JP3292057B2 - Processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing processing using energy of a laser beam, discharge energy, and the like. More specifically, the present invention relates to a material, a processed shape, and a material processed by the processing apparatus. The present invention relates to a processing apparatus for displaying the position and the like of supporting means to be superimposed on a display device and for checking the positional relationship based on the display contents.

[0002]

2. Description of the Related Art FIG. 10 is a block diagram of a conventional laser processing apparatus, in which parts shown by blocks and drawing parts in the figure show constituent elements, and arrows in the figure show signal flows. The same). In the drawing, reference numeral 1 denotes a working table provided with a plurality of pin pins 2, 3 denotes a blank, and 4 denotes a clamp for fixing the blank 3 to the working table 1. 5 is a memory for storing a machining program, 6 is an input device, 7 is a machining position calculation circuit for calculating a machining locus of the material 3 according to the machining program, and 8 is a motor 9 corresponding to the calculated machining locus of the material 3. It is a driving circuit for driving.

[0003] Reference numeral 10 denotes a laser beam irradiating apparatus for moving the focal point of the laser beam 11 to a position corresponding to the material 3 by driving the motor 9 and irradiating the laser beam to the processing point to laser-process the material 3. Reference numeral 12 denotes a display position calculation circuit that calculates a display position of the material 3 and its processing shape based on the processing locus of the material 3 calculated by the processing position calculation circuit 7. Reference numeral 13 denotes a material 3 based on the display position calculated by the display position calculation circuit 12.
And a display for displaying the processed shape. Reference numeral 17 denotes a suction pad that sucks and discharges a residual material obtained by removing a processing component from a material.

FIG. 11 shows another example of the prior art, and is a configuration diagram of a laser processing apparatus disclosed in Japanese Patent Publication No. 4-65858. This laser processing apparatus superimposes and displays a material shape and a processed shape on a material supporting means for supporting the material at a plurality of positions, and checks a processing locus based on the displayed content. In FIG. 11, reference numeral 14 denotes a sword pin position memory in which the position of a sword pin 2 as a material supporting means provided on the processing table 1 is stored, and 15 is an obstacle position memory in which the position of the clamp 4 is stored. It is. Other configurations are the same as those in FIG. 10 and 11, the drive circuit 8 and the motor 9 constitute a processing point moving means.

Next, the operation of the conventional laser processing apparatus will be described. In the laser processing apparatus of FIG. 10, when the processing position calculation circuit 7 calculates the processing locus of the material 3 according to the processing program stored in the memory 5, the display position calculation circuit 12 calculates the processing locus of the material 3 based on the processing locus of the material 3. And a display position where the processed shape of the material 3 should be displayed. As shown in FIG. 12, the display 13 displays the shape of the material 3 and the processed shapes 3a, 3b on the display screen 13D based on the display position calculated by the display position calculation circuit 12.
Is displayed.

[0006] Based on the displayed contents, it is determined whether or not the positional relationship between the shape of the material 3 and the processed shapes 3a and 3b is normal. If it is determined that the positional relationship is normal, actual processing is started. When the processing position calculation circuit 7 calculates the processing trajectory of the material 3 according to the processing program stored in the memory 5, the drive circuit 8 drives the motor 9 according to the processing position calculated to move the laser beam irradiation device 10. . When the laser beam irradiation device 10 reaches the processing locus of the material 3, the laser beam 11 is irradiated on the material 3 to start processing the material 3.

In the conventional example shown in FIG. 11, when the processing position calculation circuit 7 calculates the processing position of the material 3 according to the processing program stored in the memory 5, the display position calculation circuit 12 The display position where the shape of the material 3 and the processed shape of the material 3 are to be displayed is calculated based on the calculated position.
Further, the display position calculation circuit 12 stores the pin position memory 1 for the sword.
Based on the position data of the pin 2 stored in the pin 4 and the position data of the clamp 4 stored in the obstacle position memory 15, a display position at which the pin 2 and the clamp 4 are to be displayed is calculated. As shown in FIG. 13, the display 13 displays the shape of the material 3 and the processed shapes 3a and 3b on the display screen 13D based on the display position calculated by the display position calculation circuit 12, and in addition to them,
The position of the pin 2 and the position of the clamp 4 are displayed in an overlapping manner.

