JP3333937B2 - Parallel board connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for a parallel board for connecting a plurality of circuit boards in parallel in their thickness direction.

[0002]

2. Description of the Related Art As shown in FIG. 8, a conventional parallel board connector 11 for connecting two circuit boards 8 and 9 in parallel in their thickness direction a generally comprises a pin connector 1.
3 and a socket connector 15.

The pin connector 13 includes a box-shaped pin-side insulator 131 and a through-hole 8 of the first circuit board 8.
a or a pad (not shown), and a pin contact 132 implanted in a pin-side insulator 131. The terminal portion 132a of the pin contact 132 is
The circuit board 8 is mounted on the first circuit board 8 by soldering to the through holes 8a or pads.

The socket connector 15 has a box-shaped socket insulator 151 fitted into the pin insulator 131 and a socket insulator 151 corresponding to a through hole 9a or a pad (not shown) of the second circuit board 9. And a terminal portion 152a of the socket contact 152.
Is soldered to a through hole 9 a or a pad (not shown) of the second circuit board 9 to be mounted on the second circuit board 9.

A printed circuit board socket disclosed in Japanese Utility Model Laid-Open Publication No. 4-38689 has a function similar to that of the conventional parallel board connector. This socket is composed of a cylindrical conductive base and grips respectively incorporated at both ends of the conductive base. By inserting plug pins provided on the printed board into the grips, the socket is mounted on the printed circuit board. Are connected to each other in the thickness direction.

[0006]

In the case of a conventional connector for a parallel substrate, since an insulator is arranged between circuit boards, it is necessary to secure a wide space, which makes it difficult to reduce the size of electronic equipment. In addition, the number of parts is large, and it takes time to assemble the connector, leading to an increase in cost. Also, when it comes to a multi-core parallel board connector,
It is very difficult to align the connectors, and it is necessary to provide a floating mechanism to avoid unfitting, which has led to an increase in cost.

On the other hand, a conventional printed circuit board socket is
Since there is no insulator, the space between the printed boards is not widened unlike the conventional parallel board connector. However, in the case of the conventional printed circuit board socket, the socket is not held by the insulator like the connector for the parallel board, and is directly fixed to the printed circuit board. As a result, a gap is generated between the socket provided on the printed circuit board and the plug pin provided on the mating printed circuit board. Also, there is a risk of damaging the printed circuit board.

It is therefore an object of the present invention to provide a connector for a parallel board which can prevent a gap between circuit boards from being widened and can absorb a shift between circuit boards.

It is another object of the present invention to provide a connector for a parallel board which can reduce mismatching of characteristic impedance due to a narrow interval between boards and suppress deterioration of a transmission waveform.

[0010]

According to the first aspect of the present invention, there is provided a connector for a parallel board for connecting circuit boards in parallel with each other in a thickness direction thereof, wherein one pin contact assembly and one set of sockets are provided. A contact assembly, wherein the pin contact assembly includes a pin-side insulator and a pin contact, and the pin-side insulator has a plate-like shape, and is provided with a pin-side hole corresponding to a through hole of the circuit board. A pin-side press-fitting portion having a press-fitting hole, the pin contact being made of a conductive material, and a pin-side press-fitting portion press-fitted into the pin-side press-fitting hole; A contact portion, wherein each of the socket contact assemblies includes a socket-side insulator and a socket contact. The socket-side insulator has a flat plate shape, is drilled to face the through-hole, and has an insertion hole through which the pin-side contact portion is inserted, and a socket side drilled adjacent to the insertion hole. A press-fitting hole, wherein the socket contact is made of a material having conductivity and elasticity, and a socket-side press-fitting portion press-fitted into the socket-side press-fitting hole; and a socket inserted into the through-hole and electrically connected to the through-hole. A connecting portion that is connected to the pin-side contact portion and is inserted into the through-hole, the pin-side contact portion is inserted so that the pin-side contact portion is inserted, and the pin-side contact portion is sandwiched. A socket-side contact portion that contacts the socket-side press-fit portion and the connection portion, and a first for allowing a displacement between the insertion hole and the through-hole. A shift absorbing portion, and a second shift absorbing portion for connecting the connecting portion and the socket side contact portion and for allowing a shift between the pin side contact portion and the socket side contact portion. Thus, a connector for a parallel substrate is obtained.

