JP3312889B2 - Substrate cutting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting apparatus for separating mold chips arranged at predetermined intervals on a substrate by XY arrangement by dividing the substrate with a wheel cutter, and more particularly to a device for holding the substrate. Related to chuck technology.

[0002]

2. Description of the Related Art Conventionally, mold chips are separated by the following procedure, for example. A substrate in which the substrate 1 is pasted on the UV film F with an adhesive (see FIG. 5) is prepared in advance, and the substrate 1 is suction-held on a substrate holder (not shown). Then, while sequentially feeding the substrate holder at a pitch in the X direction, the rotary blade 37 is moved in the Y direction for each line to cut the substrate in the X direction. After the division in the X direction is completed, the substrate holder is turned by 90 ° and the rotary blade 37 is run line by line while dividing the substrate holder sequentially in the same pitch to perform division in the Y direction.

[0005] Next, the UV film F is removed from the substrate holder, and the mold chips and the remaining pieces attached to the UV film F are peeled off from the UV film F. Here, the mold chip refers to, for example, a silicon chip or the like on which an integrated circuit is formed, which is molded on the substrate 1 with an epoxy resin or the like (the same applies hereinafter). And substrate 1
Is cut and the mold chip 2 is cut, the leads of the mold chip 2 are exposed on two orthogonal surfaces of the cut substrate 1. In FIG. 5, reference numeral 1 c denotes a positioning pin hole of the substrate 1, Sx and Sy respectively denote an X-direction gap and a Y-direction gap between the mold chips 2, and vertical and horizontal broken lines indicate cutting lines along which the rotary blade 37 travels. Is shown. The rotary blade 3
The cutting depth of 7 is configured to be set in units of several μ, and the UV film F is not divided.

[0004]

However, according to the conventional cutting (cutting) technique, there are the following difficulties.
Since the extra UV film F is interposed in order to hold the substrate 1 with the substrate holder, manual work is required when attaching the substrate to the UV film or separating the mold chip from the UV film after cutting the mold chip 2. Cost. For this reason, the prior art in which a UV film is interposed has hindered automation of a subsequent processing line. Further, a sticking device for sticking the substrate to the UV film is required, and this sticking device is expensive.

Further, the UV film is an expensive consumable and requires one UV film for one substrate, so that the running cost is also high. In addition, since the substrate is cut by running the rotary blade 37 line by line while sequentially feeding the substrate holder at a pitch, it takes a long time to separate the mold chips. In addition, even after the substrate is cut, the mold chip and the residue are still attached to the UV film, so that when they are peeled off, the mold chip and the residue are mixed, and the mold chip and the residue are later separated. It takes time to sort.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to eliminate the UV film, thereby enabling the subsequent processing line to be automated, and attaching the substrate to the UV film. To reduce the running cost by eliminating the need for a sticking device to cut mold chips. To significantly reduce the time required to separate mold chips. A substrate cutting device that eliminates the need to sort mold chips and remnants. To provide.

[0007]

In order to solve the above-mentioned problems, according to the present invention, as shown in FIG. 1, for example, a substrate holder 5 for holding a substrate 1 and a substrate holder 5 for holding the substrate 1 are provided. Substrate 1 is cut and XY
And a wheel cutter 7 for separating the mold chips 2 arranged in the direction, and further has the following characteristic configuration.

As shown in FIG. 2, for example, the substrate holder 5 is provided with a movable frame 21 movably in the vertical (Z) direction and XY directions, and a substrate fixed to a lower end of the movable frame 21. A holding frame 23 is provided, and a wedge holder 25 and a claw holder 27 are provided to be able to move up and down with respect to the substrate holding frame 23, respectively.

The board holding frame 23 has a board fitting recess 31 having a shape along the outer periphery of the board 1 on the lower surface thereof,
A plurality of blade passage grooves 32x and 32y formed in the outer peripheral portion of the substrate fitting concave portion 31 corresponding to the X-direction gap Sx and the Y-direction gap Sy between the mold chips 2, respectively;
A plurality of contact pieces 33 that come into contact with the upper surface of each of the mold chips 2 and a plurality of claw through holes 34 that are open to face the X-direction gap Sx are provided. The claw holder 27 includes a plurality of pairs of holding claws 28 inserted in each claw through hole 34. The wedge holder 25 includes the pair of holding claws 2.
8 and 28 are provided with a plurality of wedges 26.