Based on the displayed contents, it is determined whether or not the positional relationship between the shape of the material 3 and the processed shapes 3a and 3b is normal, and the positional relationship between the processed shapes 3a and 3b, the position of the pin 2 and the position of the clamp 4 are determined. Is determined to be normal. If it is determined that the processing is normal, the process proceeds to actual processing. When the processing position calculation circuit 7 calculates the processing trajectory of the material 3 according to the processing program stored in the memory 5, the drive circuit 8 drives the motor 9 according to the processing position calculated to move the laser beam irradiation device 10. . Laser beam irradiation device 1
When 0 reaches the processing locus of the material 3, the laser beam 1
1 is irradiated on the material 3 to start processing the material 3.

[0009]

In the conventional example shown in FIG. 10, as shown in FIG. 12, it is possible to confirm how the processed portion is arranged on the material 3. However, in this laser processing apparatus, it is difficult to predict the positional relationship between the processing locus and the suction pad 17 for unloading the processed product after the processing, and therefore, depending on the processing locus, the suction pad 17 is present on the above-mentioned dropped processing portion. As a result, the material from which the processed product has been removed (hereinafter referred to as residual material) cannot be lifted by the suction pad 17, or even if the material is lifted luckily, the suction force decreases when the residual material is carried out and the material falls. There was a problem that continuous operation became impossible.

In the conventional example shown in FIG. 11, when the pin 2 comes under the machined shapes 3a and 3b, data is input from the input device 6 by looking at the display contents shown in FIG. The positional relationship between the machining program and the pin 2 is corrected to change the machining locus so that the pin 2 does not come under the machining shapes 3a and 3b. In addition, when a pin pin exists directly below the processing locus, a processing defect occurs, so that the pin 2 does not come directly below the processing locus. However, in the apparatus of FIG. 11 as well, it is difficult to predict the positional relationship between the processing locus and the suction pad 17 that unloads the remaining material after the processing.
Depending on the processing trajectory, the suction pad 17 is present on the processing portions 3a and 3b, so that the suction pad 17 cannot lift up the remaining material, so that there is a problem that continuous operation becomes impossible.

The present invention has been made to solve such a problem, and has been made for the purpose of eliminating the occurrence of inconvenience in the operation of discharging a residual material obtained by removing a processed part from a raw material from a processing machine. Things.

[0012]

Means for Solving the Problems Processing according to the first invention
The apparatus comprises a material supporting means for supporting the material, and a
A processing energy supplier that supplies processing energy to construction points
Step, moving means for moving the processing point on the material,
Absorb the remaining material from which the processed products cut from the material have been removed.
Adsorption means to be attached, the shape of the remaining material, and the position of the adsorption means.
A display device for displaying the display in an overlapping manner, and a display on the display device
So that the suction means does not come over the processed shape
The machining path by changing the machining program
Shift the position of the shape, or suction means for the processing shape
And an input device for shifting the position of the
is there.

The processing method according to the second invention is a processing method.
Display the shape of the material and its processed shape according to the gram
Along with the remaining material from which the processed products cut from the material have been removed
A step of displaying the position of the adsorption means for adsorbing the image in an overlapping manner;
Modify the machining program to change the machining trajectory and change the machining shape
Shift the position of the
Shift the position of the step so that the suction means comes
In accordance with the machining program
Supply the processing energy to the processing points of the material and perform the actual processing.
And a step of performing the above.

The processing apparatus according to the third invention supports the material.
Holding means for holding the material and processing energy at the processing point of the material.
Energy supply means for supplying energy, and the processing point
Moving means for moving the material on the material;
Adsorption means to adsorb the residual material after removing the processed product
And the shape of the remaining material, the material supporting means and the suction hand.
A display device for displaying the positions of the columns in an overlapping manner, and on the display device
Based on the display of, the remaining material from a plurality of adsorption means
Selection means for selecting suction means to function for suction
And only the suction means selected by the selection means is sucked.
The remaining material is adsorbed by applying a force.

