JP3296251B2 - Piezoelectric component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component,
The present invention relates to a piezoelectric component used as a filter, an oscillator, a discriminator, and the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 21 shows an example of a conventional piezoelectric component.
The piezoelectric component 80 has a case 81 in which a piezoelectric resonator 85 having vibrating electrodes 83 and 84 on the upper and lower surfaces of a piezoelectric substrate 82 and vibrating in area is sandwiched between a pair of holding terminals 91 and 92 inside a case 81. It is. The case 81 includes an inner case 81a, an inner lid 81b thereof, and an outer case 81c. The external connection portions 91b and 92b of the holding terminals 91 and 92 are drawn out of the outer case 81c through the side wall of the inner case 81a, and the opening of the outer case 81c is sealed with a sealing resin 86 and an inflow prevention sheet 87 thereof. .

The electrode portions 91a, 92 of the holding terminals 91, 92
“a” is curved toward the piezoelectric resonator 85, and exerts a good spring property by the stroke of the electrode portions 91 a and 92 a. Each of the electrode portions 91a and 92a has a protruding holding portion 93 and 94 at the center thereof, and smooth press contact surfaces 93a and 94a of the protruding holding portions 93 and 94 are provided on the upper and lower surfaces of the piezoelectric resonator 85. The vibrating electrodes 83 and 84 are elastically pressed against each other.

[0004]

By the way, in the conventional piezoelectric component 80 which vibrates in area, the projection-like holding portions 93 and 94 are provided.
It is necessary to reduce the area of the press contact surfaces 93a and 94a as much as possible, support the piezoelectric resonator 85 at the node point, and prevent damping. However, the pressing surfaces 93a, 9
When 4a is reduced, the pressure contact force concentrates on a local portion of the piezoelectric resonator 85, and therefore, the piezoelectric resonator 85 is easily damaged, and there is a problem that the impact resistance is weak. Also, the vibrating electrodes 83, 84
May be scraped off by the protruding holding portions 93 and 94, which may cause poor conduction. Further, the pressing surfaces 93a, 9
Since 4a is a smooth surface, the piezoelectric resonator 85 tends to rotate, tilt, or deviate from a predetermined position, and the electrical characteristics of the piezoelectric component 80 tend to be unstable.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a piezoelectric component having a holding terminal capable of reliably and stably holding a piezoelectric resonator with a small influence of damping, and a method of manufacturing the same. .

[0006]

In order to achieve the above object, a piezoelectric component according to the present invention is designed to reduce the surface roughness of at least one of the holding terminals by adjusting the surface roughness of the vibration electrode of the piezoelectric resonator. It is characterized by being rougher than the surface roughness. Here, the holding portion of the holding terminal specifically has a plurality of conductive cilia or a plurality of minute projections.

With the above configuration, the surface roughness of the holding portion of the holding terminal is larger than the surface roughness of the vibration electrode of the piezoelectric resonator, so that the contact area between the holding portion and the vibration electrode is small, and the holding portion and the vibration electrode do not adhere. . Therefore, the vibration generated in the piezoelectric resonator is less likely to be damped. In addition, the contact state between the holding part and the vibration electrode changes from the conventional surface contact at a single point to point contact at a plurality of points. The effect can be almost ignored. Therefore, the holding portion can be brought into point contact over a wide range of the piezoelectric resonator, and the piezoelectric resonator is reliably and stably supported.

Further, in the piezoelectric component according to the present invention, the height of the tip surface of the minute projection formed at the center of the holding portion of the holding terminal may be higher than the height of the tip surface of the minute projection formed at the edge portion. Alternatively, it is characterized in that the area of the tip end surface of the micro projections arranged at the center portion of the holding portion is larger than the area of the tip end surface of the micro projections arranged at the edge portion. Thus, the piezoelectric resonator is reliably supported mainly at the central portion of the holding portion, and the displacement of the piezoelectric resonator is suppressed.

Further, the method of manufacturing a piezoelectric component according to the present invention includes a step of providing a plating resist film on a surface of a conductive mother substrate; a step of providing a plurality of pinholes in the plating resist film; A step of growing a conductive metal on the surface of the conductive mother substrate exposed from the pinhole, and removing a plating resist film from the conductive mother substrate to form a plurality of conductive metals on the surface of the conductive mother substrate. A step of forming fine projections, and holding the conductive mother substrate by cutting out the conductive mother substrate at a predetermined size, and including a holding portion having the fine projections and having a surface roughness greater than that of the vibration electrode of the piezoelectric resonator; Forming a terminal.

