JP3286499B2 - Method and apparatus for bonding release film - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a peeling method in which a release-treated film having a release-treated layer formed by subjecting a surface of a substrate to a release-treatment layer is laminated with the release-treated layers and partially adhered with sufficient strength. The present invention relates to a method and an apparatus for bonding a treated film, particularly, a sanitary article such as a sanitary napkin having a non-use surface coated with an adhesive, and a release treatment film suitable for use when individually packaged with a release treatment film. And a bonding method.

[0002]

2. Description of the Related Art Japanese Patent Laid-Open Publication No. Sho 61 (1986) discloses a prior art in which a release treatment film in which a release treatment layer is formed by applying a release treatment to the surface of a base material and the release treatment layers are overlapped and partially adhered.
A method described in -122861 has been proposed.

In this method, the structure of the film is
Release agent layer, a film having a higher melting point than the release agent layer present on the release agent layer, and a three-layer structure consisting of a film having a lower melting point than the release agent layer present on the high melting point film,
The adhesion between the films having the three-layer structure is performed by stretching the film while heating at a temperature at which only the low-melting-point film is melted, and thermally welding the low-melting-point films.

[0004]

However, the above-mentioned bonding method seals only the low-melting-point film with the high-melting-point film therein, by heat-sealing only the low-melting-point film.
There is a problem that setting of heating conditions and the like is complicated and difficult, and the materials to be used are extremely limited due to the melting point.

[0005] Accordingly, an object of the present invention is to allow a release-treated film comprising at least a substrate and a release-treated layer to have a sufficient strength and to be easily adhered even when the release-treated layers are overlapped. An object of the present invention is to provide a method and an apparatus for bonding a release-treated film.

[0006]

According to the present invention, a release-treated film comprising at least a substrate and a release-treated layer formed by subjecting the surface of the substrate to a release treatment is laminated on the release-treated layers. In a method of bonding a release treatment film that partially adheres to each other , the method comprises a pair of rolls, and one of the rolls
Has a plurality of convex portions provided on the curved surfaces facing each other between the rolls.
A plurality of protrusions are arranged in a grid on the surface of the protrusions.
Using pressure roll is a column shape, the release treatment film was pressure by passage through the above pressure roll, partially expose the base and partially destroyed the release treatment layer And thereafter bonding the substrates partially exposed by the pressure between the pressure rolls at their exposed portions (first invention of the present invention).
The above object has been achieved by providing the above.

[0007] The present invention also provides a release treatment film comprising at least a substrate and a release treatment layer formed by subjecting the surface of the substrate to a release treatment, by partially overlapping the release treatment layers with each other. In the method of bonding a release-treated film to be bonded, the method comprises a pair of rolls, one of which is a roll.
Convex roll in which a plurality of convex portions are provided on the curved surface facing each other
The surface of the projection has a shape in which a plurality of protrusions are arranged in a lattice.
Using a pressure roll that is in the shape of
When attaching, the release treated film is placed between the pressure rolls.
And pressurized to partially break the release treatment layer and partially expose the base material, and simultaneously bond the partially exposed base materials at their exposed portions. Method for bonding release treated film (second invention)
The above object has been achieved by providing the above.

[0008] The present invention provides a preferred apparatus for use in the first aspect of the present onset Ming embodiment, at least a base material and the substrate
From the release treatment layer formed by applying a release treatment to the surface of
Feeding means for feeding a strip-shaped release processing film comprising
A release treated film fed out by said feeding means, by applying pressure by passage through the pressing roll, the release treatment layer of the release treated film was partially destroyed
The release treatment layer destruction means for partially exposing the base material, the release treatment film in which the release treatment layer is partially destroyed by the release treatment layer destruction means and the base material is partially exposed,
A tubular article forming means for forming a tubular package by enclosing the article to be packaged with the release treatment layer inside, a delivering means for delivering the packaged article to a predetermined packaging position of the tubular article forming means, and the delivering Ri formed the packaged article fed comprises a bonding means for bonding the substrates to each other in the release-treated film in the tubular packaging material formed by enclosed by the cylindrical-forming means at their exposed portions by means , The pressure roll is a pair of
Rolls, one of which is a pair of rolls
A convex roll provided with a plurality of convex portions on a curved surface, wherein the convex portions
The surface is to provide device in which a plurality of projections and wherein the shape der Rukoto arranged in a lattice pattern (third invention).