[0010] The substrate holder 5 is provided with a moving frame 21.
And the substrate 1 placed on the substrate table 6 is fitted into the substrate fitting recess 31 of the substrate holding frame 23,
In addition, the substrate 1 is slid on the substrate table 6 in a state where the contact piece 33 is in contact with the upper surface of each mold chip 2, and a number of rotary blades 37 facing from below the substrate table 6. The X-direction gap corresponding portion 1a of the substrate 1 is cut in a lump by the wheel cutter 7 having the above, and then the claw holder 27 is lowered to penetrate a plurality of pairs of the holding claws 28, 28 into the respective claw through holes 34. At the same time, the wedge holder 25 is lowered, and each pair of pinching claws 28 is
-By expanding 28, the mold chips 2 in each Y column direction are clamped by the lower ends of the adjacent claws 28, 28,
Subsequently, the Y-direction gap corresponding portion 1b of the substrate 1 is cut at one time.

According to a second aspect of the present invention, in the substrate cutting apparatus of the first aspect, the wedge holder 25 is provided.
And the claw holder 27 are provided so as to be able to ascend and descend integrally and to be relatively close to and separated from each other.
8 penetrates into the respective claw through holes 34, and the pinching claws 28
Is brought into contact with the substrate table 6 to stop the lowering of the claw holder 27, and the lowering of the wedge holder 25 causes each wedge 26 to hold a pair of holding claws 28.
28 is configured to be expanded.

[0012]

According to the first aspect of the present invention, the substrate 1 placed on the substrate table 6 is held by the substrate holder 5 having the above-mentioned feature, and the substrate table 6
, The X-direction gap corresponding portion 1a of the substrate 1 is cut at once by a wheel cutter 7 facing downward, and then the mold chips 2 in each Y-column direction are clamped by the lower ends of the clamping claws 28. Since the Y-direction gap corresponding portion 1b is cut in a lump, the mold chips can be cut individually without interposing a UV film for attaching the substrate and thus without any human intervention at all. Thereby, the subsequent processing line can be automated.

(B) Further, the need for a consumable UV film and a device for attaching the substrate to the UV film is eliminated, and the running cost can be reduced.

(C) By holding the substrate 1 placed on the substrate table 6 with the substrate holder 5 having the above-mentioned characteristic configuration, the wheel cutter 7 having a number of rotary blades 37 facing from below the substrate table 5. , The X-direction gap corresponding portion 1a and the Y-direction gap corresponding portion 1b of the substrate 1 are cut at once, so that the substrate is cut by running the rotary blade line by line while sequentially feeding the substrate table at a predetermined pitch. Compared with the prior art, the installation area of the apparatus is reduced as much as the pitch feed mechanism of the substrate table is not required, and the time for separating the mold chips can be greatly reduced.

(D) The substrate 1 placed on the substrate table 6 is held by the substrate holder 5 having the above-mentioned characteristic configuration, and the X-direction gap corresponding portion 1a and the X-direction gap of the substrate 1 are By collectively cutting the Y-direction gap corresponding portion 1b, only the mold chip is finally held by the holding claws 28 of the substrate holder 5. As a result, the mold chip and the residual piece do not mix with each other, so that the work of sorting the mold chip and the residual piece can be eliminated.

(E) According to the second aspect of the present invention, in the substrate cutting apparatus according to the first aspect, the wedge holder 25 and the claw holder 27 are provided so as to be able to move up and down integrally and to be relatively close to and separated from each other. The two are lowered together to penetrate the claws 28, 28 into the respective claw through holes 34, and the claws 2
The lower ends of the claws 8 and 28 are brought into contact with the substrate table 6 to stop the lowering of the claw holders 27, and the lowering of the wedge holders 25 causes the wedges 26 to expand the pair of holding claws 28 and 28. Thus, the wedge holder and the claw holder can be successively lowered by a single lifting drive source. This simplifies the lifting drive source.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a substrate cutting apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a substrate cutting apparatus according to an embodiment of the present invention.
(A) is a plan view of the XY drive mechanism of the substrate holder, and FIG.
(B) is a vertical sectional front view of the substrate cutting device, FIG. 1 (C) is a plan view showing carrying of the substrate holder with respect to the wheel cutter,
FIG. 1D is a vertical right side view of a main part of the substrate cutting apparatus.