Further, in the method of manufacturing a piezoelectric component according to the present invention, an unnecessary portion of the insulator film provided on the surface of the conductive mother substrate is removed until the surface of the conductive mother substrate is exposed. Forming a plurality of minute projections on the conductive mother substrate, forming a conductive film on the surface of the conductive mother substrate provided with the minute projections, and forming the conductive mother substrate into a predetermined size. Forming a holding terminal having a holding portion having fine projections provided on the surface of the conductive coating and having a surface roughness greater than that of the vibration electrode of the piezoelectric resonator. It is characterized by the following.

According to the above method, a holding terminal having a holding portion having fine projections and a surface roughness greater than that of the vibration electrode of the piezoelectric resonator can be manufactured with high productivity.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a piezoelectric component and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings. In each embodiment, the same components and the same portions are denoted by the same reference numerals.

[First Embodiment, FIGS. 1 to 6] As shown in FIG. 1, a piezoelectric component 1 according to a first embodiment includes a vibrating electrode 12 on the upper and lower surfaces of a piezoelectric substrate 14 inside a case 11. A piezoelectric resonator 15 having an area 13 and having an area vibration is sandwiched between a pair of holding terminals 21 and 22 made of phosphor bronze or the like with an appropriate pressing force.

The holding terminals 21 and 22 are connected to the electrode 2
1a, 22a, external connection portions 21b, 22b, and holding portion 21
c, 22c. Holders 21c, 22c
Are the electrode portions 21a and 22a and the external connection portions 21b and 22b
Are manufactured separately by a method described later.
The press contact surfaces 23a, 23b of the holding portions 21c, 22c
Each of the vibration electrodes 12 and 13 of the piezoelectric resonator 15 is pressed against the entire surface. As shown in FIG.
The minute protrusions 32 are formed on 3a and 23b, and the surface roughness of the press contact surfaces 23a and 23b is set to be larger than the surface roughness of the vibrating electrodes 12 and 13.

The case 11 comprises an inner case 11a, an inner lid 11b and an outer case 11c. The piezoelectric resonator 15 is housed in the inner case 11a,
b, and is covered with the outer case 11c.
The external connection portions 21b and 22b of the holding terminals 21 and 22 are drawn out of the outer case 11c through the side wall of the inner case 11a, and the opening of the outer case 11c is sealed by the seal resin 16 and the inflow prevention sheet 17 thereof. .

In the piezoelectric component 1 having the above-described structure, the surface roughness of the press-contact surfaces 23a and 23b of the holding portions 21c and 22c is made larger than the surface roughness of the vibrating electrodes 12 and 13, so that the vibration with the holding portions 21c and 22c. The contact area of each of the electrodes 12 and 13 is small, and the holding portions 21c and 22c and the vibrating electrode 1
2 and 13 do not adhere. Therefore, the vibration generated in the piezoelectric resonator 15 is less likely to be damped. Also, the holding unit 2
1c and 22c and the vibrating electrodes 12 and 13 are changed from the conventional surface contact at a single point to point contact at a plurality of points. Therefore, even if the holding parts 21c and 22c are brought into contact with a point other than the node point of the piezoelectric resonator 15. The effect of damping can be almost ignored. For this reason, the holding portions 21c and 22c can be brought into point contact over a wide range of the piezoelectric resonator 15, and the piezoelectric resonator 15 can be reliably and stably supported without rotating or causing a positional shift. be able to.

Further, experiments performed by the present inventors will be described in detail using specific numerical values. As shown in FIG. 3A, the surface roughness of the holding portions 21c and 22c (that is, the pressing surfaces 23a and
The piezoelectric component 1 in which the piezoelectric resonator 15 was sandwiched between the holding terminals 21 and 22 having the height Rmax of the minute projections 23b of about 22 μm was prepared. At this time, the vibration electrode 1 of the piezoelectric resonator 15
The surface roughness (Rmax) of each of the samples 2 and 13 was about 6 μm as shown in FIG. For comparison, a piezoelectric resonator in which a piezoelectric resonator is sandwiched between holding terminals having a surface roughness (Rmax) of about 6 μm (see FIG. 3B) and 0.5 μm or less (see FIG. 3C), respectively, for comparison. Components B and C and a conventional piezoelectric component D (see FIG. 21) were prepared together.