[0009] The present invention provides a preferred apparatus used in the second of the onset Ming embodiment, a pair of rolls,
One of the rolls has a plurality of convexes on the curved surface facing each other.
A convex roll provided with a convex portion, and the surface of the convex portion has a plurality of protrusions.
Equipped with a pressure roll whose shape is arranged in a grid
Yes, at least subject the substrate and the surface of the substrate to a release treatment
Consisting release treatment layer formed Te feeding means for feeding a peeling-treated film of the strip, with a release treated film fed out by said feeding means, the release process fill
Means for forming a tubular package by enclosing the article to be packaged with the above-mentioned peeling treatment layer inside, a delivery means for sending the article to be packaged to a predetermined packaging position of the tubular article forming means, and When the release processing film in the tubular package formed by enclosing the article to be packaged sent out by the delivery means by the tubular object forming means is adhered, the release processing film is used.
Pressurizing the Lum passed through between the pressure roller and a release treatment layer is partially destroyed at the same time to partially expose the base material, the base material together with partially exposed in their exposed part (4) The present invention provides an apparatus (fourth aspect of the present invention) characterized by comprising means for destruction / adhesion of a peeling treatment layer to be adhered by (1).

[0010]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. First, an embodiment of the bonding apparatus (third present invention) of the present invention used for carrying out the method for bonding a release treatment film (first present invention) of the present invention will be described with reference to the drawings. FIG. 1 shows the third
FIG. 2 is a schematic view showing an embodiment of the bonding apparatus of the present invention together with an embodiment of the first present invention. FIG. 2 shows a partially broken state of the peeling treatment layer by the peeling treatment layer breaking means of the bonding apparatus shown in FIG. FIG. 2A is a cross-sectional view showing a release-treated film before a partial destruction state of a release-treated layer, and FIG.
FIG. 3 is a cross-sectional view showing a release treatment film showing a state in which a release treatment layer is partially destroyed.

As shown in FIG. 1, the peeling film bonding apparatus of the present embodiment comprises a feeding means 1 for feeding a strip-shaped peeling film 7 and a release processing layer of the peeling film 7 fed by the feeding means 1. A release treatment layer destroying means 2 for partially destroying the base material 9 to partially expose the base material 9, and the release treatment layer 10 is partially destroyed by the release treatment layer breakdown means 2 to partially break the base material 9 With the exposed release film 7, the tubular article forming means 3 for forming the tubular package 8 'by enclosing the article to be packaged 8 with the release layer 10 inside, and forming the article to be packaged 8 into the tubular article A feeding means 4 for sending out to a predetermined packaging position of the means 3, and a peeling processing film 7 on a tubular package 8 ′ formed by enclosing the article to be packaged 8 sent out by the sending means 4 by the tubular material forming means 3. Substrate 9 The is configured by including an adhesive means (5) for bonding at their exposed portions.

The feeding means 1 comprises a base material 9 and the base material 9.
And a release treatment layer 10 formed by subjecting the release treatment layer 10 to a release treatment layer 10 formed by subjecting the release treatment layer 10 to a top surface (the base material 9 is a lower surface). By rotating the roll, the release processing film 7 is fed out.

The release treatment layer breaking means 2 is provided with a release treatment film 7 delivered by the delivery means 1.
Is passed between two pressure rolls 11 and 12 having different shapes to apply pressure, thereby partially breaking the release treatment layer 10 and exposing the substrate 9, as shown in FIG. 2. A convex roll 1 is provided on the lower surface side (substrate 9 side) of the release film 7.
1 and a flat roll 12 is disposed on the upper surface side (the release processing layer 10 side) of the release processing film 7, and these two pressure rolls 11 and 12 (the convex roll 11 and the flat roll 12) Through which the release film 7 is passed.
At this time, the rolls 11 and 12 are configured to be pressurized.

