JP3284885B2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for sealing a lead frame or the like on which a semiconductor element is mounted with a resin.

[0002]

2. Description of the Related Art A conventional semiconductor manufacturing apparatus will be described. As disclosed in Japanese Patent Application No. 07-197371, the invention is to improve the production efficiency by using a plurality of molds that can be transported in a resin sealing step of a semiconductor and injecting and curing the resin in another place to improve the production efficiency. Has been made.

FIG. 3 shows the basic concept of the present invention.
This will be described with reference to FIG. FIG. 3 is a perspective view showing a mold transfer in a conventional semiconductor manufacturing apparatus. In FIG. 3, a place A is a set place, a place B is a press place, and a place C.
Is a take-out place, and place D is a post-processing place.
A mold body composed of the lower mold 1 and the lower mold 12 is transported and circulated through these four locations. 13 and 14 are upper molds 1 respectively.
1. A heater built in the lower mold 12 to maintain the mold at an optimum temperature in order to melt the resin tablet 15 and seal the lead frame 16 with resin. Also, 17
Is a plunger lifter provided at the location B. 1
Reference numerals 8, 19, and 20 denote portions formed by sealing the lead frame 16 with a resin, which are a sealing portion, a runner, and a cull, respectively. These three portions are connected immediately after the resin sealing.

FIG. 4 is a perspective view showing the internal structure of a mold in a conventional semiconductor manufacturing apparatus. The upper mold 11 and the lower mold 12 in FIG. 4 are those when divided at the center in the longitudinal direction, and the cross section is hatched. Reference numeral 21 denotes a cylindrical plunger that pushes the resin tablet 15 and is built in the lower mold 12 and can move up and down in the pot portion 22. The plunger has a shape formed by combining two cylinders and a rectangular parallelepiped. It is pushed up by the lifter 17. 23, 2
Reference numeral 4 denotes an eject pin which is built in the lower mold 12 and pushes up the sealing portion 18 of the lead frame 16 from the lower mold 12 when the mold body is opened.
1 is also provided. Reference numeral 25 denotes an eject pin for pushing up the runner 19.

The operation of the semiconductor manufacturing apparatus configured as described above will be described. First, the lead frame 16 is set on the lower mold 12 and the resin tablet 15 is set on the pot 22 at the setting location of the location A.
Then, the upper mold 11 is lowered, and is conveyed to the place B while being superimposed on the lower mold 12.

[0006] At the press location at location B, a pressurizing device (not shown) presses the upper mold 11 from above to perform mold clamping necessary for performing resin sealing. Thereafter, the plunger lifter 17 provided at this location is raised. As a result, the plunger 21 is raised, and the molten resin tablet 15 is melted.
Is extruded to inject resin into the lead frame 16. When the injection of the resin is completed, the plunger lifter 17 is lowered. At this time, it is assumed that the plunger 21 does not follow the lowering operation of the plunger lifter 17 and is at the position at the end of the resin injection. Then, the mold clamping by the pressurizing device (not shown) is released, and the mold body is transported to the place C.

At the location C, the mold is opened by allowing the upper mold 11 stacked on the lower mold 12 to rise after elapse of time until the injected resin is cured. At this time, the eject pins 23, 24, 2 built in the mold body
5 operates to push up the sealing portion 18 and the runner 19 of the lead frame 16 from the mold body. At this time, the plunger 21
Is not operated, and thus its position remains at the end of the resin injection. Then, the lead frame 16 sealed with the resin is taken out of the mold body. After taking out the resin-sealed lead frame 16, the mold body is transported to the place D.

In the post-processing place of the place D, the plunger 21 is lowered so that the resin tablet 15 can be set in the pot portion 22 in the next cycle. Further, ultraviolet irradiation or brush cleaning may be performed. When the post-processing is completed, the mold body is transported to the location A. The same is repeated as the next cycle.

