JP3315863B2 - Vacuum forming mold structure of wire harness and vacuum forming method of wire harness using this vacuum forming mold structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum forming die structure of a wire harness for joining a circuit body having wires arranged in a predetermined circuit pattern and a thermoplastic insulating sheet by vacuuming, and a vacuum forming mold for the wire harness. The present invention relates to a method for vacuum forming a wire harness using a mold structure.

[0002]

2. Description of the Related Art For example, a cable for connecting on-vehicle electric equipment.
For the cable, a wire harness having a predetermined circuit pattern is used for the purpose of, for example, increasing the efficiency of wiring work. When such a wire harness is assembled, for example, inside a door of a vehicle, a flat wire harness in which wires are arranged in a single line to form a flat circuit body is used. It is desired that the flat wire harness be as thin as possible in order to save space such as making the door thinner.

Japanese Patent Application Laid-Open No. Hei 5-314833 discloses a vacuum forming die 1 as shown in FIG. 8, and this vacuum forming die 1 is used for manufacturing a flat wire harness as described above. The upper surface of the mold 1 is a vacuum suction surface 3, and the vacuum suction surface 3 is provided with a concave portion 5 having a shape corresponding to the pattern of the wire harness and a number of vacuum holes 7.

FIG. 9 shows a cross section of a wire harness 9 vacuum-formed by a vacuum forming die 1. In forming the wire harness 9, an insulating sheet 11 made of a thermoplastic material having a large number of vacuum holes is used. Vacuum is drawn from the vacuum evacuation hole 7 while being softened by heating on the vacuum suction surface 3,
Various wires 15 are routed in the recess 13 formed in the resin sheet 11 to form a flat circuit body 17.

Next, as shown in FIG. 8, a resin sheet 19 of a thermoplastic material to which a hot-melt adhesive is applied is set on a flat circuit body 17 and heated and softened. Vacuum is applied to make the space between the resin sheets 11 and 19 vacuum, and the flat circuit members 17 are sandwiched therebetween with an adhesive to obtain a wire harness 9.

[0006]

As described above, the flat wire harness must be made as thin as possible. Therefore, as shown in FIG. The concave portion 23 becomes shallow, and the wire 15 easily jumps out of the concave portion 23 during wiring or vacuum forming, and the workability of wiring and vacuum forming is reduced. Such a problem is particularly remarkable when the wire 15 bends as in the branch portion 25 shown in FIG. 8 or when the wire 15 has a bending habit.

Therefore, conventionally, in order to prevent the wire 15 from jumping out, the wire 15 is made of an adhesive sheet or an adhesive.
5 has been fixed, but this fixing operation further reduces the workability of wire routing.

However, when the concave portion 27 of the vacuum forming die 1 is deepened as shown in FIG. 11 in order to prevent the wire 15 from jumping out, an extra thickness as shown by an arrow 29 is generated, and the wire harness 9 is sufficiently provided. Can not be thin.

Further, there is a vacuum forming die in which a concave portion for wire routing is not provided on the vacuum suction surface. In this case, jumping out of the wire occurring during routing or vacuum forming is a serious problem.

In view of the foregoing, the present invention provides a wire harness capable of vacuum forming a thin wire harness with good workability while preventing the wire from jumping out of a predetermined circuit pattern portion. Vacuum mold structure,
An object of the present invention is to provide a method of vacuum forming a wire harness using the vacuum forming die structure.

[0011]

According to the first aspect of the present invention, there is provided a vacuum forming die structure for a wire harness, comprising: a circuit body having wires arranged in a predetermined circuit pattern on a vacuum suction surface having a vacuum drawing hole; A vacuum molding die structure for mounting the plastic insulating sheet and joining the circuit body and the thermoplastic insulating sheet by vacuuming through a vacuum drawing hole; A circuit pattern portion for arranging wires to form the circuit body; and a circuit pattern portion disposed around the circuit pattern portion, which moves up and down the vacuum suction surface to change the protruding height. A guide member capable of controlling the guide member to a protrusion height for preventing the wire from jumping out of the circuit pattern portion when the wire is routed, and a circuit pattern portion for vacuum forming To prevent wire from jumping out A second stopper for restricting the guide members at the lowest projecting height range, the second during vacuum forming
Moving means for pulling down the guide member to a position regulated by the stopper.