The convex portion 11A of the convex roll 11 is formed as shown in FIG.
As shown in FIG. 2, a pair of convex portions 11A are provided at opposing positions of the convex roll 11, and a portion of the curved convex portion 11 </ b> A is enlarged and represented as a planar shape, as shown in FIG.
The surface of the protrusion 11A has a shape in which the protrusions 11A 'are arranged in a lattice. Then, when the release film 7 is passed between the pressure rolls 11 and 12, as shown in FIG. 2B, the portion passing between the protrusions 11 A ′ and 11 A ′ and the flat roll 12 is formed. The release treatment layer 10 is destroyed, and the substrate 9 is exposed as an exposed portion 9 'at the broken portion.

The tubular article forming means 3 wraps the article to be packaged 8 with the release film 7 in which the release layer 10 is partially broken and the substrate 9 is partially exposed. The article to be packaged 8 is wrapped in a tubular shape at a predetermined interval with the treatment layer 10 inside, so as to form a tubular package 8 ′.

The delivery means 4 is provided with an article to be packaged 8.
At a predetermined interval to a predetermined packaging position of the cylindrical object forming means 3. The article to be packaged 8 sent out to the predetermined position of the tubular article forming means 3 at a predetermined interval is wrapped at the non-exposed portion of the release film 7 and is exposed between the adjacent articles to be packaged 8. The tubular package 8 'is formed so that the portion 9' is located.

Further, the bonding means 5 is provided with the packaged product 8.
The tubular package 8 'formed by enclosing the
By passing between the individual rolls 51, 51, the partially exposed base materials 9 of the tubular release film 7 in the tubular package 8 'are bonded to each other by heat welding at the exposed portions 9'. Is configured. The bonding means 5
In the next step (not shown), the heat-sealed portion is cut by a cutter or the like to perform heat welding on the exposed portion.
Of individual packages are obtained.

Next, an embodiment of a method for bonding a release-treated film (first invention) using the apparatus for bonding a release-treated film according to the above-described embodiment (third invention) will be described with reference to FIGS. This will be described with reference to FIG. First, the release treatment film 10 is delivered by the delivery means 1 with the release treatment layer 10 facing the upper surface. Next, the released release film 7 is passed through the release layer breaking means 2 to form two pressure rolls 1 having different shapes.
1 and 12, the release treatment layer 10 is partially broken, and the base material 9 is partially exposed. Next, the release processing film 7 in which the base material 9 is partially exposed is sent to the tubular material forming means 3, where the release processing film 7
The packaged object 8 sent out from the sending-out means 4 with the peeling treatment layer 10 inside is included to form a tubular packaged 8 '.

Thereafter, the tubular package 8 'formed by enclosing the article to be packaged 8 is passed between the two rolls 51, 51 by the bonding means 5, and the base of the release-treated film 7 is formed. The materials 9 are bonded to each other by heat welding at the exposed portion 9 ', and the seal portion is cut using a cutter or the like in the next step. As a result, an individual package of the article to be packaged 8 is obtained.

As described above, according to the method and the apparatus for bonding the release-treated film of the present embodiment, the release-treated layer 7 of the release-treated film 7 in which the release treatment is performed on the surface of the base material 9 to form the release-treated layer 10. After partially exposing the base material 9 by partially breaking only the base material 10, the partially exposed base materials 9 can be bonded to each other. Even if they are bonded, they can be bonded with sufficient strength in the exposed portions 9 '.

FIG. 3 shows an embodiment of the peeling film bonding apparatus (fourth present invention) used for carrying out the peeling film bonding method of the second present invention and one embodiment of the second present invention. FIG. 4 is a schematic explanatory view showing the state of partial destruction / adhesion of the release treatment layer by the destruction / adhesion means of the release treatment layer of the apparatus shown in FIG. 3, and FIG. Cross-sectional view showing a release film before the partial destruction state,
FIG. 4B is a cross-sectional view showing the release processing film showing a state in which the release processing layer has been partially destroyed.

