JPH0691008A - Aseptic connection device for flexible tube - Google Patents

Abstract

PURPOSE:To conduct the connection of tubes surely by providing a wafer movement preventive portion at the front and the upper part of a wafer to fuse and cut off flexible tubes in the case of a connection device in which two flexible tubes are held by means of clams and cutting off is carried out and a clamp is made to move so that cut-off end portions may be stuck closely to each other. CONSTITUTION:In the case of an aseptic connection device for flexible tubes 1, at least two flexible tubes are held in a parallel state by means of clamps 2, 3, and flexible tubes 48, 49 are cut off between the clamps 2, 3 by means of a cutting-off device 5. At least one of the clamps 2, 3 is made to move by means of a moving means so that the fellow end portions of the cut-off flexible tubes 48, 49 that are to be connected to each other may be stuck closely to each other, and the cutting-off means 5 is moved up and down between the clamps 2, 3 by means of a cutting-off means driving means. The cutting-off means 5 possesses a wafer 6 of a thin plate shape to fuse and cut off the flexible tubes 48, 49, a wafer holding portion to hold the wafer 6, and a wafer movement preventive portion 63 that is positioned at the front upper part of the wafer 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible tube aseptic joining apparatus for heating and melting at least two flexible tubes for aseptic connection.

[0002]

2. Description of the Related Art Tube connection between a blood collection bag and a blood component bag in a blood transfusion system, continuous peritoneal dialysis (CA
It is necessary to connect the tubes aseptically when exchanging the dialysate bag and the drainage bag in PD). An apparatus for aseptically connecting such tubes is disclosed in Japanese Patent Publication No. Sho 61-30582. The device disclosed in Japanese Examined Patent Publication No. 61-30582 is a tube connecting device for heating and melting tubes to connect them. A concrete example of the conventional aseptic joining apparatus has a mechanism as shown in FIG. Figure 2
The joining device 100 shown in FIG. 7 includes a first clamp 111 and a second clamp 110 that hold two flexible tubes 115 and 116 to be connected in a parallel state, and a first clamp 111 and a second clamp 110. And a cutting means (wafer) 114 for cutting the flexible tube and a movement for moving the first clamp so that the joined ends of the flexible tube cut by the cutting means face each other through the wafer. It has a means 113 and a moving means 112 for moving the cutting means 114 upward to melt and cut the flexible tube and to move the wafer downward after cutting.

In this aseptic bonding apparatus, after heating the thin plate-shaped wafer 114, it is moved upward from below between the first clamp 111 and the second clamp 110.
Between the first and second clamps, a flexible tube 11
After melting and cutting 5, 116, the first clamp 111 is moved backward (retracted) so that the ends of the cut flexible tubes to be joined are brought into close contact with each other, and then the wafer is moved downward again. Then, the ends of the flexible tube to be joined are brought into close contact with each other and joined.

[0004]

In the above-described bonding apparatus 100, the flexible tube is melt-cut by the wafer between the first clamp 111 and the second clamp 110, and then the first clamp 111 is moved to the first clamp 111. 2 clamps 110
It is moved slightly to the side. This is to make the joining of the tube ends more reliable. Therefore, the wafer 114 has two flexible tubes 115,
By 116, it is pushed from both sides,
When the wafer 114 is moved downward again, the wafer is held by the pressing force between the flexible tubes and does not move completely below the tubes, and the wafer remains sandwiched between the tubes. There were cases where joining was not possible. Therefore, an object of the present invention is to solve the above-mentioned problems of the conventional technology, and after melting and cutting the flexible tube, the wafer is not sandwiched between the tubes,
(EN) Provided is a flexible tube aseptic bonding apparatus capable of reliably moving a wafer below a tube and reliably bonding the tubes.

[0005]

To achieve the above object, there is provided a device for aseptically joining flexible tubes, the device including at least two flexible tubes in a parallel state. A first clamp and a second clamp that are held together, cutting means for cutting the flexible tube between the first clamp and the second clamp, and joining of the flexible tube cut by the cutting means Moving means for moving at least one of the first clamp and the second clamp so that the end portions of the cutting means are brought into close contact with each other, and cutting for vertically moving the cutting means between the first clamp and the second clamp. Means for driving, the cutting means includes a thin plate wafer for melting and cutting the flexible tube, a wafer holding portion for holding the wafer in an exchangeable manner, and the wafer. Sterile joining device having a wafer movement preventing portion located in front of and above the wafer held by the holding unit.

Further, it is preferable that the cutting means has a wafer rear upper movement preventing portion provided behind and above the wafer held by the wafer holding portion.

The flexible tube aseptic joining apparatus of the present invention will be described with reference to the drawings. This flexible tube aseptic joining apparatus 1 is an apparatus for aseptically joining flexible tubes, and includes a first clamp 3 and a first clamp 3 for holding at least two flexible tubes in a parallel state. 2 clamps 2, cutting means 5 for cutting the flexible tubes 48, 49 between the first clamp 3 and the second clamp 2, and joining of the flexible tubes 48, 49 cut by the cutting means 5 The moving means for moving at least one of the first clamp 3 and the second clamp 2 so that the ends to be intimately contacted with each other, and the cutting means 5 for the first clamp 3
And a cutting means driving means for vertically moving between the second clamps 2, and the cutting means 5 includes a flexible tube 4
A thin plate-shaped wafer 6 for melting and cutting 8, 49, a wafer holding portion that holds the wafer 6 in an exchangeable manner, and a wafer movement preventing portion 63 that is located in front of and above the wafer held by the wafer holding portion 63. Have

FIG. 1 is a perspective view of an embodiment of the flexible tube aseptic joining apparatus of the present invention. FIG. 2 is a perspective view showing a state where the aseptic joining apparatus shown in FIG. 1 is housed in a case, and FIG. 3 is a block diagram showing an example of an electric circuit used in the aseptic joining apparatus of the present invention. is there. FIG. 4 is a top view of an embodiment of the flexible tube aseptic joining apparatus of the present invention.

