JP3332563B2 - Method of manufacturing ink jet recording head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a side type ink jet recording head having an ink discharge port for discharging ink provided above a substrate.

[0002]

2. Description of the Related Art A conventional on-demand type ink jet recording head using a heating resistor includes an edge type ink jet recording head having an ink discharge port formed at an end of a substrate as shown in FIG. Side-type inkjet recording head 2 in which ink ejection ports are formed above the substrate
Seeds are known.

The edge type ink jet recording head shown in FIG. 7 has an angle of approximately 90 degrees between the normal line of the wiring surface and the ink ejection direction. Since there is no dependency on the mounting method, there is an advantage that various methods such as wire bonding, TAB, and flip chip can be used as the method of electrical connection. However, this type of head requires a similar fine pattern to form a head that enables fine line drawing in order to line up the ink discharge nozzles. The more difficult it is, the more difficult it is.

[0004] Further, since the thermal ink jet type head has such a property that the shorter the distance between the heating resistor and the ink discharge port, the higher the viscosity of the ink can be discharged, it can be regarded as a fatal defect of the ink jet. It is difficult for the edge type head to find good results for printing, and cap the ink discharge port of the head.
At present, measures such as sucking out ink from the direction of the ink ejection port after leaving it for a long time are taken.

In the side type ink jet recording head shown in FIG. 8, since the ink discharge ports can be formed by photolithography, the positions of the ink discharge ports can be precisely adjusted regardless of the arrangement for fine printing or the staggered arrangement. There is an advantage that a head which can easily cope with a fine pattern can be easily formed even if the ejection openings are formed at twice the pitch of the fine pattern. Further, the distance between the ink discharge port and the heat generating resistor is determined by the thickness of the ink discharge port forming plate (orifice plate) and the thickness of the ink flow path forming resin, so that there is an advantage that ink can be discharged even with high viscosity ink. Have.

However, in this type of recording head, since the ink ejection direction and the normal line of the wiring surface are parallel, it is necessary to make the distance between the ink ejection port and the paper short enough to maintain print quality. It is necessary to mount and connect a low-height driving IC. For this purpose, TAB is usually used. This method has a problem that it is expensive and it is difficult to improve the reliability of the connection.

Further, since it is necessary to supply the ink from the back surface of the head, it is necessary to make a hole in the substrate, and it is difficult to change the ink supply speed (refill) with the accuracy. Further, there is a disadvantage that it is difficult to form a large head because a strength is insufficient when a large head is formed because a hole is formed in the substrate.

[0008]

At present, computers are becoming color and high-speed, and printers are required to be color, high-speed and high-definition as well as computer performance. However, the recording head provided in the above-mentioned conventional printer does not sufficiently satisfy these requirements.

Therefore, a bent type ink jet recording head in which a part of the side type ink jet recording head is bent as a modification of the side type ink jet recording head has been proposed. FIG.
FIG. 1 is a schematic diagram illustrating an example of a conventional bent-type inkjet recording head. In this method, a bendable material is used for the substrate, and the head is bent after patterning. This type of ink jet recording head can reduce the distance between the heater and the ejection port, so that the advantage of the side type head that non-ejection is relatively small even if printing is performed after long-term storage, and the plane having the ejection port And IC
By bending the substrate so that the plane on which it is mounted does not become the same plane, the height of the mounting portion can be set freely, so that the discharge port and the print target can be set regardless of the mounting method. Has the advantage that the distance between the two can be maintained properly.

However, the heat storage layer formed on the substrate and the protective film formed for preventing the heating resistor of the head from being oxidized have different elongation amounts on the front and back sides of the bent substrate, and the film is pulled. Since a peeling force is generated or the film cannot withstand the elongation itself, it cannot withstand the curvature and may cause peeling, cracking, or the like as shown in FIG.

The present invention has been made in view of the above-mentioned current situation of the head, and establishes a manufacturing method for supplying a side-type ink jet recording head capable of high speed, color, and high definition, and capable of miniaturizing the head mounting on a printer. The purpose is to:

[0012]

In order to achieve the above object, according to the present invention, an ink discharge port for discharging ink has a heating resistor, an external connection terminal, and an electrical connection between the heating resistor and the external connection terminal. In a method of manufacturing a bent type ink jet recording head provided above a substrate provided with wiring to be connected and having the substrate bent, a heat storage layer made of an organic resin is laminated on the substrate made of a metal material. A step of laminating a heating resistor layer and a wiring layer for forming the heating resistor and the wiring on the heat storage layer, a step of patterning the heating resistor and the wiring, And a step of bending a portion of the substrate on which the heat storage layer and the wiring layer are laminated, after performing the polishing.

