JP3366932B2 - Contact bump and its manufacturing method - Google Patents
Contact bump and its manufacturing methodInfo
- Publication number
- JP3366932B2 JP3366932B2 JP03201196A JP3201196A JP3366932B2 JP 3366932 B2 JP3366932 B2 JP 3366932B2 JP 03201196 A JP03201196 A JP 03201196A JP 3201196 A JP3201196 A JP 3201196A JP 3366932 B2 JP3366932 B2 JP 3366932B2
- Authority
- JP
- Japan
- Prior art keywords
- metal material
- wire
- wiring pattern
- contact bump
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は接点バンプとその
製法に関し、特に生産性の向上に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact bump and a method for manufacturing the same, and more particularly to improving productivity.
【0002】[0002]
【従来の技術】従来の接点バンプ1は図3に示すように
基板(リッジッドまたはフレシキブル)の配線パターン
3上に形成され、図4に示すように他の配線部材4の配
線パターン4bと接触させ、電気的導通がとられる。こ
のような接点バンプは例えばコネクタなどに使用され
る。2. Description of the Related Art A conventional contact bump 1 is formed on a wiring pattern 3 of a substrate (ridged or flexible) as shown in FIG. 3 and is brought into contact with a wiring pattern 4b of another wiring member 4 as shown in FIG. , Electrical continuity is established. Such contact bumps are used, for example, in connectors.
【0003】従来の接点バンプ1の製法は、フォトリソ
グラフィ技術とメッキ技術を応用したものであり、図5
を参照して工程順に説明する。
(A)基板の配線パターン3上に感光性レジスト5を塗
布する。
(B)配線パターン3上のバンプ形成領域6のみに光7
が当たるように、ガラス基板9a上に領域8を除いてク
ロム9bを蒸着させたマスク9を準備しておく。そのマ
スク9を感光性レジスト5を塗布した基板2上に位置決
めして配設し、感光性レジスト5を露光する。The conventional method of manufacturing the contact bumps 1 is to apply photolithography technology and plating technology.
Will be described in order of steps. (A) A photosensitive resist 5 is applied on the wiring pattern 3 of the substrate. (B) Light 7 is applied only to the bump formation region 6 on the wiring pattern 3.
A mask 9 is prepared by vapor-depositing chromium 9b on the glass substrate 9a except for the region 8 so that the mask 9 will hit. The mask 9 is positioned and disposed on the substrate 2 coated with the photosensitive resist 5, and the photosensitive resist 5 is exposed.
【0004】(C)基板2を溶剤にひたして、感光性レ
ジスト5の光の当たった部分を溶解、除去する。
(D)メッキ技術を応用して、配線パターン3上の感光
性レジスト5の除去された領域8に接点バンプ1を形成
する。
(E)基板2を溶剤にひたして、感光性レジスト5を全
て溶解、除去する。(C) The substrate 2 is immersed in a solvent to dissolve and remove the light-exposed portion of the photosensitive resist 5. (D) Applying the plating technique, the contact bump 1 is formed on the region 8 of the wiring pattern 3 where the photosensitive resist 5 has been removed. (E) The substrate 2 is immersed in a solvent to dissolve and remove all the photosensitive resist 5.
【0005】[0005]
【発明が解決しようとする課題】上記説明から分かるよ
うに、従来の接点バンプの製法は工程数が多く、作業時
間が長くなり、生産性が悪い欠点があった。この発明の
目的は、これら従来の欠点を解決し、製造工程を簡単化
して、作業時間を短縮し、生産性を向上させようとする
ものである。As can be seen from the above description, the conventional contact bump manufacturing method has a number of steps, a long working time, and poor productivity. An object of the present invention is to solve these conventional drawbacks, simplify the manufacturing process, shorten the working time, and improve the productivity.