A processing method according to a fourth aspect of the present invention is a processing method
Display the shape of the material and its processed shape according to the gram
Along with the remaining material from which the processed products cut from the material have been removed
For displaying the positions of a plurality of adsorption means for adsorbing the images in an overlapping manner
And the displayed positional relationship, and
Medium, select one without suction means located in the processing path
And processing the material according to the processing program
Process of supplying machining energy to points and performing actual machining
Drive only the selected suction means by applying suction force.
And a step to be performed.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of a laser processing apparatus according to Embodiment 1 of the present invention. In the figure, 1 is a plurality of Kenzan pins 2
A processing table provided with, 3 is a material, 4 is a material 3 and a processing table 1
It is a clamp to be fixed to. 5 is a memory that stores a machining program, 6 is an input device, 7 is a machining position calculation circuit that calculates a machining trajectory of the material 3 according to the machining program,
Reference numeral 8 denotes a drive circuit that drives the motor 9 in accordance with the calculated processing locus of the material 3. Reference numeral 10 denotes a laser beam irradiating device that moves the focal point of the laser beam 11 to a position corresponding to the material 3 by driving the motor 9, irradiates the processing point, and laser-processes the material 3. With 8 drive circuits and 9 motors,
It constitutes a moving means of the laser beam irradiation device as a processing means.

Reference numeral 16 denotes a suction pad position memory in which the positions of the suction pads 17 for sucking the remaining material are stored. 12
Is the processing locus of the material 3 calculated by the processing position calculation circuit 7 and the suction pad 17 stored in the suction pad position memory.
Is a display position calculation circuit that calculates the display position of the material 3, the processed shape thereof, and the suction pad 17 based on the position. 1
Reference numeral 3 denotes a display for displaying the material 3, its processed shape and the position of the suction pad based on the display position calculated by the display position calculation circuit 12.

Next, the operation of the laser processing apparatus according to the present embodiment will be described. When the processing position calculation circuit 7 calculates the processing position of the material 3 according to the processing program stored in the memory 5, the display position calculation circuit 12 calculates the position of the material 3 and the position at which the processing shape of the material 3 is to be displayed. Further, the display position calculation circuit 12 calculates a display position at which the suction pad 17 is to be displayed based on the position data of the suction pad 17 stored in the suction pad position memory 16.

As shown in FIG. 2, the display 13 displays the shape of the material 3 and the processed shape 3 on the display screen 13D based on the display position calculated by the display position calculation circuit 12.
a and 3b are displayed, and the position of the suction pad 17 is displayed in addition thereto.

After confirming the display state of the display 13,
For example, if the suction pad 17 comes over the part of the processed shape 3a, 3b that has fallen off, the suction pad 17
May cause a vacuum leak and may not be able to adsorb the remaining material. In this case, the processing program is modified from the input device 6 to change the processing locus and shift the position of the processing shape, or the position of the suction pad is shifted with respect to the processing shape,
Make sure the suction pad does not come over the processed shape.

As described above, the shape of the raw material 3 and the processed shape 3
By displaying a and 3b, it is determined whether the positional relationship between the processed shape and the material is normal. Further, since the processing shapes 3a and 3b and the position of the suction pad 17 are displayed in an overlapping manner, it is determined whether or not the positional relationship between the processing locus and the suction pad is appropriate. When it is determined that these positional relationships are appropriate, the process proceeds to actual processing.

When the processing position calculating circuit 7 calculates the processing locus of the material 3 in accordance with the processing program stored in the memory 5, the driving circuit 8 drives the motor 9 in accordance with the calculated processing locus to drive the laser beam irradiation device 10 To move.
When the laser beam irradiation device 10 reaches the processing locus of the material 3, the laser beam
Start machining.