The method of manufacturing an ink jet recording head according to the present invention further comprises a step of making a cut in the bottom of the substrate.
Using the notch to bend the substrate.

[0014]

[0015]

[0016]

[0017]

[0018]

Further, the method of manufacturing an ink jet recording head of the present invention includes that the substrate is made of at least one metal material selected from the group consisting of aluminum, aluminum alloy, iron, stainless steel and copper.

According to the method of manufacturing an ink jet recording head of the present invention, a metal protective film is formed on a patterned heating resistor and wiring, and the metal protective film of the substrate is formed when the substrate is bent. After bending the bent portion, at least insulating the metal protective film on the heating resistor.

Further, the method of manufacturing an ink jet recording head according to the present invention includes using an organic resin as a protective film of the wiring.

In the method of manufacturing an ink jet recording head according to the present invention, when the substrate is bent, a portion of the substrate on which the heating resistor layer is laminated is bent, and then a part of the heating resistor is anodized. Including doing.

[0023]

[0024]

Further, the method of manufacturing an ink jet recording head of the present invention includes bending a portion of the substrate where no ink flow path is formed.

According to the present invention, there is provided an ink jet recording head according to any one of the above, wherein an ink ejection port for ejecting ink toward a recording surface of a recording medium is provided; A recording device.

[0027]

According to the present invention, (1) a heating resistor which does not require a protective film is formed by using a substrate made of a bendable material; and (2) a protective film of the heating resistor is first formed of metal. (3) Use an organic resin that is unlikely to be cracked even when bent, as a protective film for wiring. (4) Form a protective film of wiring with metal to form a substrate. to insulate the metal protective film from by bending, by any method or some combination, to provide a bending type inkjet head that does not cause cracks or peeling the protective film and the heat storage layer of the heating resistor it can. The ink ejection port is provided substantially above the heating resistor provided on the substrate.

The ink jet recording head of the present invention is of a side type and has a substrate surface (hereinafter referred to as a heating resistor formation surface) and an external connection terminal formed at a position where a heating resistor is formed. (Hereinafter referred to as an external connection terminal forming surface) is a bent type ink jet recording head larger than at least 0 degrees. FIG. 10 is a schematic diagram illustrating the angle between the heating resistor formation surface and the external connection terminal formation surface. Where θ
Is the angle between the normal to the heating resistor formation surface 19 and the normal to the external connection terminal formation surface 20, and ２０ is the heating resistor formation surface 1
9 is the outer angle of the angle between the tangent line 9 and the tangent line to the external connection terminal forming surface 20. The substrate can be bent by making a cut in the bottom. As such a substrate material, a metal is suitable, and particularly, Al, an Al alloy, iron, stainless steel, copper, or the like is preferable.

In the present invention, the term "bend" has a broad meaning including a curve. As a method of bending the substrate,
There are a method in which the substrate is bent along a mold having a desired shape in advance and pressure is applied from the outside, and a method in which one end of the substrate is held and the other end is displaced in the bending direction. As such a substrate material, metal is suitable, and in particular, Al, Al alloy,
Iron, stainless steel, copper and the like are preferred.

As a material of the heat storage layer, a material which does not cause cracks or the like due to bending, particularly an organic resin is suitable, and for example, polyimide, polyamide, polyamideimide, polyetherimide, polyetheramide and the like can be used.

As a material of the heating resistor, TaAl, T
By using aAlPt, TaIr, TaPt, or the like, a heating resistor that does not require a protective film can be formed.

As wiring materials, Al, copper, gold, platinum,
What is necessary is just to use what is usually used for an ink jet recording head, such as a wiring material of a plurality of layers in which Al, TaAl or the like which can be anodized to tungsten is formed on the upper part.

Examples of the organic resin as the wiring protective film include polyimide, polyamide imide, polyether imide, and polyether amide.

Examples of a method for insulating the metal protective film or the heating resistor include an anodizing method (a barrier anodizing method and a porous anodizing method).

The present invention particularly provides an excellent effect in a recording head and a recording apparatus of an ink jet recording system in which flying droplets are formed by utilizing thermal energy to perform recording, among the ink jet recording systems.