【0006】[0006]
(1)請求項1の接点バンプの製法は、配線パターン上
に低融点の少量の第1金属材料を配設する第1工程と、
第1金属材料より融点の高い第2金属材料より成るワイ
ヤを、配線パターン上に配された第1金属材料の上を覆
うように、半ループ状に配設する第2工程と、配線パタ
ーンと、その上に配された第1金属材料及びワイヤとを
加熱し、第1金属材料のみを溶解させ、そのぬれ性によ
ってワイヤと配線パターンとで囲まれた領域内に充満さ
せた後、冷却させる第3工程とより成るものである。(1) The method for manufacturing contact bumps according to claim 1 comprises a first step of disposing a small amount of a low melting point first metal material on a wiring pattern,
A second step of arranging a wire made of a second metal material having a melting point higher than that of the first metal material in a half loop so as to cover the first metal material arranged on the wiring pattern; , Heating the first metal material and the wire arranged thereon to melt only the first metal material, and fill the region surrounded by the wire and the wiring pattern by its wettability, and then cool it. It comprises a third step.
【0007】(2)請求項2の発明は、前記(1)にお
いて、第1工程が第1金属材料より成るワイヤの一端を
配線パターン上にボンディングすると共に、そのボンデ
ィングされた一端の近傍を切断する工程を含むものであ
る。
(3)請求項3の発明は、前記(1)において、第2工
程が第2金属材料より成るワイヤの一端を配線パターン
上の第1金属材料の一側にボンディングした後、半ルー
プ状に延長し、その延長端を切断する工程を含むもので
ある。(2) In the invention of claim 2, in the above-mentioned (1), in the first step, one end of the wire made of the first metal material is bonded to the wiring pattern, and the vicinity of the bonded one end is cut. It includes a step of performing. (3) In the invention of claim 3, in the above-mentioned (1), after the second step of bonding one end of the wire made of the second metal material to one side of the first metal material on the wiring pattern, a half-loop shape is formed. It includes the steps of extending and cutting the extended end.
【0008】(4)請求項4の発明は、前記(1)にお
いて、第2工程が第2金属材料より成るワイヤを配線パ
ターン上の第1金属材料の両側にボンディングする工程
を含むものである。
(5)請求項5の接点バンプは、配線パターン上に半ル
ープ状の金属ワイヤが上に凸に配設され、その金属ワイ
ヤと配線パターンとで囲まれた領域に、金属ワイヤより
低融点の金属材料が充満されているものである。(4) According to the invention of claim 4, in the above (1), the second step includes a step of bonding a wire made of a second metal material to both sides of the first metal material on the wiring pattern. (5) In the contact bump according to claim 5, a semi-loop-shaped metal wire is provided on the wiring pattern so as to be convex upward, and the region surrounded by the metal wire and the wiring pattern has a lower melting point than the metal wire. It is filled with a metallic material.
【0009】(6)請求項6の発明は、前記(5)にお
いて、金属ワイヤの少なくとも一端が配線パターン上に
ボンディングされているものである。(6) According to the invention of claim 6, in the above item (5), at least one end of the metal wire is bonded onto the wiring pattern.
【0010】[0010]
【発明の実施の形態】図1及び図2の実施例を参照し
て、発明の実施の形態を工程順に説明する。
(A)第1工程:基板2の配線パターン3上に低融点の
少量の第1金属材料12を配設する。
(B)第2工程:第1金属材料12より融点の高い第2
金属材料より成るワイヤ13を第1金属材料12の上を
覆うように、半ループ状に配設する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in the order of steps with reference to the examples of FIGS. (A) First step: A small amount of the first metal material 12 having a low melting point is provided on the wiring pattern 3 of the substrate 2. (B) Second step: second step having a higher melting point than the first metal material 12
The wire 13 made of a metal material is arranged in a half loop so as to cover the first metal material 12.
【0011】(C)第3工程:配線パターン3とその上
に配された第1金属材料12及びワイヤ13を加熱し、
第1金属材料12のみを溶融させ、そのぬれ性によって
ワイヤ13と配線パターン3とで囲まれた領域内に充満
させた後、冷却させて接点バンプを形成する。ワイヤ1
3内が第1金属材料12で満たされているので、他の配
線部材と接触させる際の押圧力を支えることができる。
前記の第1工程において、第1金属材料より成るワイ
ヤの一端を配線パターン3上にボンディングすると共
に、そのボンディングされた一端の近傍を切断すること
によって、少量の第1金属材料12を短時間で確実に配
線パターン3上に配設することができる(請求項2)。(C) Third step: heating the wiring pattern 3, the first metal material 12 and the wire 13 arranged thereon,
Only the first metal material 12 is melted, the wettability thereof is filled in the region surrounded by the wire 13 and the wiring pattern 3, and then cooled to form the contact bump. Wire 1
Since the inside of 3 is filled with the first metal material 12, the pressing force at the time of contacting with another wiring member can be supported.
