JP3283779B2 - Disk-shaped substrate chuck device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk-shaped substrate chuck device. More specifically, the present invention relates to a disk-shaped substrate chuck device that chucks a plurality of disk-shaped substrates simultaneously and changes the direction of the disk-shaped substrates.

[0002]

2. Description of the Related Art Among semiconductor wafers, a semiconductor wafer 1 is particularly preferred.
When the device 01 is transported, it is not preferable that devices and the like come into contact with the front and back surfaces of the semiconductor wafer 101, so that the transport method is limited. Further, in order to transport a plurality of semiconductor wafers 101 collectively,
Contact between the semiconductor wafers 101 must also be avoided.

Therefore, in Japanese Patent Laid-Open No. Hei 5-226458, as shown in FIGS. 6 to 8, a large number of semiconductor wafers 101 vertically accommodated in grooves 103 in a carrier (cassette) 102 are supported. There has been proposed a method using a device which is supported by a support 104 provided with 105 and is taken out at once. As shown in FIG. 8, the lower edge of the semiconductor wafer 101 is supported by the support protrusions 105, and the upper edge thereof is supported by two grooves 107 provided on the support bar 106.

[0004]

However, in the above-described apparatus, since one semiconductor wafer 101 is supported by one supporting member 104, if the number of semiconductor wafers 101 to be taken out is increased, the number of semiconductor wafers 101 is increased. Therefore, the number of the support members 104 and the number of the support protrusions 105 must be increased, so that the apparatus becomes large and is not suitable for handling the large semiconductor wafer 101.

On the other hand, a plurality of semiconductor wafers 10 taken out
It is desired that the semiconductor wafer 101 not only be transported in that direction, but also be changed in the direction of the surface of the semiconductor wafer 101 before being mounted on another cassette. For example, in a case where semiconductor wafers 101 that are stored horizontally stacked at a certain interval are taken out and transported, and the semiconductor wafers 101 are placed on a cassette that stands vertically and arranged side by side,
Or, conversely, it is a case where the sheet is transported from a vertical cassette to a horizontal cassette. In such a case, if a plurality of semiconductor wafers 101 can be transferred simultaneously and the direction of the semiconductor wafers 101 can be changed during the transfer, the semiconductor wafers 10 can be transferred to another cassette as it is.
1 can be placed.

In consideration of the case of transporting the semiconductor wafers 101, it is advantageous if the surfaces of the respective semiconductor wafers 101 can be arranged to face each other.

Accordingly, the present invention provides a disk-shaped substrate which is capable of simultaneously chucking a plurality of disk-shaped substrates such as semiconductor wafers and changing the direction of the disk-shaped substrate in both directions while chucking. It is an object of the present invention to provide a chuck device.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, an invention according to claim 1 is a circle for chucking and taking out a plurality of disk-shaped substrates stored in parallel at regular intervals and collectively. In the plate-shaped substrate chuck device, a tip-side chuck portion that supports the inner edge portion of each disk-shaped substrate by a support member that extends between the disk-shaped substrates and extends perpendicularly to the direction of the disk-shaped substrate, A base-side chuck portion that moves in the through direction of the distal-side chuck portion to support a front edge portion of each disk-shaped substrate, and the distal-side chuck portion includes at least a support member for each disk-shaped substrate. It is rotatable between a first rotation position that is parallel to the first rotation position and a second rotation position that is perpendicular to the first rotation position. Each circle in the state rotated to the second rotation position The back side of the edge portion of the Jo substrate support, the proximal chuck portion has two supporting surfaces for supporting the edge portion of the front side of the disk-shaped substrate at a position away from each other.

Therefore, the distal chuck portion rotated to the first rotation position passes through the space between the respective disc-shaped substrates and rotates to the second rotation position, and the supporting member of the distal chuck portion is rotated to the respective disc positions. The support surface of the proximal chuck portion supports the front edge portion of the disc-shaped substrate while supporting the rear edge portion of the substrate, so that the distal chuck portion and the proximal chuck portion support the front edge portion of the disc-shaped substrate. Chucking the disk-shaped substrate.

In the chucking apparatus for a disk-shaped substrate according to the present invention, the supporting member of the distal-side chuck and the supporting surface of the base-side chuck are provided with irregularities for supporting the edge of each disk-shaped substrate. Are formed at the same intervals as the storage intervals of the respective disc-shaped substrates.

Therefore, the unevenness of the distal chuck supports the inner edge of the disk-shaped substrate, and the unevenness of the proximal chuck supports the front edge of the disk-shaped substrate. Chucking while keeping the storage interval. In addition, the concave and convex portions of the distal-side chuck portion and the proximal-side chuck portion chuck a plurality of disk-shaped substrates simultaneously.

According to the third aspect of the present invention, the distal-side chuck portion and the proximal-side chuck portion include:
These chuck portions are attached to a chuck holding portion that is rotatable in a direction of inverting the chuck portions. When the chuck holding portions rotate, the tip-side chuck portion moves between the first rotation position and the second rotation position. It is made to rotate between.

Therefore, when the chuck holding portion is rotated in a state where the distal-side chuck portion and the proximal-side chuck portion chuck the disk-shaped substrate, the distal-side chuck portion and the proximal-side chuck portion are rotated. Rotates while chucking the disk-shaped substrate, and changes the direction of the disk-shaped substrate.

According to a fourth aspect of the present invention, the width of the support member of the tip-side chuck portion is made smaller than the storage interval of each disk-shaped substrate.

