JP3316731B2 - Multilayer ceramic electronic components - Google Patents

Multilayer ceramic electronic components

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Publication number
JP3316731B2
JP3316731B2 JP2205596A JP2205596A JP3316731B2 JP 3316731 B2 JP3316731 B2 JP 3316731B2 JP 2205596 A JP2205596 A JP 2205596A JP 2205596 A JP2205596 A JP 2205596A JP 3316731 B2 JP3316731 B2 JP 3316731B2
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JP
Japan
Prior art keywords
electrodes
electrode
multilayer ceramic
internal
dummy
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2205596A
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Japanese (ja)
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JPH09190946A (en
Inventor
勝己 加藤
政樹 高木
Original Assignee
株式会社村田製作所
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Priority to JP2205596A priority Critical patent/JP3316731B2/en
Publication of JPH09190946A publication Critical patent/JPH09190946A/en
Application granted granted Critical
Publication of JP3316731B2 publication Critical patent/JP3316731B2/en
Anticipated expiration legal-status Critical
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer ceramic electronic component, and more particularly, to a multilayer ceramic electronic component in which an internal electrode and a dummy electrode are provided in a ceramic.

[0002]

2. Description of the Related Art For example, a multilayer ceramic capacitor, which is one of typical multilayer ceramic electronic components, has a plurality of internal electrodes 2 in a ceramic 1 as shown in FIG. It is formed by disposing external electrodes 4 that are electrically connected to the internal electrodes 2 on both ends of the element (multilayer capacitor element) 3 formed by disposing.

In the case of a multilayer ceramic electronic component having a structure as shown in FIG. 4, an electrode lead-out portion A in which the internal electrodes 2 are led out to the opposite end surfaces of the element 3 one by one.
Is smaller than the portion B where the internal electrodes 2 overlap, by the thickness of the internal electrode × 0.5N (N = the number of layers). When the number of layers becomes 50 or more, the laminated block is pressed. When the internal electrode 2 is bent due to distortion,
There is a problem in that delamination occurs when the laminated block is cut or after firing, and the life of the product is shortened.

In order to reduce such distortion,
As shown in FIG. 5, a multilayer ceramic electronic component in which dummy electrodes 5 are disposed on upper and lower outer sheets has been proposed. However, when the number of internal electrodes 2 is increased, the number of dummy electrodes 5 is increased. In fact, it is not always possible to sufficiently address the above problems.

As shown in FIG. 6, a multilayer ceramic electronic component in which a dummy electrode 5 which does not contribute to the formation of a capacitance on the same surface as the internal electrode 2 is also proposed.
When the number of stacked internal electrodes 2 is increased, the positions of the internal electrodes 2 and the dummy electrodes 5 when viewed from the stacking direction are aligned, so that a distortion or a step occurs in this portion, and the multilayer ceramic electronic component of FIG. As in the case of (1), there is a problem that delamination and shortening of the service life occur.

The present invention solves the above-mentioned problems. Even when the number of internal electrodes is increased, large distortion does not occur, and internal defects such as delamination and shortened product life are reduced. It is an object of the present invention to provide a multilayer ceramic electronic component that does not cause any problems.

[0007]

In order to achieve the above object, a multilayer ceramic electronic component according to the present invention is provided in a ceramic and has a first end formed on one end face of an element for forming a capacitor. The first internal electrode is opposed to the first internal electrode via a ceramic layer, and one end of the second electrode for forming a capacitance is drawn to an end surface opposite to the end surface from which the first internal electrode of the element is drawn. 2, an internal electrode, and a first dummy electrode provided at a predetermined distance G from the end of the element of the first internal electrode that is not drawn out to the end face of the element; On the side of the end of the element of the second internal electrode which is not drawn out to the end face of the element, the end and a second dummy electrode disposed at a predetermined distance G alternately via a ceramic layer. A multilayer ceramic electronic component having a structure stacked on, First and second inner electrodes and the first
And the first and second dummy electrodes are arranged so as not to be overlapped at the same position when viewed from the stacking direction.
The position of the second internal electrode and the position of the first and second dummy electrodes are shifted by a predetermined amount in a direction parallel to the direction in which the first and second internal electrodes are drawn out, for each layer or for each of a plurality of layers. L
However, it is characterized by intentionally shifting.

[0008] Further, the present invention is characterized in that the displacement L of each of the electrodes with respect to the corresponding electrode is 50% or more of the distance G between the internal electrode and the dummy electrode.

[0009] Further, among the electrodes of the internal electrode and the dummy electrode, the number of overlappingly disposed electrodes at the same position when viewed from the stacking direction does not exceed 60% of the entire electrodes. Features.

[0010] Further, a distance G between the internal electrode and the dummy electrode is made larger than a thickness of a ceramic layer interposed between the adjacent electrodes in the stacking direction.

[0011]

In the multilayer ceramic electronic component of the present invention,
The positions of the first and second internal electrodes stacked via the ceramic and the positions of the first and second dummy electrodes are set in parallel with the direction in which the first and second internal electrodes are drawn out for each layer or for each of a plurality of layers. In the direction, the predetermined positional deviation amount L is intentionally shifted, so that all of the first and second internal electrodes and each of the first and second dummy electrodes are In addition, it is possible to suppress the occurrence of internal defects such as the bending of the internal electrodes and the resulting delamination by suppressing the overlapping of the internal electrodes at the same position when viewed from the stacking direction.

Further, by setting the displacement L of each electrode to 50% or more of the distance G between the internal electrode and the dummy electrode, the generation of distortion is suppressed, and the generation of internal defects such as delamination is suppressed. Prevention can be surely prevented.

Further, among the electrodes, 60% of the electrodes overlappingly arranged at the same position when viewed from the stacking direction are used.
The internal electrodes and the
By making the distance G between the me electrodes larger than the thickness of the ceramic layer interposed between the adjacent electrodes in the stacking direction, even when the number of laminated internal electrodes increases, distortion and the occurrence of delamination due to the distortion can be prevented. As a result, the present invention can be made more effective.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and features thereof will be described in more detail.

Here, a multilayer ceramic capacitor using ceramic as a dielectric will be described as an example.

[Manufacturing Method] First, a slurry is prepared by mixing a ceramic raw material powder with a binder, and this is formed into a ceramic green sheet having a thickness of 10 μm. Then, after a conductive paste was printed on the ceramic green sheets, a plurality of the conductive pastes were stacked to form a laminated element. Then, after decomposing and removing the binder of this laminated element, it was fired at a predetermined temperature.

Then, by applying and baking a metal paste for forming an external electrode, as shown in FIGS. 1, 2 and 3, the first and second internal electrodes 2 (2a, 2b) are formed in the ceramic 1. ), The first and second dummy electrodes 5 (5
a, 5b), and external electrodes 4 electrically connected to the first and second internal electrodes 2 (2a, 2b) drawn out on both end surfaces of the element (multilayer capacitor element) 3. A multilayer ceramic capacitor having a structure was obtained. At this time, the effective number of laminated internal electrodes was 150.

As a comparative example, a multilayer ceramic capacitor (FIG. 4) in which only a plurality of internal electrodes 2 are provided in the ceramic 1 and no dummy electrode is provided, and a ceramic 1 A multilayer ceramic capacitor (FIG. 6) having a structure in which the internal electrode 2 and the dummy electrode 5 are disposed at the same position when viewed from the stacking direction and overlapped with each other was manufactured.

[Structure of Multilayer Ceramic Capacitor] The multilayer ceramic capacitor of FIG. 1 has a gap (gap) 10 between the internal electrodes 2 (2a, 2b) and the dummy electrodes 5 (5a, 5b), which are adjacent to each other in the stacking direction. (10
a, 10b) are configured to be shifted by a distance L. Note that, in this example, the displacement L is equal to the distance G of the gap 10.

The multilayer ceramic capacitor shown in FIG. 2 has a capacitor portion 6a composed of four layers of first internal electrodes 2a and four layers of second internal electrodes 2b, and also has a four-layered ceramic electrode. In the relationship between the first internal electrode 2a and the capacitor portion 6b including the four layers of second internal electrodes 2b, the position of the gap 10 (10a, 10b) between the internal electrode 2 and the dummy electrode 5 is shifted by L. Is configured. Note that, in this example, the displacement L is equal to the distance G of the gap 10.

In the multilayer ceramic capacitor of FIG. 3, as in the case of the multilayer ceramic capacitor of FIG.
The internal electrodes 2 (2a, 2a,
2b) and the gap 1 between the dummy electrode 5 (5a, 5b)
0 (10a, 10b) is shifted by a distance L, and the position shift amount L
Is configured to be larger than the distance G of

[Results of Observation of Structural Defects, etc.] With respect to the multilayer ceramic capacitor manufactured as described above, the state of occurrence of delamination before and after debinding and the state of occurrence of delamination and short circuit after firing were examined. Table 1 shows the results.

[0023]

[Table 1]

In Table 1, the samples of Nos. 1 to 9 are all multilayer ceramic capacitors having the structure of the present invention. Among them, the samples of Nos. 8 and 9 have the element thickness (thickness of the ceramic layer). ) = 7 μm, distance G of gap 10 =
The condition is 5 μm. In addition, other No. 1 ~
In the sample No. 7, the element thickness was 10 μm, and the distance G of the gap 10 was changed between 100 and 10 μm as shown in Table 1. In the samples of Nos. 1 to 9, No.
No. 5 has the structure shown in FIG. 2, No. 6 has the structure shown in FIG. 3, and others have the structure shown in FIG.

The sample of No. 10 is a conventional multilayer ceramic capacitor having no dummy electrode and having a structure as shown in FIG. 4 described above, and the sample of No. 11 is as shown in FIG. This is a conventional multilayer ceramic capacitor having a structure in which the whole electrode is overlapped at the same position when viewed from the stacking direction. This No.
Also in the multilayer ceramic capacitors 10 and 11, the element thickness is 10 μm, and the gap distance G is 10 μm.
0 μm.

G, D 1 , D 2 , and L 1 in Table 1 (for example, see the model in FIG. 3) are as follows: (1) G = distance between the internal electrode 2 and the dummy electrode ( 2) D 1 = length of the shorter dummy electrode 5a (3) D 2 = length of the longer dummy electrode 5b (4) L 1 = displacement (L) of the electrode−distance of the gap 10 (G ). From the above (4) , the displacement L is L 1
+ G. In other words, L 1 indicates how much the position of the electrode is shifted from the distance G of the gap 10. When L 1 = 0, it means that the electrode is shifted by the same distance G as the gap 10. are doing.

As shown in Table 1, in the case of the samples of Nos. 10 and 11 (conventional example), before the debinding was performed, the element was already distorted, and the internal electrode was curved. The occurrence of delamination was observed at the time when the device was cut out by cutting the laminated block.

On the other hand, when the gap width G is 100 to 1
0 μm, D 1 is 100 μm, D 2 is 200 to 110 μm, L 1
In the case of the samples of Nos. 1 to 7 in which No. 1 was set to 0 or 50 μm (only No. 6), no delamination occurred and a multilayer ceramic capacitor free from short circuit was obtained. However,
In the sample of No. 7 in which the gap width G was as small as 10 μm, a short-circuit defect was slightly generated (occurrence rate: 2%) due to the problem of printing accuracy.

No delamination was observed in the samples of Nos. 8 and 9, but a short-circuit defect occurred because the gap distance G was as small as 5 μm with respect to the element thickness (7 μm). ing. As described above, in the multilayer ceramic electronic component of the present invention, it is desirable to consider the relationship between the element thickness and the gap distance. In addition,
In general, the displacement L of each electrode with respect to the corresponding electrode
Is preferably 50% or more of the gap distance G.

In the above embodiment, a multilayer ceramic capacitor has been described as an example. However, the present invention is also applicable to a case in which internal electrodes are provided in ceramic, such as a multilayer LC composite component, a multilayer actuator, and a multilayer varistor. It can be applied to various ceramic electronic components.

Although not particularly shown in the above embodiment, of the first and second internal electrodes and the respective electrodes of the first and second dummy electrodes, they overlap when viewed from the stacking direction. 60% of the total number of electrodes placed
When the number of electrodes is more than 60%, the curvature of the internal electrodes and the accompanying delamination tend to be easily generated. It is desirable that

The present invention is not limited to the above embodiment in other respects. The number of laminated internal electrodes, the type of material constituting the internal electrodes, the thickness of the ceramic layer, and the configuration of the ceramic layer are not limited. Regarding the type of material,
Various applications and modifications can be made within the scope of the invention.

[0033]

As described above, in the multilayer ceramic electronic component of the present invention, the position of the first and second internal electrodes and the position of the first and second dummy electrodes stacked on each other via the ceramic can be determined for each layer. For each of the plurality of layers , a predetermined positional deviation amount L is intentionally shifted in a direction parallel to the direction in which the first and second internal electrodes are drawn out. The second internal electrode and the first and second dummy electrodes are all prevented from being disposed at the same position when viewed from the stacking direction. This can prevent the occurrence of internal defects such as delamination.

Further, by setting the displacement L of each electrode to 50% or more of the distance G between the internal electrode and the dummy electrode, the generation of distortion is suppressed, and the generation of internal defects such as delamination is suppressed. It can be reliably prevented.

Further, among the electrodes, 60% of the electrodes overlappingly arranged at the same position when viewed from the stacking direction are used.
By not exceeding the internal electrodes and the front
By making the distance G between the dummy electrodes greater than the thickness of the ceramic layer interposed between the adjacent electrodes in the stacking direction, even when the number of stacked internal electrodes increases, distortion and delamination due to the distortion occur. Can be reliably prevented, and the present invention can be made more effective.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a structure of a multilayer ceramic electronic component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing another example of the structure of the multilayer ceramic electronic component according to the embodiment of the present invention.

FIG. 3 is a sectional view showing still another example of the structure of the multilayer ceramic electronic component according to the embodiment of the present invention.

FIG. 4 is a sectional view showing a conventional multilayer ceramic capacitor.

FIG. 5 is a cross-sectional view showing another example of a conventional multilayer ceramic capacitor.

FIG. 6 is a sectional view showing still another example of the conventional multilayer ceramic capacitor.

[Explanation of symbols]

1 ceramic 2 (2a, 2b) internal electrode 3 element 4 external electrode 5 (5a, 5b) dummy electrodes 6a, 6b capacitor section 10 (10a, 10b) gap G internal electrodes and the distance D 1 shorter dummy electrodes of the dummy electrode D 2 Length of the longer dummy electrode L Displacement of electrode L Displacement of electrode 1 (L) -Gap distance (G)

Claims (4)

(57) [Claims]
1. A first internal electrode for capacitance formation, which is provided in a ceramic and has one end side drawn out to one end face of an element, facing the first internal electrode via a ceramic layer,
One end side is drawn out to an end face of the element opposite to the end face from which the first internal electrode is drawn out, and a second internal electrode for forming a capacitance is drawn out to an end face of the element of the first internal electrode. A first dummy electrode disposed at a predetermined distance G from the other end, and an end not drawn to an end face of the element of the second internal electrode. A multilayer ceramic electronic component having a structure in which the end and a second dummy electrode disposed at a predetermined distance G are alternately stacked via a ceramic layer, The first and second internal electrodes, the first and second dummy electrodes, and the first and second internal electrodes, so that the respective electrodes of the first and second dummy electrodes are not disposed at the same position when viewed from the stacking direction. The position of the second dummy electrode is changed for each layer or for each layer by the first and second A multilayer ceramic electronic component characterized in that the multilayer ceramic electronic component is intentionally shifted by a predetermined position shift amount L in a direction parallel to a direction in which the internal electrodes are led out.
2. The method according to claim 1, wherein the amount of displacement L between each of the electrodes and the corresponding electrode is a distance G between the internal electrode and the dummy electrode.
2. The multilayer ceramic electronic component according to claim 1, wherein the ratio is 50% or more.
3. A method according to claim 1, wherein, of the internal electrodes and the dummy electrodes, the number of electrodes provided at the same position when viewed from the stacking direction does not exceed 60% of the total number of the electrodes. The multilayer ceramic electronic component according to claim 1, wherein:
4. The device according to claim 1, wherein a distance G between the internal electrode and the dummy electrode is larger than a thickness of a ceramic layer interposed between the adjacent electrodes in the stacking direction. Of multilayer ceramic electronic components.
JP2205596A 1996-01-11 1996-01-11 Multilayer ceramic electronic components Expired - Lifetime JP3316731B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2205596A JP3316731B2 (en) 1996-01-11 1996-01-11 Multilayer ceramic electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2205596A JP3316731B2 (en) 1996-01-11 1996-01-11 Multilayer ceramic electronic components

Publications (2)

Publication Number Publication Date
JPH09190946A JPH09190946A (en) 1997-07-22
JP3316731B2 true JP3316731B2 (en) 2002-08-19

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158682C (en) * 1997-11-18 2004-07-21 松下电器产业株式会社 Laminate, capacitor, and method for producing laminate
JP2003017362A (en) * 2001-06-28 2003-01-17 Kyocera Corp Method of manufacturing ceramic laminate
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7345868B2 (en) 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
JP2005285801A (en) 2004-03-26 2005-10-13 Kyocera Corp Method of manufacturing stacked electronic component
TWI399765B (en) 2005-01-31 2013-06-21 Tdk Corp Laminated electronic components
DE112006002088T5 (en) 2005-08-19 2008-06-05 Murata Manufacturing Co., Ltd., Nagaokakyo Multilayer ceramic capacitor
JP4760857B2 (en) * 2008-05-29 2011-08-31 Tdk株式会社 Manufacturing method of multilayer electronic component
JP2012532455A (en) 2009-07-01 2012-12-13 ケメット エレクトロニクス コーポレーション High capacitance multilayer with high voltage capability
KR101141402B1 (en) 2011-03-09 2012-05-03 삼성전기주식회사 A multilayer ceramic capacitor and a method for manufactuaring the same
JP2014027255A (en) * 2012-06-22 2014-02-06 Murata Mfg Co Ltd Ceramic electronic component and ceramic electronic device
KR101420517B1 (en) * 2012-10-31 2014-07-16 삼성전기주식회사 Multi-Layer Ceramic Capacitor and Printed Circuit Board embedding the same
KR102067173B1 (en) * 2013-02-25 2020-01-15 삼성전기주식회사 Multi-layered ceramic capacitor and manufacturing method of the same
JP6550737B2 (en) * 2014-12-09 2019-07-31 Tdk株式会社 Multilayer ceramic capacitor

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