JP3373422B2 - Silicon wafer processing machine - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silicon wafer (hereinafter simply referred to as "wafer") processing machine and, more particularly, to enable a wafer to be continuously polished without being removed from a work plate after the wafer is ground. Wafer processing machine.

[0002]

2. Description of the Related Art A grinding machine has been developed and used as a wafer surface processing machine. However, the surface of the wafer is still rough even after grinding, and the surface properties due to residual compressive stress, work-affected layer, etc. are not satisfactory, and it is necessary to finally carry out polishing. Grinding is a motion control method, that is, motion transfer processing, and polishing is a pressure control method, that is, pressure transfer processing, and both have different processing principles.
For this reason, generally, both grinding and polishing are not performed on the same processing machine, after the grinding is completed, the wafer is removed from the work plate, transferred to another polishing machine, set on the work plate again and polished. is doing. In this way, since grinding and polishing are performed separately, the grinding machine and the polishing machine are combined.
It took a lot of processing machine and required a lot of time and labor for setup.

Partly, an experiment was conducted in which grinding and polishing were continuously processed by using the same board and the same spindle, and reported (Magazine Mechanical Technology Vol. 44, No. 10, 75-80).
Page), but in the method announced here,
After grinding, the switching plate is removed to separate the constant cutting mechanism, and the grinding wheel and replaced polishing disk are made to act on the wafer processing surface for polishing, so it is not necessary to remove and transfer the wafer, It took a lot of labor and time to change the setup.

[0004]

DISCLOSURE OF THE INVENTION The present invention, in wafer processing, does not remove and transfer the wafer after the grinding is completed, and the polishing operation is continuously performed on the same work table by a simple operation of hydraulic control. The object is to obtain a wafer processing machine that can perform

[0005]

SUMMARY OF THE INVENTION According to the present invention, a grinding wheel holder is fixed to a spindle that is rotationally driven and is capable of constant cutting feed, and a grinding wheel holder is cylindrically fitted to the outer periphery of the grinding wheel holder to perform grinding. The wheel holder is formed with a circumferential groove having a square cross section on the outer circumference, and the grinding wheel holder is provided on the inner surface side with an eaves-shaped flange that fits into the circumferential groove of the grinding wheel holder. The circumferential groove serves as a cylinder, and the flange of the grinding wheel holder serves as a piston,
By supplying hydraulic pressure to the circumferential groove of the grinding wheel holder to slide the grinding wheel holder axially on the outer peripheral surface of the grinding wheel holder, so that the grinding wheel surface of the grinding wheel can be projected from the grinding surface of the grinding wheel. did. Further, hydraulic pressure is supplied to the circumferential groove of the grinding wheel holder via a pipe line provided in the center of the main shaft in the axial direction and a pipe line provided radially in a direction perpendicular to the axis of the grinding wheel holder.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 1 is a cross-sectional view showing a mounting state of a grinding wheel and a polishing wheel according to the present invention. In the figure, an upper half shows a state where a grinding wheel projects during grinding, and a lower half shows a state where a polishing wheel projects during polishing. Shows. Reference numeral 1 is a headstock, which is capable of rotating a main spindle 2 and
Supports constant feed. Reference numeral 3 denotes a conduit formed at the center of the main shaft 2 in the axial direction, to which hydraulic pressure is supplied via the rotary coupling 4.

Reference numeral 5 is a grinding wheel holder fixed to the main shaft 2, and 6 is a grinding wheel attached to the holder 5. Reference numeral 7 is a polishing grindstone holder that is cylindrically fitted around the outer circumference of the grinding wheel holder 5, and 8 is a grinding grindstone attached to the holder 7. A circumferential groove 9 having a square cross section is formed on the outer peripheral surface of the grinding wheel holder 5, and an eave-shaped flange 1 is formed on the inner surface side of the grinding wheel holder 7.
0 is formed, and the circumferential groove 9 serves as a cylinder and the flange 10 serves as a piston in a state where the grinding wheel holder 7 is fitted to the grinding wheel holder 5. Reference numeral 11 denotes a pipe line formed in a direction perpendicular to the axis of the grinding wheel holder 5, and a plurality of pipe lines are provided in a radial pattern. The pipe lines 11 communicate with the pipe lines 3 formed on the main shaft 2 and are connected to the circumferential groove 9. It is open. A pressing spring 12 is housed in the circumferential groove 9 of the grinding wheel holder 5, contacts the flange 10 of the grinding wheel holder 7, and normally causes the grinding wheel holder 7 to contact the grinding surface of the grinding wheel holder 5. It is urged to be located on the opposite side, that is, the left end in the figure. In addition, 13 is a hole for positioning the push spring 12, which is provided in a groove shape on the side surface of the circumferential groove 9 on the grinding side.

2 and 3 show a detent structure between the grinding wheel holder 5 and the grinding wheel holder 7. In FIG. 2, the detent pin 14 is planted on the side of the grinding wheel holder 5 on the cutting surface side of the circumferential groove 9, and its tip is inserted into the pin hole 15 drilled in the flange 10 of the grinding wheel holder 7. Has been done. In FIG. 3, the detent pin 16 is an elongated hole 17 provided in the polishing grindstone holder 7.
Is screwed into the grinding wheel holder 5 through
In any case, between the grinding wheel holder 5 and the polishing grindstone holder 7, the sliding in the axial direction, the lateral direction in the drawing, of the two is made free and the sliding in the rotational direction is prevented. Reference numeral 18 in the drawing denotes a processed surface of the wafer. Further, although not shown, the ground gold steel grains and the whetstone grains are fixed to the ground surface A and the grindstone surface B, respectively.