According to the second aspect of the present invention, the socket-side contact portion is in contact with the pin-side contact portion so as to be in contact with the plurality of spring pieces. 2. A connector for a parallel substrate according to claim 1, comprising a ring-shaped portion through which the portion is inserted.

According to the third aspect of the present invention, there is provided the parallel substrate connector according to the first or second aspect, wherein a circuit board is used as the pin-side insulator.

[0013]

Next, an embodiment of the present invention will be described. 1A and 1B show a use state of a connector for a parallel substrate according to an embodiment of the present invention, wherein FIG.
3A is a cross-sectional view taken along line AA shown in FIG. 3A, FIG. 3C is a cross-sectional view taken along line BB shown in FIG. 3A, and a C region in FIG. Only area D shows a state where the socket contact assembly is inserted into the second circuit board, and area E shows a state where the pin contact assembly is further inserted into the first circuit board. FIG. 2 is a perspective view of a pin contact assembly of the parallel substrate connector shown in FIG. 1, and FIG. 3 is an exploded perspective view of the pin contact assembly. FIG. 4 is a perspective view of the socket contact assembly of the connector for a parallel substrate shown in FIG.
FIG. 2 is an exploded perspective view of the socket contact assembly. FIG. 6 is a perspective view of the pin contact shown in FIG.
7A and 7B show the socket contact shown in FIG. 1, wherein FIG. 7A is a side view and FIG. 7B is a perspective view.

Referring to FIGS. 1 to 7, a connector 1 for a parallel substrate according to this embodiment includes a first printed circuit board (circuit board) 8 and a second printed circuit board (circuit board) 9 connected to each other. Are connected in parallel in the thickness direction a.
One pin contact assembly 3 and two socket contact assemblies 5 are provided.

As apparent from FIGS. 2 and 3, the pin contact assembly 3 has a pin-side insulator 31.
And a pin contact 32.

The pin-side insulator 31 is a flat plate and has a pin-side press-fit hole 31a. The pin-side press-fit holes 31a are formed corresponding to the through holes 8a, 9a provided in the first and second printed circuit boards 8, 9, respectively. Incidentally, the through hole 8a of the first printed board 8 and the through hole 9a of the second printed board 9
Are provided so as to be opposed to each other in the thickness direction a, and these through holes 8a, 9a
Each is electrically connected to a conductor pattern (not shown) formed on the first and second printed circuit boards 8 and 9.

As is apparent from FIG. 6, the pin contact 32 has a substantially waiting shape, is made of a material having conductivity and elasticity, and has a pin-side press-fit portion 32a and a pin-side contact portion 32b integrally. . The pin-side press-fit portion 32a has a plate shape and is press-fitted into the pin-side press-fit hole 31a of the pin-side insulator 31. Thereby, the pin contact 32 is fixed to the pin-side insulator 31. Pin side contact part 3
Reference numeral 2b denotes a pin, which is connected to the pin-side press-fitting portion 32a. As is clear from FIG. 1, the connection holes 2b pass through the through holes 8a, 9a of the first and second printed circuit boards 8, 9 at the time of connection. Made up of

Each socket contact assembly 5 includes:
As is clear from FIGS. 4 and 5, the socket-side insulator 51 includes a socket contact 52.

The socket-side insulator 51 has a flat plate shape, and has an insertion hole 51a and a socket-side press-fit hole 51b. The insertion hole 51a is formed so as to face the through holes 8a, 9a of the first and second printed circuit boards 8, 9, and allows the pin-side contact portion 32b of the pin contact 32 to be inserted. The socket-side press-fitting hole 51b has a slit shape and is formed adjacent to the insertion hole 51a.

The socket contact 52 is made of a material having conductivity and elasticity. As is apparent from FIG. 7, the socket-side press-fit portion 52a, the connection portion 52b, the socket-side contact portion 52c, and the first displacement absorbing portion 52d and the second displacement absorbing portion 52e are integrally provided.

The socket side press-fit portion 52a is plate-shaped,
Socket-side press-fit hole 51 of socket-side insulator 51
b. Thereby, the socket contact 5
2 is fixed to the socket-side insulator 51.