Embodiment 2 FIG. FIG. 3 is a configuration diagram of a laser processing apparatus according to Embodiment 2 of the present invention. In FIG. 3, the portions performing the same functions as those in FIG. Reference numeral 14 denotes a sword pin position memory in which the position of the sword pin 2 as a material supporting means provided on the processing table 1 is stored. Reference numeral 15 denotes an obstacle position memory in which the position of the clamp 4 is stored. Reference numeral 16 denotes a suction pad position memory in which the position of the suction pad 17 for sucking the remaining material is stored.

Next, the operation of the laser processing apparatus according to this embodiment will be described. When the processing position calculation circuit 7 calculates the processing position of the material 3 according to the processing program stored in the memory 5, the display position calculation circuit 12 determines the shape of the material 3 and the processing shape of the material 3 based on the processing locus of the material 3. The display position to be displayed is calculated. Further, the display position calculation circuit 12 stores the position data of the pin 2 stored in the pin position memory 14, the position data of the clamp 4 stored in the obstacle position memory 15, and the suction pad position memory 16. The display positions of the pin 2, the clamp 4, and the suction pad 17 are calculated based on the position data of the suction pad 17 that is being used.

The display 13 has a display screen 13D
Based on the display position calculated by the display position calculation circuit 12, the shape of the material 3 and its processed shapes 3a and 3b are displayed, and the position of the pin 2 of the sword, the position of the clamp 4 and the position of the suction pad 17 are displayed. Is displayed over the display.

By checking the contents displayed on the display 13, it is confirmed that there is no pin pin 2 below the processing shapes 3a and 3b and that the suction pad 17 does not come above the processing shapes 3a and 3b. When the pin 2 is located below the processing shapes 3a and 3b, large erosion occurs on the cut surface, and the processing quality is significantly reduced. Further, if the suction pad 17 comes over the part where the processed shapes 3a and 3b have fallen off, a vacuum leak may occur at the suction pad 17 and the remaining material may not be able to be suctioned.

In such a case, data is input from the input device 6 to modify the machining program to change the position of the machining locus so that the pin 2 does not come under the machining locus, and the machining shapes 3a, 3b So that the suction pad 17 does not come on. That is, the position of the processing shape is shifted with respect to the pin 2 and the suction pad 1 is shifted with respect to the processing shape.
7 or shift the suction pad 1
The position of the machined shape is shifted with respect to the position of the pin 7 and the pin 2 of the sword. Also, when the clamp 4 is on the machining locus, the machining locus is changed with respect to the position of the clamp 4 or the clamp
Change the position of.

As described above, since the shape of the material 3 and the processed shapes 3a and 3b are displayed, the processed shapes 3a and 3b are displayed.
It is determined whether the positional relationship between 3b and the shape of the material 3 is normal. Further, since the positions of the pin 2 and the suction pad 17 are superimposed and displayed on the processing shapes 3a and 3b, it is determined whether the positional relationship between the processing locus and the pin 2 and the positional relationship between the processing locus and the suction pad 17 are appropriate. Is done. When it is determined that these positional relationships are appropriate, the process proceeds to actual processing.

When the processing position calculation circuit 7 calculates the processing locus of the material 3 in accordance with the processing program stored in the memory 5, the drive circuit 8 drives the motor 9 in accordance with the calculated processing locus, and To move.
When the laser beam irradiating means 10 reaches the processing locus of the material 3, the material 3 is irradiated with the laser beam 11 to start processing the material 3.

Embodiment 3 FIG. 5 is a configuration diagram of a laser processing apparatus according to Embodiment 3 of the present invention. In FIG. 5, the portions performing the same functions as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 5, reference numeral 16 denotes a suction pad position memory in which the positions of a plurality of suction pads are stored, 18 a suction pad selection circuit for selecting a suction pad to be operated, and 19 a suction pad selected by the suction pad selection circuit 18. This is a suction pad driving circuit to be driven.

