JP3354602B2 - Flexible tube aseptic joining device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aseptic flexible tube joining apparatus for aseptically connecting at least two flexible tubes by heating and melting the tubes.

[0002]

2. Description of the Related Art Tube connection of blood collection bags and blood component bags in blood transfusion systems, continuous peritoneal dialysis (CA)
At the time of exchanging the dialysate bag and the waste liquid bag in PD), it is necessary to connect the tubes aseptically. The apparatus for performing aseptic connection of such tubes are those Ru shown in JP-B-61-30582. The device disclosed in Japanese Patent Publication No. Sho 61-30582 is a tube connecting device for connecting a tube by heating and melting the tube, and a first clamp for holding two flexible tubes to be connected in a parallel state. And a second clamp, a cutting means for cutting the flexible tube between the first clamp and the second clamp, and a joined end of the flexible tube cut by the cutting means so as to be in close contact with each other. Moving means for moving at least one of the first clamp and the second clamp.

[0003] The cutting means has a wafer for melting and cutting the flexible tube, and a power supply for heating the wafer. As a power supply for heating the wafer, a constant current source is used as disclosed in Japanese Patent Application Laid-Open No. 59-64034. The temperature control of the wafer uses a method of predicting the temperature of the wafer from the resistance value using a change in the resistance value temperature of the resistor.

[0004]

However, Japanese Unexamined Patent Publication No.
As disclosed in Japanese Patent No. 64034, a method of predicting a wafer temperature from a resistance value by using a constant current source and controlling a temperature of a wafer by using a temperature change of a resistance value of a resistor is not actually used. However, there is a problem that it is difficult to perform reliable temperature control because the temperature is not measured and controlled. Furthermore, a heating circuit using the constant-current source, since the loss of the drive circuit is large, there is a problem called large power consumption. Therefore, an object of the present invention is to provide a flexible tube aseptic joining apparatus which can surely control the temperature of a wafer for cutting a flexible tube by heating and melting, and further consumes less power. It is.

[0005]

SUMMARY OF THE INVENTION To achieve the above object, an apparatus for aseptically joining flexible tubes comprises a first clamp and a second clamp for holding the tubes. Cutting means for cutting the flexible tube between the first clamp and the second clamp, the cutting means comprising: a wafer for melting and cutting the flexible tube; A constant-voltage source for heating, a wafer temperature detection unit, and a wafer heating control unit, wherein the wafer heating control unit is a pulse width modulation signal output unit that is calculated based on an output of the wafer temperature detection unit. When, a drive circuit for controlling the constant voltage source by the pulse width modulation signal, wafer circuit protection
Circuit, and the wafer short-circuit protection circuit is
A short-circuit detection section of the hull and a detection signal of the short-circuit detection section.
A pulse width modulation signal from the pulse width modulation signal output unit.
Width modulation for controlling the flow of signals into the drive circuit
It is a flexible tube aseptic joining device having a signal control unit . What achieves the above object is a device for aseptically joining flexible tubes, the device comprising: a first clamp for holding at least two flexible tubes in a parallel state; A second clamp, a cutting means for cutting the flexible tube between the first clamp and the second clamp, and an end of the flexible tube cut by the cutting means joined to each other; Moving means for moving at least one of the first clamp and the second clamp so that the cutting means,
A wafer for melting and cutting the flexible tube;
A constant voltage source for heating the wafer, a wafer temperature detecting means, and a wafer heating control means, wherein the wafer heating control means calculates a pulse width based on an output of the wafer temperature detecting means. A flexible tube aseptic joining apparatus having a modulation signal output section and controlling the constant voltage source by the pulse width modulation signal.

The wafer heating control means includes a correction wafer temperature calculating section based on an output of the wafer temperature detecting means, and a deviation signal between the correction temperature calculated by the calculation section and a target heating temperature of the wafer. And a deviation signal output unit that outputs a pulse width modulation signal based on the deviation signal. Further, it is preferable that the wafer heating control means has a wafer short-circuit protection circuit. Further, the wafer heating control means has a drive circuit for controlling the constant voltage source by the pulse width modulation signal, and the wafer short circuit protection circuit,
A short-circuit detection unit for the wafer, and a pulse width modulation signal control unit that controls a pulse width modulation signal from the pulse width modulation signal output unit to flow into the drive circuit based on a detection signal of the short circuit detection unit. Is preferred. Also,
It is preferable that the corrected wafer temperature calculating section has a proportional / integral / differential correction circuit. Further, it is preferable that the deviation signal output section has a proportional / integral / differential correction circuit. And, the wafer temperature detecting means includes:
It is preferably a thermocouple or a resistance thermometer. Further, it is preferable that the wafer temperature detecting means is a sheath type thermocouple or a temperature measuring resistor.

Therefore, a flexible tube aseptic joining apparatus of the present invention will be described with reference to the drawings. The flexible tube aseptic joining device 1 is a device for aseptically joining flexible tubes, and includes a first clamp 3 and a second clamp 3 that hold at least two flexible tubes in a parallel state. 2 clamp 2, cutting means 5 for cutting flexible tubes 48, 49 between first clamp 3 and second clamp 2, and joining of flexible tubes 48, 49 cut by cutting means 5 Moving means for moving at least one of the first clamp 3 and the second clamp 2 so that the end portions 48a, 49a to be brought into close contact with each other, and the cutting means 5 melt-cuts the flexible tubes 48, 49. And a constant voltage source 43 for heating the wafer 6, a wafer temperature detecting means 7, and a wafer heating control means 44. The wafer heating control means 44 Based on the output of the sensing means 7, it has a pulse width modulation signal output unit 59 is calculated, and controls the constant voltage source 43 by a pulse width modulated signal.