The typical configuration and principle are described in, for example, US Pat. Nos. 4,723,129 and 4,740.
It is preferable to use the basic principle disclosed in the specification of Japanese Patent No. 796. This method can be applied to both the so-called on-demand type and continuous type. In particular, in the case of the on-demand type, liquid (ink)
By applying at least one drive signal corresponding to the recorded information and providing a rapid temperature rise exceeding nucleate boiling to an electrothermal transducer arranged corresponding to the sheet or liquid path in which This is advantageous in that heat energy is generated in the electrothermal transducer, thereby causing film boiling on the heat-acting surface of the recording head. As a result, bubbles in the liquid (ink) corresponding to this drive signal on a one-to-one basis can be advantageously formed. It is. By discharging the liquid (ink) through the discharge opening by the growth and contraction of the bubble, at least one droplet is formed. When the drive signal is formed into a pulse shape, the growth and shrinkage of the bubble are performed immediately and appropriately, so that the ejection of liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable.

As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. still,
US Patent No. 4 of the invention relating to the rate of temperature rise of the heat acting surface
If the conditions described in JP-A-313124 are employed, more excellent recording can be performed.

As the configuration of the recording head, in addition to the combination of the discharge port, the liquid path, and the electrothermal converter (linear liquid flow path or right-angle liquid flow path) as disclosed in the above-mentioned respective specifications, The present invention also includes a configuration using U.S. Pat. No. 4,558,333 and U.S. Pat. No. 4,459,600, which disclose a configuration in which a heat acting portion is arranged in a bending region.

In addition, JP-A-59-123670 discloses a configuration in which a common slit is used as a discharge portion of an electrothermal transducer for a plurality of electrothermal transducers, or absorbs pressure waves of thermal energy. The present invention is also effective as a configuration based on JP-A-59-138461, which discloses a configuration in which an opening corresponds to a discharge unit.

Further, as a full line type recording head having a length corresponding to the width of the maximum recording medium that can be recorded by the recording apparatus, the length is determined by a combination of a plurality of recording heads as disclosed in the above specification. The present invention can exhibit the above-mentioned effects more effectively, though it may be either a configuration that satisfies the above requirements or a configuration as a single recording head that is formed integrally.

In addition, the print head is exchangeable with a print head of a chip type, which can be electrically connected to the main body of the apparatus or supplied with ink from the main body of the apparatus, or is integrated with the print head itself. The present invention is also effective when a cartridge type recording head provided with an ink tank is used.

It is preferable to add recovery means for the printhead, preliminary auxiliary means, and the like provided as components of the printing apparatus of the present invention since the effects of the present invention can be further stabilized. If you list these specifically,
Capping means, cleaning means, pressurizing or suction means for the recording head, preheating means using an electrothermal transducer or a heating element different from this or a combination thereof, and a preliminary ejection mode for performing ejection different from recording Is also effective for performing stable recording.

Further, the recording mode of the recording apparatus is not limited to the mode for recording only the mainstream color such as black, and the recording head may be integrally formed or a plurality of recording heads may be combined. The present invention is also very effective for an apparatus provided with at least one of full-color or mixed-color.

In the above-described embodiments of the present invention, the description has been made using the liquid ink. However, an ink which solidifies at room temperature or below and which softens at room temperature or is a liquid, In general, in the inkjet method, the temperature of the ink itself is adjusted within a range of 30 ° C. or more and 70 ° C. or less to control the temperature so that the viscosity of the ink is in a stable ejection range. May be a liquid.

In addition, the temperature rise due to thermal energy can be positively prevented by using it as energy for changing the state of the ink from a solid state to a liquid state, or the ink can be left standing for the purpose of preventing the ink from evaporating. Ink that liquefies by applying the heat energy according to the recording signal or discharges as a liquid ink, or that already starts to solidify when it reaches the recording medium, etc. The use of an ink having a property of being liquefied for the first time by application of thermal energy, such as described above, is also applicable to the present invention. In such a case, the ink is disclosed in JP-A-54-56847 or JP-A-60-7126.
As described in Japanese Patent Publication No. 0, the liquid sheet or the solid substance may be held in the concave portion or through hole of the porous sheet and opposed to the electrothermal converter.
In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, as a form of the recording apparatus according to the present invention, in addition to those provided integrally or separately as an image output terminal of an information processing apparatus such as a word processor and a computer, a copying apparatus combined with a reader and the like, May take the form of a facsimile machine having a transmission / reception function.

