JP3366280B2 - Bonding equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus used in a semiconductor device manufacturing process, and more particularly to a heater plate and a heater block for heating a substrate equipped in the apparatus.

[0002]

2. Description of the Related Art As an example of this type of apparatus, Japanese Patent Laid-Open No.
The heater plate for a wire bonding device disclosed in Japanese Patent No. 53242 will be described with reference to FIG .
FIG. 4 is a sectional view showing a conventional heater plate for a wire bonding apparatus. The heater plate for the wire bonding device shown in FIG. 4 functions as a contact member for contacting the lower surface of the lead frame (not shown) to heat the lead frame. Also, the heater plate 1
5 is located on a heater block (not shown) that transfers heat to the heater plate 15. The heater block is arranged on a heater provided as a heat generating means, and the heat generated from the heater heats the heater plate 15 via the heater block. Also,
As shown in FIG. 4 , the heater plate 15 is a portion (hereinafter referred to as DP) that is sunk from the island portion 17 of the lead frame.
Is provided on the heater plate 15 side (hereinafter, referred to as DP escape portion 16). Therefore, FIG.
The heater plate 15 shown in FIG.
It has a structure in which a groove is provided in the DP escape portion 16 and the heater plate 15 are separated (hereinafter referred to as a DP escape portion block). Further, the heater plate 15 is provided in the DP escape portion 1
6 has a hook-shaped recess provided to be detachably fitted. In the heater plate for the wire bonding apparatus having the above-described structure, the heater plate 15 is D
Since it is separated from the P relief portion block 18, only the DP relief portion block 18 can be replaced for each type of product.
Furthermore, in the case of wear or when dealing with each type, only the DP relief block 18 needs to be partially manufactured, which has an advantage that the cost can be reduced and the storage space can be easily secured.

[0003]

However, the heater plate for the wire bonding apparatus disclosed in the above-mentioned Japanese Patent Laid-Open No. 4-53242 has the following problems. In the heater plate for the wire bonding apparatus described above, the DP relief block 18 and the heater plate 15 are used.
Have a separate structure. In other words, conventionally, the DP escape block 18 has been replaced by replacing each type.
However, when a large amount of each product type is continuously bonded, it is necessary to replace a large number of DP escape block 18 for each product type, which causes a problem of reducing productivity. Further, since the DP escape portion block 18 is detachably fitted into the hook-shaped concave portion, there is a case in which the DP escape portion block is laterally displaced due to the vibration accompanying the work. Therefore, in order to solve such a problem, there is a means for fixing a hook-shaped recess on the heater plate 15 and the DP relief block 18 which is in a fitting relationship therewith with a screw. However, in this case, there is a problem that productivity and workability are deteriorated because the labor required for attachment and detachment is very large.

The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a bonding apparatus capable of improving productivity and workability.

[0005]

SUMMARY OF THE INVENTION A first invention of the present application for solving the above problems is to provide a heater plate which functions as an abutting member for abutting a lower surface of a lead frame to heat the lead frame, and a heater plate thereof. And between the heater provided as the heat generating means,
In the bonding apparatus and a heater block for transmitting emitted heat to the heater plate, said Hitabu
The lock is provided with a recess with which at least one surface of the heater plate abuts, and the side surface of the recess has an elastic portion.
The heater plunger is formed by a ball plunger mechanism having a material.
An urging device for urging the rate is provided .