Next, the operation of the laser processing apparatus according to this embodiment will be described. The processing position calculated by the processing position calculation circuit 7 and the positions of the plurality of suction pads 17 stored in the suction pad position memory 16 are the display position calculation circuit 1.
2 and is displayed on the display 13. The positional relationship displayed on the display 13 is confirmed, and the suction pad selection unit 18 selects a plurality of suction pads excluding the suction pad located in the processing locus. A signal is output from the suction pad selecting means 18 to the display position calculation circuit 12 and the suction pad driving circuit 19, so that the suction pad 17 selected by the suction pad selecting means 18 can be confirmed on the screen of the display 13, and Only the suction pad 17 selected by the pad selecting means 18 is driven by applying a suction force.

FIG. 6 shows a screen 13D of the display 13 according to the present embodiment.
a represents a processing locus, and 4 represents a clamp. Also, 1
7a, 17b and 17c represent the positions of the suction pads. In this case, among the three suction pads 17a, 17b and 17c, 17b is located in the processing locus, so that the suction pads excluding 17b, that is, 17a and 1
The suction pad 7b is selected by the suction pad selection means 18.

Embodiment 4 FIG. The mechanism for moving the suction pad according to the above-described embodiment includes, for example, those shown in FIGS. 7, 8, and 9. In FIG. 7, 17 is a suction pad, 2
0a is a suction pad fitting, 21 is an LM guide. The suction pad 17 attached to the suction pad fitting 20a is L
The M guide 21 can move in a horizontal direction (a direction perpendicular to the paper surface). The means for adsorbing the material by the suction pad utilizes the pressure difference or magnetic force of the gas. By using this mechanism, if there is a case where the suction pad comes over the part where the processed shapes 3a and 3b shown in FIG.
So that the position of the suction pad is shifted from the position of the processed shape.

In FIG. 8, 17 is a suction pad, 20b
Is a suction pad fitting, and 22a is a shaft. The suction pad 17 has an offset amount e with respect to the rotation axis of the shaft 22a, and is connected to the suction pad fitting 20b. With this mechanism, the suction pad 17 attached to the suction pad fitting 20b is rotatable in the horizontal direction about the rotation axis of the shaft 22a. The means by which the suction pad absorbs the material utilizes the pressure difference of the gas and / or the magnetic force. With this mechanism, if the suction pad comes over the part where the processed shapes 3a and 3b shown in FIG. 2 have fallen off, the suction pad 17 is rotated in the horizontal direction around the rotation axis of the shaft 22a, Make sure that the position of the suction pad does not come over the processed shape.

In FIG. 9, 23 is an air suction pad,
24 is a magnetic suction pad, 20c is a suction pad fitting, 2
2b is a shaft. The air suction pad 23 and the magnetic suction pad 24 are connected to a suction pad fitting 20c. The air suction pad 23 and the magnetic suction pad 24 are rotatable in the horizontal direction about the shaft 22b as a rotation axis. In the present embodiment, it is possible to freely select either the air suction pad 23 or the magnet suction pad 24 according to the material of the material.

In the above description, the present invention has been described with respect to a laser processing apparatus. However, the present invention is not limited to this, and may be applied to other processing apparatuses, for example, other processing machines such as electric discharge machines. It goes without saying that you can do it.

[0037]

The processing apparatus according to the first invention and the second processing apparatus
The processing method according to the invention is based on
When the suction position is grasped and there is no remaining material in the suction means,
It is possible to correct the relationship between the machining path and the suction position.
You.

The processing apparatus and the fourth embodiment according to the third invention.
The processing method related to the brightness depends on the processing shape and the absorption of the selected material.
The pick-up position is ascertained, and there is suction means at a position where there is no remaining material
In this case, it is necessary to adsorb remaining material from multiple adsorption means.
Select the suction means to be operated, and make sure that there is no remaining material.
Make sure the attachment means does not function, and ensure that any remaining material is adsorbed
Make it possible.

[0039]

[0040]

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a laser processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram of a display screen of a display of the laser processing apparatus according to the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a laser processing apparatus according to a second embodiment of the present invention.

FIG. 4 is a diagram of a display screen of a display of a laser processing apparatus according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram of a laser processing apparatus according to a third embodiment of the present invention.

FIG. 6 is a diagram of a display screen of a display of a laser processing apparatus according to a third embodiment of the present invention.