[0047]

The present invention will be described below in detail with reference to examples.

Embodiment 1 FIG. 1 shows an embodiment according to the present invention. Flexible substrate 1
The heat storage layer 2 is made of polyimide which does not crack even if bent and can withstand high temperatures during printing. The above-mentioned polyimide was applied onto the substrate at a rotation speed of 50 Hz using a spin coater, and cured at 100 ° C. and 400 ° C. for 2 minutes and 2 hours. The film thickness after curing is 0.5 μm. After that, Ta / Ir is applied to the heating resistor with a thickness of 100 nm, and the wiring is provided with Al.
Was sputtered 500 nm each. Ta / Ir and Al were patterned by photolithography to form a heating resistor 3 and a wiring 4 (step (a) in the figure).
In order to form a nozzle, the flow path forming resist 6
50 μm was applied and dried. Next, an epoxy resin 7 for forming a liquid chamber and an ink flow path was poured (step (b) in the figure). This is cured to form an epoxy resin layer, and a Si-based resist 8 is applied thereon, dried and then exposed and developed.
An ink ejection port pattern was formed by dry etching of CF ₄ + O ₂ (step (c) in the figure). Si-based resist 8
After forming the ink discharge port 22 and the ink inflow port 23 by removing the flow path forming resist 6, the angle θ between the normal line of the heating resistor forming surface 19 and the normal line of the external connection terminal forming surface 20 is formed. Was bent at 60 ° (step (c) in the figure). The bending was performed by making a cut in the substrate and bending the portion. Unlike the conventional head, no inorganic film was used for the protective film and the heat storage layer of the heating resistor, and the heat storage layer was made of an organic resin. Therefore, even if the substrate was bent, no cracking or peeling occurred.

After bending the substrate, the external connection terminals 18
Was connected to a head driving IC. The external connection terminal is a portion that is not covered with the wiring protection film at the wiring end where the discharge port is not formed. The ink tank 21 was attached so as to cover the periphery of the ink inlet formed at the edge of the recording head so that the ink inside the ink tank 21 flows into the ink flow path from the ink inlet 23. FIG.
FIG. 1 is a sectional view showing an example of an ink jet recording head to which an ink tank is attached. Through the above steps, the ink jet recording head according to the present invention was completed.

Embodiment 2 FIG. 2 shows another embodiment according to the present invention. An Al substrate was used as the bendable substrate 1, and the heat storage layer 2 was made of polyimide which did not crack even when bent and could withstand high temperatures during printing. The above-mentioned polyimide was applied by a spin coater at a rotation speed of 50 Hz, and cured at 100 ° C. and 400 ° C. for 2 minutes and 2 hours. The film thickness after curing was 0.5 μm. After that, Ta / Ir is applied to the heating resistor with a thickness of 100 nm, and the wiring is provided with Al.
Was sputtered 500 nm each. Ta / Ir and Al were patterned by photolithography to form the heating resistor 3 and the wiring 4. Further, as a protective film 5 for the wiring, a polyimide was applied by 2-3 μm by spin coating (step (a) in the figure). The rotation speed during spin coating was 50 Hz. This polyimide is cured, and a flow path forming resist 6 is applied for 30 to 5 to form a nozzle.
0 μm was applied and dried. Next, an epoxy resin 7 for forming a liquid chamber and an ink flow path was poured (step (b) in the figure). In FIG. 2, (b ′) is a cross-sectional view of the XY cut surface of the head shown in the step (b) viewed from the direction of the arrow. This is cured to form a Si-based resist 8 on the epoxy resin.
After coating and drying, exposure and development were performed, and an ink discharge port pattern was formed by dry etching of CF ₄ + O ₂ (step (c) in the figure). In FIG. 2, (c ′) is a cross-sectional view of the XY cut surface of the head shown in step (c) as viewed from the direction of the arrow.
After removing the Si-based resist 8 and the flow path forming resist 6 to form the ink discharge ports 22 and the ink inflow ports 23,
Normal line of heating resistor forming surface 19 and external connection terminal forming surface 20
The substrate was bent in the same manner as in Example 1 so that the angle θ with respect to the normal was 60 ° (step (d) in the figure). Unlike the conventional head, no inorganic film was used for the protective film and the heat storage layer of the heating resistor, and the heat storage layer was made of an organic resin. Therefore, even if the substrate was bent, no cracking or peeling occurred.