As described above, in this vacuum forming die structure, the guide member disposed around the circuit pattern portion is provided with a protruding height for preventing the wire from jumping out of the circuit pattern portion when the wires are routed. Move to the end.

Thus, when arranging wires,
Since the jumping-out of the wire is prevented by the guide function of the guide member projecting to a sufficient height, the wire can be quickly arranged with good workability.

The effect of preventing the wire from jumping out is particularly remarkable when the wire is bent, such as a branch portion of a wire harness, or when the wire has a bending habit.

Further, unlike the conventional example, it is not necessary to fix the wire with an adhesive sheet or an adhesive in order to prevent the wire from jumping out, so that the workability is further improved.

Furthermore, in vacuum forming, the guide member is pulled down to the lowest protruding height in a range where the wire is prevented from jumping out, so that the wire harness can be thinly vacuum-formed while preventing the wire from jumping out. .

The sum of the maximum diameter of the wire and the thickness of the insulating sheet is the thinnest state of the wire harness.
By setting the protrusion height of the guide member with the second stopper to the sum of the maximum diameter of the wire and the thickness of the insulating sheet during vacuum forming, the wire harness can be formed to be the thinnest.

According to a second aspect of the present invention, there is provided a vacuum forming die structure of the wire harness according to the first aspect, wherein the guide member is disposed at a position corresponding to a bent portion of the wire. An effect equivalent to that of the configuration of item 1 is obtained.

In addition, the jumping out of the wire is likely to occur at a portion where the wire is bent such as a branch path of a circuit body. In this configuration, however, the guide member is disposed at a position corresponding to the bent portion of the wire. Thus, the jumping out of the wire can be effectively prevented, and the cost of the vacuum forming mold can be reduced by omitting the arrangement of the guide member in other places where the wire is difficult to jump out.

According to a third aspect of the present invention, there is provided the wire harness according to the first or second aspect of the present invention, wherein the circuit pattern portion has a vacuum suction surface and a level surface. Thus, an effect equivalent to that of the configuration of claim 1 or 2 is obtained.

In addition to this, in this vacuum forming die in which the circuit pattern portion is not a groove but a surface having the same height as the vacuum suction surface, a vacuum forming device in which the circuit pattern portion is formed in a groove shape is used. As compared with the mold, the wire jumps out easily during the wiring or the vacuum forming.

Therefore, the effect of improving the wire arranging work by arranging the guide member, the compatibility with the wire having the bent portion and the bend habit of the wire, and the adhesive sheet or adhesive for fixing the wire are required. The effect of improving the workability by omitting it, and the effect of preventing the wire from jumping out of the circuit pattern during vacuum forming are particularly great.

Further, the vacuum forming mold having no groove for wire arrangement is easy to process and the cost is low.

According to a fourth aspect of the present invention, there is provided the wire harness vacuum forming die structure according to any one of the first to third aspects, wherein the moving means regulates the guide member by the first stopper. 5. A biasing member for pressing the guide member to a position, and a driving force source for lowering the guide member to a position regulated by the second stopper against the pressing force of the biasing member. The same effect as that of the configuration is obtained.

In addition, by using the urging member, the moving means only has to function to lower the guide member to the position regulated by the second stopper, so that the structure of the vacuum forming die is simplified accordingly.

Further, if the urging member is used, if the urging member is selected such that the protruding height of the guide member becomes a predetermined value when the urging member is bent by receiving the weight of the guide member, the first member can be obtained. Therefore, the structure of the vacuum forming die is further simplified.

According to a fifth aspect of the present invention, there is provided a vacuum forming die structure of the wire harness according to the fourth aspect, wherein a housing hole for a guide member is provided in a vacuum forming die body having a vacuum suction surface, and an urging member is provided. Is disposed inside the receiving hole and presses the guide member to the position restricted by the first stopper. The same effect as the configuration of claim 6 or 7 is obtained.

According to a sixth aspect of the present invention, there is provided a method for vacuum forming a wire harness using the vacuum forming die structure according to any one of the first to fifth aspects. The wire is routed in a predetermined circuit pattern while preventing the wire from jumping out of the circuit pattern portion by the guide function of the guide member whose projection height is raised to the position regulated by the first stopper. When the circuit body and the thermoplastic insulating sheet are placed on the vacuum suction surface, the height of the guide member is lowered to a position regulated by the second stopper. The guide function is used to evacuate the wire while preventing the wire from jumping out of the circuit pattern portion, thereby joining the circuit body and the thermoplastic insulating sheet.