Then, the impedance characteristics and the phase characteristics of these prepared piezoelectric components were measured. FIG. 4 is a graph showing the measurement results. In FIG. 4, solid lines A1,
A2 indicates the impedance characteristic and the phase characteristic of the piezoelectric component 1 provided with the holding terminals 21 and 22 having the holding parts 21c and 22c having the surface roughness of about 22 μm, respectively. Solid line B
Numerals 1 and B2 indicate the impedance characteristic and the phase characteristic of the piezoelectric component B having the holding terminal with the holding part having a surface roughness of about 6 μm. Solid lines C1 and C2 indicate the impedance characteristics and the phase characteristics of the piezoelectric component C having the holding terminals with the holding unit having a surface roughness of about 0.5 μm or less. Dotted lines D1 and D2 indicate impedance characteristics and phase characteristics of the conventional piezoelectric component D having a holding terminal having a protruding holding portion having a smooth pressure contact surface.

From the graph, it can be seen that the piezoelectric component C in which the surface roughness of the holding portion is smaller than the surface roughness of the vibration electrode of the piezoelectric resonator is largely damped, and unnecessary vibration is also generated (see solid lines C1 and C2). Also, the piezoelectric component B whose surface roughness of the holding portion is substantially the same as the surface roughness of the vibration electrode is considerably damped (see solid lines B1 and B2). However, the piezoelectric component 1 in which the surface roughness of the holding parts 21c and 22c is larger than the surface roughness of the vibrating electrodes 12 and 13 is different from that of the holding parts 21c and 22.
Despite the fact that c is in contact with a point other than the node point of the piezoelectric resonator 15, it is hardly damped (solid line A1,
A2). That is, the piezoelectric component 1 has the dotted lines D1 and D2.
The characteristics almost equivalent to the characteristics of the conventional piezoelectric component D indicated by are obtained.

Here, the holding portions 21 of the holding terminals 21 and 22
A first example of a method for manufacturing c and 22c will be described with reference to FIG. As shown in FIG. 5A, on the surface of the conductive mother substrate 3, a plating resist film 31 slightly thicker than a desired height of the minute projections is formed. Examples of the material of the conductive mother substrate 3 include a single metal such as Cu, Al, Fe, and Ni, an alloy such as nickel silver, phosphor bronze, stainless steel, and Monel, or an insulating plate provided with a conductive film. Is used. Next, FIG.
As shown in (B), pinholes 31a having an arbitrary diameter are formed in the plating resist film 31 by, for example, about 5 per 1 mm ² by photolithography or laser irradiation. The surface of the conductive mother substrate 3 is exposed from the pinhole 31a.

Then, Ag, Cu, and A are formed on the mother substrate 3 exposed from the pinhole 31a by an electrolytic plating method or the like.
After forming a conductive material such as u or Al, the plating resist film 3 is formed.
1 is removed and, for example, as shown in FIG.
The conductive minute projections 32 having a height of about m to 100 μm are formed stably with high dimensional accuracy. In addition, the minute protrusion 32 is
A multilayer structure may be formed by plating a plurality of times. For example, a two-layer structure of a lower layer made of Fe and an upper layer made of Ag may be formed by performing plating twice. If necessary, the fine protrusions 32 may be thinned by etching or the like, or a conductive material may be applied to the fine protrusions 32 by plating, coating, or the like.
May be reinforced.

Next, the mother substrate 3 on which a plurality of minute projections 32 are formed is cut out by a predetermined size by cutting, pressing, laser or the like, and the holding portion 21c shown in FIG.
22c is manufactured. The holding portions 21c and 22c are attached to the electrode portions 21a and 22a of the holding terminals 21 and 22, respectively, using a conductive adhesive or the like.