FIG. 1 is a perspective view of one embodiment of the flexible tube aseptic joining apparatus of the present invention, and FIG. 2 is a perspective view showing a state in which the aseptic joining apparatus shown in FIG. 1 is housed in a case. FIG. 3 is a block diagram showing an example of an electric circuit used in the aseptic bonding apparatus of the present invention. FIG. 4 is a block diagram of the wafer heating control means of the electric circuit of the aseptic bonding apparatus of the present invention. It is an electric circuit block diagram which shows an example. FIG. 5 is a top view of one embodiment of the flexible tube aseptic joining apparatus of the present invention.

Next, the wafer heating control means shown in FIG. 4 will be described. As the wafer 6, a metal plate bent so as to face each other, an insulating layer formed on the inner surface of the metal plate, a resistor formed in the insulating layer so as not to contact the metal plate, A resistor having current-carrying terminals provided at both ends of the resistor is preferably used. Since the resistor generates heat when energized, the heat generated by the resistor is transmitted to the metal plate and the entire wafer generates heat when energized. Then, the resistance value of the resistor changes due to heat generated by energization. Therefore, sufficient temperature control of the wafer cannot be achieved simply by adjusting the power supply to the wafer by simply using the constant voltage source. Therefore, the aseptic bonding apparatus 1 of this embodiment has a wafer heating control unit.

The wafer heating control means 44 has a wafer heating control circuit 55 and a corrected wafer temperature calculating section 51 as shown in FIG. 4, and further has a wafer short circuit protection circuit 65 as shown in FIG. Is preferred.
The wafer heating control circuit 55 outputs a pulse width modulation signal output section 59 which is calculated based on the output from the temperature detecting means 7.
And the constant voltage source 43 is controlled by the pulse width modulation signal. Specifically, based on the output of the wafer temperature detecting means 7, a corrected wafer temperature calculator 56 for calculating a corrected wafer temperature, and a deviation signal between the corrected temperature calculated by the calculator and the target heating temperature of the wafer are output. A pulse width modulation signal output unit 5
9 outputs a pulse width modulation signal based on the deviation signal. The temperature detecting means 7 is preferably a thermocouple or a resistance temperature detector. More preferably, it is a sheath-type thermocouple or a resistance temperature detector, and in particular, a sheath-type thermocouple is preferable.

The heating control means 44 will be described in more detail with reference to FIG. 4. A temperature detection signal a from a thermocouple as the temperature detection means 7 is output from the PI
The corrected temperature signal b is input to the D corrector 56 (proportional / differential / integral corrector 1) and is output. This PI
The D corrector 56 calculates a correction value according to, for example, Expression 1 b = 1 / K · a · (1 + K1 · T · da / dt) (1) K is a coupling coefficient between the wafer and the thermocouple, K1 is a correction coefficient due to the flexible tube to be cut, and T is a thermal time constant of the thermocouple. The purpose of making such a correction is to make a correction (K) based on the heat conduction loss between the wafer and the thermocouple,
It is to perform the correction in consideration of the thermal time constant (T) of the thermocouple. Then, as shown in Equation 1, the corrected temperature signal b is 1
Since / K is a constant, the actually measured wafer temperature signal a
Therefore, while the wafer temperature is rising, K1 · T · d
It is calculated higher by a / dt. The temperature detected by the thermocouple is the internal temperature of the thermocouple and has a delay with respect to the surface temperature of the wafer. However, by performing the above correction, the delay of the thermocouple is approximated to the first-order delay, and the time constant T
Conversely, as the correction function, the primary advance calculation of the time constant T is performed, so that the wafer surface temperature can be accurately calculated without time delay.

Further, by performing the correction as shown in Equation 1, even when the wafer temperature decreases, the accurate wafer surface temperature can be accurately calculated without time delay. Then, when Expression 1 is rewritten in consideration of the sampling time (Δt), Expression 2 is obtained. b (t + △ t) = 1 / K · a (t + △ t) · ｛1 + K1
・ T / {t ・ [a (t + Δt) -a (t)]}
(2) The corrected temperature signal b thus calculated is compared with the target wafer temperature signal c, and the deviation signal output unit 5
7 outputs a deviation signal d. The deviation signal d is input to the PID corrector 2 designed to have an appropriate transfer function to enhance the response of the control system, and is output as a corrected deviation signal e.
Is output. This correction deviation signal e is a pulse width modulation signal
The output unit ( PWM signal generation circuit ) 59 is input to the output unit 59. PW
The M signal creation circuit 59 synchronizes with the correction deviation signal e and the predetermined frequency created by the carrier oscillation circuit 60,
A signal f having a pulse width (PWM modulated pulse train signal) proportional to the correction deviation signal e is output. This pulse train signal f
Flows through the gate circuit 61 into the drive circuit 62. The drive circuit 62 is constituted by a transistor, a thyristor, or the like, which is a semiconductor switching element. The input pulse train signal g acts as a switching and timing signal, and only when the pulse train signal g is in the H state is the constant voltage source. And the wafer are connected. The connection between the drive circuit 62 and the wafer 6 is made by a connection terminal 39 . The constant voltage source 43 and the wafer 6 are intermittently connected based on the pulse train signal g, and the wafer is controlled to a target wafer temperature.