Therefore, according to the bonding apparatus of the first invention of the present application, since the heater block is provided with the recess in which at least one surface of the heater plate abuts, the heater plate is arranged so as to be fitted into the recess of the heater block. It In addition, the heater plate has a structure in which a lead receiving portion and a DP relief portion are integrally formed according to various types. Therefore, when it is necessary to bond a large number of lead frames of a plurality of types, a heater plate having a DP relief portion corresponding to each of a plurality of types can be prepared in advance and easily replaced to improve the productivity. There are advantages. Further, since the size of the heater plate is determined by the recess, the size can be made uniform by manufacturing the heater plate in which the DP escape portion is different for each product type. That is, since the size of the heater plate is within the standard of the heater block recess, it can be downsized as compared with the conventional heater plate, and it becomes easy to secure a management space for the heater plate. Further, when the heater plate is placed in the recess of the heater block, the more the surface where the heater block and the heater plate are in contact with each other, the more the thermal conductivity of the heater plate is improved, and the bonding quality can be improved. Also, bias the heater plate to the side surface of the recess.
Since the urging device is installed, the heater plate
There is an advantage that it can be fixed securely. here,
Since the biasing device is a ball plunger mechanism,
The heater plate can be detachable. Also,
Heater plate or heater block is a ball plunge
It is securely biased and locked by the biasing force of the arm mechanism. Yo
Therefore, there is an advantage that workability is improved. In addition, the biasing device
Since it is made of a flexible material, it has the advantage that it can be urged securely.
It

The second invention of the present application is described in claim 1.
In the bonding apparatus of the above, the biasing device is a heater.
From the side surface of the block to the side surface of the recess
It is characterized by being screwed into the through hole .

Therefore, according to the bonding apparatus of the second invention of the present application, the urging device can be made detachable.
It

The third invention of the present application is the claim 1 or the contract.
In the bonding apparatus according to claim 2, the heater pre
The hole for inserting the dedicated attachment / detachment jig when attaching or detaching the
It is characterized in that it is provided on the touch plate .

Therefore, according to the bonding apparatus of the third invention of the present application , a dedicated attachment / detachment jig is attached when attaching / detaching the heater plate.
It has a heater plate with a hole for inserting a tool.
The heater plate from the heater block,
Safe and easy to put on and take off. That is, workability and safety are improved.
There are advantages to be addressed.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION A bonding apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 is a perspective view showing a bonding apparatus according to an embodiment of the present invention. As shown in FIG. 1, the bonding apparatus of the present invention has a heater block 1 above a heater (not shown). Further, in the vicinity of the center of the upper portion of the heater block 1, there is provided a recess 3 in which the heater plate 2 is fitted. Further, on the upper part of the heater plate 2, there is formed an attachment / detachment hole portion 4 provided to insert a dedicated attachment / detachment jig for attachment / detachment. A ball plunger mechanism 7 is inserted in the insertion hole 5.

FIG. 2 is a sectional view showing the ball plunger mechanism. The ball plunger mechanism will be described with reference to FIG. In the ball plunger mechanism 7 shown in FIG. 2, the outer peripheral edge of the support plate 8 is formed in a male screw shape, and the ball plunger 10 is attached. Further, the support plate 8 to which the ball plunger 10 is attached has a vertically long concave portion 13 opened in the lower surface in the vertical direction. A ball plunger 10 is attached to the support plate 8 inside the recess 13, and the ball plunger 10 is arranged so as to be biased toward the opening side. Further, the inner periphery of the lower end opening of the ball plunger mechanism 7 is formed with a taper portion 12 so as to be gradually tapered toward the lower end of the opening. Therefore, the ball plunger 1 urged toward the opening side by the spring 14
The ball 11 at the 0th end is locked by the taper part 12 of the opening, and a part of the ball is held in a state of protruding to the locking part 6 of the heater plate 2. Further, a wrench insertion hole 9 is provided on the upper surface in the vertical direction so that the ball plunger mechanism 7 can be attached and detached.
Is provided.

