JPS6113991U - Printed wiring board cooling device - Google Patents

Printed wiring board cooling device

Info

Publication number
JPS6113991U
JPS6113991U JP9900584U JP9900584U JPS6113991U JP S6113991 U JPS6113991 U JP S6113991U JP 9900584 U JP9900584 U JP 9900584U JP 9900584 U JP9900584 U JP 9900584U JP S6113991 U JPS6113991 U JP S6113991U
Authority
JP
Japan
Prior art keywords
printed wiring
cooling device
wiring board
opening
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9900584U
Other languages
Japanese (ja)
Inventor
啓介 小田
祥三 北村
聖 高桑
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP9900584U priority Critical patent/JPS6113991U/en
Publication of JPS6113991U publication Critical patent/JPS6113991U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第1図は従来のプリント配線基板の冷却装置の内部を示
す正面図、第2図は上側支持板の斜視図、第3図は下側
支持板の斜面図、第4図はこの考案に係るプリント配線
基板の冷却装置の内部を示す正面図、第5図は上側支持
板の斜視図、第6図は上側支持板の他の例を示す斜視図
、第7図および第8図は上側支持板のさらに他の例を示
す斜視図である。 1・・・密閉容器、21〜2n・・・プリント配線基板
、3・・・間隔、4・・・上側支持板、5・・・下側支
持板、8,9・・・開口、15・・・送風機、17.1
7A・・・風向板。 なお、図中同一符号は同一もしくは相当部分を示す。
[Brief Description of the Drawings] Figure 1 is a front view showing the inside of a conventional printed wiring board cooling device, Figure 2 is a perspective view of the upper support plate, Figure 3 is a perspective view of the lower support plate, and Figure 3 is a perspective view of the upper support plate. 4 is a front view showing the inside of the cooling device for a printed wiring board according to this invention, FIG. 5 is a perspective view of the upper support plate, FIG. 6 is a perspective view showing another example of the upper support plate, and FIG. 7 and FIG. 8 is a perspective view showing still another example of the upper support plate. DESCRIPTION OF SYMBOLS 1... Sealed container, 21-2n... Printed wiring board, 3... Spacing, 4... Upper support plate, 5... Lower support plate, 8, 9... Opening, 15. ...Blower, 17.1
7A...Wind direction board. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 密閉容器内に複数のプリント配線基板が所定間隔を存し
、かつ上下両端を1対の支持板に支持されて並列設定さ
れ、上記両支持板にプリント配線基板の間隔に対応する
開口がそれぞれ形成されており、上記下側支持板の開口
から空気流を強制導入し上記間隔を通して上側支持板の
開口から吹き出],循環させる送風機を密閉容器内に備
えたプリント配線基板の冷却装置において、上記上側支
持板の開口に、この開口から吹き出される空気流を少く
とも一側方に指向させる風向板を設けたことを特徴とす
るプリント配線基板の冷却装置。
A plurality of printed wiring boards exist in a sealed container at predetermined intervals, and are set in parallel with both upper and lower ends supported by a pair of support plates, and openings corresponding to the spacing of the printed wiring boards are formed in each of the support plates. In a cooling device for a printed wiring board, which is equipped with a blower in a sealed container that circulates the air by forcibly introducing it from the opening in the lower support plate and blowing it out from the opening in the upper support plate through the above-mentioned interval, 1. A cooling device for a printed wiring board, characterized in that an opening in a support plate is provided with a wind direction plate that directs air flow blown out from the opening to at least one side.
JP9900584U 1984-06-29 1984-06-29 Printed wiring board cooling device Pending JPS6113991U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9900584U JPS6113991U (en) 1984-06-29 1984-06-29 Printed wiring board cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9900584U JPS6113991U (en) 1984-06-29 1984-06-29 Printed wiring board cooling device

Publications (1)

Publication Number Publication Date
JPS6113991U true JPS6113991U (en) 1986-01-27

Family

ID=30658521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9900584U Pending JPS6113991U (en) 1984-06-29 1984-06-29 Printed wiring board cooling device

Country Status (1)

Country Link
JP (1) JPS6113991U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0281463A (en) * 1988-09-16 1990-03-22 Hitachi Ltd Cooled mounting structure of semiconductor device and method of cooling
JPH02127093U (en) * 1989-03-30 1990-10-19
JP2009206168A (en) * 2008-02-26 2009-09-10 Nec Corp Cooling structure of electronic apparatus, its manufacturing method and cooling method of electronic apparatus
JP2012084639A (en) * 2010-10-08 2012-04-26 Hino Motors Ltd Inlet structure of electric storage box
JP2012156367A (en) * 2011-01-27 2012-08-16 Nec Network Products Ltd Cooling device of shelf using baffle plate, shelf having cooling device and cooling method
JP2014158051A (en) * 2014-05-19 2014-08-28 Nippon Telegr & Teleph Corp <Ntt> Air flow optimization means in mounting ict device on cabinet

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0281463A (en) * 1988-09-16 1990-03-22 Hitachi Ltd Cooled mounting structure of semiconductor device and method of cooling
JPH02127093U (en) * 1989-03-30 1990-10-19
JP2009206168A (en) * 2008-02-26 2009-09-10 Nec Corp Cooling structure of electronic apparatus, its manufacturing method and cooling method of electronic apparatus
JP2012084639A (en) * 2010-10-08 2012-04-26 Hino Motors Ltd Inlet structure of electric storage box
JP2012156367A (en) * 2011-01-27 2012-08-16 Nec Network Products Ltd Cooling device of shelf using baffle plate, shelf having cooling device and cooling method
JP2014158051A (en) * 2014-05-19 2014-08-28 Nippon Telegr & Teleph Corp <Ntt> Air flow optimization means in mounting ict device on cabinet

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