JP3335456B2 - Method for fusing thermoplastic resin moldings - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fusing thermoplastic resin moldings. More specifically, the present invention relates to a method of fusing by heating and melting by microwave using a specific method.

[0002]

2. Description of the Related Art A method of assembling a resin molded product and bonding it to form a complicated molded product has been widely adopted. In the case where there is no effective adhesive such as polyolefin, or in the case where reliability is required, a method of heat fusion is adopted.

[0003]

SUMMARY OF THE INVENTION The method of heat fusion is as follows.
The reliability is high because the bonding surface is melted and bonded, but if only the bonding surface is melted, it is difficult to mold the molded product, such as burying a metal near the bonded part and performing dielectric heating. The equipment is also expensive.

[0004]

Means for Solving the Problems The inventors of the present invention have solved the above-mentioned problems and have intensively studied a method which can be easily heated and fused to complete the present invention.

That is, the present invention relates to a method for heat-sealing a thermoplastic resin molded article, wherein a polymer of a five-membered heterocyclic compound obtained by polymerization using a catalyst in which an oxidizing agent is supported on an inorganic compound is welded. This is a method for fusing a thermoplastic resin molded article, which comprises contacting a mixture of a fused or polyaniline and a thermoplastic resin and irradiating a microwave.

In the present invention, the thermoplastic resin forming the thermoplastic resin molded product is not particularly limited, and may be a polymer having any structure as long as it can be heated and melt-molded. Specifically, polyolefins such as polyethylene, polypropylene, or copolymers of ethylene and propylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polymethyl methacrylate, and copolymers of styrene, vinyl chloride, methyl methacrylate, vinylidene chloride, etc. Any material such as polymers, polycarbonates, polyamides, polyesters, polyimides, and other condensed engineering plastics may be used.

[0007] The shape and molding method of the thermoplastic resin molded product are not particularly limited as is clear from the gist of the present invention.

In the present invention, as a catalyst used for synthesizing a polymer of a five-membered heterocyclic compound or polyaniline, a catalyst obtained by supporting an oxidizing agent on an inorganic compound is used. Here, as the inorganic compound, various compounds used as a filler of the thermoplastic resin can be used, such as metal salts, oxides, nitrides, and carbides, and more specifically, talc, kaolin, mica, calcium carbonate,
Examples include calcium silicate, calcium sulfate, barium sulfate, barium titanate and the like.

Examples of the oxidizing agent include salts of persulfuric acid such as ferric chloride and ammonium persulfate, aqueous hydrogen peroxide, tungsten chloride, antimony chloride, and arsenic pentafluoride.

The method for supporting the oxidizing agent on the inorganic compound can be obtained by treating the inorganic compound with the oxidizing agent, and specifically, by co-milling or contact-treating the inorganic compound with a solution of the oxidizing agent. can get. It can also be carried out simultaneously with polymerization by co-milling with a 5-membered heterocyclic compound or aniline. Finer powder can be obtained by co-grinding with a 5-membered heterocyclic compound or aniline, and mixing with a thermoplastic resin described later is easy.

[0011] Further, as the heterocyclic compound which is a raw material of the polymer of the heterocyclic compound, pyrrole, thiophene, or hydrogen at the 3-position and / or 5-position may have 3 to 20 carbon atoms.
The aniline as a raw material of polyaniline is exemplified by aniline in which an amino group or hydrogen of a benzene ring is substituted by an alkyl group.

The ratio of the inorganic compound, oxidizing agent, five-membered heterocyclic compound or aniline is 1: 0.001-1:
0.001 to 5 (weight ratio).

The polymerization of the five-membered heterocyclic compound or aniline can be carried out by contacting a catalyst in which an oxidizing agent is supported on an inorganic compound with the five-membered heterocyclic compound or aniline at -100 ° C to 100 ° C. . Further, the reaction can be performed in a solid phase, a liquid phase, or a gas phase.