The connecting portion 52b has a cylindrical shape with a part of the side surface opened, is elastically deformable in the radial direction, is inserted into the through hole 8a or 9a, and is electrically connected to the through hole 8a or 9a. In this state, the pin-side contact portion 32b of the pin contact 32 is inserted.

The socket side contact portion 52c has a substantially nozzle shape and is inserted into the through hole 8a or 9a. In this state, the pin side contact portion 32b of the pin contact 32 is inserted and the pin side contact portion 32b is inserted. The pin-side contact portion 32b is brought into contact with the pin-side contact portion 32b so as to be conducted. In the case of the present embodiment, the socket-side contact portion 52c includes three spring pieces 52c 'and a ring-shaped portion 52c ". The three spring pieces 52c' correspond to the pin-side contact portion 32b of the pin contact 32. Ring-shaped portion 52
c ″ is a cylindrical shape with a part of the side surface opened, connecting the three spring pieces 52 c ′ to each other, and
Of the pin-side contact portion 32b. As described above, in the present embodiment, since the socket-side contact portion 52c has three spring pieces 52c ', the pin-side contact portion 32b of the pin contact 32 is inserted into the socket-side contact portion 52c when the pin is inserted. The displacement of the side contact portion 32b is corrected by the spring piece 52c '.

In the present embodiment, the number of the spring pieces 52c 'is three, but the number of the spring pieces may be two or four or more, and the number of the spring pieces is not particularly limited.

The first displacement absorbing portion 52d is elastically deformable, connects the socket side press-fitting portion 52a and the connecting portion 52b, and inserts the insertion hole 5 of the socket side insulator 51.
This is to allow a deviation between 1a and the through hole 8a or 9a.

The second displacement absorbing portion 52e is elastically deformable, connects the connecting portion 52b and the socket-side contact portion 52c, and connects the pin contact 32 with the pin-side contact portion 32b.
Is to allow a displacement between the pin-side contact portion 32b and the socket-side contact portion 52c in a state where the pin-side contact portion 52c is inserted into the socket-side contact portion 52c.

In use, first, the connection portion 52b of the socket contact 52 and the socket-side contact portion 52c are inserted into the through holes 8a of the first printed circuit board 8, and one of the socket contact assemblies 5 is first inserted. On the upper surface of the printed circuit board 8. As a result, the socket contact 52 is electrically connected to the through hole 8a through the connection portion 52b. Similarly, the other socket contact assembly 5 is arranged on the upper surface of the second printed circuit board 9. Thereby, the socket contact 52 is electrically connected to the through hole 9a through the connection portion 52b. Next, the first printed circuit board 8 on which the socket contact assembly 5 is mounted and the second printed circuit board 9 are superimposed, respectively.
The through hole 8a and the through hole 9a are arranged in a straight line. Lastly, the pin contact 32 of the pin contact assembly 3 is inserted into the through holes 8a and 9a through the insertion holes 5 of the one socket contact assembly 5 disposed on the first printed circuit board 8, and the one socket The pin contact assembly 3 is arranged on the upper surface of the contact assembly 5. Thereby, the socket contact 52 of the one socket contact assembly 5 and the socket contact 52 of the other socket contact assembly 5 conduct with each other through the contact portion 32b of the pin contact 32.
These pin contacts 32 and socket contacts 52
, The first printed board 8 and the second printed board 9 are electrically connected.

As described above, since only one socket contact assembly 5 is interposed between the first printed circuit board 8 and the second printed circuit board 9, the distance between the two printed circuit boards 8, 9 is increased. There is nothing. Further, the socket contact 52 is provided with the first and second shift absorbing portions 52.
Since these parts have d and 52e, it is possible to allow a deviation between the printed circuit boards 8 and 9 and a deviation between the pin contact 32 and the socket contact 52 due to manufacturing tolerance or the like in these portions.

In the present embodiment, two socket contact assemblies 5 constitute one set. However, the present invention is not limited to this, and three or more socket contact assemblies may be provided as one set. In this case, three or more circuit boards can be connected to each other with one parallel board connector.

It is also possible to use a circuit board as the pin-side insulator. That is, it is also possible to implant a pin contact directly on the circuit board and use it as a pin contact assembly. In this case, a large number of circuit boards can be efficiently connected.