As shown in FIGS. 1A and 1B, the substrate cutting apparatus includes an XY drive mechanism 4 and a vertical
4, a substrate table 6 on which the substrate 1 is placed, and a plurality of rotary blades which project the substrate 1 held on the lower surface of the substrate holder 5 onto the substrate table 6. A wheel cutter 7 for cutting the mold chips 2 arranged in the X and Y directions on the substrate 1 by cutting at 37, and disposed below the substrate table 6;
A separating and collecting means for separating and collecting the cut mold chips from the remaining pieces of the substrate; In addition, a liquid supply pipe 9 for supplying cutting fluid is provided in front of the wheel cutter 7 as shown in FIG. This is intended to prevent clogging of each rotary blade constituted by a diamond cutter and overheating due to cutting, and also to collect cuttings of the substrate 1 together with cutting waste liquid.

The XY drive mechanism 4 is shown in FIGS.
As shown in FIG. 1, a pair of front and rear guide rails 10a and 10a provided on the top plate 3 and the guide rails 10a and 1a
X movable base 11a provided so as to be movable on Xa in the X direction.
And a ball screw 12a for driving the X-movement base 11a
And an X drive motor 13a for driving the ball screw 12a to rotate forward and reverse, a pair of left and right guide rails 10b and 10b provided on the X moving base 11a, and movable in the Y direction on the guide rails 10b and 10b. Y provided in
It comprises a moving base 11b, a ball screw 12b for driving the Y moving base 11b, and a Y drive motor 13b for driving the ball screw 12b to rotate forward and reverse. Openings 3c and 11 are respectively provided on the top plate 3 and the X-movement stand 11a so that the vertical member 14 for the substrate holder can be moved.
c is formed.

The substrate holder 5 is attached to the lower end of a vertically extending member 14 vertically suspended at the center of the Y-movement gantry 11b, and this vertically extending member 14 is shown in FIGS. 1B and 1D. Actuator 15 that drives substrate holder 5 up and down by a predetermined stroke as described above,
5, a rotating gear 17 for rotating the substrate holder 5 forward and backward about the Z axis 16 by 90 °, a driving rack 18 thereof, and a solenoid 19 for driving the driving rack 18 forward and backward are incorporated. .

FIG. 2 shows a substrate holder 5 according to an embodiment of the present invention. FIG. 2 (A) is a longitudinal sectional front view of the substrate holder, FIG. 2 (B) is a longitudinal sectional side view of the substrate holder, and FIG.
2 (C) is a bottom view of the substrate holder, FIG. 2 (D) is an enlarged sectional view of a main part of the substrate holder showing a state in which wedges 26 and holding claws 28 which will be described later are at an elevated position, and FIG. FIG. 4 is an enlarged cross-sectional view of a main part of the substrate holder, showing a state where the holding claws 28 are at a lowered position.

As shown in FIG. 2, for example, the substrate holder 5 is provided with a movable frame 21 having a rectangular shape in a plan view, which is provided so as to be movable in a vertical (Z) direction and an XY direction via a support shaft 20. A column 22 suspended from four corners of the moving frame 21 in a plan view, a substrate holding frame 23 having a rectangular shape in a plan view fixed to a lower end thereof, and a second actuator 24 provided at a central portion of the moving frame 21. And a wedge holder 25 and a claw holder 27 which are raised and lowered by the second actuator 24 and have a rectangular shape in plan view.

The substrate holding frame 23 is shown in FIG.
As shown in FIG. 2, a substrate fitting recess 31 having a shape along the outer periphery of the substrate 1 on the lower surface thereof,
A plurality of blade passage grooves 32x and 32y formed respectively on the outer peripheral portion of the fitting concave portion 31 corresponding to the direction gap Sx and the Y direction gap Sy, and a plurality of contact pieces 33 that contact the upper surface of each mold chip 2. And a plurality of claw through-holes 34 opened to face the X-direction gap Sx of the mold chip 2.

The wedge holder 25 is fixed to the output shaft of the second actuator 24 via an elevating frame 25a, and a plurality (31) of each pair of the holding claws 28 of the claw holder 27 are expanded. Wedge 26
Is provided. The claw holder 27 is vertically movably supported by support rods 30 suspended from four corners of the wedge holder 25, and is inserted into each claw through hole 34 formed in the substrate holding frame 23. (31 pairs) pinching claws 28
28.

The pair of holding claws 28, 28 are shown in FIG.
As shown in (D), a gap through which the wedge 26 can pass is provided, and the upper end thereof is fixed to the claw holder 27, and the lower half thereof has the Y of the mold chip 2 as shown in FIG. 2 (B). 28s slits at intervals matching the direction arrangement pitch Py
Are formed. This is intended to facilitate the elastic deformation of the lower half of the holding claws 28 and to securely hold each mold chip 2. A similar slit 26s is formed in the lower half of each wedge 26.