In the first step, by bonding one end of the wire made of the first metal material onto the wiring pattern 3 and cutting the vicinity of the bonded one end, a small amount of the first metal material 12 can be formed in a short time. It can be reliably arranged on the wiring pattern 3 (claim 2).
【0012】前記の第2工程において、第2金属材料よ
り成るワイヤ13の一端を配線パターン3上の第1金属
材料の一側にボンディングした後、半ループ状に延長
し、その延長端を切断する方法を用いることができる
(請求項3)。この方法はワイヤボンディングの技術を
応用したもので生産性に優れている。また他の方法とし
て、ワイヤ13を第1金属材料12の両側でボンディン
グすることもできる(請求項4)。この方法も上記と同
様の効果が得られる。In the second step, one end of the wire 13 made of the second metal material is bonded to one side of the first metal material on the wiring pattern 3, then extended in a half loop shape, and the extended end is cut. The method can be used (claim 3). This method is an application of wire bonding technology and has excellent productivity. Alternatively, the wire 13 may be bonded on both sides of the first metal material 12 (claim 4). This method also has the same effect as above.
【0013】[0013]
【発明の効果】以上述べたようにこの発明の接点バンプ
は、工程数が少なく、かつ簡単な工程で作製できるの
で、作業時間を短縮し、生産性を向上できる。特に、第
1金属材料12またはワイヤ13の配設にワイヤボンデ
ィングの技術を応用した場合にはその効果はいっそう顕
著である。As described above, since the contact bump of the present invention has a small number of steps and can be manufactured by a simple step, the working time can be shortened and the productivity can be improved. Particularly, when the wire bonding technique is applied to the disposition of the first metal material 12 or the wire 13, the effect is more remarkable.
【図1】この発明の接点バンプの製造工程を示す原理的
な断面図。FIG. 1 is a principle sectional view showing a manufacturing process of a contact bump of the present invention.
【図2】Aはこの発明の接点バンプの形成された基板2
の斜視図、B及びCはそれぞれAの接点バンプ1の側面
図及び正面図。FIG. 2A is a substrate 2 on which contact bumps of the present invention are formed.
Is a perspective view, and B and C are a side view and a front view of the contact bump 1 of A, respectively.
【図3】Aは従来の接点バンプを形成した基板の斜視
図、BはAの接点バンプ1の正面図。3A is a perspective view of a substrate on which a conventional contact bump is formed, and B is a front view of the contact bump 1 of FIG.
【図4】図3の接点バンプを他の配線部材に接触させた
状態を示す正面図。FIG. 4 is a front view showing a state where the contact bump of FIG. 3 is brought into contact with another wiring member.
【図5】従来の接点バンプの製造工程を示す原理的な断
面図。FIG. 5 is a principle cross-sectional view showing a manufacturing process of a conventional contact bump.
Claims (6)
属材料を配設する第1工程と、 前記第1金属材料より融点の高い第2金属材料より成る
ワイヤを、前記配線パターン上に配された前記第1金属
材料の上を覆うように、半ループ状に配設する第2工程
と、 前記配線パターンと、その上に配された前記第1金属材
料及び前記ワイヤとを加熱し、前記第1金属材料のみを
溶解させ、そのぬれ性によって前記ワイヤと前記配線パ
ターンとで囲まれた領域内に充満させた後、冷却させる
第3工程と、 より成ることを特徴とする接点バンプの製法。1. A first step of disposing a small amount of a first metal material having a low melting point on a wiring pattern, and a wire made of a second metal material having a melting point higher than that of the first metal material, on the wiring pattern. A second step of arranging in a semi-loop shape so as to cover the arranged first metal material, the wiring pattern, and the first metal material and the wire arranged thereon are heated. A third step of melting only the first metal material, filling the region surrounded by the wire and the wiring pattern by its wettability, and then cooling the contact bump. Manufacturing method.
