The electron gun described above can be easily manufactured.

[0128] In the cathode ray tube according to the present invention,
Since it has an electron gun, you can increase the lens diameter.
The lens characteristics can be further improved and the image quality can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing the overall configuration of a first embodiment of the present invention.

FIG. 2A is a front view of the cylindrical holder of the same embodiment. B
FIG. 2B is a sectional view taken along the line a-0-a ′ of FIG. 2A. C b- in FIG. 2A
It is a b'line sectional view. FIG. 3D is a sectional view taken along line cc ′ of FIG. 2C.

FIG. 3 is a plan view of the HV shield of the same embodiment.

FIG. 4 is a flowchart showing a manufacturing process of the embodiment.

FIG. 5 is an explanatory diagram showing the manufacturing process of the example.

FIG. 6 is a cross-sectional view showing a mounting portion of a G ₄ pin of the same embodiment.

FIG. 7 is an explanatory diagram showing an example of a method of applying a resistance paste in the example.

FIG. 8 is an explanatory diagram showing an example of a method of trimming a resistance film in the example.

FIG. 9 is an explanatory diagram showing an example of a method for forming a spiral resistance film in the same Example.

FIG. 10 is a cross-sectional view showing another example of the method of attaching the cylindrical holder according to the embodiment.

FIG. 11 is a cross-sectional view of essential parts of a second embodiment of the present invention.

FIG. 12 is a sectional view showing the overall structure of a third embodiment of the present invention.

FIG. 13 is a flow chart showing a manufacturing process of the embodiment.

FIG. 14 is an explanatory diagram showing the manufacturing process of the example.

FIG. 15 is an explanatory diagram showing a first example of a method for forming an electrode film and a conductive ring.

FIG. 16 is an explanatory diagram showing a second example of a method for forming an electrode film and a conductive ring.

FIG. 17 is an explanatory diagram of an electrode film and a conductive ring formed according to the same example.

FIG. 18 is an explanatory diagram showing a third example of a method for forming an electrode film and a conductive ring.

FIG. 19 is an explanatory diagram showing a fourth example of a method for forming an electrode film and a conductive ring.

FIG. 20 is an explanatory diagram showing a fifth example of a method for forming an electrode film and a conductive ring.

FIG. 21 is an explanatory diagram showing a sixth example of a method for forming an electrode film and a conductive ring.

FIG. 22 is an explanatory diagram for explaining the role of the conductive ring.

FIG. 23 is a graph for explaining the role of a conductive ring.

FIG. 24 is an explanatory diagram showing the principle of the effect of the third embodiment.

FIG. 25 is a cross-sectional view showing another example of the method of attaching the cylindrical holder.

FIG. 26 is an explanatory diagram showing another example of a method of fixing a high resistance tube.

FIG. 27 is a perspective view showing a main part of a fourth embodiment of the present invention.

28A and 28B are a sectional view and a plan view showing an essential part of the fifth embodiment of the present invention.

FIG. 29 is a cross-sectional view of essential parts showing a sixth embodiment of the present invention.

FIG. 30 is an overall configuration diagram of the same embodiment.

FIG. 31 is a sectional view of a key portion showing a seventh embodiment of the present invention.

FIG. 32 is a sectional view for explaining the lens diameter.

FIG. 33 is a principle view showing an embodiment of a cathode ray tube according to the invention.

FIG. 34 is a cross-sectional view showing the main parts of the same embodiment.

FIG. 35 is a cross-sectional view of an essential part of the embodiment and its equivalent circuit diagram.

FIG. 36 is a flowchart showing a manufacturing process of the example.

FIG. 37 is a perspective view showing a third grid of the same example.

FIG. 38 is an explanatory diagram showing a schematic configuration of a conventional example.

[Explanation of symbols]

1 Neck 2 Stem 3 Insulation Tube 3A High Resistance Tube 4 HV Shield 5 HV Spring 6 Stem Pin 7 Bead Glass 8, 9, 10 Electrode Film 11 Resistance Film 11A Conductive Ring 12 (12a, 12b) Cylindrical Holder 13 Flange 14 Protrusion 15G ₄ Pin 17 conductive film G ₁ first grid G ₂ second grid G _3a , G _4a electrode film G _3A cup member G ₃ third grid

Continuation of the front page (56) Reference JP-A-4-230935 (JP, A) JP-A1-225044 (JP, A) JP-A-3-40343 (JP, A) JP-A-63-225464 (JP , A) Actual development Sho 58-91845 (JP, U) (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01J 29/48 H01J 9/14

Claims (14)

(57) [Claims] 1. A cathode and a first electrode arranged coaxially with the cathode.
A resistance cylinder having a plurality of electrodes forming a pole, a second electrode and a main electron lens, wherein the resistance cylinder is axially formed on an inner surface of the insulating cylinder.
The plurality of electrodes are adhered and formed so as to overlap any of the electrodes.
The inner surface of the insulating cylindrical body corresponding to each of the electrodes
An electron gun for a cathode ray tube, which is characterized in that a spiral resistance film is formed . 2. A cathode and a first electrode coaxially arranged.
A resistance cylinder having a pole, a second electrode and a plurality of electrodes forming a main electron lens, wherein the resistance cylinder is axially formed on an inner surface of the cylinder made of a high resistance material.
A plurality of electrodes are deposited along the electrodes, and a pair of electrodes is provided between the electrodes.
A conductive ring is formed on the inner surface of the cylindrical body of the high resistance material.
An electron gun for a cathode ray tube, which is characterized by being formed . 3. An outer wall surface of the resistance cylinder along an axial direction.
A conductive film is formed on the opposite ends of the conductive film and the resistance cylinder.
This made the electrodes are electrically connected by each holder
An electron gun for a cathode ray tube according to claim 1, wherein: 4. The resistance of the plurality of electrodes of the resistor cylinder is
Electrically connected to the electrode formed in the middle between the two ends of the anti-cylindrical body
The connected conductive pin is led out of the resistance cylinder.
An electron gun for a cathode ray tube according to claim 1 or 2, wherein 5. The cylindrical body of the high resistance material is divided into three , and the surface resistance value of the intermediate cylindrical body of the high resistance material is high.
The electron gun for a cathode ray tube according to claim 2, wherein the electron resistance is set to be larger than the surface resistance value of the cylindrical body of the anti-substance . 6. The cylindrical body of high resistance material is divided into three parts.
And a first high-resistance substance cylinder, and the first high-resistance substance cylinder
It becomes the body and a second high-resistance material cylinder which UchiOsamu, middle high-resistance material of said first high-resistance material cylinder
The surface resistance value of the cylinder is the surface of the high resistance material cylinder at both ends.
The second high resistance material cylinder is set to have a resistance value higher than that of the middle high resistance material.
The same material as the cylinder, or the first high resistance material cylinder
Claims, characterized in that formed by formed of a material different
2. An electron gun for a cathode ray tube as described in 2 . 7. The main electric power is applied to the inner surface of the insulating cylinder along the axial direction.
A step of forming a plurality of electrodes constituting a child lens, and any one of the plurality of electrodes on the inner peripheral surface of the insulating cylinder.
Process to form a resistance film with resistance paste so that it also overlaps
And a portion of the resistive film excluding the electrodes is spirally trimmed.
To form a spiral resistance film and make a resistance cylinder.
Arrangement of the process, the first electrode, the second electrode, and the resistance cylinder body coaxially
And dispose a cathode adjacent to the first electrode.
A method of manufacturing an electron gun for a cathode ray tube, comprising the steps of : 8. The inner surface of the cylindrical body made of a high resistance material is axially aligned.
To form a plurality of electrodes that form the main electron lens
And on the inner surface of the cylindrical body of the high resistance material corresponding to each of the electrodes.
A step of forming a conductive ring and producing a resistance cylinder, and arranging the first electrode, the second electrode and the resistance cylinder coaxially.
And dispose a cathode adjacent to the first electrode.
A method of manufacturing an electron gun for a cathode ray tube, comprising the steps of : 9. A cathode and a first electrode coaxially arranged.
A plurality of electrodes that form the pole, the second electrode, and the main electron lens.
And a resistance cylinder having a resistance cylinder, the resistance cylinder being provided on the inner surface of the insulating cylinder along the axial direction.
The plurality of electrodes are adhered and formed on any of the plurality of electrodes.
The insulation corresponding to the plurality of electrodes so that
Electrons formed by forming a spiral resistance film on the inner surface of a cylinder
A cathode ray tube comprising a gun . 10. A cathode and a first member arranged coaxially with the cathode.
A plurality of electrodes that form the electrode, the second electrode, and the main electron lens
And a resistance cylinder having a resistance cylinder, the resistance cylinder being axially formed on the inner surface of the cylinder of high resistance material.
A plurality of electrodes are formed along the line between the plurality of electrodes.
A conductive ring is formed on the inner surface of the cylinder of the high resistance material corresponding to
A cathode ray tube comprising an electron gun formed by forming a . 11. The resistance cylindrical body constituting the electron gun.
A conductive film is formed on the outer wall surface of the resistor along the axial direction, and the conductive film and the resistor cylinder are formed on both ends of the conductive film.
This made the electrodes are electrically connected by the respective holder
The cathode ray tube according to claim 9 or 10, characterized in that . 12. The resistance cylinder of the electron gun
Formed in the middle of both ends of the resistance cylinder among multiple electrodes
The conductive pin electrically connected to the
10. The structure of claim 9 which is led out of the cylindrical body.
Is a cathode ray tube according to item 10 . 13. The high resistance material of the electron gun
The cylinder is divided into three parts, and the surface resistance value of the middle cylinder of high resistance material is
Consists of greater than the surface resistance of the cylinder of anti-substance
The cathode ray tube according to claim 10, wherein 14. The high resistance material of the electron gun
The cylindrical body is divided into three first high-resistance material cylindrical body;
Second high-resistance substance circle containing the first high-resistance substance cylinder
It consists of a cylindrical body, an intermediate high resistance material of said first high-resistance material cylinder
The surface resistance value of the cylinder is the surface of the high resistance material cylinder at both ends.
The second high resistance material cylinder is set to have a resistance value higher than that of the middle high resistance material.
The same material as the cylinder, or the first high resistance material cylinder
Claims, characterized in that formed by formed of a material different
10. The cathode ray tube according to item 10 .