The outline of the heating circuit in the case of the constant current system is as shown in FIG. 19. When the loss of the heating circuit of the constant current system is obtained, the loss ( Wo ' ) is expressed as Wo' = (Vi- Vo) Io, and Wo ′ = [Vce + {(Vi−Vce) −Vo}] · Io (A). The heating circuit in the case of the PWM method is schematically shown in FIG. 20, and the loss (Wo) of the drive circuit is Wo = Vo / Vi · Vce · Io + W1, and (B) W1 is the drive circuit. Is the switching loss of the transistor that constitutes. When Wo and Wo 'are compared, the following relationship is generally established in the expression B. Vo / Vi · Vce · Io> W1 Next, in the formula A, the following relationship generally holds. Vce≪ (Vi-Vce) -Vo By comparing the first and second items of the expressions A and B, Vo / Vi ・ Vce ・ Io <Vce ＜ Io W1 <(Vi-Vce) -Vo｝ Io Therefore, Wo <Wo ', and the PWM method consumes less power than the constant current method.

Next, the wafer short-circuit protection circuit will be described with reference to FIG. In the normal state, since the signal j from the comparator 67 is not input to the latch circuit 68, the latch circuit 68 always outputs an H signal to the gate circuit 61 (AND circuit). For this reason, the gate circuit turns ON / OFF (H /
The signal g is output to the drive circuit 62 according to L).
As shown in FIG. 4, a shunt resistor 66 is electrically connected to the wafer 6.
6 is set by the comparator 67 to the set voltage Vs
compared to et. In the normal state, since the voltage V between the shunt resistors is lower than the set voltage Vset, the signal j is not output from the comparator 67. However, when the wafer 6 is short-circuited, a current exceeding the specified value flows through the shunt resistor 66, and the voltage V of the shunt resistor 66 increases. When the voltage V exceeds the set voltage Vset, a signal j is output from the comparator 67 to the latch circuit 68. You. Latch circuit 6
8 has a function of holding the state once the signal j is input. For this reason, once the signal j is input, an L signal is always output to the gate circuit 61 (AND circuit). Therefore, the gate circuit 61 outputs P
The signal g based on the WM signal f is not output to the drive circuit 62, and the circuit is protected. After replacing the short-circuited wafer, the reset switch 69
When is pressed, the latch circuit 68 outputs an H signal to the gate circuit 61 (AND circuit). Latch circuit 68
, Once the reset signal k is input, holds that state and returns to the normal state.

Next, the overall mechanism of the aseptic joining apparatus 1 will be described. This aseptic bonding apparatus 1 is shown in FIGS.
As shown in FIGS. 5 and 10, a first clamp 3 and a second clamp 2 for holding at least two flexible tubes in a parallel state are provided. A gear 30 rotated by the operation of the motor, a gear 31 rotated by the rotation of the gear 30,
A shaft 32 which is rotated by the rotation of the gear 31, a frame 9 having both ends of the shaft rotatably fixed, a prevention member 11 for preventing rattling of the first clamp 3 at the origin position, micro switches 13, 14, 15, a driving arm 18 for moving the first clamp 3, a cam 19 for moving the first clamp 3, the cutting means 5, the cam 17 for driving the cutting means 5 and the second clamp,
Pressing member 3 for pressing the second clamp 2 toward the first clamp
3. a regulating member 2 for regulating a retreat position of the first clamp 3
5, a spring member 27 for preventing rattling of the first clamp 3, a wafer exchange lever 22, a wafer cartridge 8, a wafer cartridge exchange lever 24, a used wafer storage box gripping member 28, and a used wafer stored in the storage box. Guiding member 26 for guiding, used wafer storage box 2
9, an operation panel 50 is provided.

The aseptic joining apparatus 1 is provided with a first tube 48, which is cut by the cutting means 5, so that the ends 48a, 49a to be joined face each other.
A first clamp moving mechanism for moving the clamp 3, a moving function for moving the cutting means 5 to the tube side (upward), and moving the cutting means 5 away from the tube again (downward) after cutting, and a second clamp 2 And a second clamp moving mechanism for moving the first clamp 3 toward and away from the first clamp 3. The cutting means driving mechanism moves the cutting means 5 vertically upward with respect to the axes of the two tubes, and moves the cutting means 5 downward after cutting the tubes. One clamp 3 is moved in a direction perpendicular to the axis of the two tubes in a horizontal state (more specifically, backward),
The second clamp moving mechanism moves the second clamp 2 very slightly parallel to the axis of the two tubes in a horizontal state so as to approach the first clamp side.

Therefore, the first and second clamps 3 and 2 will be described. The first and second clamps 3, 2 are configured as shown in FIG. 1, FIG. 5, FIG. 7, and FIG. Specifically, as shown in FIG. 10, the first clamp 3 has a base 3b, a cover 3a rotatably attached to the base 3b, and a clamp fixing base 3c to which the base 3b is fixed. I have. And this clamp fixing base 3c is fixed to the linear table. The linear table includes a moving table 3d fixed to the lower surface of the clamp fixing table 3c, and a rail member 3 provided below the moving table 3d.
n. Then, the first clamp 3 is connected to the tubes 48 and 4 by the linear table.
9, so that the joined ends of the cut flexible tubes face each other.
Moves without distortion. Therefore, in the aseptic joining apparatus 1 of this embodiment, the first clamp moving mechanism includes the linear table, the motor, the gear 30, the gear 31, the shaft 32,
It is composed of a driving arm 18 and a cam 19. As shown in FIGS. 1 and 5, the joining device 1 is provided with a spring member 27 that connects the rear of the first clamp fixing base 3 c and the frame of the joining device 1. Is always pulled backward, so that the first clamp 3 (accurately, the first clamp fixing base 3c) has less rattling. In addition, as shown in FIGS. 1 and 5, the first clamp 3 is prevented from rattling at the tube mounting position of the first clamp 3 (in other words, at the position where the first clamp is at the foremost position). Is fixed to a side surface of the frame 9. Therefore, in the tube mounting position, the first clamp 3 is pulled rearward by the spring member 27, that is, in a state where there is no rattling on the rear side, and the front rattling preventing member prevents the first clamp 3 from rattling further. You cannot move forward. Therefore, the first clamp 3 is configured so that there is no play at the tube mounting position.
Also, as shown in FIGS. 1 and 5,
First clamp 3 (Accurately, first clamp fixing base 3c)
A restricting member 25 for restricting the maximum movement position behind is provided.