Next, the overall mechanism of the aseptic joining apparatus 1 will be described. This aseptic joining apparatus 1 is shown in FIGS.
As shown in FIGS. 4 and 18, it has a first clamp 3 and a second clamp 2 that hold at least two flexible tubes in a parallel state. A gear 30 rotated by the operation of the motor, a gear 31 rotated by the rotation of the gear 30,
The shaft 32 rotated by the rotation of the gear 31, the frame 9 in which both ends of the shaft are rotatably fixed, the prevention member 11 for preventing rattling of the first clamp 3 at the origin position, the micro switches 13, 14 ,, 15, a driving arm 18 for moving the first clamp 3, a cam 19 for moving the first clamp 3, a cutting means 5, a cam 17 for driving the cutting means 5 and the second clamp,
A pressing member 3 for pressing the second clamp 2 toward the first clamp side
3, the regulating member 2 for regulating the retracted position of the first clamp 3
5, a spring member 27 for preventing rattling of the first clamp 3, a wafer exchange lever 22, a wafer cartridge 8, a wafer cartridge exchange lever 24, a used wafer storage box holding member 28, and a used wafer in a storage box. Guide member 26 for guiding, used wafer storage box 2
9 has an operation panel 50.

As shown in FIG. 3, the aseptic bonding apparatus 1 of this embodiment has a constant voltage source for heating a wafer having a rectifying power supply circuit 41 for converting an AC power supply into a direct current and converting a predetermined voltage. 43, a motor 42 similarly supplied with power from the constant voltage source 43, and a controller 40 for controlling the motor 42 and the wafer heating control circuit 44,
A wafer 6 for cutting the flexible tube by heating and melting, a temperature detecting means 7 for the wafer 6, and an electric power sent from the constant voltage source 43 to the wafer 6 based on a signal from the temperature detecting means 7. The wafer heating control means 44 for controlling the heating of the wafer 6 is provided. Further, as shown in FIG. 5, a connection terminal 9 for electrically connecting the constant voltage source 43 and the wafer is provided. Further, the wafer heating control means 44 is electrically connected to a reset switch 69 for returning the apparatus after the operation of the wafer short circuit, and the wafer heating control means 44 is electrically connected to the controller 40. Connected to each other. Further, the controller 40 includes a micro switch S.
W1 (13), micro switch SW2 (14), micro switch SW3 (15), micro switch SW4
(72), the micro switch SW5 (73), the micro switch SW6 (74), the power switch 51 provided on the input panel 50, the start switch 52, and the clamp reset switch 53 are electrically connected, and further, the controller. A buzzer 45 operated by a signal output from 40
Is provided. The motor 42 is the cutting means 5, the first
It is a drive source that drives the clamp 3 and the second clamp 2.

In this aseptic joining apparatus 1, the first ends 48a, 49a of the flexible tubes 48, 49 cut by the cutting means 5 are joined so as to face each other.
A first clamp moving mechanism for moving the clamp 3, a moving function for moving the cutting means 5 to the tube side (upward), and a direction (downward) away from the tube after cutting, and the second clamp 2 Has a second clamp moving mechanism that moves the first clamp 3 toward and away from the first clamp 3. The cutting means drive mechanism moves the cutting means 5 vertically upward with respect to the axes of the two tubes and moves the tubes downward after cutting the tubes. The first clamp moving mechanism moves the tubes after cutting the tubes. 1 clamp 3 is to move in an orthogonal direction (more specifically, to the rear) in a horizontal state with respect to the axes of the two tubes,
The second clamp moving mechanism moves the second clamp 2 so as to approach the first clamp side, and moves the second clamp 2 very slightly in parallel to the axes of the two tubes.

Next, the cutting means will be described with reference to the drawings. FIG. 5 is a left side view showing an example of the cutting means used in the joining device of the present invention, and FIG. 6 is a right side view showing an example of the cutting means used in the joining device of the present invention.
FIG. 7 is a top view of the cutting means shown in FIGS. 5 and 6, FIG. 8 is a front view of the cutting means shown in FIGS. 5 and 6, and FIG. 9 is AA of FIG. FIG. 10 is a line end view of FIG.
FIG. 10 is a partial cross-sectional view of the cutting means taken along the line BB in FIG. 9. The wafer 6 is a thin plate having a rectangular side surface, and specifically, a metal plate bent to face each other, an insulating layer formed on the inner surface of the metal plate, and the inside of the insulating layer. What has a resistor formed so that it may not contact with the above-mentioned metal plate, and a terminal for electricity provided in both ends of this resistor is used suitably.

As shown in FIGS. 7 and 8, the cutting means 5 has a wafer holding portion member 81, a wafer heating portion and a temperature detecting means holding portion 83 (hereinafter, temperature detecting means holding portion 83). ing. Further, as shown in FIGS. 5 and 7, the cutting means 5 has a rotatable hinge portion 5d.
And a fixing portion 5e for fixing the cutting means 5 to the main body 9,
It has an arm portion 5c. The wafer holding portion 81 includes a lower member 60, a wafer side surface holding member 67 mounted and fixed on a flat surface formed by the upper surface of the lower member 60, and a wafer lower side surface holding member 61 fixed to a side surface of the lower member 60. It is composed by. The wafer 6 is exchangeably held between the wafer side surface holding member 67 and the wafer lower side surface holding member 61. As shown in FIG. 5, the wafer side surface holding member 67 includes a columnar wafer front side surface holding portion 67a extending upward from below and a wafer rear side surface holding portion 67b located behind the front side surface holding portion 67a. A space is provided between the wafer front side surface holding portion 67a and the rear side surface holding portion 67b, and the wafer is exposed. Further, there is a window portion behind the wafer rear side surface holding portion 67b,
The standby wafer 69 is exposed. The wafer contact side surfaces of the wafer front side surface holding portion 67a and the rear side surface holding portion 67b are flat surfaces.