After the substrate is bent, the external connection terminals 18
An IC for driving the head was connected in the same manner as in the first embodiment. The ink tank 21 was attached in the same manner as in Example 1. Through the above steps, the ink jet recording head according to the present invention was completed.

Embodiment 3 FIG. 3 shows another embodiment according to the present invention. Polyimide was applied as a heat storage layer 2 on a bendable substrate 1 by spin coating at 50 Hz. Curing was performed for 2 hours in an inert gas oven at 400 ° C., and Ta was sputtered as a heating resistor, and Al was sputtered as a wiring material. The film thicknesses are 100 nm and 500 nm, respectively. After patterning the heating resistor 3 and the wiring 4 by photolithography, Al was sputtered as a protective film 9 for the wiring 4 and the heating resistor 3. The thickness is 100 nm.

Since Al on the flow channel forming surface cannot be anodized once the flow channel has been formed, a portion to be a flow channel was first formed with a flow channel forming resist 6 (step (a) in the figure). This was immersed in an anodizing solution to oxidize the exposed portions. An epoxy resin 7 forming an ink flow path was allowed to flow as it was (step (b) in the figure), and a Si-based resist 8 was further applied. After curing at a temperature of about 80 ° C. to form a pattern for ink discharge ports with a Si-based resist 8,
Was dry-etched with CF ₄ + O ₂ gas to pattern the discharge port (step (c) in the figure). Si-based resist 8
For forming the flow path 6 used for forming the resist 6
Is removed by washing the ink discharge port 22 and the ink inlet port 23.
After forming, cut the substrate according to the size of the head,
Normal line of heating resistor forming surface 19 and external connection terminal forming surface 20
The substrate was bent so that the angle θ formed with the normal line was 60 ° (step (d) in the figure). Here, the anodized Al
Is located at a position on the substrate that is not affected by the bending, so that there is no major problem even if a crack occurs due to the bending. Since Al on the heating resistor remains a metal, peeling or cracking does not occur even when bent. After that, Al in a portion that was not anodized (corresponding to the ink flow path) was oxidized by anodization to be insulated. The ink tank 21 was attached to the recording head as in the first embodiment.

The external connection terminal 18 on which no insulating film was formed on the wiring was connected to a head driving IC (wire bonding) to complete an ink jet recording head according to the present invention.

Embodiment 4 FIG. 4 shows another embodiment of the present invention. Polyimide was applied as a heat storage layer 2 on a bendable substrate 1 by spin coating of 0.5 μm. The rotation is 50 Hz. 100
After condensation hardening by step curing at 400 ° C and 400 ° C,
Ta was used as the heat generating resistor, and Al was used as the wiring.
0 nm and 500 nm were sputtered. The wiring 4 and the heating resistor 3 were patterned by photolithography. A 2 to 3 μm layer of polyimide was applied and cured as a protective film 5 for the wiring, avoiding the heating resistor portion (step (a) in the figure). Thereafter, a photocurable epoxy resin 15 was applied to the substrate, the ink flow path pattern was exposed, and an epoxy resin 7 for blocking the flow path without developing was applied (step (b) in the figure). The upper epoxy 7 was temporarily cured to form an ink ejection port pattern (step (c) in the figure). After the epoxy exposed to the ink flow path pattern is washed out from the discharge port and fully cured to form the ink discharge port 22 and the ink inlet 23, the normal of the heating resistor forming surface 19 and the external connection terminal forming surface 20 are formed. The substrate was bent so that the angle θ formed with the normal line was 60 °.
The substrate was placed in an anodic oxidizing solution, and an electrode connecting the whole was previously used as an anode, and a platinum electrode was used as a cathode to anodize the portion where the heating resistor was exposed (step (d) in the figure).

The ink tank 21 was mounted in the same manner as in the first embodiment, and an IC for driving each heating resistor was wire-bonded to the external connection terminal 18 which was not anodized to complete the ink jet recording head according to the present invention. .

Reference Example FIG. 5 shows a reference example related to the present invention. Polyimide was applied as a heat storage layer 2 on a bendable substrate 1 by spin coating at 50 Hz. Curing was performed for 2 hours in an inert gas oven at 400 ° C., and Ta was sputtered as a heating resistor, and Al was sputtered as a wiring material. The film thickness is 100
nm and 500 nm. After patterning the heating resistor 3 and the wiring 4 by photolithography, Al was sputtered as a protective film 17 between the wiring and the heating resistor. The thickness is 100 nm.