[0031]

According to the connector for a parallel substrate of the present invention, the distance between the circuit boards is not widened, and the displacement between the circuit boards can be absorbed.

Further, according to the connector for a parallel substrate of the present invention, since the interval between the substrates is narrowed, the mismatch of the characteristic impedance is reduced, and the deterioration of the transmission waveform can be suppressed.

[Brief description of the drawings]

1A and 1B show a use state of a connector for a parallel substrate according to an embodiment of the present invention, wherein FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA shown in FIG. , (C) is (a)
FIG. 3 is a sectional view taken along line BB shown in FIG.

FIG. 2 is a perspective view of a pin contact assembly of the parallel substrate connector shown in FIG. 1;

FIG. 3 is an exploded perspective view of the pin contact assembly.

FIG. 4 is a perspective view of a socket contact assembly of the parallel substrate connector shown in FIG. 1;

FIG. 5 is an exploded perspective view of the socket contact assembly.

FIG. 6 is a perspective view of the pin contact shown in FIG. 1;

FIG. 7 shows the socket contact shown in FIG. 1,
(A) is a side view, (b) is a perspective view.

FIG. 8 is a longitudinal sectional view of an example of a conventional parallel substrate connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connector for parallel boards 3 Pin contact assembly 31 Pin side insulator 31a Pin side press-fitting hole 32 Pin contact 32a Pin side press-fitting part 32b Pin side contacting part 5 Socket contact assembly 51 Socket side insulator 51a Insertion hole 51b Socket side press-fitting hole 52 Socket contact 52a Socket-side press-fit portion 52b Connection portion 52c Socket-side contact portion 52c 'Spring piece 52c "Ring-shaped portion 52d First displacement absorbing portion 52e Second displacement absorbing portion

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI H01R 24/06 H01R 23 / 02F // H01R 107: 00 23/68 303C (56) References JP-A-11-149965 (JP) JP-A-8-330043 (JP, A) JP-A-6-163124 (JP, A) JP-A-5-174883 (JP, A) JP-A-3-182067 (JP, A) 59-141679 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 9/09 H01R 13/04 H01R 13/10 H01R 23/02 H01R 23/68 303 H01R 107: 00

Claims (3)

(57) [Claims] 1. A parallel board connector for connecting circuit boards to each other in a direction parallel to each other in a thickness direction thereof, the connector including one pin contact assembly and a set of socket contact assemblies, wherein the pin contact assembly has a pin side. An insulator and a pin contact are provided, wherein the pin-side insulator has a plate-like shape, and has a pin-side press-fit hole formed in correspondence with a through hole of the circuit board, and the pin contact has conductivity. Made of material having
A pin-side press-fitting portion press-fitted into the pin-side press-fitting hole, and a pin-side contact portion provided continuously with the pin-side press-fitting portion and penetrating the through hole, wherein each of the socket contact assemblies includes a socket-side insulator, A socket contact, wherein the socket-side insulator has a flat plate shape, is drilled so as to face the through-hole, and an insertion hole for inserting the pin-side contact portion, and is drilled adjacent to the insertion hole. A socket-side press-fitting hole, wherein the socket contact is made of a material having conductivity and elasticity, and a socket-side press-fitting portion that is press-fitted into the socket-side press-fitting hole; A connection portion electrically connected to the pin-side contact portion, and a connection portion inserted into the through-hole, The socket-side contact portion that contacts the pin-side contact portion so as to pinch the pin-side contact portion, and connects the socket-side press-fitting portion and the connection portion while allowing the insertion hole and the through hole to pass through. A first displacement absorbing portion for permitting a displacement between the connecting portion and the socket-side contact portion, and a displacement between the pin-side contact portion and the socket-side contact portion. And a second displacement absorbing portion. 2. A plurality of spring pieces in which the socket-side contact portion is in contact with the pin-side contact portion in a sandwiching manner, and a ring-shaped portion connecting these spring pieces and allowing the pin-side contact portion to pass therethrough. The connector for a parallel substrate according to claim 1, comprising: 3. The circuit board according to claim 1, wherein a circuit board is used as the pin-side insulator.
The connector for a parallel substrate as described in the above.