Further, the wafer holding portion 81 of the cutting means 5
Preferably has a wafer rear upper movement preventing portion on the rear side as shown in FIGS. 5, 6 and 7. In this embodiment, a wafer rear upper movement preventing member 62 formed of a metal plate is provided on the rear upper surface of the wafer side surface holding member 67. As shown in FIG. 7, the wafer rear upper movement preventing member 63 has its entire side surface protruding in the wafer direction, encapsulating the upper portion of the standby wafer and forming a wafer guiding portion. Further, the end portion 62a protruding forward is configured so as to be located at the upper rear portion of the wafer 6. As a result, the wafer 6 is cut by the two cut flexible tubes.
Even if the wafer is moved downward while being pressed from both side surfaces, the movement of the wafer at the rear portion can be prevented, so that the movement of the wafer, which is different from the movement of the cutting means, can be reliably prevented. Wafer rear upper movement prevention member 6
2 may be provided not on the wafer side surface holding member 67 but on the rear upper surface of the wafer lower side surface holding member 61. Further, the wafer side surface holding member 67 is provided with a standby wafer holding bolt 71.

As shown in FIGS. 6, 7 and 8, the temperature detecting means holding portion 83 is fixed to the right side surface of the wafer holding portion 81, and the electric connection terminal 9 for heating the wafer and the wafer are connected. It has a temperature detecting means 7 for detecting the temperature and a temperature detecting means holding member 64. Temperature detection means 7
As the above, a thermocouple or a resistance temperature detector is preferable. A sheath type thermocouple or a resistance temperature detector is more preferable, and a sheath type thermocouple is particularly preferable.

As shown in FIG. 6, the end portion of the temperature detecting means holding member 64 and the lower portion of the electric connection terminal 9 are fixed to the fixing portion 60a of the lower member 60 of the wafer holding portion 81, and Two terminals 9 extending from the connection terminal 9
a and 9a contact the wafer 6 and supply a heating current to the wafer. The connector 66 is connected to the rear portion of the electrical connection terminal 9. Also, the temperature detecting means 7
Is connected to the cord at the connecting portion 7a. And
As shown in FIG. 7, the temperature detecting means holding member 64 is bent, and in the state of being fixed by the fixing portion 60a of the lower member 60, the front end portion provided with the temperature detecting means 7 is attached to the wafer 6. It is pushing to the side. As a result, the temperature detecting means 7 can be surely brought into close contact with the wafer 6, and accurate temperature detection can be performed. Further, the wafer holding surface of the wafer front side holding portion 67a of the wafer side holding member 67 is formed in a substantially vertical state, and as described above,
By pressing the front side surface of the wafer, the wafer can be held in a vertical state, so that the cut surface of the tube to be cut is also vertical and the joining of the tubes is more reliable. In particular, as shown in FIG. 7, it is preferable that the wafer is pressed by the temperature detecting means holding member 64 so that it is located above the wafer. In this way, by pressing at the upper portion, the wafer can be more reliably held in the vertical state. Further, in this aseptic bonding apparatus, as shown in FIGS. 9, 10 and 11, a heat conductive flat plate member 76 is fixed to the surface of the temperature detecting means 7 that contacts the wafer 6. As the heat conductive flat plate member 76, a metal plate formed of a metal having high heat conductivity, such as copper or stainless steel, is suitable. The shape of the flat plate member 76 is circular, elliptical, or polygonal (for example,
It may be a square, a pentagon, etc. As described above, by providing the heat conductive flat plate member 76 on the surface of the temperature detecting means 7 that contacts the wafer 6, the pressing area for pressing the wafer by the temperature detecting means can be widened, whereby the vertical state of the wafer can be achieved. Is more reliably held, and the thermal coupling between the wafer surface and the temperature detecting means is tight, so that a more accurate temperature signal can be obtained. further,
Between the temperature detecting means 7 and the temperature detecting means holding member 64,
A heat insulating member 74 is provided. By providing the heat insulating member 74, the temperature detecting means 7 is less likely to be cooled by the outside air, and the temperature can be detected more reliably. A heat resistant resin is used as the heat insulating member 74, and a polyimide resin is preferable.

Then, as shown in FIGS. 7, 8 and 9, the upper portion of the temperature detecting means holding member 64 projects toward the wafer side, and the end portion of the temperature detecting means holding member 64 goes over the upper portion of the wafer 6 to hold the front side surface of the wafer. It is formed so as to abut against the portion 67a or slightly beyond the wafer front side surface holding portion as shown in FIGS. 8 and 9, and this end portion forms the wafer front upper movement preventing portion 63. By providing such a wafer front upper movement preventing portion 63, the wafer 6
However, due to the two cut flexible tubes, even if the wafer is moved downward (the cutting means is downward) while being pressed from both side surfaces, the wafer front upper movement preventing portion 6
Since the movement of the wafer is prevented by 3, the wafer is not held by the pressing force between the flexible tubes and is not sandwiched between the tubes, and the wafer 6 is moved downward together with the cutting means. You can move.

Further, as shown in FIG. 8 and FIG. 9, the wafer front upper part movement preventing portion 63 formed by the tip of the temperature detecting means holding member 64 crosses over the upper portion of the wafer 6 and slightly extends to the wafer front side holding portion 67a. It is such a degree, and it is preferable that it does not project to the wafer front side surface holding portion 67a side so much. When the wafer 6 is exchanged, when the wafer exchange lever 22 shown in FIG. 4 is pulled, the lever tip portion 22a becomes
It advances forward, and as shown in FIG. 13, enters between the temperature detecting means holding member 64 and the wafer lower side surface holding member 61. As a result, the pressing of the wafer is released by the temperature detecting means holding member 64, and the temperature detecting means holding member 64 is separated from the wafer 6. Then, the used wafer is also pushed by the standby wafer pushed by the wafer exchange lever, passes through the guide member 26 shown in FIGS. 2 and 4, and falls into the storage box 29 while tilting forward. By forming the wafer front upper movement preventing portion 63 as described above, when the wafer is exchanged, the wafer front upper movement preventing portion 63 is separated from the wafer 6 together with the temperature detecting means holding member 64, so that the wafer 6 When tilting forward, the rear part does not get caught, making sure that the storage box 29
Can be dropped inside.

Further, the wafer front upper movement preventing portion 63
May be provided on the upper end of the wafer front side surface holding portion 67a as shown in FIGS. Specifically, as shown in FIGS. 7 and 8, the wafer front side surface holding portion 6
At the upper end of 7a, the end portion of the wafer front side holding portion 67 is provided.
It is conceivable to provide a wafer front upper movement preventing member 63 which projects in the wafer direction from the wafer holding side surface of a and is located above the tip of the wafer 6. Further, in this embodiment, the wafer front upper movement preventing member 63 is formed by fixing a metal plate to the upper end of the wafer front side surface holding portion 67a with a screw.
By providing such a wafer front upper movement preventing member 63, the wafer 6 is pushed downward (the cutting means is lowered when the wafer 6 is pushed from both side surfaces by the two cut flexible tubes). Even if the wafer is moved, the wafer front upper movement preventing member 63 prevents the wafer from moving, so that the wafer is held by the pressing force between the flexible tubes and the wafer remains sandwiched between the tubes. Therefore, the wafer 6 can be moved downward together with the cutting means. Further, the wafer front upper movement preventing member 63 may prevent the wafer movement different from the movement of the cutting means, and is not limited to being provided on the wafer front side holding portion 67a of the wafer side holding member 67 as described above. Absent. As the wafer movement preventing portion, for example, the tip end portion of the lower wafer side surface holding member 61 extends upward, and the end portion of the wafer lower side surface holding member 61 crosses the upper portion of the wafer and abuts against the front wafer side surface holding portion 67a or holds the front wafer side surface. You may attach the member beyond a part.

Next, the first and second clamps 3 and 2 will be described. The first and second clamps 3 and 2 are configured as shown in FIGS. 1, 4, 15 and 18. Specifically, as shown in FIG. 18, the first clamp 3 has a base 3b, a cover 3a rotatably attached to the base 3b, and a clamp fixing base 3c to which the base 3b is fixed. There is. The clamp fixing base 3c is fixed to the linear table. The linear table is composed of a moving table 3c fixed to the lower surface of the clamp fixing table 3c, and a rail member 3n provided below the moving table 3c. Then, with this linear table, the first clamp 3 is connected to the tubes 48,
Move in a direction perpendicular to the axis of 49, in other words, without distortion, so that the joined ends of the cut flexible tube face each other. Therefore, in the aseptic joining apparatus 1 of this embodiment, the first clamp moving mechanism includes the linear table, the motor, the gear 30, the gear 31, and the shaft 3 described above.
2. It is composed of a driving arm 18 and a cam 19. As shown in FIGS. 1 and 4, the joining device 1 is provided with a spring member 27 that connects the rear of the first clamp fixing base 3c and the frame of the joining device 1 to each other. Is always pulled rearward, and the rattling of the first clamp 3 (to be exact, the first clamp fixing base 3c) is reduced. Further, as shown in FIGS. 1 and 4, the rattling of the first clamp 2 is prevented at the tube mounting position of the first clamp 3 (in other words, the position where the first clamp is in the foremost position). A prevention member 11 for preventing the movement is fixed to the side surface of the frame 9. Therefore, the first clamp 3 is pulled backward by the spring member 27 at the tube mounting position,
That is, there is no rattling on the rear side, and the rattling prevention member on the front side prevents the player from moving further than that. Therefore, the first clamp 3 is configured so that there is no rattling at the tube mounting position. In addition, as shown in FIGS. 1 and 4, the joining device 1 includes a first clamp 3 (more precisely, a first clamp fixing base 3).
A restriction member 25 that restricts the maximum movement position behind c) is provided.

As shown in FIGS. 4, 15 and 18, the second clamp 2 includes a base 2b, a cover 2a rotatably attached to the base 2b, and a clamp fixing base 2c to which the base 2b is fixed. have. The clamp fixing base 2c is fixed to the linear table. The linear table is composed of a moving table 2c fixed to the lower surface of the clamp fixing table 2c and a rail member 2n provided below the moving table 2c. The linear table causes the second clamp 2 to move in a direction parallel to the axes of the tubes 48 and 49 to be joined, in other words, to move the second clamp 2 toward and away from the first clamp 3. Only move without distortion.

Further, as shown in FIGS. 4 and 15, between the frame of the joining device 1 and the clamp fixing base 2c,
The pressing member 33 is provided, and the second clamp 2 is always provided.
(To be precise, the second clamp fixing base 2c) is pushed to the first clamp side. A spring member is preferably used as the pressing member. The pressing member 33 is connected to the two flexible tubes 4 by the first and second clamps 3 and 2.
The one in which the pressing force of the pressing member 33 is weaker than the repulsive force of the flexible tube when the flexible tube 8 and 49 are crushed and gripped is used.
The clamp 2 is configured to move in a direction in which it is slightly separated from the first clamp 3. Therefore, in the aseptic joining apparatus 1 of this embodiment, the second clamp moving mechanism is composed of the linear table, the motor, the gear 30, the gear 31, the shaft 32, the cam 17, and the pressing member 33.

As shown in FIG. 18, the first clamp 3 and the second clamp 2 are configured to hold the tube to be held in a state of being squeezed obliquely. The clamps 3, 2 have covers 3a, 2a pivotally attached to the bases 3b, 2b.
2b has two slots 3f, 3e and 2f, 2e provided in parallel for placing two tubes. And the slots 3f and 3e and the slot 2
Saw blade-shaped closing members 3h, 2h are provided on the end surfaces of the bases 3b, 2b where f and 2e face each other. The bases 3b and 2b are attached to the covers 3a and 2a.
Saw blade-shaped closing members 3g and 2g having a shape corresponding to the closing members 3h and 2h. The inner surfaces of the covers 3a and 2a are flat. Each of the covers 3a and 2a has a swing cam, and this swing cam
When the covers 3a and 2a are closed, they engage with the rollers of the bases 3b and 2b. And the two tubes are the cover 3
When a and 2a are closed, the closing member 3h of the base 3b
And the closing member 3g of the cover 3a, and the base 2b
Between the closing member 2h and the closing member 2g of the cover 2a is squeezed obliquely and held in a closed state. The first clamp 3 has a protrusion 3i protruding in the second clamp direction, and the second clamp 2 has a recess 2i for accommodating the protrusion 3i.
Is configured so that it cannot be closed unless the first clamp 1 is closed.