Next, a second example of a method of manufacturing the holding portions 21c and 22c will be described with reference to FIG. As shown in FIG. 6A, an insulating film 33 of a predetermined thickness made of ceramic, glass, resin or the like is formed on a surface of a conductive mother substrate 3 made of a metal plate by a known method such as printing. . Next, the insulating film 3 is etched or laser-processed.
3 are removed, and a plurality of minute projections 33a are formed stably with high dimensional accuracy as shown in FIG. Then, as shown in FIG. 6C, the minute protrusions 33a are coated with a conductive thin film 34 made of Ag, Cu, Ni, Al, or an alloy such as Monel by a PVD method such as plating, vapor deposition, or sputtering. I do. At this time, the conductive thin film 34 may have a multilayer structure. In this manner, the mother substrate 3 on which the plurality of minute projections 33a are formed is cut out for each predetermined size,
The holding parts 21c and 22c shown in FIG. 1 are manufactured. In particular, when the insulating film 33 is made of a resin material, elastic minute projections 33a can be formed.

As described above, according to the manufacturing method of the holding portions 21c and 22c of the first and second examples, the minute projections 32 and 33a can be formed in the state of the mother substrate 3, and the holding portions with good dimensional accuracy can be obtained. 21c and 22c can be efficiently and stably manufactured. As a result, the holding terminals 21 and 22 can be manufactured by a method excellent in mass productivity. Further, by changing the cut-out dimension from the mother board 3, the holding portions 21c and 22c of an arbitrary size can be obtained, so that the specification can be easily changed. And the holding unit 2
Since the electrodes 1c and 22c are separate from the electrode portions 21a and 22a, it is possible to select a material suitable for each function, to increase the degree of freedom in design, to improve characteristics and reduce costs. be able to.

[Second Embodiment, FIGS. 7 to 13] As shown in FIG. 7, the holding terminal 35 used in the piezoelectric component of the second embodiment includes an electrode portion 35a, an external connection portion 35b, and a holding portion 3.
5c. The holding portion 35c is composed of a plurality of conductive cilia 36 provided directly on the electrode portion 35a at an appropriate density. However, as in the first embodiment, a plurality of conductive cilia may be cut out of a conductive mother substrate having a surface formed on the surface in desired sizes, and attached to the electrode portions 35a with a conductive adhesive or the like. .

The size of the conductive cilia 36 is preferably 100 μm or less. If the conductive cilia 36 becomes too long,
This is because the conductive cilia easily bends and the positioning of the piezoelectric resonator 15 becomes difficult. The conductive cilia 36 is disposed so that the length direction is substantially perpendicular to the electrode portion 35a. Examples of the material of the conductive cilia 36 include metal, carbon fiber, glass fiber, insulating whisker or the like coated with a conductive metal material, or heat-resistant fiber with metal plating, vapor deposition, sputtering, or the like. A treated one and a conductive whisker are used.

As shown in FIG. 8, the pair of holding terminals 35 sandwich the piezoelectric resonator 15 with an appropriate pressing force, and then housed in a case (not shown) to form a piezoelectric component 38. In the piezoelectric component 38, the surface of the holding portion 35c of the holding terminal 35 is rougher than the surfaces of the vibrating electrodes 12, 13 of the piezoelectric resonator 15, so that the contact area between the holding portion 35c and the vibrating electrodes 12, 13 is small, and the holding portion 35c And the vibrating electrodes 12 and 13 do not adhere. In addition, the conductive cilia 36 is substantially vertically
Since they abut against the vibrating electrodes 12 and 13, the tips of the conductive cilia 36 are strongly locked to the vibrating electrodes 12 and 13, and the displacement of the piezoelectric resonator 15 is unlikely to occur. Therefore, the pressure contact force of the holding terminal 35 to the piezoelectric resonator 15 can be reduced. As described above, the vibration generated in the piezoelectric resonator 15 is less likely to be damped. Further, the holding portion 35c and the vibration electrode 12,
13 changes from a conventional surface contact at a single point to a point contact at a plurality of points. Therefore, even if the holding portion 35c is brought into contact with a point other than the node point of the piezoelectric resonator 15, the effect of damping can be almost ignored. For this reason, the holding portion 35c can be brought into point contact over a wide range of the piezoelectric resonator 15, and the piezoelectric resonator 1
5 can be reliably and stably supported without tilting.

