JP3292340B2 - Mold clamping press for molding dies - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin using a thermosetting resin for encapsulating a semiconductor device such as a diode, a transistor or an IC, or an electric appliance such as an electric motor, a transformer or a solenoid. The present invention relates to a mold clamping press for a molding die used for manufacturing a mold.

[0002]

2. Description of the Related Art Conventionally, as a clamping press device used for manufacturing a resin mold of this type, a plurality of columns are slidably guided on a lower table serving as a fixed table, and a movable table is provided on the upper end side of each column. A certain upper table is connected and fixed, and the lower end side of the column is connected to a lower movable plate connected to an operating rod of a hydraulic cylinder, and the upper table is lowered by the operation of the hydraulic cylinder so that the upper table and the lower table can be moved between the upper table and the lower table. It is generally known that the molds arranged in the mold are adjusted, and in this state, the upper table is urged downward to perform the mold clamping press.

[0003]

The use of a hydraulic cylinder as the means for raising and lowering the movable table is advantageous in that both mold matching and mold clamping can be performed by a single cylinder. When used for molding a resin mold using a thermosetting resin in the manufacture of devices, it cannot be said that there are no problems as described below.

That is, since the hydraulic pump must always be operated, not only a large amount of energy is consumed, but also noise and dust are generated by the operation of the hydraulic pump, and a large amount of oil is used. There has been a problem that the burden on the semiconductor device manufacturing environment is adversely affected due to an increase in the burden and restrictions on fire prevention. Further, it has disadvantages such as that the speed of opening and closing the mold is slow, and it is difficult to control the contact load at the time of mold matching.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances as described above. It is an object of the present invention to maintain a high degree of cleanliness in a manufacturing environment, and to improve the speed at the time of opening and closing a mold and the time of mold matching. An object of the present invention is to provide a mold-clamping press device for a molding die, which can easily control the degree of contact with the mold and is excellent in energy saving and suitable for use in manufacturing a resin mold of a semiconductor device.

[0006]

In order to achieve the above-mentioned object, a mold clamping press according to the present invention comprises a movable table connected to one end of a plurality of columns slidably guided by a fixed table. A mold clamping press device for fixing and moving a movable plate provided on the other end side of the support column to open and close a mold provided between the fixed table and the movable table and perform a mold clamping press, A movable plate driving mechanism for rotating the screw shaft engaged with the movable plate in the forward and reverse directions by electric means using a motor as a driving source to move the movable plate forward and backward, and retracted to the mold matching position by the operation of the driving mechanism; A mold holding means for loading a block between the movable plate and the fixed table to maintain a mold matching state of a molding die; and an amplifying unit for amplifying a pressure in a pressurizing chamber provided between the movable plate and the support. For operation of pressure means Pressurizing means for urging the support column in the retreating direction of the movable plate, opening and closing the mold by operating the movable plate driving mechanism, maintaining the mold matching state by the mold matching holding means, and It is characterized in that a mold clamping press pressure is applied to a molding die in a mold matching state by operation.

[0007]

According to the above arrangement, after the molds are matched, the mold holding state is maintained by the mold holding means, so that the movable plate drive mechanism has the minimum functions necessary for opening and closing the molds. And it is sufficient to drive only when the mold is opened and closed. Similarly, the pressurizing means only needs to have the minimum function required to apply the mold clamping press pressure, and may be driven only when the mold clamp press pressure is applied.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a mold clamping press according to the present invention. In this embodiment, the mold clamping press 100 is configured as a vertically moving press, and the press 100 is combined with a resin injection device 200 to form a large molding facility A. The resin injection device 200 will be described later with reference to FIGS.

As shown in FIGS. 1 to 4, the mold clamping press 100 has a lower table 101 immovably fixed above a stand a1 of the molding equipment A to form a fixed table. Are vertically slidably guided, and an upper table 10 is provided on the upper ends of the four columns 102.
3 are connected and fixed to form a movable table, a lower movable plate 104 is provided at the lower end of each column 102, and a molding die 400 is opened and closed by a movable plate drive mechanism 130 provided on the gantry a1, and the mold matching is performed. The state is held by the matching holding means 150, and the respective columns 102, 102... And the lower movable plate 104 are held.
The pressurizing means 170 provided between them is used to perform a mold clamping press of the molding die 400.

The movable plate driving mechanism 130 has screw holes 131, 131,... Formed at appropriate plural positions (three positions in this embodiment so as to be at the apex of a triangle) of the lower movable plate 104, and the respective screw holes are formed.
A screw shaft 132 screwed to the shaft 131 is rotatably supported on the upper surface of the mount a1, and the lower end of each screw shaft 132 is connected to a motor 136 via a transmission mechanism by a gear 134 and a belt 135 disposed inside the mount a1. The lower movable plate 104 is moved up and down by the rotation of the screw shaft 132 in the forward and reverse directions driven by the motor 136, whereby the upper table 103 is moved up and down to form the molding die 400. It opens and closes.

A ball (not shown) is interposed between the threaded portion of the screw hole 131 and the screw shaft 132 to form a ball screw structure 133.
As a result, the frictional force when the lower movable plate 104 moves up and down by the rotation of the screw shaft 132 is reduced, and the motor 136 is of the lowest power type possible. Also motor 136
By using a servomotor for the motor, it is possible to appropriately control the opening / closing speed of the molding die 400 and the contact load at the time of mold alignment.

The mold holding means 150 is provided with the drive mechanism 13.
0 can be fitted into a gap s (see FIG. 3) formed between the lower movable plate 104 retracted to the molding position of the molding die 400 and the fixed table 101 described above. A block 151 having a height h,
1 is a well-known driving device (not shown) that can automatically load and unload the space s. The block 151 is loaded into the space s to change the state of the molding die 400. Hold.

The height h of the block 151 is set to be equal to the gap s so that an error in the height of the molding die 400 can be absorbed.
Slightly larger than the height of

As shown partially enlarged in FIGS. 1 and 4, the pressurizing means 170 has a large-diameter hole 172 on the lower half side of a rectangular column guide hole 171 of the lower movable plate 104, and guides it. The lower end portion 102a of the supporting column loosely inserted into the hole 171 is provided with a locking flange 102b that engages with the upper end of the guide hole 171 and further includes a flange portion 173 that is slidably inserted into the large-diameter hole 172. The collar 174 is mounted and fixed, and the pressurizing chamber 175 is provided between the lower movable plate 104 and the support 102.
And pressurizing fluid (oil in this embodiment) is sealed in the pressurizing chamber 175, and the inside of the pressurizing chamber 175 is communicated to a pressure intensifier 177 via a pipe 176, so that the By increasing the pressure in the pressurizing chamber 175 by the operation of, the strut 102 is urged in the retreating direction of the movable plate, that is, downward.

The molding die 400 has a structure well known in this type of technical field, that is, the lower die 401 is
An upper mold 402 is mounted on the upper table 103, and a resin injection port 404 communicating with the molding cavity 403 formed on the mold mating surface is opened on the side of the mold. The resin material extruded from the resin injection device 200 is injected into the molding cavity 403 through the resin injection port 404 in a state where the mold clamping press is performed.

Hereinafter, the clamping press process by the clamping press apparatus 100 of the present embodiment will be described. First, a preparatory operation such as cleaning of the molding cavity and mounting of an embedding metal fitting is performed with the mold opened as shown in FIG.
Then, the movable plate driving mechanism 130 is operated, and the upper table 103 is lowered to perform the mold matching of the molding die 400 (FIG. 3).

Next, the mold holding means is operated from this state, and the block 151 is fitted in the gap s formed between the lower movable plate 104 and the fixed table 101 so as to fit, so that the forming metal is formed. Holding the mold matching state of mold 400, motor 136
Is stopped (FIG. 4). At this time, since the block 151 is slightly larger than the height dimension of the gap s, the block 151 moves the lower movable plate 104 against the internal pressure of the pressurizing chamber 175 as shown in an enlarged view in FIG. Energize downward. Therefore, the lower movable plate 104 is connected to the lower table 101 via the block 151.
And is integrally connected and fixed.

In this state, the pressure intensifier 177 is actuated to increase the pressure in the pressurizing chamber 175, and the increased pressure urges the column 102 and the upper table 103 together with the flange portion 173 downward to form the molding die 400. To the mold. In this state, the resin material extruded from the resin injection device 200 is injected into the resin injection port 40.
4 into the molding cavity 403. After the curing of the injected resin is completed, the operation of the pressure intensifier 177 is stopped to release the mold clamping press state.
To remove the block 151, and then
The mold is opened by the operation of the movable plate drive mechanism 130 to take out the molded product.

According to the mold clamping press apparatus 100 of the present embodiment, since the mold matching state is maintained by the mold matching holding mechanism 150, the motor serving as the driving source of the movable plate drive mechanism 130 is provided.
Reference numeral 136 only needs to have the minimum functions necessary for opening and closing the molding die 400, and may be driven only when opening and closing the mold. Similarly, the pressure intensifier 177, which is the pressurizing source of the pressurizing means 170, only needs to have the minimum function required to apply the mold clamping press pressure, and is driven only when the mold clamping press pressure is applied. You can do it.

Therefore, the amount of oil used is smaller than that of a conventional press device using a large hydraulic cylinder, so that the cleanness of the manufacturing environment can be maintained high. In addition, the movable plate driving mechanism 130 can be operated only when the mold is opened and closed, and the pressurizing means 170 can be operated only during the mold clamping press. If a servomotor is used as the source, it is easy to control the opening / closing speed of the mold and the contact load at the time of mold matching. Therefore,
It is extremely useful for manufacturing resin molds for semiconductor devices. In the present embodiment, oil is used as the pressurized fluid as described above. However, the present invention is not limited to this, and air can be used as the pressurized fluid. An effect that can be maintained at a higher level is obtained.

Hereinafter, the resin injection device 200 shown in the figure will be briefly described. The resin injection device 200 is a resin injection machine 220
And a resin kneading bar molding machine 240. Resin injection machine 22
Reference numeral 0 denotes a movable pot 221 supported coaxially with a resin injection port 404 opened on the side surface of the molding die 400 pressed by the mold clamping press 100 and slidably in a horizontal direction by a drive mechanism (not shown). Is provided so that the resin supply port 222 at the tip of the pot 221 can be freely moved toward and away from the resin injection port 404, and the movable pot 221 has
1 is provided with a pressure plunger 224 for pushing out a resin kneading bar to be supplied to the charging port 223 provided in 1.

The resin kneading bar forming machine 240 includes, for example, a tank 240a containing a desired amount of refined powder obtained by mixing an epoxy resin material with a filler which is advantageous in terms of sealing property and fluidity,
Weighing machine 240b for feeding resin powder contained in 240a to outer cylinder 240d by a predetermined amount, outer cylinder 240d heated to a predetermined preheating temperature by heating means 240c, screw rotatably supported in outer cylinder 240d 240e, a driving means 240f for rotationally driving the screw, a cutter 240g, and the like.

As shown in FIG. 6, the inner circumference of the outer end of the outer cylinder 240d is a multi-step shaped part 241 having a gradually decreasing diameter toward the resin discharge port 242, and a helical blade part is provided at the end of the screw 240e. A structure in which a tip blade portion 245 provided with a plurality of blades 244 inclined in a direction different from that of the blade 243 is provided. Thereby, the resin powder supplied into the outer cylinder 240d is preheated, and the resin discharge port is kneaded by the spiral blade portion 243.
242, and the fed resin material is re-kneaded in a direction different from that of the spiral blade portion 243 by the respective blades 244 in the tip blade portion 245.
The resin powder can be discharged from the resin discharge port 242 while preheating and kneading the resin powder more uniformly.

The cutter 240g is a resin discharge port at the tip of the outer cylinder 240d.
A resin kneading bar of a predetermined length is obtained by cutting the resin material discharged from the 242, and is vertically slid while being in sliding contact with the guide plate 246 by the operation of a driving means (not shown) connected to the base end thereof. It is arranged to go up and down.

According to the resin kneading bar molding machine 240 having the above-described configuration, the multi-stage portion 241 at the inner end of the outer cylinder 240d repeatedly exerts the squeezing action, so that air is less likely to be introduced into the resin material. At the same time, an air bleeding action is exhibited, and the blade 245
Accordingly, a kneading action different from that of the spiral blade portion 243 of the screw can be obtained, and more uniform preheating and kneading can be performed, and the above-described air bleeding action can be further improved.

The resin kneading bar thus obtained is
The resin is injected into the movable pot 221 from the material input port 223, and the resin injection port 404 of the mold 400 is moved by the forward movement of the pressure plunger 224.
From the mold cavity 403, and after a predetermined process, is taken out as a molded product. As described above, since the molded product obtained is sufficiently heated, kneaded and vented at the time of molding the resin material as described above, it is possible to obtain a high quality product that is unlikely to vary in quality among products. Can be. Further, since the resin kneading bar is obtained by kneading the resin powder while heating the resin powder to a predetermined preheating temperature, the fluidity in the mold is improved, and molding can be performed safely and quickly. become able to.

The molding dies to be used by the mold clamping press of the present invention are not limited to those having a well-known structure in which a lower die is provided on a lower table and an upper die is provided on an upper table. Apparatus for manufacturing a resin mold of the prior application filed by the applicant (Japanese Patent Application No. 59-126952 (Japanese Patent Application No. 2-57)
No. 006) and Japanese Patent Application No. 5-53594, etc.).

The above-mentioned manufacturing apparatus of the prior application by the present applicant is:
A plurality of curing process points, molded product removal process points, and the like are connected by an annular transfer path around one resin injection process point, and a plurality of molding dies are distributed and arranged at each process point, and each molding die is provided. The mold is pressed intermittently by a transfer mechanism, and a mold clamping press and a resin injection of a molding die are performed by a molding facility installed at a resin injection process point. By curing the injection resin confined in the molding die clamped by the method, advantages such as a reduction in the molding cycle time to a fraction of the conventional value can be obtained.

Further, the method of supplying the resin material to the molding die is not limited to the above-mentioned horizontal one, and a resin injection port for communicating with the molding cavity is formed on the upper surface of the lower mold and connected to the resin injection port. It is also possible to cope with a molding die in which a cylindrical pot is built in the upper mold and the resin material is supplied in a vertical direction, and such correspondence is made by a design change within a known range.

[0030]

As described above, the mold clamping press device of the present invention maintains the state by the mold holding means after the mold is set, so that the movable plate drive mechanism opens and closes the mold. What is necessary is just to have the required minimum functions, and to drive only when opening and closing the mold. Further, the pressurizing means only needs to have the minimum function necessary to apply the mold clamping press pressure, and need only be driven when applying the mold clamp press pressure.

Therefore, the amount of oil used is smaller than that of a conventional press device using a large hydraulic cylinder, so that the cleanness of the manufacturing environment can be maintained high, and the movable plate drive mechanism can be used only when the mold is opened and closed. Since the pressurizing means only needs to be operated during the mold clamping press, it has an excellent effect on energy saving. In this case, the contact load can be easily controlled. Therefore, it was possible to provide a mold clamping press extremely useful for manufacturing a resin mold of a semiconductor device.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a mold clamping press according to the present invention, in which main parts are enlarged and shown.

FIG. 2 is a sectional view taken along lines (X)-(X) in FIG.

FIG. 3 is a front view showing a state in which the press device shown in FIG.

FIG. 4 is a front view showing a state of a mold clamping press of the press device shown in FIG.

5 is a front view showing an example in which the press device shown in FIG. 1 is incorporated in a resin injection device.

FIG. 6 is an enlarged sectional view of a main part of the resin injection device shown in FIG.

FIG. 7 is a sectional view taken along the line (Y)-(Y) of FIG. 6;

[Explanation of symbols]

100: Mold clamping press 101: Lower table 10
2: Support 103: Upper table 104: Lower movable plate 13
0: movable plate drive mechanism 132: screw shaft 136: motor 15
0: Mold holding means 151: Block 170: Pressurizing means 17
5: Pressurizing chamber 177: Intensifier 400: Mold 401: Lower mold
402: Upper type

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-131497 (JP, A) JP-A-2-252518 (JP, A) JP-A-62-87318 (JP, A) (58) Survey Field (Int.Cl. ⁷ , DB name) B29C 45/00-45/84 B29C 33/24

Claims (1)

(57) [Claims] A movable table is connected and fixed to one end of a plurality of columns slidably guided by a fixed table, and a movable plate provided at the other end of the column is moved forward and backward to move the fixed table and the movable table. A mold clamping press device that performs opening and closing and a mold clamping press of a molding die disposed between tables,
A movable plate driving mechanism for rotating a screw shaft engaged with the movable plate in the forward and reverse directions by electric means using a motor as a drive source to move the movable plate forward and backward; A mold holding means for loading a block between the movable plate and the fixed table to maintain the mold matching state of the molding die, and amplifies the pressure in a pressurizing chamber provided between the movable plate and the support. Pressurizing means for urging the column in the retreating direction of the movable plate by operating the pressure increasing means, opening and closing the mold by operating the movable plate driving mechanism, and maintaining the mold matching state by the mold matching holding means, A mold-clamping press apparatus for a molding die, wherein a mold-clamping press pressure is applied to a molding die in a mold-matched state by operation of the pressurizing means.