The claw holder 27 is resiliently downwardly sprung by a resilient spring 35 via a collar 36. This is because the wedge holder 25 and the claw holder 27 can be moved up and down integrally by the second actuator 24 and can be separated from each other by the resilient spring 35 so that the wedge holder and the claw holder can be connected in series by a single lifting drive source. This is intended to make the holding and releasing operations of the mold chip 2 possible, that is, to simplify the driving source of the molding chip 2 by causing the two to approach each other against the resilient spring 35. is there. This substrate holder 5 operates as follows.

The substrate 1 is preliminarily positioned at a predetermined position on the substrate table 6 using the positioning pin holes 1c of the substrate 1 and positioning pins (not shown). The substrate 1 placed on the substrate table 6 by moving the substrate holder 5 down by the first actuator 15
3 and the contact piece 33 of the substrate holding frame 23 is brought into contact with the upper surface of each mold chip 2. In this state, the substrate 1 is slid on the substrate table 6 so that a large number (31
), The X-direction gap corresponding portion 1a of the substrate 1 is cut at one time by the wheel cutter 7 having the rotating blades 37. Next, the claw holder 27 is lowered together with the wedge holder 25 so that a plurality of pairs (31 pairs) of the holding claws 28, 28 penetrate into the respective claw through holes 34. The claw holder 27 stops descending when the lower end of the holding claw 28 contacts the substrate table 6.

Subsequently, the wedge holder 25 is lowered against the spring 35. As shown in FIGS. 2 (D) and 2 (E), claw expanding pieces 29, 29 are integrally formed on the inside of each pair of holding claws 28, 28, respectively.
By pressing and expanding the pair of claw expanding pieces 29, 29 to expand the pair of holding claws 28, the 30 rows of mold chips 2 arranged in the X direction are adjacent to each other.
8 at the lower end. Next, the substrate holder 5 is turned 90 ° by the solenoid 19 and the Y-direction gap corresponding portion 1b of the substrate 1 is cut by the wheel cutter 7 at a time.

As shown in FIGS. 1B and 1C, the wheel cutter 7 has a first rotary blade group 7 configured to be coaxially rotatable.
A and a second rotary blade group 7B, and a first rotary blade group 7A
After the mold chips 2 arranged in the X direction are cut at once, the substrate holder 5 is turned by 90 ° and the mold chips 2 arranged in the Y direction are collectively cut by the second rotary blade group 7B. It is configured.

As shown in FIG. 3, the first rotary blade group 7A
Consists of a plurality of (31) rotating blades 37 aligned with the X-direction arrangement pitch Px of the mold chips 2 mounted on the first cylindrical shaft 41 and fastened with the fastening nuts 43. 7B is a plurality (five) of rotary blades 3 arranged on the second cylindrical shaft 42 in alignment with the pitch Py of the mold chips 2 in the Y direction.
7 and fastened with a fastening nut 43.
The cylindrical shaft 41 and the second cylindrical shaft 42 are detachably fixed to one rotary drive shaft 40 via an intermediate tapered flange 44a and tapered flanges 44b at both ends, and are rotatably supported coaxially. I have. Each rotary blade 37 is formed of a diamond cutter.

The outer diameter of each of the cylindrical shafts 41 and 42 and each rotary blade 3
The gap with the inner diameter of the cylinder shaft insertion hole of No. 7 is set to less than 50 μ, and if the rotary blade 37 is independently mounted on each of the cylinder shafts 41 and 42, it is difficult to smoothly mount the rotary blade 37. Each rotary blade 37 is formed integrally with a spacer 38. However, the rotating blades 37 and the spacers 38 are alternately arranged, and the pitch Px · P
The arrangement may be such that y is aligned. 3 is a transmission pulley, and 46 is the first cylindrical shaft 41 and the second pulley.
A fastening nut for fixing the cylindrical shaft 42 of the
47 denotes tailstock shafts, respectively.

The widths Wx and Wy of the rotary blades 37 are slightly smaller than the gaps Sx and Sy in the X direction and the Y direction of the mold chip 2, respectively, and are set to be at least half the widths of the gaps Sx and Sy. . The substrate holder 5 is configured to be capable of cutting while repeatedly moving the rotary blade groups 7A and 7B in a lateral direction intersecting the cutting direction. This is intended to cut the gaps Sx and Sy of the substrate 1 by shaving the peripheral surface and the side surface of each rotary blade 37.