The substrate on which Al was formed over the entire surface was immersed in an anodic oxidizing solution to anodic oxidize the entire surface of the remaining wiring portion except for the wiring portion serving as an external connection terminal. At this time, it is necessary to determine the voltage so as to oxidize the entire Al film thickness (100 nm in this case). This time it was 100V. Further, when the substrate is bent in the next step, the Al
A protective film 16 made of an organic resin is further laminated on the wiring in case a crack occurs in the oxide film. In this case, the polyimide was applied in a thickness of 2 to 3 μm (step (a) in the figure). Next, a portion to be a flow path was formed with a flow path forming resist 6. An epoxy resin 7 forming an ink flow path was allowed to flow as it was (step (b) in the figure), and a Si-based resist 8 was further applied. Cured at a temperature of about 80 ° C,
After forming a pattern for the ink discharge port with a resist, the epoxy resin 7 was dry-etched with CF ₄ + O ₂ gas to form a pattern for the discharge port (step (c) in the figure). After peeling off the Si-based resist 8 and washing and removing the flow path forming resist 6 previously used to form the ink discharge ports 22 and the ink inflow ports 23, the substrate is removed according to the size of the head. The substrate was cut, and the substrate was bent so as to draw a large arc while keeping the vicinity of the heating resistor flat (step (d) in the figure). As the bending method, the heating resistor forming surface 1
9 between the normal to the external connection terminal forming surface 20 and the normal to the external connection terminal forming surface 20
The substrate was placed on a mold that had been previously deformed so that the angle was 60 °, and was gradually deformed by applying pressure from a direction opposite to the mold.

Here, the previously anodized Al is present on the entire surface of the substrate, but particularly important heat generating resistor portions are flat, so that no cracks are generated. As described above, there is no problem because the organic protective film is provided thereon.

The ink tank 21 is attached in the same manner as in the first embodiment, and the external connection terminal 1 having no insulating film on the wiring is formed.
8 and a head driving IC were connected (wire bonding) to complete an ink jet recording head according to the present invention.

Embodiment 5 FIG. 6 shows another embodiment according to the present invention. Polyimide was applied as a heat storage layer 2 on a bendable substrate 1 by spin coating at 50 Hz. Curing was performed for 2 hours in an inert gas oven at 400 ° C., and Ta was sputtered as a heating resistor, and Al was sputtered as a wiring material. The film thickness is 100n
m and 500 nm. After patterning the heating resistor 3 and the wiring 4 by photolithography, the wiring 4
Then, Al was sputtered as a protective film 17 of the heating resistor 3. The thickness is 100 nm.

The substrate on which Al was formed over the entire surface was immersed in an anodic oxidizing solution to anodic oxidize the entire surface of the remaining wiring portion except for the wiring portion serving as an external connection terminal. At this time, it is necessary to determine the voltage so as to completely oxidize the Al film thickness (100 nm in this case). This time it was 100V. Further, when the substrate is bent in the next step, a protective film 16 made of an organic resin is further superimposed on the wiring in case a crack occurs in the Al oxide film serving as a protective film on the wiring. In this case, the polyimide was applied in a thickness of 2 to 3 μm (step (a) in the figure). Next, a portion to be a flow path was formed with a flow path forming resist 6. An epoxy resin 7 forming an ink flow path was allowed to flow as it was (step (b) in the figure), and a Si-based resist 8 was further applied. After curing at a temperature of about 80 ° C. to form a pattern for the ink discharge port with a Si-based resist 8, the epoxy resin 7 was etched with CF ₄ + O ₂ gas to form a pattern for the discharge port (step (FIG. c)). The Si-based resist 8 is peeled off, and the flow path forming resist 6 used earlier is formed.
Is removed by washing the ink discharge port 22 and the ink inlet port 23.
Is formed, the substrate is cut in accordance with the size of the head, and the normal line of the heating resistor forming surface 19 and the normal line of the heating resistor forming surface 19 are maintained while the vicinity of the heating resistor and the surface on which the ink flow path is formed are flat. The substrate was bent such that the angle θ between the external connection terminal forming surface 20 and the normal line was 60 ° (step (d) in the figure).

Here, the previously anodized Al is present on the entire surface of the substrate. However, since the particularly important heating resistor portion and the ink flow path are flat, no crack is generated. Even if it occurred, there was no problem because the organic protective film was present thereon as described above.

The ink tank 21 is mounted in the same manner as in the first embodiment, and the external connection terminal 1 having no insulating film on the wiring is formed.
8 and a head driving IC were connected (wire bonding) to complete an ink jet recording head according to the present invention.

[0065]

According to the present invention, it is possible to provide a side-type and bent-type head in which a protective film or a heat storage layer of a heating resistor does not crack or peel off in a manufacturing process thereof. The present invention has an effect that a compact and highly reliable head can be provided.

Further, since it is not necessary to make a hole in the substrate for supplying the ink, it is possible to solve the problem of the prior art that the speed of the ink supply changes depending on the accuracy of making the hole. Further, since it is not necessary to make a hole in the substrate for supplying the ink, the problems of the prior art, such as insufficient strength, are solved, which is advantageous for forming a large head.

[Brief description of the drawings]

FIG. 1 is a process chart showing an example of a manufacturing process of an ink jet recording head according to the present invention.

FIG. 2 is a process chart showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 3 is a process chart showing another example of the manufacturing process of the ink jet recording head according to the present invention.

FIG. 4 is a process chart showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 5 is a process chart showing a reference example of a manufacturing process of an ink jet recording head related to the present invention.

FIG. 6 is a process chart showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 7 is a schematic cross-sectional view illustrating an example of a conventional edge type inkjet recording head.

FIG. 8 is a schematic sectional view showing an example of a conventional side-type inkjet recording head.

FIG. 9 is a schematic sectional view showing an example of a conventional bent-type inkjet recording head.

FIG. 10 is a schematic diagram illustrating an angle between a heating resistor formation surface and an external connection terminal formation surface.

FIG. 11 is a schematic diagram illustrating an example of an ink jet recording head to which an ink tank is attached.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Heat storage layer 3 Heating resistor 4 Wiring 5 Wiring protective film 6 Flow path forming resist 7 Epoxy resin 8 Si-based resist 9 Al (heating resistor protective film) 10 Anodized film 11 Anodized film 12 Flow path and liquid Chamber 13 Ink supply port 14 Ink droplet 15 Photocurable epoxy resin 16 Organic protective film 17 Heating resistor and wiring protection film 18 External connection terminal 19 Heating resistor formation surface 20 External connection terminal formation surface 21 Ink tank 22 Ink ejection port 23 Ink inlet

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-204346 (JP, A) JP-A-5-338174 (JP, A) JP-A-2-76744 (JP, A) JP-A-6-204 8445 (JP, A) JP-A-2-227254 (JP, A) JP-A-60-157772 (JP, A) JP-A-6-15811 (JP, A) (58) Fields investigated (Int. ⁷ , DB name) B41J 2/05 B41J 2/16

Claims (7)

(57) [Claims] An ink ejection port for ejecting ink is provided above a substrate on which a heating resistor, an external connection terminal, and a wiring for electrically connecting the heating resistor and the external connection terminal are provided. A method of manufacturing a bent type ink jet recording head in which the substrate is bent, a step of laminating a heat storage layer made of an organic resin on the substrate made of a metal material, and forming the heating resistor on the heat storage layer and A step of laminating a heating resistor layer and a wiring layer for forming the wiring, a step of patterning the heating resistor and the wiring, and after the patterning, the heat storage layer and the wiring of the substrate. A method for manufacturing an ink jet recording head, comprising a step of bending a portion where a wiring layer is laminated. 2. A step of making a cut at the bottom of the substrate, and a step of bending the substrate using the cut.
The method for manufacturing an ink jet recording head according to claim 1, comprising: 3. The method according to claim 1, wherein the substrate is made of at least one metal material selected from the group consisting of aluminum, an aluminum alloy, iron, stainless steel, and copper. 4. A metal protective film is formed on the patterned heating resistor and wiring, and after bending the substrate, a portion of the substrate on which the metal protective film is formed is bent.
3. The method according to claim 1, wherein at least a metal protective film on the heating resistor is insulated. 5. The method according to claim 1, wherein an organic resin is used as the protective film for the wiring. 6. The ink jet recording head according to claim 5, wherein when the substrate is bent, a part of the substrate on which the heating resistor layer is laminated is bent, and then a part of the heating resistor is anodized. Manufacturing method. 7. The method according to claim 1, wherein a portion of the substrate where the ink flow path is not formed is bent.