FIG. 3 is a sectional view taken along line AA 'of the bonding apparatus showing the attaching / detaching operation. The attaching / detaching operation will be described with reference to FIG. When fitting the heater plate 2 into the recess 3 of the heater block 1, the ball plunger mechanism 7 is inserted into the hole 5 before fitting the heater plate into the recess.
It shall be screwed together. Therefore, the heater plate 2
After inserting and fixing a dedicated attaching / detaching jig (not shown) into the attaching / detaching hole 4 provided on the upper surface of the heater block, the heater plate 2 is fitted into the concave portion 3 provided on the heater block 1 for exclusive attaching / detaching. The jig is removed from the attachment / detachment hole 4. At this time, the ball 11 located at the tip of the ball plunger mechanism 7 is biased by the elastic force of the ball plunger mechanism 7 into the locking hole 6 provided on the side surface of the heater plate 2. Therefore, the heater plate 2 is locked in the recess 3 on the heater block 1. The dedicated attaching / detaching jig used here corresponds to the attaching / detaching hole portion 4 provided on the upper surface of the heater plate 2. For example, if the attaching / detaching hole 4 has a female screw shape, the dedicated attaching / detaching jig has a male screw shape corresponding to the female screw shape. The handle of the dedicated attachment / detachment jig is made of a heat insulating material such as urethane.

A case where the heater plate 2 is removed from the heater block 1 will be described with reference to FIG. When the heater plate 2 is removed from the heater block 1, a dedicated attachment / detachment jig is inserted and fixed in the attachment / detachment hole portion 4 provided on the upper surface of the heater plate 2 as in the case of attachment. For example, if the removable hole portion 4 and the female screw shape, dedicated removable jig having a male screw shape corresponding thereto, for attaching and detaching hole 4
It is screwed and fixed. Then, when the attachment / detachment jig is pulled up in the vertical direction, the ball 11 at the tip of the ball plunger mechanism 7 moves rearward from the biasing direction of the heater plate 2 due to the elastic action of the spring 14 of the ball plunger mechanism 7. Therefore, although the heater plate 2 is biased, it is not locked.
Is free, and the heater plate 2 can be easily taken out from the recess 3 of the heater block 1.

According to the above-described bonding apparatus of the present invention, the heater plate 2 has the island portion and the DP relief portion formed integrally. Further, since the recess 3 on the heater block 1 is in a relationship of being fitted to the heater plate 2, the heater plate 2 does not have a larger standard than the recess 3 of the heater block 1. further,
The heater plate 2 and the heater block 1 are in a detachable relationship by a ball plunger. Therefore, in multiple types, a large amount of bonding becomes efficient, and the heater plate becomes smaller than the conventional one,
The labor required for attachment and detachment can be reduced, productivity and workability can be improved, and storage space can be easily secured. Further, since the heater block 2 is fitted into the recessed portion 3 so that the three surfaces of the heater plate 2 come into contact with the recessed portion 3 of the heater block 1, the heater block 2 is superior in heat conductivity to the conventional heater plate. There is.

[Brief description of drawings]

FIG. 1 is a perspective view of a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of the ball plunger mechanism of the bonding apparatus according to the embodiment of the present invention.

FIG. 3 is a sectional view taken along the line AA ′ of the bonding apparatus according to the embodiment of the present invention.

FIG. 4 is a sectional view of a heater plate for a wire bonding device of a conventional example.

[Explanation of symbols]

1. Heater block 2. Heater plate 3. Recess 4. Hole for attachment and detachment 5. Hole 6. Locking recess 7. Ball plunger mechanism 8. Support plate 9. Wrench insertion hole 10. Ball plunger 11. ball 12. Tapered part 13. Recess 14. spring 15. Heater plate 16. DP escape section 17. Island section 18. DP escape block

Claims (3)

(57) [Claims] 1. A heater plate, which functions as an abutting member for contacting a lower surface of a lead frame to heat the lead frame, and a heater plate and a heater provided as a heat generating means. Emit from
In the bonding apparatus having the <br/> heater block to transfer heat that is in the heater plate, said Hitaburo'
The groove is provided with a recess with which at least one surface of the heater plate abuts , and an elastic member is provided on the side surface of the recess.
With the ball plunger mechanism, the heater play
A bonding device , wherein a biasing device for biasing the switch is provided . 2. The urging device is a side surface portion of a heater block.
Is screwed into a through hole formed through the side surface of the recess.
The bonding according to claim 1, wherein
apparatus. 3. The bonding apparatus according to claim 1, wherein the heater plate is provided with a hole for inserting a dedicated attaching / detaching jig when the heater plate is attached / detached.