Thus, even when the gaps Sx and Sy in the XY directions are different due to different types of substrates, if the arrangement pitches Px and Py of the mold chips 2 are the same, the rotary blade 37 and its arrangement pitch are changed. Instead, just adjust the amount of horizontal repetition of the substrate holder 5,
The cutting width by the rotary blade 37 can be adapted to the gaps Sx and Sy. Incidentally, in the present embodiment, one repetition time of the substrate holder 5 in the horizontal direction is set to 0.5 second to 1 second.
It can be adjusted in the range of 5 seconds. Thus, the cutting speed of the substrate 1 can be appropriately set.

FIG. 4 shows the arrangement of the sorting and collecting means 8 provided below the substrate table 6, FIG. 4 (A) is a plan view thereof, FIG. 4 (B) is a front view thereof, and FIG. ) Is a right side view thereof. As shown in FIG. 4, the sorting / collecting unit 8 includes a first collecting unit 51 that is disposed behind the first rotary blade group 7A that constitutes the wheel cutter 7 and that collects both ends in the X direction. Before the two-rotation blade group 7B (the substrate holder 5
Collecting section 52 and the mold chip 2 which are arranged in this order in the lower side of the carrying direction and collect the remaining pieces at both ends in the Y direction.
A third collection unit 53 that collects only
Liquid recovery pallet 55 arranged below 52 and 53
It is composed of

Since the width of the outer peripheral edge portion of the substrate 1 is larger than the X-direction gap Sx and the Y-direction gap Sy, when the substrate is cut by the first rotary blade group 7A, a residue at both ends in the X direction is generated. When the substrate is cut by the second rotary blade group 7B, a residue at both ends in the Y direction is generated. As shown in FIG. 4A, first and second collecting holes 6a, 6a for collecting the remaining pieces at both ends of the substrate in the X direction are provided in the substrate table 6 for collecting these.
And second collecting holes 6b for collecting the remaining pieces at both ends of the substrate in the Y direction, and a third collecting hole 6c for collecting only the mold chip 2.

The first collecting section 51 is provided on the substrate table 6.
The liquid recovery container 51a is provided with a liquid recovery container 51a provided facing the first recovery holes 6a. The cutting waste liquid collected in step (1) is caused to flow down to the liquid collecting pallet 55 via the drain 54a, and the remaining pieces at both ends in the X direction of the substrate are collected in the wire netting container 51b. The cutting chips on the substrate 1 are collected on the liquid collecting pallet 55 together with the cutting waste liquid (the same applies hereinafter). The wire netting container 51b is configured to be taken out in the direction of arrow E.

The second collecting section 52 is provided on the substrate table 6.
And a wire mesh container 52b provided in an upper part of the liquid collecting container 52a, the liquid collecting container 52a being provided facing the second collecting holes 6b. The cutting fluid collected in step (1) is caused to flow down to the liquid collecting pallet 55 via the drain 54b, and the remaining pieces at both ends in the Y direction of the substrate are collected in the wire mesh container 52b. The wire mesh container 52b is configured to be taken out in the direction of arrow F.

The third collecting section 53 includes a substrate table 6
And a wire netting container 53b provided at an upper part in the liquid collecting container 53a. The liquid collecting container 53a is provided in the liquid collecting container 53a. The cutting fluid thus formed is caused to flow down to the liquid recovery pallet 55 via the drain 54c, and only the mold chip 2 is recovered in the wire netting container 53b. The wire mesh container 53b is configured to be taken out in the direction of arrow G (the front of the apparatus).

That is, after the Y-direction gap corresponding portion 1b of the substrate 1 is cut by the second rotary blade group 7B, the third collection hole 6c is cut.
By releasing the holding of the mold chips 2 by the holding claws 28 of the substrate holder 5 at the position of, the separated mold chips 2 can be collected by the third collecting unit 53. As a result, the operation of sorting the mold chip 2 and the remaining pieces can be eliminated. The cutting waste liquid flowing down to the liquid recovery pallet 55 contains cutting chips, and the waste liquid is filtered by a waste liquid treatment device (not shown) to separate the cutting chips, and the processing liquid is reused.

The present invention is not limited to the above embodiment, and various design changes can be made without departing from the gist of the present invention.