The arrangement density and length of the conductive cilia 36 need not necessarily be uniform. In particular, by making the arrangement density and the length non-uniform, the pressure contact characteristics of the holding terminal 35 to the piezoelectric resonator 15 become gentle, and the effect of increasing the design margin can be obtained. Further, as shown in FIG. 9, a piezoelectric component 38a in which the piezoelectric resonator 15 is sandwiched between a pair of holding terminals 35 having holding portions 35c having different areas may be used. As shown in FIG. 10, a piezoelectric component 38b having a larger area of the holding portion 35c than the piezoelectric resonator 15 has
Alternatively, as shown in FIG. 11, a piezoelectric component 38c in which the piezoelectric resonator 15 is supported by three or more holding portions 35c may be used.

Further, as shown in FIG. 12, at least one of the pair of holding terminals may be a piezoelectric component 38d serving as a holding terminal 41 exhibiting a good spring property. The holding terminal 41 includes an electrode portion 41a curved toward the piezoelectric resonator 15, an external connection portion 41b extending from a corner of the electrode portion 41a, and a projection provided at the center of the electrode portion 41a. 41c, and a holding portion 41d made of a plurality of conductive cilia disposed on the surface of the projection 41c. The holding terminal 41 exhibits a good spring property by the stroke of the curved electrode portion 41a.
Alternatively, as shown in FIG. 13, a piezoelectric component 38e in which one of a pair of holding terminals is a holding terminal 42 exhibiting a conventional spring property may be used. The holding terminal 42 includes an electrode portion 42
a, the external connection part 42b, and the projection part 42c.

[Third Embodiment, FIGS. 14 to 17] FIG.
As shown in the figure, the piezoelectric component 51 of the third embodiment has a holding terminal 53 provided along the wall surface of the case 61 by a method such as sputtering or vapor deposition.
The external connection part 53b of this enables connection with the outside.
On the surface of the electrode portion 53a of the holding terminal 53, a holding portion 53c composed of a plurality of minute projections (or conductive cilia) is formed. The opening of the case 61 is sealed with the sealing resin 62 and the inflow prevention sheet 63 in a state in which the piezoelectric resonator 15 is housed.

The holding terminal 53 holds the piezoelectric resonator 15 together with a holding terminal 54 having a spring property. The holding terminal 54 includes an electrode portion 54a curved toward the piezoelectric resonator 15, an external connection portion 54b extending from the electrode portion 54a, and a protrusion 54c provided at the center of the electrode portion 54b. The holding portion 54d is formed on the surface of the projection 54c. The holding unit 54d is configured as shown in FIG.
As shown in the figure, the projections are composed of a plurality of minute projections (or conductive cilia) 55 having substantially the same height. The protrusion 54c has a pointed shape, and the distal end surface of the minute protrusion 55 formed at the center portion of the holding portion 54d is higher than the distal end surface of the minute protrusion 55 formed at the edge portion. Therefore, the piezoelectric resonator 15 is located at the center of the holding portion 54d.
Are firmly supported, and the displacement of the piezoelectric resonator 15 can be suppressed.

However, the holding terminal 54 can be variously modified in accordance with the specification. For example, like the holding terminal 54 shown in FIG. May form the tall minute projections 56, and may form the tall minute projections 56 at the edges. Alternatively, as in the case of the holding terminal 54 shown in FIG. 17, a minute projection 57 having a large tip area is formed at the center on the surface of the projection 54c 'having a flat head, and a minute projection having a small tip area is formed at the edge. The protrusion 57 may be formed.

[Other Embodiments] The piezoelectric component and the method of manufacturing the same according to the present invention are not limited to the above embodiment, but can be variously modified within the scope of the invention. The shape of the fine projections or conductive cilia of the holding terminal is arbitrary such as a columnar shape, a prismatic shape, a conical shape, a pyramid shape, and the like. For example, as shown in FIG. 18, the back surface of the electrode portion 63a of the holding terminal 63 may be hit with a fine tip of a punch to form a substantially hemispherical minute projection 64 on the surface of the electrode portion 63a. Alternatively, FIG.
As shown in FIG. 9, a conductive cilia 66 is further provided on the tip end surface of the minute projection 66a provided on the surface of the electrode portion 65a of the holding terminal 65.
The configuration provided with b may be adopted.