It is more effective to further dope a dopant. Here, as the dopant, halides such as iodine, bromine, chlorine and iodine trichloride, protic acids such as sulfuric acid, persulfuric acid, nitric acid, perchloric acid, and borohydrofluoric acid;
Lewis acids such as aluminum chloride, iron chloride, molybdenum chloride, tungsten chloride, antimony chloride, arsenic pentafluoride, sulfur trioxide, nitrosyl hexafluoroantimonate, nitrosyl hexafluoroarsenate, nitrosyl hexafluoromethanesulfonate, hexafluoroantimonate Examples thereof include nitroyl, lithium salt, sodium salt, potassium salt, rubidium salt, cesium salt, and tetraalkylammonium salt. The contact with the dopant can be performed simultaneously with the mixing with the thermoplastic resin described below.

The thus obtained polymer of a five-membered heterocyclic compound or polyaniline is mixed with a thermoplastic resin.
Although there is no particular limitation on the thermoplastic resin, it is also possible to select the same resin that forms the thermoplastic resin molded article to be fused. Specifically, polyvinyl alcohol, polyvinyl acetate, polyolefin, polystyrene,
Examples thereof include polyvinyl chloride, polymethyl methacrylate, polycarbonate, polyester, polyamide, and polyimide. It is of course possible to use other resins and thermosetting resins, and examples of such resins include polyimide, epoxy resin, phenol resin, and polycarbodiimide. The ratio of the polymer of the five-membered heterocyclic compound or polyaniline to the thermoplastic resin is about 1: 0.01 to 2 (weight ratio).

The mixing method is not particularly limited, and mixing can be performed with a Henschel mixer, an extruder, a Brabender, or the like.

In the case where the molded product to be fused is thin, the mixture obtained in this way is brought into contact with the mixture formed into a film or sheet on the side opposite to the bonding surface, and another molding is performed to fuse the other surface. If the adhesive surface is thick, a thin film of the same material as the resin to be fused is placed on the adhesive surface if the mixture formed into a film or sheet is in contact with the adhesive surface. By contacting with another molded product to be fused, preparation for fusion can be performed. Alternatively, the above mixture can be formed and introduced into the surface to be fused by the deformed shape.

In the present invention, the molded product is irradiated with microwaves. At the time of irradiation, it is preferable that when the resin is melted by pressing the bonding portion, the resin is sufficiently fused.
As a microwave, it can be sufficiently fused with a wavelength and energy that are commercially available as a household microwave oven,
Microwaves with frequencies of several gigahertz are available and several KW
Energy of about / 1 kg is sufficient. A small molded product can be fused by placing it in a commercially available microwave oven and irradiating it with microwaves for several seconds to several minutes.

[0019]

The present invention will be further described with reference to examples.

Example 1 30 g of talc and 6 g of ferric chloride were co-ground, and then 10 ml of pyrrole was added and co-ground. 100 g of polypyrrole obtained by repeating the same operation and polyethylene 3
The pellets were obtained by mixing 00 g with an extruder. The pellet was press-molded to obtain a film having a thickness of 30 μm. This film was 5 mm in width and 10 cm in length, and two polystyrene sheets (10 cm × 10 cm × 1 mm) were stacked on top of each other, and then one polystyrene sheet was placed. Use a microwave (Toshiba Toshiba Microwave E
RT-540F) and irradiated with microwaves for 1 minute while pressing with 100 g of glass. When the sheet was taken out and bent, the adhesive surface did not peel off and broke in other parts.

Example 2 The same procedure as in Example 1 was carried out except that the film obtained in Example 1 was used and a commercially available polyethylene sheet was used as the sheet (however, microwave irradiation was performed for 2 minutes). The sheet was bent without peeling off the surface.

Comparative Example 1 The polypyrrole obtained in Example 1 was used as it was, and sandwiched between two polystyrene sheets (10 cm × 10 cm × 1 mm) so as to have a thickness of about 200 μm. Irradiation caused sparks at the polypyrrole and holes in the polystyrene.

[0023]

By carrying out the method of the present invention, a resin molded product can be easily bonded, which is extremely valuable industrially.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B29C 65/00-65/82

Claims (2)

(57) [Claims] 1. A method for heat-fusing a thermoplastic resin molded product, wherein a polymer of a five-membered heterocyclic compound or polyaniline obtained by polymerization using a catalyst in which an oxidizing agent is supported on an inorganic compound in a fusion zone. , And a mixture of a thermoplastic resin and a microwave. 2. The fusion method according to claim 1, wherein microwaves are irradiated after doping the dopant.