The second clamp 2 is shown in FIGS. 5, 7 and 1
As shown in FIG. 1, the base 2b includes a base 2b, a cover 2a rotatably attached to the base 2b, and a clamp fixing base 2c to which the base 2b is fixed. And this clamp fixing base 2c is fixed to the linear table. The linear table includes a moving table 2d fixed to the lower surface of the clamp fixing table 2c and a rail member 2n provided below the moving table 2d . The linear table allows the second clamp 2 to move in a direction parallel to the axis of the tubes 48 and 49 to be joined, in other words, to move the second clamp 2 toward and away from the first clamp 3. Only move without distortion.

As shown in FIGS. 5 and 7, a pressing member 33 is provided between the frame of the joining apparatus 1 and the clamp holder 2c, and the second clamp 2 (more precisely, The second clamp fixture 2c) is pushed toward the first clamp. A spring member is suitably used as the pressing member. The pressing member 33 includes the first and second
Two flexible tubes 48, 49 are provided by the clamps 3, 2.
Is used, the pressing force of the pressing member 33 is weaker than the repulsive force of the flexible tube when the flexible tube is crushed, and when the flexible tube is gripped, the second clamp 2 It is configured to move slightly away from the clamp 3. Therefore, in the aseptic joining apparatus 1 of this embodiment, the second clamp moving mechanism is constituted by the above-described linear table, motor, gear 30, gear 31, shaft 32, cam 17, and pressing member 33.

As shown in FIG. 10, the first clamp 3 and the second clamp 2 are configured to hold the tube to be held in a state where the tube is obliquely crushed. The clamps 3, 2 have covers 3a, 2a pivotally attached to the bases 3b, 2b.
2b, the two slots 3f provided in parallel in order for placing the two tubes, 3e and 2f, and a 2e. And slots 3f, 3e and slot 2
Saw blade-shaped closing members 3h, 2h are provided on the end surfaces of the bases 3b, 2b at the portions where f and 2e face each other. Then, the bases 3b, 2b are attached to the covers 3a, 2a.
Are provided with saw blade-shaped closing members 3g and 2g corresponding to the closing members 3h and 2h. The inner surfaces of the covers 3a and 2a are flat. Each of the covers 3a and 2a has a turning cam.
When the covers 3a and 2a are closed, they engage with the rollers of the bases 3b and 2b. And the two tubes cover 3
a, 2a are closed, the closing member 3h of the base 3b is closed.
And the closing member 3g of the cover 3a, and the base 2b
Between the closing member 2h of the cover 2a and the closing member 2g of the cover 2a, and is held in a closed state. The first clamp 3 has a projection 3i projecting in the second clamp direction, and the second clamp 2 has a recess 2i for accommodating the projection 3i.
Are configured so that they cannot be closed unless the first clamp 3 is closed.

As shown in FIG. 1, the aseptic joining apparatus 1 includes a gear 30 rotated by a motor,
0, and has a gear 31 that rotates by the rotation of 0.
As shown in FIG. 7, two cams 19 and 17 are fixed to one shaft 32, and the cams 19 and 17 rotate with the rotation of the gear 31. On the right side of the cam 19, a first clamp driving cam groove 19a having a shape as shown in FIG. 8 is provided. Further, a first clamp moving arm 18 having a follower 18a at the center thereof which slides in the cam groove 19a of the cam 19 is provided. The lower end of the arm 18 is connected to the frame 9 by a fulcrum 18b.
The upper end of the arm 18 is supported by a fulcrum 1 provided on a clamp fixing base 3 c of the first clamp 3.
8c rotatably supported. Therefore, as shown in FIG. 8, the first clamp 3 is rotated along the rail member 3n of the linear table by the rotation of the cam 19, and is formed on the axis of the two tubes as shown by the arrow according to the shape of the cam groove 19a. On the other hand, it moves backward in the orthogonal direction in a horizontal state.

As shown in FIG. 6, the cutting means 5 includes a wafer holding portion 5a for holding a wafer so as to be exchangeable, an arm portion 5c provided below the wafer holding portion 5a, and an end portion of the arm portion 5c. It has a follower 5b, a hinge 5d, and an attachment 5e to the frame 9. The hinge part 5d is capable of turning with respect to the frame 9. As shown in FIG. 6, an electric connection terminal 39 for heating the wafer and a temperature detecting means 7 for detecting the temperature of the wafer are fixed to the right side surface of the cutting means 5. The temperature detecting means 7 is preferably a thermocouple or a resistance temperature detector. More preferably, it is a sheath-type thermocouple or a resistance temperature detector, and in particular, a sheath-type thermocouple is preferable. As the wafer 6, a metal plate bent so as to face each other, an insulating layer formed on the inner surface of the metal plate, a resistor formed in the insulating layer so as not to contact the metal plate, A resistor having current-carrying terminals provided at both ends of the resistor is preferably used.