Further, as shown in FIG.
The electrode portion 68a may be provided with a holding portion 68b composed of a plurality of concentric microprojections 69, or a holding portion composed of a plurality of linear microprojections disposed in parallel in one direction, The holding portion may be a holding portion including a plurality of linear minute protrusions and a holding portion including a plurality of dot-like minute protrusions arranged orthogonally to. These minute projections may be provided at equal intervals or at irregular intervals. Further, as a method of roughening the surface of the holding portion, a method such as a press working, a scratch working, a knurling work, an etching work and the like may be used.

[0035]

As is apparent from the above description, according to the present invention, the surface roughness of the holding portion of at least one of the holding terminals is made larger than the surface roughness of the vibration electrode of the piezoelectric resonator. The contact area between the holding part and the vibration electrode is small, and the holding part and the vibration electrode do not adhere. Therefore, the vibration generated in the piezoelectric resonator is less likely to be damped.

Also, since the holding portion and the vibrating electrode change from the conventional surface contact at a single location to point contact at a plurality of locations, even if the holding portion is brought into contact with a point other than the node point of the piezoelectric resonator, the influence of damping is obtained. Can be almost ignored. For this reason, the holding portion can be brought into point contact over a wide range of the piezoelectric resonator, and the piezoelectric resonator can be reliably and stably supported without rotating the piezoelectric resonator or causing a position shift.

Further, in the piezoelectric component according to the present invention, the height of the tip surface of the minute projection formed at the center portion of the holding portion of the holding terminal is made higher than the tip surface of the minute projection formed at the edge portion. Alternatively, by increasing the area of the distal end surface of the microprojection disposed at the central portion of the holding portion to be larger than the area of the distal end surface of the microprojection disposed at the edge portion, the piezoelectric element is mainly provided at the central portion of the retaining portion. The resonator is reliably supported, and the displacement of the piezoelectric resonator can be suppressed.

Further, according to the method of manufacturing a piezoelectric component of the present invention, after forming minute projections on the conductive mother substrate, the holding parts of the holding terminals are cut out at predetermined sizes to manufacture the holding portions of the holding terminals. In addition, a holding terminal having a holding portion having a surface roughness greater than that of the vibration electrode of the piezoelectric resonator can be manufactured with high productivity.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of a piezoelectric component according to the present invention.

FIG. 2 is an enlarged sectional view of a contact portion between a holding terminal of the piezoelectric component and a piezoelectric resonator shown in FIG.

3 (A), (B), and (C) are graphs each measuring the surface roughness of the holding part, and (D) is a graph measuring the surface roughness of the vibrating electrode.

4 is a graph showing impedance characteristics and phase characteristics of the piezoelectric component shown in FIG.

FIGS. 5A, 5B, and 5C are partially enlarged cross-sectional views each showing a first example of a manufacturing procedure of a holding terminal.

FIGS. 6A, 6B, and 6C are partially enlarged cross-sectional views showing a second example of a manufacturing procedure of the holding terminal.

FIG. 7 is a perspective view showing the appearance of a holding terminal used in a second embodiment of the piezoelectric component according to the present invention.

FIG. 8 is a front view showing a piezoelectric component according to a second embodiment.

FIG. 9 is an exemplary front view showing a modification of the piezoelectric component according to the second embodiment;

FIG. 10 is an exemplary front view showing another modification of the piezoelectric component according to the second embodiment;

FIG. 11 is an exemplary front view showing still another modification of the piezoelectric component according to the second embodiment;

FIG. 12 is an exemplary front view showing still another modification of the piezoelectric component according to the second embodiment;

FIG. 13 is an exemplary front view showing still another modification of the piezoelectric component according to the second embodiment;

FIG. 14 is a sectional view showing a third embodiment of the piezoelectric component according to the present invention.

FIG. 15 is an enlarged sectional view showing a holding portion of a holding terminal of the piezoelectric component shown in FIG. 14;

FIG. 16 is a partially enlarged sectional view showing a modified example of the holding terminal shown in FIG. 14;

FIG. 17 is a partially enlarged sectional view showing another modification of the holding terminal shown in FIG. 14;

FIG. 18 is a partially enlarged sectional view of a holding terminal showing another embodiment of the piezoelectric component according to the present invention.

FIG. 19 is a partially enlarged sectional view of a holding terminal showing still another embodiment of the piezoelectric component according to the present invention.

FIG. 20 is a plan view of a holding terminal showing still another embodiment of the piezoelectric component according to the present invention.