[0009]

However, in the above-mentioned conventional configuration, even if the plunger lifter is lowered after the injection of the resin at the press place, the plunger built in the lower mold follows the plunger. However, if the plunger lifter is lowered to make the plunger free at the stage where the resin is not completely cured, the plunger may be lowered by its own weight. At that time, a space tends to be formed between the plunger and the resin. However, since the space is a space having a low pressure, the uncured resin moves so that the space does not expand. As a result, the plunger pulls the resin, which adversely affects the curing of the resin, causing voids inside the resin, thereby reducing the reliability of the product.

In addition, the plunger does not move when the mold is opened to take out the resin-sealed lead frame at the take-out place. There is a second problem that even if there is something to push up, there is nothing to push up the cull, the resin breaks between the runner and the cull, and the cull remains in the pot part, which hinders the next operation. .

The present invention solves these problems, and restricts the position of the plunger with respect to the mold from being changed by its own weight during the period from the end of the resin injection to the curing, thereby preventing the plunger from pulling the resin. The first object is to prevent it. It is a second object of the present invention to prevent the cull from remaining in the pot portion by interlocking an eject pin provided on the mold body with the plunger when the mold body is opened to take out the lead frame. .

[0012]

In order to solve the above-mentioned problems, a semiconductor manufacturing apparatus according to the present invention comprises a transportable mold in which a resin-sealed body and a sealing resin are set; A plunger that rises relatively to the body and presses the sealing resin, and the plunger from the end of the injection of the sealing resin to the curing.
A lock mechanism for preventing the plunger from lowering with respect to the mold body due to the weight of the lancer .

[0013] Further, a transportable mold body in which a resin-sealed body and a sealing resin are set, a plunger which moves relatively to the mold body and presses the sealing resin, A plunger hook that takes a first posture that does not engage with the plunger hook, a driving source that changes the posture of the plunger hook, and a driving source that operates the plunger via the plunger hook. It is a thing.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention provides a transportable mold body having a plunger lock which is operable by using an air cylinder as a drive source. By restricting the position of the plunger with respect to the body so as not to change by its own weight, the plunger does not pull the resin during the curing of the resin. In addition, a plunger hook is provided, which can be engaged with the plunger by rotating the rotary actuator as a drive source, and a plunger mover supporting the plunger hook can be operated using a servo motor as a drive source, thereby taking out a lead frame. When the mold is opened, the plunger and the eject pin provided on the mold are linked to prevent the cull from remaining in the pot portion. The transfer using a plurality of molds is the same as in the conventional example, and the basic description thereof is omitted.

An embodiment of the present invention will be described below with reference to the drawings. First, the configuration and operation at the setting place and the press place will be described with reference to FIG. FIG.
FIG. 3 is a perspective view showing a lock mechanism of a plunger in the semiconductor manufacturing apparatus according to one embodiment of the present invention.

In FIG. 1, 33 is a resin tablet 1
5 is a plunger that pushes the cylinder 5 and has a shape formed by combining two cylinders and a rectangular parallelepiped. The plunger is built in the lower mold 32 and moves up and down in the pot portion 34. 35, 36 are lower molds 32
Is a plunger lock for restricting the plunger 33 from lowering, and is provided integrally with the lower mold 32. The air cylinders 37 and 38 are used as driving sources in the directions of arrows K and L, and arrows M and N, respectively. Work in the direction. 41
Is a plunger lifter for pressing the plunger 33, which is provided at the press location, and which has guide rods 42, 4 at both ends.
3 and the central ball screw mechanism 44, the servo motor 4
With the drive source 5, the power is transmitted by the belt 46 to move up and down. Reference numeral 47 denotes a lift bar which is a portion of the plunger lifter 41 which comes into contact with the plunger 33. 48
Is a pressure sensor provided on the lower side of the lift bar 47, and performs resin injection while measuring a pressure for pressing the molten resin tablet 15. Also, 49
This is a heat insulating plate for thermally insulating the upper and lower portions of the lower mold 32, so that heat generated from the heater 14 at the upper portion is not transmitted to the air cylinders 37 and 38 provided at the lower portion. Note that FIG. 1 is for explanation, and in a press place where the plunger lifter 41 is provided, the upper die 31 overlaps the lower die 32, and the upper die 31 as shown in FIG. There is actually no state where the type is open. Further, the upper mold 31 and the lower mold 32 are those when divided in the longitudinal direction at the center, and the cross section is hatched as in the conventional example.

The operation of the lock mechanism of the plunger configured as described above will be described. First, at the setting location, the plunger locks 35 and 36 are at the retracted positions in the directions of the arrows L and N, respectively.
It is below the pot portion 34. In this state, the lead frame 16 is connected to the lower mold 32 and the resin tablet 15 is connected to the pot 3.
Set each to 4. Then, the upper mold 31 is lowered, overlapped with the lower mold 32, and transported to the press place.

At the press location, a pressing device (not shown) presses the upper mold 31 from above to perform mold clamping necessary for performing resin sealing. Thereafter, the servomotor 45 is operated to raise the plunger lifter 41. The plunger lifter 41 comes into contact with the plunger 33 at the lift bar 47 and raises it. Thus, the molten resin tablet 15 is extruded, and the resin is injected into the lead frame 16. The injection of the resin is continued until the sealing portion 18 of the lead frame 16 is filled with the resin and the value indicated by the pressure sensor 48 becomes a predetermined value. When the resin injection is completed, the air cylinders 37 and 38 are operated to move the plunger locks 35 and 36 which have been in the retracted position to the lock positions in the directions of arrows K and M, respectively. Thereby, the plunger 33 is moved to the lower mold 32.
Is restricted from descending. After restricting the lowering of the plunger 33, the servomotor 45 is operated to lower the plunger lifter 41. In addition, the mold clamping by the pressurizing device (not shown) is released, and the mold body is conveyed from the press place to the take-out place.

Next, the configuration and operation at the take-out place will be described with reference to FIG. FIG. 2 is a perspective view showing a mechanism for operating a plunger at a take-out place in the semiconductor manufacturing apparatus according to one embodiment of the present invention.

In FIG. 2, reference numeral 51 denotes a T-shaped plunger hook which can be engaged with the plunger 33, and rotates in the directions of arrows P and Q using the rotary actuator 52 as a drive source. 53 is a plunger mover that supports the plunger hook 51 and is provided at a take-out place.
Guide rods 54 and 55 at both ends and ball screw mechanism 5 at the center
By using the servo motor 57 as a drive source, power is transmitted by the direct connection of the shaft, and the servo motor 57 moves up and down. Note that the upper mold 31 and the lower mold 32 are those when they are divided in the longitudinal direction at the center, and the cross section is hatched as in FIG.

The operation of the mechanism for operating the plunger configured as described above will be described. After a lapse of time until the injected resin is cured at the take-out location, the servomotor 57 is operated to raise the plunger mover 53 to a position where the plunger hook 51 and the plunger 33 can engage. By operating the rotary actuator 52 at that position, the plunger hook 51 is rotated in the direction of arrow P to engage with the engaging portion (hidden and invisible in the figure) of the plunger 33. This engagement causes the plunger 33 to move up and down integrally with the plunger mover 53. After the plunger hook 51 is engaged with the plunger 33, the air cylinders 37, 38
Is operated to move the plunger locks 35 and 36 which were at the lock position to the retracted positions in the directions of the arrows L and N, respectively. Thus, the restriction on the lowering of the plunger 33 is released. Next, the servomotor 57 is operated to lower the plunger 33 once. This is because the plunger 33 may be stuck to the resin at the contact surface with the cull 20 and the operation is to be peeled off just in case. After the plunger 33 is lowered, it is raised to push up the cull 20. In synchronization with this, the upper mold 31 that has been stacked on the lower mold 32 is raised to open the mold body. When the mold body is opened, the eject pins 23, 24, 25 built in the mold body operate, and the lead frame 1 is opened.
The sealing portion 18 and the runner 19 of FIG. 6 are pushed up from the mold body.
As a result, the cull 20 connected to the sealing portion 18 and the runner 19 of the lead frame 16 is also pushed up together without the resin breaking and remaining in the pot portion 34. Then, the lead frame 16 sealed with the resin is taken out of the mold body. Thereafter, the plunger 33 is lowered so that the resin tablet 15 can be set in the pot portion 34 in the next cycle. Then, by operating the rotary actuator 52, the plunger hook 51 is rotated in the direction of the arrow Q to release the engagement with the plunger 33. Thus, the plunger 33 does not move up and down integrally with the plunger mover 53.
Thereafter, the mold body is transported from the take-out place to the post-processing place.

In this embodiment, the plunger 3
Although the shape of No. 3 is a shape obtained by combining two cylinders and a rectangular parallelepiped, the shape is not limited to this, and various shapes can be used. Further, the plunger locks 35 and 36 operate using the air cylinders 37 and 38 as driving sources, and the plungers 33
Of the plunger locks 35 and 36, as well as the lock mechanism can be changed to various types.

Also, the plunger hook 51 is T-shaped,
This is described as rotating the rotary actuator 52 as a drive source to engage with the engaging portion of the plunger 33.
The shape and operating mechanism for this engagement can be variously changed. Further, the plunger mover 53 is formed by guide rods 54 and 55 at both ends and a ball screw mechanism 56 at the center.
The servo motor 57 is used as a drive source to move up and down.
The mechanism for operating the plunger 33 can be changed to various methods.

[0024]

According to the present invention, a plunger lock is provided integrally with a transportable mold body, which can be operated by using an air cylinder as a drive source, so that the mold body can be moved from completion of resin injection to curing. By limiting the position of the plunger so that it does not change by its own weight, the plunger does not pull the resin during the curing of the resin. As a result, it is possible to prevent voids from being generated inside the resin, and it is possible to secure quality related to the reliability of the product.

Also, a plunger hook is provided at a take-out location, and can be engaged with the plunger by rotating the plunger hook using a rotary actuator as a drive source, and a plunger mover supporting the plunger hook can be operated using a servo motor as a drive source. When the mold body is opened to take out the lead frame, the plunger and the eject pin provided on the mold body are interlocked, so that the cull does not remain in the pot portion. Thus, the semiconductor manufacturing apparatus can be continuously operated without any trouble in the next operation.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a lock mechanism of a plunger in a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a mechanism for operating a plunger at a take-out location in the semiconductor manufacturing apparatus according to one embodiment of the present invention;

FIG. 3 is a perspective view showing a mold transfer in a conventional semiconductor manufacturing apparatus.

FIG. 4 is a perspective view showing an internal configuration of a mold body in a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 11 Upper Die 12 Lower Die 13, 14 Heater 15 Resin Tablet 16 Lead Frame 17 Plunger Lifter 18 Sealing Section 19 Runner 20 Cal 21 Plunger 22 Pot 23,24,25 Eject Pin 31 Upper Die 32 Lower Die 33 Plunger 34 Pot section 35, 36 Plunger lock 37, 38 Air cylinder 41 Plunger lifter 42, 43 Guide rod 44 Ball screw mechanism 45 Servo motor 46 Belt 47 Lift bar 48 Pressure sensor 49 Insulating plate 51 Plunger hook 52 Rotary actuator 53 Plunger mover 54, 55 Guide rod 56 Ball screw mechanism 57 Servo motor

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/56 B29C 45/02

Claims (2)

(57) [Claims] 1. A transportable mold body in which a resin-sealed body and a sealing resin are set, and ascending relative to the mold body.
And pressing the sealing resin, and the sealing resin
During the period from the end of injection to curing, the weight of the plunger is
The semiconductor manufacturing apparatus characterized by comprising a lock mechanism for preventing the lowering of the plunger with respect to the mold body I. 2. A transportable mold body in which a resin-sealed body and a sealing resin are set, a plunger which moves relative to the mold body and presses the sealing resin, and a plunger. A plunger hook that takes a first posture that does not engage with the plunger hook, a driving source that changes the posture of the plunger hook, and a driving source that operates the plunger via the plunger hook. A semiconductor manufacturing apparatus.