As shown in FIG. 3, the peeling film bonding apparatus according to the present embodiment uses a feeding means 1 for feeding a strip-shaped peeling film 7 and a peeling film 7 fed by the feeding means 1. A tubular article forming means 3 for forming a tubular package 8 'by enclosing the article to be packaged 8 with the layer 10 inside, and the article to be packaged 8 is formed by the tubular article forming means 3
Of the release processing film 7 in a cylindrical package 8 ′ formed by enclosing the article to be packaged 8 sent out by the module 4 with the feeding means 4 for feeding to the predetermined packaging position A peeling treatment layer destruction / adhesion means 6 is provided for partially destroying the treatment layer 10 to partially expose the base material 9 and for bonding the partially exposed base materials 9 to each other at respective exposed portions. It is configured.

That is, the peeling film bonding apparatus of the present embodiment comprises the feeding means 1 and the feeding means 4
The configuration of the apparatus of the embodiment shown in FIG. 1 is exactly the same as that of the apparatus of the embodiment shown in FIG. 1, and the tubular article forming means 3 is also substantially the same as the apparatus of the embodiment shown in FIG.

However, in the apparatus of the present embodiment, the peeling layer breaking means 2 in the apparatus of the embodiment shown in FIG.
And the bonding means 5 in the apparatus of the embodiment shown in FIG.
Instead, a peeling treatment layer breaking / adhering means 6 is provided, which is different from the previous embodiment in this point.

The peeling layer breaking / adhering means 6 peels the peeling film 7 from the tubular package 8 ′ in which the article to be packaged 8 sent out by the sending means 4 is included by the tubular object forming means 3. The treatment layer 10 is passed between a pair of pressure rolls 61 and 62 to partially break the release treatment layer 10 to expose the base material 9 and, at the same time, to separate the partially exposed base materials 9 from each other. It is made to adhere at the exposed part of the.

The peeling treatment layer breaking / adhering means 6 is shown in FIG.
As shown in FIG. 1, a pair of convex rolls 61 and flat rolls 62 similar to the rolls 11 and 12 in the apparatus of the embodiment shown in FIG. 1 are provided, and the cylindrical package 8 'is passed between them. Between the packaged object 8 and the packaged object 8 in the cylindrical packaged material 8 ′, the peeling treatment layer 10 is partially broken at the overlapping portion of the peeling treatment layer 10 of the tubular release treatment film 7. Then, the base material 9 is partially exposed at a point P in FIG. 4, and at the same time, the partially exposed base materials 9 are bonded to each other at their exposed portions.

The present embodiment will be further described. The pair of pressure rolls 61 and 62 (convex roll 61 and flat roll 62) in this embodiment have the same configuration as the rolls 11 and 12 of the apparatus shown in FIG. However, in the present embodiment, the release film 7 of the tubular package 8 ′ is adhered at the position of the convex portion 61 A of the convex roll 61, except for the convex portion 61 A of the convex roll 61. The portion where the packaged object 8 is wrapped at the position shown in FIG. In the apparatus shown in FIG. 3, the flat roll 62 intermittently separates upward from the convex roll 61 when the packaged object 8 of the tubular package 8 'passes.

Next, an embodiment of a method for bonding a release-treated film (second invention) using the apparatus for bonding a release-treated film of the above-described embodiment (fourth invention) is shown in FIG. 3 and FIG. Explaining with reference to FIG. 4, in this embodiment, there is no peeling treatment layer breaking means 2 in the embodiment shown in FIG. 1, and therefore, there is no breaking step of the peeling treatment layer 10 in the means 2; The embodiment is substantially the same as that of the embodiment shown in FIG. 1 except that the peeling treatment is destroyed and adhered by the peeling treatment layer destruction / adhesion means 6 instead of the adhesion by the adhesion means 5 in the above embodiment.