FIG. 21 is a sectional view showing a conventional piezoelectric component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric component 3 ... Conductive mother board 12, 13 ... Vibration electrode 15 ... Piezoelectric resonator 21, 22 ... Holding terminal 21c, 22c ... Holding part 31 ... Plating resist film 31a ... Pinhole 32 ... Micro projection 33 ... Insulator Film 33a ... minute protrusion 34 ... conductive thin film 35 ... holding terminal 35c ... holding portion 36 ... conductive cilia 38, 38a to 38e ... piezoelectric component 41 ... holding terminal 41d ... holding portion 51 ... piezoelectric component 53, 54, 63, 65 , 68 ... holding terminals 53c, 54d, 68b ... holding parts 55, 56, 57, 64, 66a, 69 ... minute projections 66b ... conductive cilia

Claims (5)

(57) [Claims] A piezo-resonator having a vibration electrode provided on a surface thereof; and a pair of holding terminals for holding a piezo-resonator by a holding portion being pressed against a vibration electrode of the piezo-resonator. Among them, the surface roughness of the holding portion of at least one holding terminal is made larger than the surface roughness of the vibration electrode of the piezoelectric resonator, and the surface roughness is rougher than the vibration electrode of the piezoelectric resonator.
Holding portion of the holding terminal having a plurality of conductive minute protrusions.
And formed at the center of the holding portion of the holding terminal.
The height of the tip surface of the small projections
A piezoelectric component , which is higher than the tip end surface of the projection . 2. A piezoelectric resonator having a vibration electrode provided on a surface thereof, and a holding portion pressed against a vibration electrode of the piezoelectric resonator so that the piezoelectric resonator is pressed.
A pair of holding terminals for holding the resonator, and holding at least one holding terminal among the holding terminals.
The surface roughness of the vibrating electrode of the piezoelectric resonator
And coarser, piezoelectric component holding portion of the holding terminal having a vibrating electrode rougher surface roughness of the piezoelectric resonator, it has a plurality of conductive cilia, characterized. 3. A piezoelectric resonator having a vibrating electrode provided on a surface thereof, and a holding portion press-contacting the vibrating electrode of the piezoelectric resonator , and
A pair of holding terminals for holding the resonator, and holding at least one holding terminal among the holding terminals.
The surface roughness of the vibrating electrode of the piezoelectric resonator
The surface roughness of the piezoelectric resonator
Holding portion of the holding terminal having a plurality of conductive minute protrusions.
A piezoelectric element , wherein the area of the distal end surface of the microprojection disposed at the center of the holding portion of the holding terminal is larger than the area of the distal end surface of the microprojection disposed at the edge portion. parts. 4. A piezoelectric resonator having a vibration electrode provided on a surface thereof,
In a method for manufacturing a piezoelectric component, comprising: a holding terminal in which a holding portion is pressed against a vibration electrode of the piezoelectric resonator; a step of providing a plating resist film on a surface of a conductive mother substrate; and a plurality of pinholes in the plating resist film. Providing a conductive metal on a surface of the conductive mother substrate exposed from pinholes of the plating resist film; and removing the plating resist film from the conductive mother substrate to remove the conductive mother substrate. Forming a plurality of fine protrusions made of conductive metal on the surface of the substrate, cutting out the conductive mother substrate for each predetermined size, having the fine protrusions, and having a surface roughness greater than the vibration electrode of the piezoelectric resonator. Forming a holding terminal provided with a holding portion having a method of manufacturing a piezoelectric component. 5. A piezoelectric resonator having a vibrating electrode provided on a surface thereof,
In a method for manufacturing a piezoelectric component, comprising: a holding terminal that presses a holding portion against a vibration electrode of the piezoelectric resonator; an unnecessary portion of an insulator film provided on a surface of the conductive mother substrate is removed from the surface of the conductive mother substrate. Forming a plurality of minute protrusions made of an insulator on the conductive mother substrate, and forming a conductive film on the surface of the conductive mother substrate provided with the minute protrusions. A conductive mother substrate cut out by a predetermined size, a holding portion having fine projections provided on the surface with the conductive coating, and having a surface roughness greater than the vibration electrode of the piezoelectric resonator; Forming the holding terminal, and a method of manufacturing a piezoelectric component.