The aseptic joining apparatus 1 has, as shown in FIG. 1, a gear 30 rotated by a motor and a gear 30.
It has a gear 31 that rotates by 0 rotation,
As shown in FIG. 15, two cams 19 and 17 are fixed to the shaft 32 of No. 1 and the cams 19 and 17 rotate together with the rotation of the gear 31. A cam groove 19a for driving the first clamp having a shape as shown in FIG. 7 is provided on the right side surface of the cam 19. A first clamp moving arm 18 having a follower 18a sliding in the cam groove 19a of the cam 19 at the center is provided. Further, the lower end of the arm 18 is connected to the frame 9 by the fulcrum 18b.
The arm 18 is rotatably supported by the fulcrum 1 provided on the clamp fixing base 3 c of the first clamp 3.
It is rotatably supported by 8c. Therefore, the first
The clamp 3 is in a horizontal state along the rail member 3n of the linear table with respect to the axes of the two tubes as shown by the arrow according to the shape of the cam groove 19a by the rotation of the cam 19 as shown in FIG. Move to the rear in the orthogonal direction.

The cutting means 5 is shown in FIG. 14 and, as described above, the wafer holding portion 5a for holding the wafer in a replaceable manner.
And the arm portion 5 provided below the wafer holding portion 5a.
c and a follower 5b provided at the end of the arm 5c
And a hinge portion 5d and a mounting portion 5e to the frame 9. The hinge portion 5d is capable of turning with respect to the frame 9. The follower 5b provided at the end of the arm 5c slides in the cam groove 17a of the cam 17, as shown in FIG. 14, and the cutting means 5 moves up and down due to the shape of the cam groove.

Then, the cam 17 is similar to that shown in FIGS.
As shown in FIG. 5, a cam groove 17a for driving the cutting means is provided on the left side surface
have. Then, the follower 5b of the cutting means 5 is
It is located in the cam groove 17a of the cam 17, and
The inside of a slides along the shape of the cam groove. Therefore, the cutting means 5 is rotated by the cam 17 as shown in FIG.
It moves vertically according to the shape of the cam groove 17a, in other words, vertically and vertically with respect to the axes of the two tubes. Further, as shown in FIG. 15, the cam 17 has a cam groove 17c for driving the second clamp 2 in the central portion. The cam groove 17c has a left side surface 17f and a right side surface 17e.
And the position of the second clamp is controlled by the left side surface 17f and the right side surface 17e. The second clamp fixing base 2c has a protruding portion extending downward, and a follower 20 is provided at the tip thereof. This follower 20
Slides in the cam groove 17c for driving the second clamp 2. Then, as shown in FIG. 15, a slight gap is formed between the follower 20 and the side surface of the cam groove 17c. Since the second clamp fixing base 2c is constantly pushed by the spring member 33, in the normal state,
The follower 20 comes into contact with the left side surface 17f of the cam groove 17c, and the follower 20 and the right side surface 1 of the cam groove 17c.
There will be a slight gap between it and 7e. However, if the two tubes are held by the first and second clamps 3,2, as described above, the two clamps 3,2 respectively
To squeeze and hold the two tubes so that they are crushed,
A repulsive force is generated due to the blockage of the tube. Since the spring member 33 has a force smaller than the repulsive force due to the blockage of the tube, the clamp 3,
In the state in which the tube 2 is holding the tube, the follower 20 comes into contact with the right side surface 17e of the cam groove 17c as shown in FIG. There is a gap. However, when the tube is cut by the cutting means 5 described above, the repulsive force due to the blockage of the tube disappears, and thus the normal state is restored,
The follower 20 comes into contact with the left side surface 17f of the cam groove 17c, and the follower 20 and the right side surface 1 of the cam groove 17c.
There will be a slight gap between it and 7e. In this way, the sliding surface of the cam groove with which the follower 20 contacts changes with time due to the action of the spring member 33 and the repulsive force of the tube.

Then, as shown in FIG. 15, the left side surface 17
A recess 17d is formed in f. Since the follower 20 passes through the recessed portion 17d after the tube is cut by the cutting means, the follower 20 is not connected to the cam groove 17d.
It is in a state of sliding along the left side surface 17f, and therefore the follower 20 enters the recess 17 portion. Therefore, the second clamp 2 moves in the first clamp 3 direction by the depth of the recess 17d. This makes the joining of the tubes more reliable. A recess 17g is also provided on the right side surface 17e of the cam groove 17c. This recess 17
g is for cleaning the inner surfaces of the clamps 3 and 2. By providing the recess 17g, the second clamp 2 can be moved in the direction away from the first clamp 3 by pushing the second clamp 2 toward the spring member 33 until the follower 20 contacts the recess 17g. Therefore, a gap is formed between the first clamp 3 and the second clamp. It becomes possible to clean the inside of the formed gap by a cleaning member, for example, a swab containing a solvent capable of dissolving the material for forming the tube to be cut to some extent, such as alcohol. As shown in FIG. 15, the recess 17g is provided at a position substantially facing the recess 17d of the left side surface 17f (a portion where the width of the second clamp 2 is adjusted).
When the follower 20 provided on the protruding portion extending below the second clamp fixing base 2c is in the recess 17d, it is in a state where the desired tubes are joined together after cutting the tubes, and in this state, The second clamp stops. Further, the first clamp is also already stopped, and the first clamp 3 is in a position displaced from the second clamp. Specifically, as shown in FIG. 1, the first clamp 3 is
It is retracted from the clamp 2, and the first clamp 3
It is in a position displaced from the clamp. Therefore, in this state, the inner surface of the front end portion of the second clamp 2 is slightly exposed, and further, the inner surface of the rear end portion of the first clamp is also slightly exposed. Therefore, it is easy to clean the exposed inner surface of the second clamp 2 and the first clamp 3.

Next, the operation of the aseptic joining apparatus 1 of the present invention will be described with reference to the drawings. FIG. 19 is a timing chart showing the operations of the cutting means, the first clamp, and the second clamp. 20, 21, and 22 are flowcharts for explaining the operation of the aseptic joining apparatus. Figure 2
3, FIG. 24, FIG. 25, and FIG. 26 are explanatory views for explaining the operation of the aseptic joining apparatus. In this joining device 1, the first clamp 3 is at a position displaced from the second clamp 2 at the end of the joining work, and is at the stop position in the timing chart of FIG. The angle of the horizontal axis of the timing chart of FIG. 19 is 0 ° at the origin (the state where the first clamp and the second clamp are aligned), and the rotation angle of the shaft 32 of the gear 31 thereafter, in other words, the cam 17 3 shows movements of the cutting means (wafer), the first clamp 3, and the second clamp 2 when the rotation angle of the cam 19 and the rotation angle of the cam 19.

First, as shown in FIG. 20 of the flow chart, the power switch 51 provided on the panel 50 of FIG. 3 is pushed. As a result, the CPU constituting the controller 40 shown in FIG. 3 determines whether the joining device 1 has no abnormality (specifically, the internal connector is not disconnected, the thermocouple is not broken, or the internal constant voltage is constant). If there is a defect, the buzzer sounds. Then, the clamp reset switch 53 provided on the panel 50 of FIG. 3 is pushed. The CPU determines whether the first and second clamps are open, whether the first and second clamps are not at the origin, and whether the wafer exchange lever is at the origin. In addition, the clamp used in the aseptic joining apparatus 1 of this embodiment, as described above, the first clamp 3,
Since the second clamp 2 has the protrusion 3i protruding in the second clamp direction and the second clamp 2 has the recess 2i for accommodating the protrusion 3i, the second clamp 2 must close the first clamp 1. , So that it cannot be blocked. Therefore, the fact that the first and second clamps are open means that the second clamp
A lever 16 that contacts when the clamp is closed;
This is detected by the micro switch 13 which is turned on / off by the lever 16. Specifically, the micro switch 13 is turned off when the second clamp is in the released state.
Therefore, when the second clamp 2 is closed, the second clamp 2 comes into contact with the lever 16 so that the lever 16 moves and the micro switch 13
Is turned on. ON / of this micro switch 13
The OFF signal is input to the controller 40. The fact that the first and second clamps are not at the origin means that the grooves provided on the circumference of the respective cams are set in the microswitch SW5 (73),
It is determined by the detection by SW6 (74). The presence of the wafer exchange lever 22 at the origin is detected by the microswitch 14. When the lever 22 is at the origin, the micro switch 14 is turned on, and when it is not at the origin, it is turned off, and the ON / OFF signal of the micro switch 14 is input to the controller 40.

Then, as shown in FIG. 20, when all the above-mentioned four points are YES, the motor is operated and the first and second clamps are returned to the origin. In addition, the above 4
If any one of the two points is No, the buzzer sounds, the abnormality lamp lights, the manual release is performed, and the reset switch is pressed to turn off the abnormality lamp. After the first and second clamps reach the origin, the two flexible tubes 48, 49 are attached to the first and second clamps. The first and second clamps 3 and 2 in this state are
As shown in FIG. 18, both of them are in an open state, and the slots 3e and 2e and 3f and 2 provided in both are opened.
f is in a state of facing each other. Then, the tube 49 in use is mounted in the front slots 3f, 2f, and the unused tube 48 to be connected is mounted in the rear slots 3e, 2e. Then, after closing the first and second clamps 3 as described above, the wafer exchange lever 2
Push 2 to the clamp side to replace the wafer. By pushing the wafer exchange lever 22 toward the clamp side, a new wafer is taken out from the wafer cartridge 8, the new wafer pushes the standby wafer mounted on the cutting means 5, and the standby wafer is mounted on the cutting means 5. The used wafer is pushed, the standby wafer is mounted at the used position, and the used wafer is stored in the used wafer storage box 29. Then, the panel 50
When the start switch 52 is pressed, the flow shifts to the one shown in the flowchart of FIG. 21, and the CPU constituting the controller 40 shown in FIG. 3 determines whether or not the first and second clamps are closed and whether or not the wafer has been exchanged. Whether the first and second clamps are at the origin, whether the wafer exchange lever is at the origin, and whether the first and second clamps are closed are determined when the second clamp is closed. The contact is detected by the lever 16 and the micro switch 13 that is turned ON / OFF by the lever 16. Specifically, the micro switch 13 is OFF when the second clamp is in the released state, contacts the lever 16 when the second clamp 2 is closed, the lever 16 moves, and the micro switch 13 Is turned on. The ON / OFF signal of the micro switch 13 is input to the controller 40. Whether or not the wafer has been exchanged is determined by pressing the wafer exchange lever 22 in the clamping direction and performing the wafer exchange work. The exchange lever 22 once turns on the micro switch 15. Therefore, an ON signal from the micro switch 15 determines whether the wafer has been exchanged. It is detected whether or not it has been replaced. The ON / OFF signal of the micro switch 15 is input to the controller 40.
Whether or not the first and second clamps are at the origin is detected by the microswitches 5 and 6 as described above.