The configuration of the present invention is as described above. Next, the operation of this wafer processing machine will be described. First, when the hydraulic pressure is not supplied to the circumferential groove 9 of the grinding wheel holder 5, the grinding wheel holder 7 is pushed by the pressing spring 12 to the position of the left end of the grinding wheel holder 5 in the figure, and the grinding surface A is As shown in the upper half of FIG. 1, it is in a state of protruding from the end of the polishing grindstone 8. In this state, while the grinding wheel 6 is rotated, a constant cutting feed is given to grind the wafer processing surface 18.

Next, when the grinding process is completed, the circumferential groove 9 of the grinding wheel holder 5 is passed through the conduit 3 and the conduit 11.
Supply hydraulic pressure to. By the supply of this hydraulic pressure, the grinding wheel holder 7 overcomes the reaction force of the pressing spring 12 and is pushed rightward in the figure, and finally pushed to the right end of the grinding wheel holder 5 in the figure. At this time, the grindstone surface B is in a state of protruding from the end of the grinding wheel 6 as shown in the lower half of FIG. In this state, the polishing grindstone 8 is rotated together with the grinding wheel 5 to polish the wafer processing surface 18. During the polishing process, the amount of the hydraulic pressure that overcomes the spring pressure of the push spring 12 becomes the polishing pressure, so the polishing pressure can be adjusted by adjusting the hydraulic pressure.

FIG. 4 shows another example of mounting the grinding wheel and the grinding wheel according to the present invention. Reference numeral 19 is a grinding wheel in which a holder is integrated, and 20 is a grinding wheel in which a holder is integrated. Other configurations are the same as the example shown in FIG. It is also possible to configure in this way, and it is possible to obtain equivalent actions and effects. In the figure, 12a is a push spring having a small coil diameter, and 13a is a push spring 12a.
It is also possible to accommodate a large number of pressing springs 12a having a small coil in the circumferential groove 9 of the grinding wheel 5 for holding a large diameter in any of FIGS. 1 and 4. The push spring 12 and the push spring 12a having a small diameter can be arbitrarily selected.

Further, in these embodiments, the pipe line 11 provided in the grinding wheel 5 is opened to the side surface of the grinding wheel holder 5 opposite to the grinding surface of the circumferential groove 9, and the pressing spring 12 is set to the circumference. It was housed in a hole 13 drilled on the side of the groove 9 on the grinding surface side and abutted on the flange 10 of the grinding wheel holder 7, but the reverse is the case, that is, the pipe line 11 is on the grinding surface side of the circumferential groove 9. Of the circumferential groove 9 is housed in a hole drilled on the side opposite to the ground surface of the circumferential groove 9,
In the normal state, the polishing wheel 8 is projected, and hydraulic pressure is supplied to the grinding wheel 6 to project.

[0013]

According to the present invention, the holder of the grinding wheel is cylindrically fitted to the outer peripheral surface of the grinding wheel holder, and the outer peripheral surface of the grinding wheel holder is slidable in the axial direction. By sliding it so that the grinding wheel surface can be projected from the grinding wheel surface of the grinding wheel, after the grinding of the wafer, it is possible to continue polishing without removing the wafer by hydraulic operation only. It has the effect of being able to.

[Brief description of drawings]

FIG. 1 is a sectional view showing the attachment of a grinding wheel and a polishing grindstone of the present invention.

FIG. 2 is a schematic view showing a detent structure.

FIG. 3 is a schematic view showing another detent structure.

FIG. 4 is a cross-sectional view showing another attachment of the grinding wheel and the polishing grindstone of the present invention.

[Explanation of symbols]

1 Headstock 2 spindles 3 pipelines 4 revolving joint 5 grinding wheel holder 6 grinding wheel 7 Polishing wheel holder 8 polishing wheels 9 circumferential groove 10 flange 11 pipelines 12, 12a Push spring 13, 13a Spring hole 14 16 Non-rotating pin 15 pin hole 17 slots 18 Wafer processing surface 19 grinding wheel 20 polishing whetstone A ground surface B grindstone surface

─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Ryuzo Masaki 5-2 Sokai-cho, Niihama-shi, Ehime Sumitomo Heavy Industries Machinery Co., Ltd. Niihama Plant (72) Inventor Kazutaka Hara 63-30 Yuhigaoka, Hiratsuka-shi, Kanagawa Sumitomo Heavy Industries Co., Ltd. Hiratsuka Works (72) Inventor Yoshiyuki Tomita 63-30 Yuhigaoka, Hiratsuka City, Kanagawa Sumitomo Heavy Industries Co., Ltd. Hiratsuka Works (56) Reference JP 57-168856 (JP, JP, 168856) A) JP-A-4-223859 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B24D 7/14 H01L 21/304 621 H01L 21/304 631

Claims (2)

(57) [Claims] 1. A grinding wheel holder is fixed to a main shaft, a grinding wheel holder is cylindrically fitted on the outer circumference of the grinding wheel holder, and a circumferential groove having a square cross section is formed on the outer circumference of the grinding wheel holder. The holder is provided with an eaves-shaped flange that fits in the circumferential groove of the grinding wheel holder, the circumferential groove of the grinding wheel holder serves as a cylinder, and the flange of the grinding wheel holder serves as a piston. By supplying hydraulic pressure to the circumferential groove of the grinding wheel holder to slide the grinding wheel holder axially on the outer peripheral surface of the grinding wheel holder, so that the grinding wheel surface of the grinding wheel can be projected from the grinding surface of the grinding wheel. A silicon wafer processing machine characterized by the above. 2. A hydraulic pressure is supplied to the circumferential groove of the grinding wheel holder via a pipe line provided in the axial center of the main shaft and a pipe line provided radially in a direction perpendicular to the axis of the grinding wheel holder. The silicon wafer processing machine according to claim 1, which is characterized in that.