As shown in FIGS. 6 and 9, the cam 17 has a cam groove 17a for driving the cutting means on the left side surface. The follower 5b of the cutting means 5 is located in the cam groove 17a of the cam 17, and slides in the cam groove 17a along the shape of the cam groove. Therefore, the cutting means 5
As shown in FIG. 9, the cam 17 moves up and down according to the shape of the cam groove 17a by rotation of the cam 17, in other words, vertically and vertically with respect to the axes of the two tubes.
Further, as shown in FIG. 7, the cam 17 has a second
It has a cam groove 17c for driving the clamp 2. The cam groove 17c has a left side 17f and a right side 17e, and the position of the second clamp is controlled by the left side 17f and the right side 17e. The second clamp fixing base 2c has a protruding portion extending downward, and a follower 20 is provided at the tip thereof. The follower 20 slides in the driving cam groove 17c of the second clamp 2. As shown in FIG. 7, a slight gap is formed between the follower 20 and the side surface of the cam groove 17c. The second clamp fixing base 2c is provided with a spring member 33.
In the normal state, the follower 20 comes into contact with the left side surface 17f of the cam groove 17c, and a slight gap is formed between the follower 20 and the right side surface 17e of the cam groove 17c. However, when the two tubes are held by the first and second clamps 3 and 2, as described above, the two clamps 3 and 2 close and hold the two tubes by crushing the two tubes, respectively. A repulsive force is generated due to the blockage of the body. And the spring member 33
As shown in FIG. 7, when the clamps 3 and 2 hold the tube, the follower 2 has a smaller force than the repulsive force caused by the blockage of the tube.
0 comes into contact with the right side surface 17e of the cam groove 17c, and a slight gap is formed between the follower 20 and the left side surface 17f of the cam groove 17c. However, when the tube is cut by the above-described cutting means 5, the repulsive force due to the blockage of the tube disappears.
Comes into contact with the left side face 17f of the cam groove 17c, and a slight gap is formed between the follower 20 and the right side face 17e of the cam groove 17c. Thus, the sliding surface of the cam groove with which the follower 20 abuts changes over time by the action of the spring member 33 and the repulsive force of the tube.

Then, as shown in FIG.
A concave portion 17d is formed in the recess. Time to the recess 17d portion follower 20 passes, since the cutting means is after cutting of the tube, the follower 20, the cam groove 17c
Is sliding along the left side surface 17f, and the follower 20 enters the concave portion 17d . For this reason,
The second clamp 2 moves in the direction of the first clamp 3 by the depth of the concave portion 17d. Thereby, the joining of the tubes becomes more reliable. Also, a concave portion 17g is provided on the right side surface 17e of the cam groove 17c. This recess 1
7 g is for cleaning the inner surfaces of the clamps 3 and 2. By providing the recess 17g, by pushing the second clamp 2 toward the spring member 33, the second clamp 2 can be moved in a direction away from the first clamp 3 until the follower 20 contacts the recess 17g. As a result, a gap is formed between the first clamp 3 and the second clamp. In the formed gap, cleaning can be performed by a cleaning member, for example, a cotton swab containing a solvent capable of dissolving a forming material of the tube to be cut to a certain degree such as alcohol. As shown in FIG. 7, the concave portion 17g is provided at a position substantially opposite to the concave portion 17d (the portion where the width of the second clamp 2 is adjusted) on the left side surface 17f. When the follower 20 provided on the protruding portion extending below the second clamp fixing base 2c enters the recess 17d,
After the tubes are cut, the target tubes are joined to each other, and in this state, the second clamp is stopped. In addition, the first clamp has already stopped, and the first clamp 3 is located at a position shifted from the second clamp. Specifically, as shown in FIG. 1, the first clamp 3 is retracted from the second clamp 2, and the first clamp 3 is located at a position shifted from the second clamp. Therefore, in this state, the second
The inner surface of the front end of the clamp 2 is slightly exposed, and the inner surface of the rear end of the first clamp is also slightly exposed.
Therefore, the exposed inner surface of the second clamp 2 and the first clamp 3 can be easily cleaned.

Next, the operation of the aseptic bonding apparatus 1 of the present invention will be described with reference to the drawings. FIG. 11 is a timing chart showing the operation of the cutting means, the first clamp, and the second clamp. FIGS. 12, 13 and 14 are flowcharts for explaining the operation of the aseptic joining apparatus. FIG.
5, FIG. 16, FIG. 17, and FIG. 18 are explanatory views for explaining the operation of the aseptic joining apparatus. In this joining apparatus 1, the first clamp 3 at the end of the joining operation is shifted from the second clamp 2, and is at the stop position in the timing chart of FIG. The angle of the horizontal axis in the timing chart of FIG. 11 is 0 ° at the origin (the state where the first clamp and the second clamp are in the same position), and the rotation angle of the shaft 32 of the gear 31 after that, in other words, the cam 17 7 shows the movement of the cutting means (wafer), the first clamp 3 and the second clamp 2 when the rotation angle of the cam 19 and the rotation angle of the cam 19.

First, as shown in the flowchart of FIG. 12, a power switch provided on the panel 50 of FIG. 3 is pressed. Thereby, the joining device 1 is checked by the CPU constituting the controller 40 shown in FIG. 3 whether there is no abnormality (specifically, there is no disconnection of the internal connector, no disconnection of the thermocouple, Source is not defective), and if there is an abnormality , a buzzer sounds. Subsequently, the clamp reset switch 53 provided on the panel 50 of FIG.
push. The CPU determines whether the first and second clamps are open, whether the first and second clamps are not at the origin, and whether the wafer exchange lever is at the origin. In the clamp used in the aseptic bonding apparatus 1 of this embodiment, as described above, the first clamp 3 has the protruding portion 3i protruding in the second clamp direction, and the second clamp 2
However, since the second clamp 2 has the concave portion 2i for accommodating the projecting portion 3i, the second clamp 2 cannot be closed unless the first clamp 3 is closed. Therefore, the fact that the first and second clamps are open means that when the second clamp is closed, the lever 16 that comes into contact with the micro switch 1 that is turned ON / OFF by the lever 16 is closed.
3 is detected. Specifically, the micro switch 1
3, when the second clamp is in released state, OFF and are Do Tsu <br/>, lever when the second clamp 2 is closed 16
, The lever 16 moves and the micro switch 13 is turned on.
N state. ON / OF of this micro switch 13
The F signal is input to the controller 40. The fact that the first and second clamps are not at the origin means that the grooves provided on the circumference of the respective cams are formed by the micro switches SW5 (73), SW5
6 (74) is determined by detection. The fact that the wafer exchange lever 22 is at the origin is detected by the microswitch 14. When the lever 22 is at the origin, the micro switch 14 is turned on, and when not, the micro switch 14 is turned off.
The / OFF signal is input to the controller 40.