Then, as shown in FIG. 21, when any one of the above-mentioned four points is No, the buzzer sounds and
Return to FIG. When all the above-mentioned four points are YES, the operating lamp 47 is turned on and heating of the wafer is started. After the heating of the wafer is started, it is determined whether the wafer current is equal to or more than the set value, and this is to determine whether the wafer is short-circuited. If the wafer current is not less than the set value (the voltage applied to the shunt resistor is not less than the predetermined value), it is determined whether the wafer current is within the set value range after waiting 0.3 seconds. This is due to the thermal history of the resistor when the wafer is used.
Since the resistance value decreases, the wafer current is measured and compared with the preset wafer current to detect whether it is within the set range (within the allowable range). To judge. If the above-mentioned wafer current is above the set value (when the wafer is short-circuited) and above-mentioned wafer current is not within the set range (when the wafer has been used), the buzzer sounds,
After the heating of the wafer is stopped, the wafer abnormality lamp is turned on, and the reset switch is pressed, the process proceeds to the flowchart of FIG. And compare with the wafer current,
If it is within the set range (within the allowable range), heating of the wafer is continued. The heating of the wafer 6 is performed while controlling the constant voltage source 43 by the pulse width modulation signal calculated based on the temperature detection output of the thermocouple 7 which is the wafer temperature detection means. Then, in order to prevent overheating of the wafer, it is determined whether the heating time of the wafer is within a predetermined time, and whether the wafer current is less than or equal to a predetermined value,
If the value is equal to or less than the predetermined value, that is, if the wafer is short-circuited, the buzzer sounds immediately, the heating of the wafer is stopped, and the process proceeds to the flowchart of FIG. Then, when the temperature of the wafer reaches the set temperature, the process proceeds to the flowchart of FIG. 22 and the motor is activated, whereby the gear 30, the gear 31, the cams 19 and 17 are rotated, and the cutting means (wafer) is raised. The tube is cut, the first clamp is retracted, the cutting means (wafer) is lowered, and the second clamp is moved to the first clamp side.

More specifically, first, the cam 17 rotates in the direction of the arrow to cause the follower 5 of the cutting means 5 to rotate.
b slides in the cam groove 17a. From the state where the origin O of the cam groove shown in FIGS. 17 and 19 was initially in contact with the follower 5b, the cam groove 17a shown in FIGS.
The point A comes into contact with the follower 5b. And
From the state where the point A of the cam groove 17a shown in FIGS. 17 and 19 is in contact with the follower 5b to the state where the point B of the cam groove 17a is in contact with the follower 5b, as shown in FIG. The cutting means 5 rises, during which the two flexible tubes are cut. 23 and 24, two tubes 48, 49 will be described.
Are held by the first clamp 3 and the second clamp 2, tube portions 48a and 49a located between the first clamp 3 and the second clamp 2 are formed, and the wafer 6 of the cutting means is located below them. is doing. And
As described above, the cutting means 5 (wafer 6) is lifted by the rotation of the cam 17, so that it is positioned between the first clamp 3 and the second clamp 2 of the two tubes as shown in FIG. Both are melt-cut at the tube portions 48a and 49a. In the aseptic bonding apparatus of this embodiment, although not shown in FIGS. 23 to 26, the wafer is held in a substantially vertical state by the wafer holding unit, and the temperature detecting means for holding the wafer temperature detecting means is further provided. Since the temperature detecting means is pressed against the side surface of the tip portion of the wafer by the holding portion, when the tubes 48 and 49 are melt-cut by the wafer, even if the force acting downward from the tubes 48 and 49 is exerted, the wafer is vertically moved. It can be kept in a state, so that the cut surface of the tube to be cut is also vertical.

Then, point B of the cam groove 17a shown in FIG.
1 from the state of contacting the follower 5b to the state of contacting the point C of the cam groove 17a with the follower 5b.
As shown in FIG. 7 and FIG. 19, the cutting means 5 is maintained in the raised state and sufficiently dissolves the cut ends of the tubes 48a and 49a. 17 and 19 from the state where the point C of the cam groove 17a shown in FIGS. 17 and 19 contacts the follower 5b to the state where the point E of the cam groove 17a comes into contact with the follower 5b. like,
The cutting means 5 descends gently. Further, as shown in FIG. 16, when the cam 19 rotates in the arrow direction, the follower 18a provided on the arm 18 for moving the first clamp slides in the cam groove 19a. Initially, the origin O of the cam groove shown in FIGS. 16 and 19 is the follower 1.
The point F of the cam groove 19a shown in FIGS. 16 and 19 comes into contact with the follower 18a from the state of being in contact with 8a. As shown in the timing chart of FIG. 19, the follower 18a reaches the cam groove 19a point F a little earlier than the follower 5b of the cutting means 5 reaches the point B of the cam groove 17a. Then, as shown in FIGS. 16 and 19, from the state where the point F of the cam groove 19a contacts the follower 18a to the state where the point G of the cam groove 19a contacts the follower 18a, the state shown in FIG. As described above, the first clamp 3 is gradually retracted to the state shown in FIG. 25, and the tube portions 49a and 48a to be joined face each other via the wafer 6. In this state, as shown in the timing chart of FIG. 19, the point G of the cam groove 19a is at the follower 18
It is maintained until the point C of the cam groove 17a comes into contact with the follower 5b from the state of contact with a. The position of the first clamp is such that the point G of the cam groove 19a is at the follower 18a from the state where the point G contacts the follower 18a.
The state of FIG. 25 is maintained until the state of contacting with. As described above, the cutting means 5 changes from the state where the point C of the cam groove 17a shown in FIGS. 17 and 19 contacts the follower 5b to the state where the point E of the cam groove 17a comes into contact with the follower 5b. Meanwhile, as shown in FIGS. 17 and 19, the tube portions 48a and 49a to be joined are brought into contact with each other while descending gently. Then, FIG. 25 and FIG.
As shown in FIG. 6, above the tip of the wafer 6, the wafer front side surface holding portion 63 of the temperature detecting means holding portion 83
Since the movement is suppressed, the wafer 6 surely moves downward with the movement of the cutting means.

