JP3367564B2 - Carrier tape with heat resistance conductivity - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant conductive material obtained by molding a resin composition containing carbon black in a polyphenylene ether resin by injection molding. Carrier tape. The carrier tape is an IC
It has heat resistance, conductivity and mechanical strength, and is capable of precision molding of pockets. 2. Description of the Related Art Conventionally, injection molding trays, vacuum molding trays, and the like have been used for packaging ICs and electronic equipment parts using ICs.
Embossed carrier tapes and the like are known. In general, plastic has a high surface resistivity, so that it is very easily charged and may break the function of IC. For this reason, (1) a method of applying an antistatic agent to the surface of a packaging container, (2) a method of applying a conductive paint, (3) a method of kneading an antistatic agent or carbon black into a molding resin, etc. Has been proposed. [0003] On the other hand, the IC encapsulant becomes resinous, the amount of moisture absorbed by the IC mold increases, and the sudden dehumidification that occurs when the IC is bonded to the substrate surface causes accidents such as deterioration of the IC function and wiring corrosion. In order to prevent this, pre-drying at 125 ° C. to 150 ° C., which is called baking, is generally performed before bonding the IC to the substrate surface. Many heat-resistant conductive resin compositions have been proposed as materials for the baking packaging container, and injection molding trays using the same have been used. However, injection molding trays cannot cope with high-speed mounting of ICs, and with embossed carrier tapes manufactured by conventional vacuum molding, it is difficult to precisely mold minute ribs and the like in pockets, and lead pins of ICs may be bent. Failure may occur. SUMMARY OF THE INVENTION [0004] The present invention has a heat resistance, a conductivity and a mechanical strength suitable for packaging ICs and electronic devices, and enables the precision molding of pockets. It is intended to provide a carrier tape. The present inventors have conducted intensive studies on the above-described carrier tape having heat resistance and conductivity, and as a result, the carrier tape contains (A) a polyphenylene ether-based resin composed of a polyphenylene ether resin and a polystyrene-based resin, and (B) carbon black. It is suitable for packaging of IC and electronic equipment by using resin composition and molding by injection molding. It has heat resistance, conductivity and mechanical strength, and heat resistance and conductivity that enables precision molding of pockets. And the present invention has been completed. [0005] That is, the present invention provides:
(A) a resin composition containing 38 to 96 parts by weight of a polyphenylene ether resin and 62 to 4 parts by weight of a polystyrene resin, and 100 parts by weight of a polyphenylene ether resin and (B) 5 to 50 parts by weight of carbon black;
A carrier tape having heat resistance and conductivity, which is produced by injection molding. Hereinafter, the present invention will be described in more detail. The polyphenylene ether resin used in the present invention is a homopolymer or a copolymer described in US Pat. No. 3,383,435. The polyphenylene ether resin used in the present invention comprises a polyphenylene ether resin and a polystyrene resin, and the content of the polyphenylene ether resin in 100 parts by weight of the resin is 38 to 96.
If it is less than 38 parts by weight, sufficient heat resistance and mechanical properties cannot be obtained, and if it exceeds 96 parts by weight, the melt viscosity becomes high, and processing by injection molding becomes difficult. Further, within this range, it is particularly preferably 48 to 88 parts by weight. The polystyrene resin is an impact-resistant polystyrene resin containing a rubber component in an amount of 2 to 10% by weight or a mixture of an impact-resistant polystyrene resin and a transparent polystyrene resin for the effect of reinforcing impact resistance. Those containing components can be used. Further, it is possible to add a modifier in order to improve mechanical properties such as impact resistance. As the modifier, ethylene-vinyl acetate copolymer resin and ethylene-ethyl acrylate copolymer resin are known, but in the present invention, it is preferable to use ethylene-ethyl acrylate copolymer resin, An ethylene-ethyl acrylate copolymer resin having a content of ethyl acrylate of 5 to 20% by weight is particularly preferred. The addition amount of the modifier such as ethylene-ethyl acrylate copolymer resin is preferably 5 to 20 parts by weight, particularly preferably 5 to 15 parts by weight, per 100 parts by weight of the polyphenylene ether-based resin. If the amount of the modifying material is less than 5 parts by weight, the effect as the modifying material cannot be sufficiently obtained, and if it exceeds 20 parts by weight, the heat resistance decreases. As the conductivity-imparting material, various conductive fillers such as carbon fiber, metal fiber, metal powder, and carbon black can be used. However, in order to obtain mechanical properties and secondary formability, carbon black is used. Is preferred. The carbon black that can be used in the present invention includes furnace black, channel black, acetylene black and the like, and preferably has a carbon purity of 98% or more and a volatile content of 1.5% or less. If the volatile matter content exceeds 1.5%, the surface of the molded article loses its gloss during injection molding. The amount of carbon black added is preferably 5 to 50 parts by weight based on 100 parts by weight of the polyphenylene ether-based resin, and if it is less than 5 parts by weight, sufficient conductivity cannot be obtained. Will drop. In addition, if necessary, various additives such as an antioxidant and a lubricant can be added, and further, a filler can be added to such an extent that the mechanical properties are not significantly reduced. The basic performance of the resin composition of the present invention is as follows: (1) The heat resistance is JIS-K-
The heat distortion temperature according to 7207 is 100 ° C. or higher, particularly preferably 120 ° C. or higher, and (2) the conductivity is preferably such that the surface resistivity is 10 ⁹ or lower. The method of producing the heat-resistant conductive carrier tape of the present invention is not particularly limited, and a general method can be used. Usually, first, the compound of each raw material is kneaded by a kneader such as a twin-screw extruder or a continuous kneader to form pellets, and then a carrier tape is formed by an injection molding machine. An appropriate range of these processing temperatures is in the range of 250 to 350 ° C. If the temperature is lower than this temperature range, sufficient molding cannot be performed. On the high temperature side, the resin may be deteriorated and the physical properties may be reduced. By molding the carrier tape by injection molding, it is possible to continuously mold the carrier tape. By shaping several pockets in a shape that can be connected and removed, the length can be adjusted to a convenient length. Further, when the pocket connecting portion is strong and it is difficult to wind the tape connecting portion on a tape reel, it is also possible to form an adhesive on a heat-resistant sheet or film. The carrier tape referred to in the present invention is an electronic component packaging material having a large number of pockets for inserting electronic components such as ICs on the tape.