Then, as shown in FIG. 12, if all the above four points are YES, the motor is operated to return the first and second clamps to the origin. In addition, the above 4
If any one of the two points is No, the buzzer sounds, the abnormal lamp is lit, manual release is performed, and the reset switch is pressed to turn off the abnormal lamp. After the first and second clamps have reached the origin, two flexible tubes 48, 49 are mounted on the first and second clamps. The first and second clamps 3, 2 in this state are:
As shown in FIG. 10, both are open and slots 3e and 2e and 3f and 2f provided in both are open.
f are facing each other. Then, the tube 49 in use is attached to the front slots 3f, 2f, and the unused tube 48 to be connected is attached to the rear slots 3e, 2e. Then, after closing the first and second clamps 3 and 2 as described above, the wafer is exchanged by pushing the wafer exchange lever 22 to the clamp side.
By pulling the wafer exchange lever 22 toward the clamp, a new wafer is taken out of the wafer cartridge 8, and the new wafer pushes the standby wafer mounted on the cutting means 5, and the standby wafer is moved to the cutting means 5.
The used wafer that was mounted on the wafer is pushed, the standby wafer is mounted on the used position, and the used wafer is
It is stored in the used wafer storage box 29. Subsequently, when the start switch of the panel 50 is pressed, the flow shifts to the flowchart of FIG. 13 and the CP constituting the controller 40 shown in FIG.
U determines whether the first and second clamps are closed, whether the wafer has been replaced, whether the first and second clamps are at the origin, and whether the wafer exchange lever is at the origin. Whether the first and second clamps are closed is detected by a lever 16 that contacts when the second clamp is closed, and a microswitch 13 that is turned on / off by the lever 16. In particular,
The micro switch 13 is OFF when the second clamp is in the released state, and comes into contact with the lever 16 when the second clamp 2 is closed, the lever 16 moves, and the micro switch 13 is turned ON. . The ON / OFF signal of the micro switch 13 is input to the controller 40. Whether the wafer has been replaced or not is determined by pressing the wafer replacement lever 22 in the clamping direction and performing the wafer replacement operation. The replacement lever 22 turns on the micro switch 15 once. It is detected whether or not it has been replaced. The ON / OFF signal of the micro switch 15 is input to the controller 40.
Whether or not the first and second clamps are at the origin is detected by the microswitch 13 as described above.

Then, as shown in FIG. 13, if any one of the above four points is No, the buzzer sounds,
It returns to FIG. If all four points are YES, the operating lamp 47 is turned on and heating of the wafer is started. After the start of the heating of the wafer, it is determined whether or not the wafer current is equal to or more than a set value, in order to determine whether the wafer is short-circuited. Then, if the wafer current is not set value than the (higher than a predetermined value the voltage across the shunt resistor), after waiting 0.3 seconds, to determine whether the wafer current is within a set value range. This is due to the thermal history of the resistor if the wafer is used,
Since the resistance value decreases, the wafer current is measured and compared with a preset wafer current to detect whether or not the current is within a set range (within an allowable range), thereby electrically determining whether the wafer has been used. To judge. When the above-mentioned wafer current is equal to or higher than the set value (when the wafer is short-circuited) and when the above-mentioned wafer current is not within the set range (when the wafer has been used), a buzzer sounds,
After the wafer heating is stopped, the wafer abnormality lamp is turned on, and the reset switch is pressed, the flow shifts to the flowchart of FIG. And compared with the wafer current,
If it is within the set range (within the allowable range), the heating of the wafer is continued. The heating of the wafer 6 is performed while controlling the constant voltage source 43 by a pulse width modulation signal calculated based on the temperature detection output of the thermocouple 7 serving as a wafer temperature detecting means. Then, in order to prevent excessive heating of the wafer, it is determined whether the heating time of the wafer is within a predetermined time, and determines whether the wafer current is within a predetermined value range, a predetermined value than on, i.e. wafer short If an accident has occurred, the buzzer sounds immediately, the heating of the wafer is stopped, and the flow shifts to the flowchart of FIG. When the temperature of the wafer reaches the set temperature, moves to the flowchart of FIG. 14, the motor is actuated, thereby, the gear 30, gear 31, cams 19, 17 is rotated, the cutting means (wafer) rises The cutting of the tube, the retreat of the first clamp, the lowering of the cutting means (wafer), and the shifting of the second clamp toward the first clamp are performed.

[0029] Specifically, first, the cam 17 in FIG.
By rotating in the direction indicated by the arrow 9, the follower 5 b of the cutting means 5 slides in the cam groove 17 a. Initially Figure 9
9 and 11 from the state where the origin O of the cam groove shown in FIG. 11 is in contact with the follower 5b.
The point A of 7a comes into contact with the follower 5b. As shown in FIG. 11, from the state where the point A of the cam groove 17a shown in FIGS. 9 and 11 contacts the follower 5b to the state where the point B of the cam groove 17a comes into contact with the follower 5b, as shown in FIG. The cutting means 5 rises gently, during which the two flexible tubes are cut. Referring to FIGS. 15 and 16, two tubes 48, 4
9 is held by the first clamp 3 and the second clamp 2, and tube portions 48a and 49a located between the first clamp 3 and the second clamp 2 are formed, and the wafer 6 of the cutting means is located below the tube portions 48a and 49a. positioned. As described above, the rotation of the cam 17 causes the cutting means 5 to rotate.
As the (wafer 6) rises, as shown in FIG. 16, the two tubes are melt-cut at the tube portions 48a and 49a located between the first clamp 3 and the second clamp 2 of the two tubes.