That is, in the embodiment shown in FIG. 3, in the peeling treatment layer destruction / adhesion means 6, as shown in FIG. The release treatment layer 10 of the release treatment film 7 in the package-like package 8 'is partially broken to expose the base material 9 at the same time, and the partially exposed base materials 9 are bonded to each other at their exposed portions. Then, in a next step (not shown), the heat seal portion is cut by a cutter or the like, and as a result, an individual package of the article to be packaged 8 is obtained.

As described above, according to the method and the apparatus for bonding the release-treated film of the present embodiment, the release-treated layer 10 of the release-treated film 7 in which the release treatment is performed on the surface of the base material 9 to form the release-treated layer 10. Since only the base material 9 is exposed by partially breaking only the base material 9 and the base materials 9 partially exposed can be bonded to each other, the release-treated film 7 is It can be bonded with a high strength.

The method and apparatus for bonding a release-treated film of the present invention are not limited to the above-described embodiment, and can be appropriately changed without departing from the object of the present invention.

For example, in the above embodiment, a release film composed of two layers, a substrate and a release layer formed by subjecting the surface of the substrate to a release treatment, is used as the release film. The release treatment film used in the present invention may further include other layers in addition to the substrate and the release treatment layer.

Further, as a means for partially destroying the release treatment layer, in the above embodiment, both a method has been adopted by the pressure roll, pressure roll is limited to a roll used in the above embodiment Not done.

Further, as a means for bonding the partially exposed base materials to each other, in each of the above-described embodiments, a method using heat welding is adopted, but a method using an adhesive may be adopted.

The material for forming the release-treated film is not particularly limited. As the film material for the substrate, for example, a polyolefin-based resin such as polyethylene or polypropylene, a polyester-based or cellulose-based resin film, or the like may be used. As a material for forming the release treatment layer, for example, silicone resin, Teflon, paraffin, or the like can be used.

In the above embodiment, the sanitary napkin is used as the article to be packaged, and the present invention is particularly suitable for individual packaging of the sanitary napkin, but the article to be packaged is not limited. Further, other objects can be appropriately changed without departing from the spirit of the present invention.

[0037]

According to the method or the apparatus for bonding a release-treated film of the present invention, a release-treated film having a release-treated layer formed by applying a release treatment to the surface of a substrate is sufficiently laminated with the release-treated layers. Adhesion can be easily performed with high strength.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing one embodiment of the apparatus of the present invention used for carrying out the method of bonding a release-treated film of the present invention, together with one embodiment of the present invention.

FIG. 2 is a schematic explanatory view showing a partially broken state of a peeling treatment layer by a peeling treatment layer breaking means of the bonding apparatus shown in FIG. 1, and FIG. FIG. 2B is a cross-sectional view illustrating the release processing film, showing a state in which the release processing layer is partially broken.

FIG. 3 shows one embodiment of a peeling film bonding apparatus (fourth present invention) used for carrying out the peeling film bonding method of the second present invention, together with one embodiment of the second present invention. It is a schematic diagram.

FIG. 4 is a schematic explanatory view showing a partial destruction / adhesion state of a release treatment layer by means of a release treatment layer destruction / adhesion means of the apparatus shown in FIG. 3; FIG. FIG. 4B is a cross-sectional view showing the release processing film showing a state in which the release processing layer is partially broken.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 feeding-out means 2 peeling treatment layer breaking means 3 tubular material forming means 4 sending-out means 5 bonding means 6 peeling treatment layer destruction / bonding means 7 peeling treatment film 8 packaged product 8 'cylindrical package 9 base material 9' exposed portion Reference Signs List 10 release treatment layer 11 convex roll 11A convex portion 11A 'projection 12 flat roll 51 roll 61 convex roll 61A convex portion 61A' projection 62 flat roll

Continuation of the front page (72) Inventor Tsuneo Ishii 2606 Akabane, Kaigamachi, Haga-gun, Tochigi Prefecture Kao Research Institute (56) References JP-A-4-200545 (JP, A) JP-A-61-212861 (JP, A) JP-A-3-200562 (JP, A) JP-A-4-87914 (JP, A) JP-A-6-63024 (JP, U) JP-B-6-62130 (JP, B2) (58) Survey Field (Int.Cl. ⁷ , DB name) B65B 51/00-51/32 B65B ⁷ /00-9/24 A61F 13/15-13/84 B29C 65/00-65/54