In this method of vacuum forming a wire harness, by using the vacuum forming die structure of the first to fifth aspects, when arranging the wire as described above, the guide member having the raised protrusion height is used. By the guide function, wires can be routed in a predetermined circuit pattern while preventing the wires from jumping out of the circuit pattern portion. In vacuum forming, the minimum protrusion height to prevent the wires from jumping out is provided. The evacuation is performed by lowering the guide member.

Therefore, as in the case of the first aspect, even if the wire has a bending habit even at the bent portion of the wire,
Also, without fixing the wire with an adhesive sheet or adhesive, etc.
Wires can be easily routed, and the workability of wire routing is greatly improved.

In vacuum forming, the wire harness can be formed thin while preventing the wire from jumping out.

Further, in a vacuum forming mold having no wire routing groove on the vacuum suction surface and easily jumping out of the wire, such an effect of improving the workability of wire routing, the bent portion of the wire and the bending tendency can be obtained. Compatibility with wire with wire, improvement of workability by omitting adhesive sheet and adhesive to fix wire, and prevent wire from jumping out of circuit pattern during vacuum forming The effect is particularly large.

[0033]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a vacuum forming die structure of a wire harness and a method of vacuum forming a wire harness using the vacuum forming die structure of the present invention will be described with reference to FIGS. This embodiment corresponds to claim 1,
It has 2, 3, 4, 5, and 6 features. The vertical direction is the vertical direction in FIGS. In the following description, members and parts without reference numerals are not shown.

As shown in the figures, the vacuum forming die 31 of this embodiment comprises a vacuum forming die body 33, a guide member 35,
37, 39, a number of coil springs 41 (biasing members), push plates 43 (moving means), and the like.

On the vacuum suction surface 45 of the vacuum forming die body 33, there is provided a T-shaped circuit pattern portion 51 comprising a linear portion 47 and a branch portion 49 (bent portion). 3 to 6
As shown in FIG.
It is a surface whose height is equal to 5. Further, a large number of vacuum holes are provided in the circuit pattern portion 51 and its peripheral portion.

The guide members 35 and 37 are disposed on both sides of the branch portion 49 and are bent along the branch portion 49. The guide member 39 is opposed to the guide members 35 and 37 and has a linear portion 47.
It is arranged on one side of.

Further, as shown in FIGS. 3 to 6, these guide members 35, 37 and 39 can be moved in the vertical direction with the lower part being housed in the housing hole 53 provided in the vacuum forming die body 33. It is.

The main body 33 of the vacuum forming die and the respective guide members 35,
37, 39, a contact portion for regulating the upper limit of the protrusion height of each of the guide members 35, 37, 39 with respect to the vacuum suction surface 45, and a contact portion for regulating the lower limit of the protrusion height, respectively. Is formed. The attaching portion that regulates the upper limit uses the guide members 35, 37, and 39 as shown in FIGS.
The stopper is a first stopper that regulates the guide members 35, 37, and 39 to the heights of FIGS. 2, 5, and 6. ing.

Each of the coil springs 41 is disposed in a housing hole 53 of the vacuum forming die body 33, and each of the guide members 35, 37, 39
To the positions shown in FIGS. 1, 3, and 4 where the first stopper regulates the pressure.

Each of the guide members 35, 3 shown in FIGS.
The protruding heights of 7 and 39 are set to a sufficient height so that the wire 55 does not jump out of the circuit pattern portion 51 at the time of wiring.

The vacuum forming main body 33 is provided with storage chambers 57 at the front ends of the linear portion 47 and the branch portion 49, respectively, and these storage rooms 57 are airtightly closed by a cover 59.

The push plate 43 is driven up and down by a driving force source such as a negative pressure at the time of vacuum forming, an actuator comprising a piston and a cylinder, and an electric motor.

Thus, the vacuum forming die 31 is constituted.

The vacuum forming of the wire harness using the vacuum forming die 31 is performed in the following steps.

In the first step, as shown in FIG. 1, the guide function of each of the guide members 35, 37 and 39 causes the vacuum suction surface 4 to move.
A wire 55 is routed along the circuit pattern portion 51 on 5 to form a circuit body.

The end of the circuit body in which a connector or the like is connected to the tip of each wire 55 is folded into a storage chamber 57 of the vacuum forming die body 33, and each storage chamber 57 is closed with a cover 59.

In the second step, as shown in FIG. 3, a thermoplastic insulating film 61 (insulating sheet) is arranged on the vacuum suction surface 45 after the wiring of the circuit body. This insulating film 6
A hot melt adhesive is applied to the circuit body side of No. 1.

In the third step, each of the guide members 35, 37 and 39 is moved by the push plate 43 to the insulating film 61.
3 and 4 is pushed down from the position in FIGS. 3 and 4 to the position in FIG. 5 regulated by the second stopper.

In the fourth step, while the insulating film 61 is heated and softened, the insulating film 61 is evacuated from the vacuum suction hole of the vacuum suction surface 45, and the insulating film 61 is joined to the circuit body with a hot melt adhesive. As shown in 6, a flat wire harness 63 is obtained.

Thus, the wire harness 63 is manufactured.

In this vacuum forming die 31, as described above,
When the wires 55 are routed, the guide members 35, 37, and 39 are raised to a protruding height for preventing the wires 55 from jumping out of the circuit pattern portions 51. The protruding height of the guide members 35, 37, and 39 is reduced to the extent that the wire 55 can be prevented from jumping out.

Accordingly, when the wire 55 is routed, the jumping of the wire 55 is prevented by the guide function of the guide members 35, 37, and 39, and the wire 55 can be routed quickly with good workability.

This effect is particularly great when the wire 55 bends like the branch portion 49 of the wire harness 63 or when the wire 55 has a bending habit.

Also, since there is no jump of the wire 55,
Unlike the conventional example, there is no need to fix the wire 55 with an adhesive sheet or an adhesive, and the workability of arranging the wire 55 is further improved.

Further, at the time of vacuum forming, the guide members 35, 3
The wire harness 63 can be formed thin by pulling down the wires 7 and 39 and performing vacuum forming while preventing the wire 55 from jumping out.

In addition, in this vacuum forming die 31 in which the circuit pattern portion 51 is at the same level as the vacuum suction surface 45, compared with a vacuum forming die in which the circuit pattern portion is formed in a groove shape. ,
The wire 55 easily jumps out of the circuit pattern portion 51 during the wiring or the vacuum forming, so that the guide members 35, 37, and 39 improve the workability of the wiring of the wire 55 and the bending of the wire 55 as described above. Section and the bendable wire 55, the workability is improved by omitting the adhesive sheet and adhesive for fixing the wire 55, and the circuit pattern portion 51 is formed from the circuit pattern portion 51 during vacuum forming. The effect of preventing the wire 55 from jumping out is particularly great.

Further, the vacuum forming die body 33 having no groove for arranging the wire 55 is easy to process and low in cost.

In addition to this, by using the coil spring 41, the push plate 43 can move the guide member 35,
Since only the function of lowering 37 and 39 to the position regulated by the second stopper is required, the structure of the vacuum forming die 31 is simplified accordingly.

Next, a second embodiment of the vacuum forming die structure for a wire harness of the present invention and a method for vacuum forming a wire harness using this die structure will be described with reference to FIG. This embodiment has the features of claims 1, 2, 4, 5, and 6.

Hereinafter, differences from the first embodiment will be described while giving the same reference numerals to the same functional members as in the first embodiment.

The vacuum forming die 65 of this embodiment has a vacuum forming die body 67, guide members 35, 37, 39, a number of coil springs 41 (biasing members), and a push plate 43.
(Moving means).

As shown in FIG. 7, a groove-shaped circuit pattern portion 69 is provided on the vacuum suction surface 45 of the vacuum forming die body 67. The circuit pattern section 69 is a T-shaped circuit pattern section including a straight section 47 and a branch section 49. A large number of vacuum holes are provided in the circuit pattern portion 69 and its peripheral portion.

The circuit pattern portion 69 has the same depth as the maximum diameter of the wire 55.

The vacuum molding die body 67 and each guide member 35
Between each of the guide members 35, 37, and 39, there is formed a contact portion that regulates the upper limit of the protrusion height of each of the guide members 35, 37, and 39 with respect to the vacuum suction surface 45.
9 is a first stopper that regulates the height of FIG.