It refers to products represented by SC-0806 and EIA-481-A. The tape width of the carrier tape of the present invention is
Generally, it is in the range of 8 to 56 mm, and the thickness of the tape portion between the pockets is 0.05 to 2.0 mm. If the tape width is too large or the thickness of the tape portion is too large, the reel winding property is deteriorated, which is not practical. The present invention will be described below by way of examples. Example 1 A polyphenylene ether resin, a high-impact polystyrene resin, carbon black and an ethylene-ethyl acrylate copolymer resin, each having a trade name shown in Table 1, were blended in a resin composition shown in Table 2, The mixture was kneaded by a twin-screw extruder to form pellets. Then, using a pellet, an injection molding machine was used to measure the outer dimensions to be 24 mm in width and 11 in length.
A carrier tape having 0 mm, 5 pockets each having a length of 21 mm, a width of 21 mm and a depth of 3 mm, and a thickness of 0.5 mm at the bottom of the pocket was formed. Table 3 shows various evaluation results of the composition, and Table 4 shows various evaluation results of the molded article. Examples 2 to 4 In the same manner as in Example 1, the components were mixed with the raw materials and the resin compositions having the trade names shown in Tables 1 and 2, and a carrier tape was formed. Tables 3 and 4 show various evaluation results. Comparative Examples 1 to 3 In the same manner as in Example 1, the components were mixed with the raw materials and resin compositions having the trade names shown in Tables 1 and 2, and a carrier tape was formed. Tables 3 and 4 show various evaluation results. Various evaluation methods are described below. 1) Melt flow index Measured at 280 ° C under a load of 5 kg in accordance with JIS-K-7210. 2) Plate formed by surface resistance injection molding (120 mm × 120
(mm × thickness 3 mm), silver paint was applied to 9 places at intervals of 10 mm, and electrodes were formed to obtain samples.
This was measured by Loresta MCP-Tester / Mitsubishi Yuka Co., Ltd., and the logarithmic average was taken as the surface resistance. 3) Izod impact strength The test was performed in accordance with JIS-K-7110, and the numerical values were average values of the evaluation results in the flow direction and the width direction. 4) Heat deformation temperature Measurement was performed under a load of 18.6 kg / cm ² in accordance with JIS-K-7207. 5) Precise moldability At the bottom of the pocket of the molded article having the same shape as the drop impact strength test,
Top part width 0.2mm, base part width 0.5m
m, a small rib with a trapezoidal cross section with a height of 0.8 mm
It is molded as 5 mm x 15 mm square, and a molded article having minute ribs can be molded, and a molded article that cannot be molded is represented as x. 6) Drop impact strength The outer dimensions are 21m on a tape 24mm wide x 110mm long.
When a molded product having five pockets of m × 21 mm × 3 mm in depth was dropped from a height of 1 m, a damaged product was evaluated as x, and an unbroken product was evaluated as ○. 7) The outer surface resistance of the molded product is 21 m on a tape of 24 mm width x 110 mm length.
In a molded product having five pockets of m × 21 mm × 3 mm in depth, four points of surface resistance between the bottoms of adjacent pockets were measured by Lorester MCP-Tester / Mitsubishi Yuka Co., Ltd., and the logarithmic average was taken as the surface resistance. . 8) Reel winding property A carrier tape having a width of 24 mm and a length of 90 m produced by injection molding is wound on a reel having a reel core diameter of 100 mm. X. [Table 1] [Table 2] [Table 3] [Table 4] As described above, the present invention relates to (A) 100 parts by weight of a polyphenylene ether resin comprising 38 to 96 parts by weight of a polyphenylene ether resin and 62 to 4 parts by weight of a polystyrene resin, and (B) ) Carbon black 5
A resin composition containing up to 50 parts by weight, formed by injection molding, and having heat resistance, conductivity and mechanical strength suitable for packaging ICs and electronic devices, and Provide a carrier tape capable of precision molding.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-218564 (JP, A) JP-A-3-87097 (JP, A) Patent 3115029 (JP, B2) Patent 2801655 (JP, B2) Patent 2928290 (JP, B2) (58) Field surveyed (Int. Cl. ⁷ , DB name) B65D 73/02 B65D 85/86 C08L 23/08 C08L 71/12 H05K 13/02

Claims (1)

(57) [Claims] (1) Polyphenylene ether resin (A)
96 parts by weight of a polystyrene resin 62-4 parts by weight polyphenylene ether resin 100 parts by weight consisting of the ethyl
5-20 parts by weight of a len-ethyl acrylate copolymer resin
And (B) a carrier tape having heat resistance, comprising a resin composition containing 5 to 50 parts by weight of carbon black and formed by injection molding.