[Brief description of the drawings]

FIG. 1 shows a substrate cutting apparatus according to an embodiment of the present invention,
FIG. 1A is a plan view of a driving mechanism of the substrate holder, and FIG.
(B) is a vertical sectional front view of the substrate cutting device, FIG. 1 (C) is a plan view showing carrying of the substrate holder with respect to the wheel cutter,
FIG. 1D is a vertical sectional side view of a main part of the substrate cutting apparatus.

FIG. 2 shows a substrate holder according to an embodiment of the present invention,
2 (A) is a vertical front view of the substrate holder, FIG. 2 (B) is a vertical side view of the substrate holder, FIG. 2 (C) is a bottom view of the substrate holder, and FIG. 2 (D) is a clamping claw and wedge. Is an enlarged cross-sectional view of a main part of the substrate holder, showing a state where is at the ascending position, and FIG. 2E is an enlarged cross-sectional view of main parts of the substrate holder showing a state where the holding claws and wedges are at the lowered position. FIG.

FIG. 3 is a front view of the wheel cutter with a part cut away.

FIG. 4 shows an arrangement configuration of a separation and collection means according to the present invention,
4A is a plan view thereof, FIG. 4B is a front view thereof, and FIG. 4C is a right side view thereof.

FIG. 5 is a perspective view showing a method for cutting a substrate according to a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 1a ... X direction clearance corresponding part, 1b ... Y direction clearance corresponding part, 2 ... Mold chip, 5 ... Substrate holder, 6 ...
Substrate table, 7: wheel cutter, 21: moving frame, 23: substrate holding frame, 25: wedge holder,
26: wedge, 27: claw holder, 28: pinching claw, 31
... recesses for board fitting, 32x and 32y ... cutter passage grooves, 33 ...
Contact piece, 34: claw through hole, 37: rotary blade, Sx: X-direction gap between chips, Sy: Y-direction gap between chips.

Claims (2)

(57) [Claims] 1. A substrate holder (5) for holding a substrate (1), and a mold arranged to cut the substrate (1) held by the substrate holder (5) and arranged on the substrate (1) in the XY directions. In a substrate cutting device provided with a wheel cutter (7) for separating a chip (2), the substrate holder (5) is provided with a movable frame (21) movably provided in a vertical direction and an XY direction; A substrate holding frame (23) fixedly provided at the lower end of (21), and a wedge holder (25) provided to be vertically movable with respect to the substrate holding frame (23).
And a claw holder (27), wherein the substrate holding frame (23) has a substrate fitting recess (31) on its lower surface having a shape along the outer periphery of the substrate (1).
And the gap (Sx) in the X direction between the mold chips (2)
And a plurality of blade passage grooves (32x, 32y) formed in the outer peripheral portion of the substrate fitting concave portion (31) corresponding to the Y-direction gap (Sy), and the mold chips (2), respectively.
A plurality of contact pieces (33) that contact the upper surface of the plurality of claw through-holes (3) that are opened to face the gap (Sx) in the X direction.
4), the claw holder (27) includes a plurality of pairs of pinching claws (28, 28) inserted into the respective claw through holes (34), and the wedge holder (25) includes A plurality of wedges (26) for expanding the holding claws (28, 28), and lowering the substrate holder (5) to place the substrate (1) placed on the substrate table (6) into the substrate fitting recess. (3
The substrate (1) is slid on the substrate table (6) in a state where the substrate (1) is fitted into the substrate table (6) while the contact piece (33) is in contact with the upper surface of each mold chip (2). Numerous rotary blades (37) facing from below the substrate table (6)
The X-direction gap corresponding portion (1a) of the substrate (1) is cut at a time by the wheel cutter (7) having the above, and then the claw holder (27) is lowered to make a plurality of pairs of clamping claws (28. 28) is passed through each claw through hole (34), and at the same time, the wedge holder (25) is lowered to expand each pair of holding claws (28, 28) with each wedge (26). The mold chip (2) in the Y-column direction is clamped by the lower ends of the adjacent clamping claws (28, 28), and subsequently, the Y-direction gap corresponding portion (1b) of the substrate (1) is cut in a lump. An apparatus for cutting a substrate, comprising: 2. The substrate cutting apparatus according to claim 1, wherein the wedge holder (25) and the claw holder (27) are provided so as to be able to move up and down integrally and to be relatively close to and separated from each other, and to lower both together. Then, the holding claws (28, 28) penetrate into the respective claw through holes (34), and the lower ends of the holding claws (28, 28) are brought into contact with the substrate table (6) to thereby form the claw holder (27). And a pair of holding claws (28, 28) are expanded by each wedge (26) by lowering the wedge holder (25). .