FIG. 7 is a view showing a suction pad of a laser processing apparatus according to a fourth embodiment of the present invention.

FIG. 8 is a diagram showing a suction pad section of a laser processing apparatus according to a fifth embodiment of the present invention.

FIG. 9 is a diagram showing a suction pad of a laser processing apparatus according to a third embodiment of the present invention.

FIG. 10 is a configuration diagram of a conventional laser processing apparatus.

FIG. 11 is a configuration diagram of another conventional laser processing apparatus.

FIG. 12 is an explanatory diagram of a display screen of the conventional laser processing apparatus of FIG. 10;

FIG. 13 is an explanatory diagram of a display screen of the conventional laser processing apparatus of FIG. 11;

[Explanation of symbols]

1 ... Processing table, 2 ... Sword pin, 3 ... Material, 4
... Clamp, 5 ... Memory, 6 ... Input device,
7 ... machining position calculation circuit, 8 ... drive circuit, 9 ...
・ Motor, 10 ・ ・ ・ Laser beam irradiation device, 11 ・ ・
・ Laser beam, 12 ・ ・ ・ Display position calculation circuit, 13 ・
..Display, 14 ... Kenyama pin position memory, 1
5: Obstacle position memory, 16: Suction pad position memory, 17: Suction pad, 18: Suction pad selection circuit, 19: Suction pad drive circuit, 20:
Suction pad metal fittings, 21 ... LM guide, 22 ... Shaft, 23 ... Air type suction pad, 24 ... Magnetic force type suction pad.

Continuation of front page (56) References JP-A-3-149168 (JP, A) JP-A-4-187333 (JP, A) JP-A-9-271977 (JP, A) JP-A-63-180107 (JP) , A) Japanese Utility Model Hei 5-287 (JP, U) Japanese Patent Publication Hei 4-65758 (JP, B2) (58) Field surveyed (Int. Cl. ⁷ , DB name) B23K 26/10 B23K 26/00 B23K 37/00

Claims (4)

(57) [Claims] A material supporting means for supporting a material;
Processing energy to supply processing energy to the material processing point
Supply means, and a moving hand for moving the processing point on the material
Steps and residuals after removing the workpieces cut from the material
Means for adsorbing material, the shape of the remaining material,
A display device for displaying the positions of the columns in an overlapping manner;
The suction means does not come on the processed shape based on the display of
Modify the machining path to change and add
Shift the position of the machined shape or adsorb to the machined shape
An input device for shifting the position of the means.
Processing equipment. 2. The method according to claim 2 , wherein the shape of the material and
In addition to displaying the processing shape, it was cut out from the material
The position of the adsorption means for adsorbing the residual material after removing the processed product
Display process and modify the machining program to add
Change the machining locus to shift the position of the machining shape or machining
By shifting the position of the suction means with respect to the shape,
Preventing the means from being over the work shape;
Processing energy at the processing point of the material according to the processing program
And a step of actually performing machining.
Law. 3. A material supporting means for supporting a material;
Processing energy to supply processing energy to the material processing point
Supply means, and a moving hand for moving the processing point on the material
Steps and residuals after removing the workpieces cut from the material
Adsorption means for adsorbing the material, the shape of the remaining material and the material support.
Display device for displaying the positions of the holding means and the suction means in an overlapping manner
Based on the display and the indication on this display device.
Adsorption means for functioning to adsorb said residual material from within the stage
Selecting means for selecting
The remaining material is adsorbed by applying the adsorbing force only to the adsorbing means
A processing device characterized by the fact that: 4. The shape of the material and the shape of the material
In addition to displaying the processing shape, it was cut out from the material
Positions of multiple adsorption means for adsorbing residual materials after removing processed products
Confirming the process of displaying overlapping positions and the displayed positional relationship
And a suction hand located in the processing locus among a plurality of suction means.
A step of selecting one without the step, and the machining program
Supply processing energy to the processing point of the material according to
Process and the adsorption only adsorption means selected force to perform the processing
And a step of driving by acting.