Then, the point B of the cam groove 17a shown in FIG.
9 and 11, the cutting means 5 is maintained in the raised state, and sufficiently dissolves the cut ends of the tubes 48a and 49a. . Then, from the state where the point C of the cam groove 17a shown in FIGS. 9 and 11 comes into contact with the follower 5b,
Until the point E of the cam groove 17a comes into contact with the follower 5b, as shown in FIGS. 9 and 11, the cutting means 5 descends gently. Also, as shown in FIG. 8, the follower 1 provided on the arm 18 for moving the first clamp by rotating the cam 19 in the direction of the arrow.
8a slides in the cam groove 19a. The point F of the cam groove 19a shown in FIGS. 8 and 11 comes into contact with the follower 18a from the state where the origin O of the cam groove shown in FIGS. 8 and 11 is initially in contact with the follower 18a. As shown in the timing chart of FIG. 11, the follower 18a reaches the point F of the cam groove 19a slightly before the follower 5b of the cutting means 5 reaches the point B of the cam groove 17a. And FIG.
As shown in FIG. 11 and FIG. 11, from the state where the point F of the cam groove 19a is in contact with the follower 18a to the state where the point G of the cam groove 19a is in contact with the follower 18a, FIG.
As shown in FIG. 17, the first clamp 3 gradually retreats,
And the tube portions 49a and 4a to be joined
8 a face each other via the wafer 6. This state is as shown in the timing chart of FIG.
The state is maintained from a state where the point G of the cam groove 19a contacts the follower 18a to a state where the point C of the cam groove 17a contacts the follower 5b. The position of the first clamp is maintained in the state shown in FIG. 17 from the state where the point G contacts the follower 18a to the state where the point H of the cam groove 19a contacts the follower 18a. Note that, as described above, the cutting means 5 is provided in the cam groove 1 shown in FIGS. 9 and 11.
As shown in FIGS. 9 and 11, during a period from a state in which the point C of 7a is in contact with the follower 5b to a state in which the point E of the cam groove 17a is in contact with the follower 5b, as shown in FIGS. The tube portions 48a and 49a abut.

Then, the state where the lowering of the cutting means 5 is completed, in other words, the point E of the cam groove 17a is
Almost at the same time as the state where it comes into contact with the second clamp 2, as shown in FIGS. 7 and 11, the second clamp 2 moves toward the first clamp. Specifically, as shown in FIG. 7 and FIG. 11, the point M of the concave portion 17d of the left side surface 17f of the cam groove 17c is the follower 2 for driving the second clamp 2.
0 until the point L on the left side surface comes into contact with the follower 20.
Moves to the first clamp 3 side, and the concave portion 1 of the cam groove 17c
From the state in which the point L of 7d is in contact with the follower 20 to the state in which the point K of the recess 17d is in contact with the follower 20, the state in which the width is shifted is maintained. By this approach
Since both of the tube portions 48a and 49a are securely adhered to each other, it is possible to further securely join them. Then, from the state where the point K of the concave portion 17d of the cam groove 17c is in contact with the follower 20 to the state where the point J of the left side surface 17f is in contact with the follower 20, the second clamp 2 gradually moves to the second position. moved away from the first clamp 3 side, at this state, the operation of the motor stops.

Therefore, the positions of the first clamp 3 and the second clamp 2 at the stopped positions are shifted as shown in FIG. 17, as shown in FIG. And
As shown in the flow chart of FIG. 14, when the wafer temperature is detected by the thermocouple and the wafer temperature falls below the set value, the operation lamp is turned off and the buzzer sounds. Then, as shown in FIG. 18, the first clamp 3 and the second clamp 2 are opened, and the tube is taken out, thereby completing the tube joining operation. Although not described in the flowchart of FIG. 14, the point A of the cam groove 17a shown in FIGS. 7 and 11 is in contact with the follower 5b.
As shown in the flow chart of FIG. 13, the wafer C is not moved until the point C of the cam groove 17a comes into contact with the follower 5b, in other words, from when the cutting means 5 starts moving up to when the cutting means 5 starts moving down. Is determined to be the set temperature, and based on the temperature detection output of the thermocouple 7 as the wafer temperature detection means, the constant voltage source 43 is controlled by the calculated pulse width modulation signal to control the temperature of the wafer. Is preferred. This also reached once wafer set temperature, by wafer contacts the tubes 48 and 49 of cutting, because the wafer heat is absorbed by the tube decreases, in order to perform the correction. In particular, as described above, the heating control circuit 55 in FIG. 4 converts the temperature detection signal a from the thermocouple serving as the temperature detecting means 7 into the PID corrector 56 (proportional / differential / integral correction) of the correction wafer temperature calculator 51. Unit 1), and outputs a corrected temperature signal b. The correction is expressed by the formula 1b = 1 / K · a ·
(1 + K1 · T · da / dt) (1) If the correction value is calculated by (1), the correction temperature signal “b” indicates the actual temperature of the thermocouple which is the temperature detection signal due to a decrease in the temperature of the wafer. The time delay until the pressure drops is defined as K1 · T ·
Since the correction is performed using da / dt, the actual temperature drop of the wafer is accurately detected, so that the wafer temperature can be controlled quickly.