A large number of stopper pins 71 (attached portions: second stoppers) are formed below each of the guide members 35, 37 and 39. These stopper pins 71
The guide members 35, 37 and 39 are push plates 4
3 are pushed down by the respective top surfaces 73, 75
Is equal to the vacuum suction surface 45, the bottom surface 77 of the receiving hole 53 of the vacuum mold body 67 (attached portion: second stopper).
, And constitutes a second stopper that regulates the lower limit of the protruding height of each of the guide members 35, 37, and 39. Each stopper pin 71 is arranged inside the coil spring 41.

Thus, the vacuum forming die 65 is constituted.

As in the first embodiment, the vacuum forming of the wire harness using the vacuum forming die 65 is performed with the guide members 35, 37 and 39 protruding high as shown in FIG. Thus, the wire 55 is routed on the circuit pattern portion 69 to form a circuit body, on which the thermoplastic insulating film 61 is arranged, and the push plate 4
At 3, the guide members 35, 37, 39 are pushed down to the position where the stopper pins 71 and the bottom surface 77 abut, and the insulating film 61 is heated, softened and evacuated to obtain a flat wire harness.

In this vacuum forming die 65, as described above,
Since the circuit pattern portion 69 is formed in a groove shape on the vacuum suction surface 45, the wire 55 can be easily routed.

Further, the circuit pattern portion 69 is made to have the same depth as the maximum diameter of the wire 55, and at the time of vacuum forming, the projecting height of each of the guide members 35, 37, 39 is adjusted to the vacuum suction surface 45.
Since it is the same height as the above, the wire harness can be made the thinnest.

In addition, the same effects as those of the vacuum forming mold 31 of the first embodiment are obtained.

In the present invention, the vacuum suction surface of the vacuum forming mold may have a three-dimensional shape in accordance with the shape of the portion where the wire harness is to be attached, instead of the two-dimensional shape as in each embodiment.

[0072]

According to the vacuum forming die structure of the wire harness according to the first aspect, the jumping of the wire from the circuit pattern portion is performed by the guide function of the guide member protruding to a sufficient height when the wire is routed. Since this is prevented, the workability of wire routing is greatly improved. This effect is particularly great when the wire is bent, such as a branch portion of a wire harness, or when the wire has a bending habit.

Accordingly, since it is not necessary to fix the wire with an adhesive sheet or an adhesive in order to prevent the wire from jumping out, the workability is further improved.

In vacuum forming, the guide member is pulled down to the lowest protruding height in a range that prevents the wire from jumping out, so that a thin wire harness can be obtained.

According to the second aspect of the present invention, the same effect as that of the first aspect is obtained, and the guide member is disposed at a position corresponding to the bent portion of the wire where the wire is likely to jump out, so that the wire is formed. Bouncing is effectively prevented, and the cost of the vacuum mold is reduced by omitting the guide members at other locations.

According to the third aspect of the invention, the same effect as that of the first or second aspect is obtained, and the jumping of the wire easily occurs because the circuit pattern portion is flush with the vacuum suction surface. In this vacuum forming die, the effect of improving the wire laying workability by the guide member, the compatibility with the wire having a bent portion and a bending habit of the wire, and omitting the adhesive sheet and the adhesive for fixing the wire are omitted. In particular, the effect of improving workability, and the effect of preventing the wire from jumping out of the circuit pattern during vacuum forming are particularly great.

The vacuum forming mold having no wire routing groove is easy to process and low in cost.

According to the fourth aspect of the present invention, the same effects as those of the first to third aspects are obtained, and by using the urging member, the moving means can move the guide member to the position restricted by the second stopper. The function of merely lowering the pressure simplifies the construction of the vacuum forming die.

If the biasing member is used as the first stopper,
The structure of the vacuum mold is further simplified.

According to the fifth aspect of the invention, the same effect as that of the fourth aspect is obtained.

According to a sixth aspect of the present invention, there is provided a method of vacuum forming a wire harness by using a vacuum forming die structure according to the first to fifth aspects. Even if is attached,
The wire can be routed while preventing jumping out without fixing the wire with an adhesive sheet or adhesive, etc., greatly improving the workability of wiring and making the wire harness thinner. .

In addition to this, the same effects as those of the second to fifth aspects are obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of a vacuum forming die body constituting a vacuum forming die according to a first embodiment of the present invention, showing a state in which a guide member protrudes high.