第1金属材料より成るワイヤの一端を前記配線パターン
上にボンディングすると共に、そのボンディングされた
前記一端の近傍を切断する工程を含むことを特徴とする
接点バンプの製法。2. The method according to claim 1, wherein the first step includes a step of bonding one end of the wire made of the first metal material onto the wiring pattern, and cutting the vicinity of the bonded one end. A method of manufacturing contact bumps characterized by.
第2金属材料より成るワイヤの一端を前記配線パターン
上の前記第1金属材料の一側にボンディングした後、前
記半ループ状に延長し、その延長端を切断する工程を含
むことを特徴とする接点バンプの製法。3. The method according to claim 1, wherein, in the second step, one end of the wire made of the second metal material is bonded to one side of the first metal material on the wiring pattern and then extended in the half-loop shape. And a step of cutting the extended end of the contact bump.
第2金属材料より成るワイヤを前記配線パターン上の前
記第1金属材料の両側にボンディングする工程を含むこ
とを特徴とする接点バンプの製法。4. The contact bump according to claim 1, wherein the second step includes a step of bonding a wire made of the second metal material to both sides of the first metal material on the wiring pattern. Manufacturing method.
ヤが上に凸に配設され、その金属ワイヤと配線パターン
とで囲まれた領域に、前記金属ワイヤより低融点の金属
材料が充満されていることを特徴とする接点バンプ。5. A semi-looped metal wire is provided on the wiring pattern so as to project upward, and a region surrounded by the metal wire and the wiring pattern is filled with a metal material having a melting point lower than that of the metal wire. Contact bumps that are characterized by
なくとも一端が前記配線パターン上にボンディングされ
ていることを特徴とする接点バンプ。6. The contact bump according to claim 5, wherein at least one end of the metal wire is bonded on the wiring pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03201196A JP3366932B2 (en) | 1996-02-20 | 1996-02-20 | Contact bump and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03201196A JP3366932B2 (en) | 1996-02-20 | 1996-02-20 | Contact bump and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09232730A JPH09232730A (en) | 1997-09-05 |
JP3366932B2 true JP3366932B2 (en) | 2003-01-14 |
Family
ID=12346936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03201196A Expired - Fee Related JP3366932B2 (en) | 1996-02-20 | 1996-02-20 | Contact bump and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3366932B2 (en) |
-
1996
- 1996-02-20 JP JP03201196A patent/JP3366932B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH09232730A (en) | 1997-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000031204A (en) | Manufacture of semiconductor package | |
JPH02275660A (en) | Electric pin and manufacture thereof | |
JP2001339012A (en) | Semiconductor device and its manufacturing method | |
FR2541044A1 (en) | Method for mounting a printed-circuit board on a substrate | |
JP4429564B2 (en) | Mounting structure and method of optical component and electric component | |
JP3366932B2 (en) | Contact bump and its manufacturing method | |
JPH05136317A (en) | Semiconductor device and its manufacture | |
KR20080091330A (en) | Method for producing a contact arrangement between a microelectronic component and a supporting substrate as well as component unit produced by said method | |
US6281445B1 (en) | Device and method for connecting two electronic components | |
JP3307262B2 (en) | Method of forming solder bumps | |
EP0711104B1 (en) | Semiconductor device and method for making same | |
JP2000091737A (en) | Printed wiring board and its manufacture | |
JPH11289146A (en) | Compound wiring material and production thereof | |
JPH07307341A (en) | Method of forming bumps | |
JPH05235515A (en) | Manufacture of printed wiring board | |
JPS6281744A (en) | Manufacture of film carrier with bump | |
JPH066023A (en) | Electronic part mounting method | |
JPH08203909A (en) | Bump forming method of semiconductor device | |
JPH09283195A (en) | Board structure with terminal piece | |
JPH1140610A (en) | Method of mounting work fitted with bump | |
JPH1079403A (en) | Semiconductor device and manufacturing thereof | |
JP3702516B2 (en) | Method for manufacturing printed wiring board | |
JPH0627333A (en) | Method for packaging optical fiber onto substrate | |
JP2001319942A (en) | Manufacturing method of semiconductor device | |
JP2667491B2 (en) | Electric pin manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20020917 |
|
LAPS | Cancellation because of no payment of annual fees |