[0033]

According to the present invention, a flexible tube aseptic joining apparatus is an apparatus for aseptically joining flexible tubes, the apparatus comprising a first clamp and a second clamp for holding the tubes. And cutting means for cutting the flexible tube between the first clamp and the second clamp, the cutting means comprising: a wafer for melting and cutting the flexible tube; A constant voltage source for heating the wafer, a wafer temperature detecting means, and a wafer heating control means, wherein the wafer heating control means outputs a pulse width modulation signal output calculated based on the output of the wafer temperature detecting means. and parts, and a drive circuit for controlling the constant voltage source by the pulse width modulation signal, wafer circuit protection
Circuit, and the wafer short-circuit protection circuit is
A short-circuit detection section of the hull and a detection signal of the short-circuit detection section.
A pulse width modulation signal from the pulse width modulation signal output unit.
Width modulation for controlling the flow of signals into the drive circuit
It has a signal control unit . In particular, by using a constant voltage source and a pulse width modulation signal circuit, power consumption can be reduced. In addition, by controlling a constant voltage source with a pulse width modulation signal, a flexible tube is heated and melted. The temperature of the wafer for cutting can be reliably controlled, and the tube can be reliably bonded.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a flexible tube aseptic joining apparatus of the present invention.

FIG. 2 is a perspective view showing a state in which the aseptic joining device shown in FIG. 1 is housed in a case.

FIG. 3 is a block diagram showing an example of an electric circuit used in the aseptic joining apparatus of the present invention.

FIG. 4 is an electric circuit block diagram showing an example of a wafer heating control means of the electric circuit of the aseptic bonding apparatus of the present invention.

FIG. 5 is a top view of one embodiment of the flexible tube aseptic joining apparatus of the present invention.

FIG. 6 is an explanatory view of cutting means used in the flexible tube aseptic joining apparatus of the present invention.

FIG. 7 is an explanatory diagram for explaining operations of a first clamp, a second clamp, and a cutting unit.

FIG. 8 is an explanatory diagram for explaining an operation of a first clamp.

FIG. 9 is an explanatory diagram for explaining an operation of a cutting unit.

FIG. 10 is a perspective view showing an example of first and second clamps used in the aseptic joining apparatus of the present invention.

FIG. 11 is a timing chart showing operation timings of a first clamp, a second clamp, and a cutting unit.

FIG. 12 is a flowchart for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 13 is a flowchart for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 14 is a flowchart for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 15 is an explanatory diagram for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 16 is an explanatory diagram for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 17 is an explanatory diagram for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 18 is an explanatory diagram for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 19 is a schematic diagram of a circuit of a heating unit using a constant current source.

FIG. 20 is a schematic diagram of a circuit of a heating unit using a constant voltage source.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Aseptic joining apparatus 2 2nd clamp 3 1st clamp 5 Cutting means 6 Wafer 7 Wafer temperature detecting means 13 Micro switch 1 14 Micro switch 2 15 Micro switch 3 40 Controller 41 Rectifier power supply circuit 42 Motor 43 Constant voltage source 44 Wafer Heating control means 50 Input panel 59 Pulse width modulation signal output section 65 Wafer short circuit protection circuit

Continuation of the front page (56) References JP-A-2-25318 (JP, A) JP-A-59-71814 (JP, A) JP-A-59-25756 (JP, A) JP-A-57-49468 (JP) JP-A-63-127767 (JP, A) JP-A-59-64034 (JP, A) JP-B-61-30582 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB A61J 1/14 A61M 1/28 A61M 39/02

Claims (6)

(57) [Claims] 1. A device for aseptically joining flexible tubes, the device comprising a first clamp and a second clamp for holding the tubes, and a first clamp and a second clamp between the first and second clamps. Cutting means for cutting the flexible tube, the cutting means comprising: a wafer for melting and cutting the flexible tube; a constant voltage source for heating the wafer; and a wafer temperature detector. Means, and a wafer heating control means, wherein the wafer heating control means is a pulse width modulation signal output section calculated based on an output of the wafer temperature detecting means.
And controlling the constant voltage source by the pulse width modulation signal.
Drive circuit and a wafer short-circuit protection circuit.
And the wafer short circuit protection circuit detects a short circuit of the wafer.
And the pulse width based on a detection signal of the short-circuit detection unit.
Driving the pulse width modulation signal from the modulation signal output unit
Has a pulse width modulation signal control unit that controls the inflow to the circuit
And flexible tubing aseptically joining device, characterized in that are. 2. The flexible tube aseptic joining device,
First and second clamps for holding at least two flexible tubes in parallel, cutting means for cutting the flexible tubes between the first and second clamps, 2. A moving means for moving at least one of the first clamp and the second clamp such that ends to be joined of the flexible tube cut by the cutting means are in close contact with each other. Flexible tube aseptic joining device. 3. The wafer heating control means detects a corrected wafer temperature based on an output of the wafer temperature detection means.
A correction wafer temperature calculating unit for calculating the correction wafer temperature;
And a deviation signal output section for outputting a deviation signal between a target heating temperature of the calculated correction temperature the wafer by the degree calculating unit, the pulse width modulation signal output unit, the pulse width modulation on the basis of the deviation signal A signal is output.
Or the flexible tube aseptic joining apparatus according to 2. 4. The wafer temperature detecting means includes a thermocouple or a thermocouple.
Or a resistance temperature detector.
Assembling apparatus for flexible tubes. 5. The correction wafer temperature calculating section according to claim 1, wherein:
The flexible tube aseptic joining apparatus according to claim 3, further comprising an integration / derivative correction circuit. 6. The flexible tube aseptic joining apparatus according to claim 3, wherein the deviation signal output unit has a proportional / integral / differential correction circuit.