FIG. 2 is a perspective view of a vacuum forming die body constituting the vacuum forming die of the first embodiment of the present invention, showing a state where a guide member is pulled down.

FIG. 3 is a cross-sectional view illustrating the vacuum forming die according to the first embodiment of the present invention, showing a state where a guide member protrudes high.

FIG. 4 is a cross-sectional view showing the vacuum forming die according to the first embodiment of the present invention, showing a state immediately before a push plate pushes down a guide member via an insulating film.

FIG. 5 is a cross-sectional view showing the vacuum forming die according to the first embodiment of the present invention, showing a state in which a push plate has pushed down a guide member to a lower limit position via an insulating film.

FIG. 6 is a cross-sectional view showing a vacuum forming die according to the first embodiment of the present invention, showing a state where a guide member is held at a lower limit position and vacuum is drawn.

FIG. 7 is a cross-sectional view showing a vacuum forming die according to a second embodiment of the present invention, showing a state where a guide member protrudes high.

FIG. 8 is a perspective view showing a conventional vacuum forming die.

FIG. 9 is a cross-sectional view of a wire harness formed by a vacuum forming die in which a depth of a wire routing groove is appropriate.

FIG. 10 is a cross-sectional view of a wire harness formed by a vacuum forming die in which a depth of a wire routing groove is too small.

FIG. 11 is a cross-sectional view of a wire harness formed by a vacuum forming die in which a depth of a wire routing groove is too deep.

[Explanation of symbols]

31, 65 Vacuum forming die 33, 67 Vacuum forming die main body 35, 37, 39 Guide member 41 Coil spring (biasing member) 43 Push plate (moving means) 45 Vacuum suction surface 49 Branch (bend) 51 Circuit Pattern part (equivalent height with vacuum suction surface) 53 Housing hole of guide member 55 Wire 61 Thermoplastic insulating film (thermoplastic insulating sheet)
G) 63 wire harness 69 circuit pattern (groove-shaped) 71 stopper pin (attached portion: second stopper) 77 bottom surface (attached portion: second stopper)

Claims (6)

(57) [Claims] 1. A circuit body in which wires are arranged in a predetermined circuit pattern and a thermoplastic insulating sheet are placed on a vacuum suction surface having a vacuum drawing hole. A structure of a vacuum forming die for joining the circuit body and the thermoplastic insulating sheet by evacuation, provided on a vacuum suction surface, for arranging wires to form the circuit body. And a circuit portion and a circuit pattern portion,
A guide member that can be moved up and down on the vacuum suction surface to change the protruding height and a guide member that restricts the protruding height to prevent the wire from jumping out of the circuit pattern when routing the wire A first stopper for restricting the guide member to the lowest protruding height in a range that prevents the wire from jumping out of the circuit pattern during vacuum forming, and a second stopper for performing vacuum forming during the vacuum forming. And a moving means for lowering the guide member to a position regulated by the wire harness. 2. The vacuum forming die structure for a wire harness according to claim 1, wherein the guide member is disposed at a position corresponding to the bent portion of the wire. 3. The vacuum forming die structure of a wire harness according to claim 1, wherein the circuit pattern portion has a level equal to a vacuum suction surface. 4. An urging member according to claim 1, wherein the moving means presses the guide member to a position restricted by the first stopper, and an urging member. And a driving force source for pulling down the guide member to a position regulated by the second stopper against the pressing force of the wire harness. 5. The guide member according to claim 4, wherein a housing hole for a guide member is provided in a vacuum forming die body having a vacuum suction surface, and an urging member is disposed inside the housing hole. Is pressed to a position regulated by a first stopper. 6. A guide which uses the vacuum forming mold structure according to any one of claims 1 to 5 and which has a raised projecting height up to a position regulated by a first stopper when wiring a wire. The circuit pattern is
The wire is routed in a predetermined circuit pattern to prevent the battery from jumping out of the circuit section to form a circuit body. When performing vacuum forming, the circuit body and the thermoplastic insulating sheet are placed on the vacuum suction surface. In the mounted state, the evacuation is performed by the guide function of the guide member whose projection height is lowered to the position regulated by the second stopper while preventing the wire from jumping out of the circuit pattern portion, and And a thermoplastic insulating sheet joined to the wire harness.