Claims (4)

(57) [Claims] 1. A release treatment in which a release treatment film comprising at least a base material and a release treatment layer formed by applying a release treatment to the surface of the base material is partially adhered by overlapping the release treatment layers. In the method for bonding a film, the film comprises a pair of rolls, one of which is the same as the roll.
A convex roll in which a plurality of convex portions are provided on the facing curved surface of
The surface of the projection has a shape in which a plurality of protrusions are arranged in a lattice.
There using pressure roll, the release treatment film was pressure by passage through the above pressure roll, partially expose the base and partially destroyed the release treatment layer, then, the pressurized For pressurization between pressure rolls
A method of bonding a release-treated film, wherein the base materials that are more partially exposed are bonded to each other at their exposed portions. 2. A release treatment in which a release treatment film comprising at least a substrate and a release treatment layer formed by applying a release treatment to the surface of the substrate is partially adhered by overlapping the release treatment layers. In the method for bonding a film, the film comprises a pair of rolls, one of which is the same as the roll.
A convex roll in which a plurality of convex portions are provided on the facing curved surface of
The surface of the projection has a shape in which a plurality of protrusions are arranged in a lattice.
When a certain pressure roll is used to bond the release treatment film, the release treatment film is used.
The film is passed between the pressure rolls and pressurized to partially break the release treatment layer and partially expose the substrate, and simultaneously expose the partially exposed substrates to each other. A method for bonding a release-treated film, characterized by bonding at a part. 3. An apparatus used for carrying out the method for bonding a release-treated film according to claim 1, wherein at least a substrate and a surface of the substrate are subjected to a release treatment.
Feeding means, a release treated film fed out by said feeding means, by applying pressure by passage through the pressing roll, the release of the release treated film for feeding a strip of a release treated film composed of a release treatment layer is Partially destroying the treatment layer
The release treatment layer breaking means for partially exposing the base material, the release treatment film partially peeling the release treatment layer by the release treatment layer destruction means and the release treatment film partially exposing the base material, A tubular article forming means for forming a tubular package by enclosing the article to be packaged inside, a delivery means for delivering the packaged article to a predetermined packaging position of the tubular article forming means, and a delivery means provided by the delivery means Ri formed comprises a bonding means for bonding the substrates to each other in the release-treated film in the tubular packaging a packaged article formed by enclosed by the cylindrical-forming means at their exposed portions, the pressure roll Consists of a pair of rolls,
On the other hand, a plurality of protrusions are provided on the curved surface facing each other between the rolls.
A plurality of protrusions on the surface of the protrusion are in a grid pattern.
And wherein the shape der Rukoto arranged in. 4. An apparatus used for carrying out the method for bonding a release film according to claim 2, comprising a pair of rolls, one of the rolls being the same as the roll.
A convex roll in which a plurality of convex portions are provided on the facing curved surface of
The surface of the projection has a shape in which a plurality of protrusions are arranged in a lattice.
Equipped with a certain pressure roll, formed by subjecting at least the substrate and the surface of the substrate to a release treatment
A feeding means for feeding a strip-shaped release processing film comprising a release processing layer to be peeled , and a release processing film fed by the feeding means, by enclosing an article to be packaged with the release processing layer of the release processing film inside. Means for forming a cylindrical package, sending means for sending the article to be packaged to a predetermined packaging position of the means for forming a cylindrical article, and means for forming the article to be sent sent out by the means for feeding said cylindrical article Bonding a release-treated film on a tubular package formed by enclosing
Then, passing the release treatment film between the pressure rolls
Pressurizing the partially disrupted to partially expose the substrate to release treatment layer at the same time, the release treatment layer destruction and bonding means for bonding the substrates to each other which is partially exposed at their exposed portions Te An apparatus comprising: