JP3306483B2 - Electronic component substrate support - Google Patents

Electronic component substrate support

Info

Publication number
JP3306483B2
JP3306483B2 JP00675895A JP675895A JP3306483B2 JP 3306483 B2 JP3306483 B2 JP 3306483B2 JP 00675895 A JP00675895 A JP 00675895A JP 675895 A JP675895 A JP 675895A JP 3306483 B2 JP3306483 B2 JP 3306483B2
Authority
JP
Japan
Prior art keywords
printed circuit
electronic component
circuit board
component substrate
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP00675895A
Other languages
Japanese (ja)
Other versions
JPH08204362A (en
Inventor
修 小久保
Original Assignee
日本電気エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気エンジニアリング株式会社 filed Critical 日本電気エンジニアリング株式会社
Priority to JP00675895A priority Critical patent/JP3306483B2/en
Publication of JPH08204362A publication Critical patent/JPH08204362A/en
Application granted granted Critical
Publication of JP3306483B2 publication Critical patent/JP3306483B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は電子部品基板、例えばプ
リント基板の支持体に関し、特に該プリント基板の支持
体におけるプリント基板の挿抜案内構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support for an electronic component substrate, for example, a printed circuit board, and more particularly to a guide structure for inserting and removing a printed circuit board in the printed circuit board.

【0002】[0002]

【従来の技術】プリント配線基板ユニット(以下、プリ
ント基板)はコンピュータ等の構成部品として広く用い
られている。このプリント基板は、シェルフ等の支持体
に実装されて用いられる。プリント基板はメンテナンス
等のためにシェルフから挿抜自在とする必要がある。そ
のため、シェルフを固定し、プリント基板をガイドレー
ルに沿って挿抜する構成となっているのが通常である。
シェルフからプリント基板を容易且つ確実に挿抜するた
め、従来から種々の支持体の構造が考案されている。そ
の一例として実開平1−161385号公報に開示され
ている構造を図3に示す。
2. Description of the Related Art A printed wiring board unit (hereinafter, referred to as a printed board) is widely used as a component of a computer or the like. This printed board is used by being mounted on a support such as a shelf. The printed circuit board needs to be able to be inserted and removed from the shelf for maintenance or the like. For this reason, it is usual that the shelf is fixed and the printed circuit board is inserted and removed along the guide rail.
In order to easily and surely insert and remove the printed circuit board from the shelf, various types of support structures have been devised. FIG. 3 shows an example of the structure disclosed in Japanese Utility Model Laid-Open No. 1-161385.

【0003】図3において、符号1はプリント基板、2
aはシェルフ上面、2bはシェルフ底面、3はシェルフ
の左サイドプレート、4はシェルフの右サイドプレー
ト、11はガイドレール、12はガイドレール11を形
成する一対のリブである。なお、各図において同一また
は類似の機能の部材には共通の番号を付してある。プリ
ント基板1において、ガイドレール11との接触部には
コロが設けられ(図示省略)、プリント基板1とガイド
レール11との摩擦を小さくしてプリント基板の出し入
れを容易としている。
In FIG. 3, reference numeral 1 denotes a printed circuit board;
a is a shelf upper surface, 2b is a shelf bottom surface, 3 is a left side plate of the shelf, 4 is a right side plate of the shelf, 11 is a guide rail, and 12 is a pair of ribs forming the guide rail 11. In the drawings, members having the same or similar functions are denoted by common numbers. In the printed circuit board 1, a roller is provided at a contact portion with the guide rail 11 (not shown), so that friction between the printed circuit board 1 and the guide rail 11 is reduced to facilitate the taking in and out of the printed circuit board.

【0004】また、図4に示されるような支持体の構造
も知られている。この図において、8はガイドレール、
9はシェルフの上面及び底面に形成された開口部であ
る。また、図5はこの支持体の矢視図である。
[0004] A structure of a support as shown in FIG. 4 is also known. In this figure, 8 is a guide rail,
9 is an opening formed in the upper surface and the bottom surface of the shelf. FIG. 5 is an arrow view of the support.

【0005】図3に示した構造においては、1枚のプリ
ント基板1につきガイドレール11はそれぞれ一本とな
っていたが、この構造においては、シェルフの底面及び
上面に開口部を設けているので、ガイドレールは3本に
分割されている。プリント基板1は、ガイドレール8に
よって所定の位置に案内される。また、シェルフの上面
及び底面に形成された開口部を通じて空気が流通する構
成となっているので、強制空冷または自然空冷によって
プリント基板の冷却が可能となる。
In the structure shown in FIG. 3, one guide rail 11 is provided for each printed circuit board 1. In this structure, openings are provided on the bottom and top surfaces of the shelf. The guide rail is divided into three. The printed board 1 is guided to a predetermined position by a guide rail 8. In addition, since air is circulated through openings formed in the upper surface and the lower surface of the shelf, the printed circuit board can be cooled by forced air cooling or natural air cooling.

【0006】[0006]

【発明が解決しようとする課題】しかし、上記構造の支
持体では、プリント基板の冷却効率に課題が残されてい
る。例えば図3に示される支持体においては空気の流通
が悪く、プリント基板1から発散される熱がシェルフ内
部に蓄積されてプリント基板1上の回路が熱暴走するお
それがあった。図4に示される構造においては、シェル
フの底面及び上面に開口部を設けることで空気をある程
度流通させ、これによってプリント基板からの熱を発散
させている。しかし、この構造では、シェルフの底面ま
たは上面においてガイドレールが占める割合が大きいの
で、冷却用開口部の開口面積を大きくとることは困難と
なる。従って、自然空冷、強制空冷時共に流入抵抗が大
きくなり冷却効率はあまり高くならない。
However, in the support having the above structure, there is a problem in cooling efficiency of the printed circuit board. For example, in the support shown in FIG. 3, the flow of air is poor, and the heat radiated from the printed circuit board 1 is accumulated in the shelf, and the circuit on the printed circuit board 1 may run out of heat. In the structure shown in FIG. 4, air is circulated to some extent by providing openings on the bottom and top surfaces of the shelf, thereby dissipating heat from the printed circuit board. However, in this structure, since the guide rail occupies a large portion on the bottom surface or the top surface of the shelf, it is difficult to increase the opening area of the cooling opening. Therefore, the inflow resistance is increased in both the natural air cooling and the forced air cooling, and the cooling efficiency is not so high.

【0007】また、単にガイド部分を減らして開口部の
開口面積を大きくとってしまうと、プリント基板の挿抜
時にプリント基板がガイドレールと平行にスライドしな
くなって脱落するおそれがあり、正常な挿抜は行えな
い。さらにガイドレール自体の剛性も低下するので、ゆ
がみ、ひずみの発生によりシェルフの機能さえも満足で
きなくなる場合がある。
Further, if the guide portion is simply reduced to increase the opening area of the opening, the printed circuit board may not slide in parallel with the guide rails at the time of insertion and removal of the printed circuit board and may fall off. I can't. Further, since the rigidity of the guide rail itself is reduced, even the function of the shelf may not be satisfied due to distortion and distortion.

【0008】更に、上記のようなプリント基板1の挿抜
案内構造では、ガイドレールとプリント基板配線ユニッ
トとの接触面積が大きいので摩擦抵抗が大きくなり、滑
らかな挿抜が行えず、擦れた際に摩耗粉が発生するとい
う問題点もある。本発明の課題は、上記背景に鑑み、冷
却効率が高く容易且つ確実にプリント基板を案内するこ
とができるプリント基板の支持体を提供することにあ
る。
Further, in the above-described insertion / extraction guide structure of the printed circuit board 1, since the contact area between the guide rail and the printed circuit board wiring unit is large, frictional resistance is increased, and smooth insertion / extraction cannot be performed. There is also a problem that powder is generated. SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board support that can easily and reliably guide a printed circuit board with high cooling efficiency in view of the above background.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、電子部品基板、例えばプリント基板を複
数互いに平行且つ着脱自在に配列可能であり、その底面
に個々のプリント基板を所定の配列位置に案内するため
のガイドレールが形成されたプリント基板の支持体にお
いて、前記底面に開口部を設けて前記プリント基板の装
着時にはこの開口部を通じて流通する空気が前記プリン
ト基板を冷却するようにするとともに、前記開口部内
に、前記プリント基板が前記開口部を通過する際にこの
プリント基板を案内する棒状体を設け、前記棒状体の長
手軸が前記プリント基板の挿抜方向と略垂直となるよう
に構成されていることを特徴とする。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, a plurality of electronic component substrates, for example, a plurality of printed circuit boards can be arranged in parallel with each other in a detachable manner. In the printed circuit board support having guide rails formed thereon for guiding to the arrangement position, an opening is provided in the bottom surface so that air flowing through the opening cools the printed board when the printed circuit board is mounted. In the opening, a rod is provided for guiding the printed circuit board when the printed circuit board passes through the opening, and the longitudinal axis of the rod is substantially perpendicular to the insertion / removal direction of the printed circuit board. It is characterized by having such a configuration.

【0010】上記構成において、前記棒状体は、前記プ
リント基板の挿抜時に該プリント基板に接触してその長
手軸を中心に回動可能に構成することが好ましい。また
その形状は、例えばプリント基板の支持が可能で且つ空
気の流通を妨げない円柱状のロッドのような形状とする
ことが好ましい。開口部が大きい場合、前記棒状体は、
プリント基板が円滑に案内されるようにするため、プリ
ント基板が開口部にはまりこまない間隔で複数配置する
ことが好ましい。
In the above configuration, it is preferable that the rod-shaped member is configured to be rotatable about its longitudinal axis by contacting the printed circuit board when the printed circuit board is inserted and removed. In addition, the shape is preferably, for example, a cylindrical rod-like shape that can support a printed circuit board and does not hinder the flow of air. When the opening is large, the rod is
In order to smoothly guide the printed circuit boards, it is preferable to arrange a plurality of printed circuit boards at intervals so as not to fit into the openings.

【0011】[0011]

【作用】プリント基板の支持体の底面に開口部を設ける
ことで、前記プリント基板の装着時にはこの開口部を通
じて流通する空気により前記プリント基板が冷却され
る。この際、通常は支持体の強度を確保し、且つプリン
ト基板を円滑に案内するために、前記開口部をある程度
小さくする必要がある。そこで本発明では、開口部に棒
状体を設けたことによって支持体の強度が向上するの
で、開口部を大きくとることが可能となる。また、空気
の流通に与える影響も小さい。また、棒状体の長手軸を
前記プリント基板の挿抜方向と略垂直とすることで、プ
リント基板と棒状体との接触面積が小さくなるので、両
者の摩擦が小さくなり、プリント基板の挿抜を円滑に行
うことができる。また、棒状体をその長手軸を中心とし
て回動可能に構成することで、プリント基板を一層円滑
に挿抜することが可能となる。
By providing an opening on the bottom surface of the support of the printed circuit board, the printed circuit board is cooled by air flowing through the opening when the printed circuit board is mounted. At this time, in order to secure the strength of the support and to smoothly guide the printed circuit board, it is usually necessary to reduce the opening to some extent. Therefore, in the present invention, since the strength of the support is improved by providing the rod-shaped body in the opening, the opening can be made large. Further, the influence on the air circulation is small. In addition, by setting the longitudinal axis of the rod to be substantially perpendicular to the insertion / removal direction of the printed board, the contact area between the printed board and the rod is reduced, so that the friction between the two is reduced, and the insertion / extraction of the printed board is performed smoothly. It can be carried out. Further, by configuring the rod-shaped body to be rotatable about its longitudinal axis, it is possible to more smoothly insert and remove the printed circuit board.

【0012】[0012]

【実施例】以下、図面を参照して本発明の実施例を詳細
に説明する。図1は本発明の一実施例に係るプリント基
板の支持体(シェルフ)の斜視図、図2はその矢視図で
ある。これらの図において、5aはシェルフ上面、5b
はシェルフ底面、6はロッド(棒状体)、7は回路等の
発熱体である。シェルフ底面5bの中央には開口部10
が設けられている。開口部10の中央部にはロッド6が
設けられ、その長手方向の軸は、プリント基板1の挿入
方向と垂直となっている。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of a printed circuit board support (shelf) according to an embodiment of the present invention, and FIG. In these figures, 5a is the upper surface of the shelf, 5b
Denotes a bottom surface of the shelf, 6 denotes a rod (rod-like body), and 7 denotes a heating element such as a circuit. An opening 10 is provided at the center of the shelf bottom 5b.
Is provided. A rod 6 is provided at the center of the opening 10, and its longitudinal axis is perpendicular to the insertion direction of the printed circuit board 1.

【0013】この構造において、プリント基板1は、シ
ェルフ底面5bのガイドレール8によって所定の位置に
案内される。プリント基板1が開口部を通過する際、プ
リント基板1はロッド6上を通過する。
In this structure, the printed circuit board 1 is guided to a predetermined position by a guide rail 8 on the shelf bottom surface 5b. When the printed board 1 passes through the opening, the printed board 1 passes over the rod 6.

【0014】開口部10が大きいとプリント基板1を挿
抜する際に、その自重によりプリント基板1の後下端部
が開口部10にはまりこみ、シェルフの上面と底面との
間に挟まれて摩擦により挿抜できなくなるおそれがある
が、上記のようにロッド6を設けることで、開口部10
が大きくてもプリント基板1が開口部10にはまりこむ
おそれはなくなる。
If the opening 10 is large, when inserting or removing the printed circuit board 1, the rear end of the printed circuit board 1 is inserted into the opening 10 due to its own weight, and is sandwiched between the upper surface and the bottom surface of the shelf. Although there is a possibility that insertion and removal may not be possible, by providing the rod 6 as described above, the opening 10
Even if the size is large, there is no possibility that the printed circuit board 1 gets stuck in the opening 10.

【0015】また、ロッド6の長手方向の軸はプリント
基板1の挿入方向に対して直角となっており、プリント
基板1とロッド6との接触面積は小く摩擦も小さい。従
ってプリント基板1の挿抜も容易である。更に、ロッド
6は円筒形状のため、プリント基板配線ユニット1が開
口部10を通過時、プリント基板1の後下端部が脱落し
かけても正規の挿入方向へガイドすることが可能であ
る。なお、このロッド6はその長手軸を中心にして回動
可能とすることもできる。この場合、ロッド6は”こ
ろ”として働き、プリント基板1の挿抜が一層円滑にさ
れる。
The longitudinal axis of the rod 6 is perpendicular to the insertion direction of the printed circuit board 1, so that the contact area between the printed circuit board 1 and the rod 6 is small and the friction is small. Therefore, insertion and removal of the printed circuit board 1 are also easy. Furthermore, since the rod 6 has a cylindrical shape, when the printed circuit board wiring unit 1 passes through the opening 10, the printed circuit board 1 can be guided in the normal insertion direction even if the rear lower end portion of the printed circuit board 1 is dropped off. The rod 6 may be rotatable around its longitudinal axis. In this case, the rod 6 functions as a "roller", and the insertion and removal of the printed circuit board 1 is further facilitated.

【0016】また、従来に比べて開口部10の占める面
積が相対的に大きいので、冷却風はシェルフの上下方
向、通常は下から上へ効率よく吹き抜け、プリント基板
1に設けられた発熱体7の冷却効率を上げることが可能
となる。なお、上述のようにロッド6は細い円筒形状な
ので、冷却風が通過する際の損失は殆ど無視できるもの
である。
Further, since the area occupied by the opening 10 is relatively large as compared with the conventional case, the cooling air can efficiently blow through the shelf in the vertical direction, usually from the bottom to the top. Cooling efficiency can be increased. Since the rod 6 has a thin cylindrical shape as described above, the loss when the cooling air passes can be almost ignored.

【0017】通常、シェルフ底面5bの開口部10の開
口率を大きくとるとその剛性が低下するが、本実施例に
おいてはロッド6を配したことで、ゆがみやひずみ
えられ、シェルフ全体の剛性も向上する。
[0017] Normally, larger take the rigidity of the opening ratio of the opening 10 of the shelf bottom 5b is lowered, by which arranged rod 6 in the present embodiment, distortion or distortion suppression <br/> Erare Also, the rigidity of the entire shelf is improved.

【0018】この実施例では開口部10にロッド6を一
本だけ設けた構成となっているが、開口部10が大き
く、ロッド6を一本設けただけではロッド6と開口部1
0の端部との間にプリント基板1がはまりこむおそれが
ある場合には、複数のロッド6を所定間隔で複数並設し
てもよい。このようにすれば、より一層プリント基板1
の挿抜が円滑になる利点もある。
In this embodiment, only one rod 6 is provided in the opening 10. However, the opening 10 is large, and if only one rod 6 is provided, the rod 6 and the opening 1 are provided.
If there is a possibility that the printed circuit board 1 will fit between the end portions of the printed circuit board 0, a plurality of rods 6 may be arranged in parallel at a predetermined interval. By doing so, the printed circuit board 1 can be further improved.
There is also an advantage that the insertion and removal of the device becomes smooth.

【0019】更に、開口部10をより大きくとること
で、シェルフ底面5bとプリント基板1との接触面積が
減り、摩擦抵抗が減少する。従って、シェルフ底面5b
とプリント基板1との摩擦により発生する摩耗粉の発生
も抑えられる。なお、以上プリント基板について説明し
たが、プリント基板に類する他の電子部品基板について
も同様に本実施例を適用できることはいうまでもない。
Further, by making the opening 10 larger, the contact area between the shelf bottom surface 5b and the printed circuit board 1 is reduced, and the frictional resistance is reduced. Therefore, the shelf bottom surface 5b
The generation of abrasion powder generated by friction between the substrate and the printed circuit board 1 is also suppressed. Although the printed circuit board has been described above, it goes without saying that the present embodiment can be similarly applied to other electronic component boards similar to the printed circuit board.

【0020】[0020]

【発明の効果】以上説明したように、本発明によれば、
電子部品基板が挿抜時に棒状体によって支持されるの
で、開口部を大きくしてもその電子部品基板が開口部に
はまりこんでしまうことはなく、しかも棒状体が電子部
品基板の支持体底面の補強材ともなるので、支持体の底
面の強度が高まり、底面のゆがみやひずみが抑制される
効果がある。
As described above, according to the present invention,
Since the electronic component substrate is supported by the rod-shaped body during insertion / removal, even if the opening is enlarged, the electronic component substrate is not stuck in the opening, and the rod-shaped body is a reinforcing material for the bottom surface of the support of the electronic component substrate. Therefore, there is an effect that the strength of the bottom surface of the support is increased and distortion and distortion of the bottom surface are suppressed.

【0021】また、電子部品基板と棒状体の接触面積が
小さく、摩擦が小さくなるので、電子部品基板の挿抜案
内が円滑になる効果がある。特に、棒状体の形状を円筒
形とすると、従来の板金製のガイドレールに比べて剛性
が向上し、電子部品基板配線ユニットとガイドレールと
の間で摩擦により発生する摩耗粉も抑えられ、信頼性が
向上する。
Further, since the contact area between the electronic component substrate and the rod-shaped body is small and the friction is reduced, there is an effect that the insertion / extraction guide of the electronic component substrate becomes smooth. In particular, when the rod-shaped body is cylindrical, the rigidity is improved as compared with the conventional sheet metal guide rail, and the abrasion powder generated by friction between the electronic component substrate wiring unit and the guide rail is suppressed, and the reliability is improved. The performance is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例に係る支持体の斜視図。FIG. 1 is a perspective view of a support according to one embodiment of the present invention.

【図2】本発明の一実施例に係る支持体の矢視図。FIG. 2 is an arrow view of a support according to one embodiment of the present invention.

【図3】従来例に係る支持体の説明図。FIG. 3 is an explanatory view of a support according to a conventional example.

【図4】従来例に係る支持体の説明図。FIG. 4 is an explanatory view of a support according to a conventional example.

【図5】従来例に係る支持体の矢視図。FIG. 5 is an arrow view of a support according to a conventional example.

【符号の説明】[Explanation of symbols]

1 プリント基板 3 左サイドプレート 4 右サイドプレート 5a シェルフ上面 5b シェルフ底面 6 ロッド 7 発熱体 8 ガイドレール 10 開口部 DESCRIPTION OF SYMBOLS 1 Printed circuit board 3 Left side plate 4 Right side plate 5a Shelf top surface 5b Shelf bottom surface 6 Rod 7 Heating element 8 Guide rail 10 Opening

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 複数の電子部品基板を互いに平行且つ着
脱自在に配列可能であり、その底面に個々の電子部品基
板を所定の配列位置に案内するためのガイドレールが形
成された電子部品基板の支持体において、 前記底面に開口部を設けて前記電子部品基板の装着時に
この開口部を通じて流通する空気が前記電子部品基板を
冷却するようにするとともに、前記開口部内に、前記電
子部品基板が前記開口部を通過する際にこの電子部品基
板を案内する棒状体を設け、前記棒状体の長手軸が前記
電子部品基板の挿抜方向と略垂直となるように構成され
ている、電子部品基板の支持体。
1. An electronic component substrate, comprising: a plurality of electronic component substrates which can be arranged in a parallel and detachable manner with each other; and a guide rail formed on a bottom surface for guiding each electronic component substrate to a predetermined arrangement position. In the support, an opening is provided in the bottom surface so that air flowing through the opening cools the electronic component substrate when the electronic component substrate is mounted, and the electronic component substrate is provided in the opening. the rod-like member to guide the electronic component substrate when passing through the opening is provided, the longitudinal axis of the rod-shaped member has been configured such that the insertion direction substantially perpendicular of the electronic component substrate, the support of the electronic component substrate body.
【請求項2】 請求項1記載の電子部品基板の支持体に
おいて、 前記棒状体は、前記電子部品基板の挿抜時に該電子部品
基板に接触してその長手軸を中心に回動可能に構成され
ている、電子部品基板の支持体。
2. The electronic component substrate support according to claim 1, wherein the rod-shaped member is configured to be rotatable about its longitudinal axis by contacting the electronic component substrate when the electronic component substrate is inserted and removed. Tei Ru, the support of the electronic component substrate.
JP00675895A 1995-01-19 1995-01-19 Electronic component substrate support Expired - Fee Related JP3306483B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP00675895A JP3306483B2 (en) 1995-01-19 1995-01-19 Electronic component substrate support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00675895A JP3306483B2 (en) 1995-01-19 1995-01-19 Electronic component substrate support

Publications (2)

Publication Number Publication Date
JPH08204362A JPH08204362A (en) 1996-08-09
JP3306483B2 true JP3306483B2 (en) 2002-07-24

Family

ID=11647088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP00675895A Expired - Fee Related JP3306483B2 (en) 1995-01-19 1995-01-19 Electronic component substrate support

Country Status (1)

Country Link
JP (1) JP3306483B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002098198A1 (en) * 2001-05-25 2002-12-05 Mitsubishi Denki Kabushiki Kaisha Sub rack and sub rack guide plate

Also Published As

Publication number Publication date
JPH08204362A (en) 1996-08-09

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