Then, the state where the lowering of the cutting means 5 is completed, in other words, the point E of the cam groove 17a is at the follower 5b.
As shown in FIGS. 15 and 19, the second clamp 2 shifts the width toward the first clamp side almost at the same time when the state of contacting the first clamp is reached. Specifically, as shown in FIGS. 15 and 19, from the state where the point M on the left side surface 17d of the cam groove 17c comes into contact with the follower 20 for driving the second clamp 2, the point L on the left side surface changes. Until it comes into contact with the follower 20, the second clamp 2 gradually moves to the side of the first clamp 3, and the point L of the recess 17d of the cam groove 17c.
From the state in which K contacts the follower 20 to the state in which the point K of the recessed portion 17d contacts the follower 20, the widthwise state is maintained. By this width adjustment, both of the tube portions 48a and 49a are surely brought into close contact with each other, so that the two can be joined more reliably. Then, the point K of the concave portion 17d of the cam groove 17c is changed to the follower 20.
From the state of contact with the left side surface 17f, the point J is the follower 2
The second clamp 2 gradually moves in the direction away from the first clamp 3 side until it comes into contact with 0. In this state, the operation of the motor is stopped.

Therefore, the positions of the first clamp 3 and the second clamp 2 at the stopped position are as shown in FIG.
The position is shifted as in FIG. 25. And FIG.
As shown in the flowchart of FIG. 2, when the wafer temperature is detected by the thermocouple and the wafer temperature becomes equal to or lower than the set value, the operation lamp is turned off and the buzzer sounds. And
As shown in FIG. 26, by opening the first clamp 2 and the second clamp 3 and taking out the tube, the tube joining operation is completed.

[0036]

Industrial Applicability The flexible tube aseptic joining apparatus of the present invention is an apparatus for aseptically joining flexible tubes, the apparatus comprising at least two flexible tubes in a parallel state. A first clamp and a second clamp held by, a cutting means for cutting the flexible tube between the first clamp and the second clamp, and a flexible tube cut by the cutting means. A moving means for moving at least one of the first clamp and the second clamp so that the joined ends are in close contact with each other, and for moving the cutting means up and down between the first clamp and the second clamp. A cutting means driving means, the cutting means includes a thin plate-shaped wafer for melting and cutting the flexible tube, a wafer holding portion holding the wafer in an exchangeable manner, and the wafer. Because it has a wafer movement preventing portion located in front of and above the wafer held by the holding unit, wafer, without differences with the movement of the cutting means, since the movement to follow the downward movement of the wafer,
It is possible to prevent the wafer from being held by the pressing force between the two cut flexible tubes and to keep the wafer sandwiched between the tubes, and to prevent the defective joining of the tubes.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a flexible tube aseptic joining apparatus of the present invention.

FIG. 2 is a perspective view showing a state where the aseptic joining apparatus shown in FIG. 1 is housed in a case.

FIG. 3 is a block diagram showing an example of an electric circuit used in the aseptic joining apparatus of the present invention.

FIG. 4 is a top view of one embodiment of the flexible tube aseptic joining device of the present invention.

FIG. 5 is a left side view showing an example of a cutting means used in the bonding apparatus of the present invention.

FIG. 6 is a right side view showing an example of a cutting means used in the joining device of the present invention.

FIG. 7 is a top view of the cutting means shown in FIGS. 5 and 6;

8 is a front view of the cutting means shown in FIGS. 5 and 6. FIG.

9 is an end view taken along the line AA of FIG.

10 is a partial cross-sectional view of the cutting means taken along the line BB in FIG.

FIG. 11 is a top view of another example of the cutting means used in the bonding apparatus of the present invention.

FIG. 12 is a front view of another example of the cutting means used in the joining device of the present invention.

FIG. 13 is an explanatory view for explaining the action at the time of wafer exchange in the bonding apparatus of the present invention.

FIG. 14 is an explanatory diagram for explaining the operation of the cutting means.

FIG. 15 is an explanatory diagram for explaining the operations of the first clamp, the second clamp, and the cutting means.

FIG. 16 is an explanatory diagram for explaining the operation of the first clamp.

FIG. 17 is an explanatory diagram for explaining the operation of the cutting means.

FIG. 18 is a perspective view showing an example of first and second clamps used in the aseptic joining apparatus of the present invention.

FIG. 19 is a timing chart showing operation timings of the first clamp, the second clamp and the cutting means.

FIG. 20 is a flow chart for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 21 is a flow chart for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 22 is a flow chart for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 23 is an explanatory diagram for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 24 is an explanatory view for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 25 is an explanatory view for explaining the action of the aseptic joining apparatus of the present invention.

FIG. 26 is an explanatory view for explaining the operation of the aseptic joining apparatus of the present invention.

FIG. 27 is a perspective view showing a conventional aseptic joining device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Aseptic bonding apparatus 2 2nd clamp 3 1st clamp 5 Cutting means 6 Wafer 7 Wafer temperature detection means 9 Electric connection terminal for wafer heating 13 Micro switch 1 14 Micro switch 2 15 Micro switch 3 40 Controller 41 Rectification power supply circuit 42 motor 43 constant voltage source 44 wafer heating control means 50 input panel 60 lower member 60a fixing portion 61 wafer lower side surface holding member 62 wafer rear upper movement preventing member 63 wafer front upper movement preventing portion 64 temperature detecting means holding member 65 fixing portion 67 Wafer side holding member 67a Wafer front side holding portion 67b Wafer rear side holding portion 69 Standby wafer 74 Insulating member 76 Metal plate

[Procedure amendment]

[Submission date] October 22, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] Figure 8

[Correction method] Change

[Correction content]

[Figure 8]

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Correction target item name] Figure 9

[Correction method] Change

[Correction content]

[Figure 9]

Claims (1)

[Claims] 1. A device for aseptically joining flexible tubes, the device comprising a first clamp and a second clamp for holding at least two flexible tubes in parallel.
The clamp, the cutting means for cutting the flexible tube between the first clamp and the second clamp, and the joined ends of the flexible tube cut by the cutting means are in close contact with each other. Moving means for moving at least one of the first clamp or the second clamp,
A cutting means driving means for moving the cutting means up and down between the first clamp and the second clamp, wherein the cutting means is a thin wafer for melt cutting the flexible tube; A flexible tube aseptic bonding apparatus, comprising: a wafer holding portion that holds the wafer in a replaceable manner, and a wafer movement preventing portion that is located in front of and above the wafer held by the wafer holding portion.