Therefore, the tip side chuck portion can pass between the disc-shaped substrates which are stacked and stored at regular intervals.

According to a fifth aspect of the present invention, the supporting member of the tip-side chuck portion passes through a rear edge portion of each disk-shaped substrate in a direction of a diameter of the disk-shaped substrate. In addition to supporting at a position offset laterally with respect to the reference diameter extending in the direction, each support surface of the base end chuck portion is located on both sides of the reference edge of the front edge portion of each disc-shaped substrate with the reference diameter therebetween. The supporting and chuck holding unit is rotated so that the supporting member of the distal-side chuck unit is positioned downward.

Therefore, when the tip-side chuck portion and the base-side chuck portion are rotated to change the direction of the disc-shaped substrate, the irregularities of the tip-side chuck portion and the base-side chuck portion are below the disc-shaped substrate. Each edge is held to prevent the disc-shaped substrate from coming off or falling.

In the disk-shaped substrate chuck device according to the present invention, a pair of base-side chuck portions are provided, and these base-side chuck portions are provided on both sides of the front-end side chuck portion, respectively. Each support surface of the chuck portion is disposed at a position symmetrical with respect to the distal chuck portion, and when the chuck holding portion is rotated in one direction, one of the proximal chuck portion and the distal chuck portion is rotated. Chuck the disk-shaped substrate with
When the chuck holding unit is rotated in the other direction, each disk-shaped substrate is chucked by the other base end chuck unit and the front end chuck unit.

Therefore, when one base end chuck portion is used and when the other base end chuck portion is used,
The direction of rotating the chucked disk-shaped substrate is reversed. Thereby, the disc-shaped substrate can be stood vertically with any surface of the chucked disc-shaped substrate facing the front and back surfaces. In addition, one base end chuck portion and the other base end chuck portion disposed at positions symmetrical with respect to the front end chuck portion chuck the disk-shaped substrate similarly to the front end chuck portion. .

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the present invention will be described below in detail based on an example of an embodiment shown in the drawings.

FIGS. 1 to 5 show an embodiment of the disk-shaped substrate chuck apparatus of the present invention. The disc-shaped substrate chuck device 1 is, for example, a plurality of semiconductor wafers 15 stored in a horizontal cassette 16 in parallel at regular intervals.
And a supporting member 6 extending perpendicularly to the passing direction to support a rear edge portion of each semiconductor wafer 15, and move in the passing direction of the front chuck portion 4. And each semiconductor wafer 1
5, a proximal chuck portion 7, 8 supporting the front edge portion, a chuck holding portion 3 for holding the distal chuck portion 4 and the proximal chuck portions 7, 8, and a chuck holding portion 3. And a shaft unit 2.

The shaft unit 2 is attached, for example, to an upper portion of a table 11 of a positioning device 22 described later, and moves forward and backward with respect to the horizontal cassette 16. When the shaft unit 2 moves forward toward the horizontal cassette 16, the tip-side chuck 4 is inserted between the semiconductor wafers 15 stored in the horizontal cassette 16 and passes therethrough. On the other hand, when the shaft unit 2 retreats with respect to the horizontal cassette 16, the front chuck 4 is pulled out from between the semiconductor wafers 15.

The distal chuck section 4 and the proximal chuck sections 7 and 8 are mounted on a chuck holding section 3 which is rotatable in a direction in which these chuck sections are reversed. By doing so, the tip side chuck portion 4 is rotated. That is, the chuck holding unit 3 that holds the distal chuck unit 4 and the proximal chuck units 7 and 8 is attached to the rotating shaft 13 that projects from the shaft unit 2 in the direction in which the shaft unit 2 advances and retreats.

The tip-side chuck 4 is disposed on an extension of the rotating shaft 13. The tip side chuck portion 4 includes a major axis 5 and a minor axis (support member) 6 integrally formed at the tip of the major axis 5.
The short shaft 6 extends perpendicularly to the direction in which the shaft unit 2 advances and retreats, that is, the direction in which the shaft unit 2 passes through. The tip-side chuck section 4 has a second rotation position that is perpendicular to a first rotation position in which the chuck 6 holds at least the short axis 6 in parallel with each semiconductor wafer 15 stored in the cassette 16 in parallel. It is rotated between. The tip-side chuck portion 4 is inserted between the semiconductor wafers 15 and passes therethrough while being rotated to the first rotation position. Further, when the tip side chuck portion 4 after passing through between the semiconductor wafers 15 is rotated to the second rotation position, it is possible to support the edge portion (outer peripheral portion) on the back side of each semiconductor wafer 15. Become.

A spring 10 as shown in FIG. 3 is interposed between the tip side chuck portion 4 and the chuck holding portion 3. The spring 10 is deformed when the tip side chuck portion 4 hits an obstacle, and turns on the detection switch 9 disposed near the spring 10. Then, when the detection switch 9 is turned on, the movement of the tip side chuck portion 4 stops, and each chucked semiconductor wafer 15 is protected.

The width of the short axis 6 of the tip side chuck portion 4 is set smaller than the interval (storage interval) between the semiconductor wafers 15 stored in the horizontal cassette 16.
In this case, even if the thickness of each semiconductor wafer 15 is taken into consideration, the width of the short axis 6 is such that it does not interfere with each semiconductor wafer 15 when inserted between the semiconductor wafers 15. The short axis 6 is formed with concaves and convexes for supporting the edge portion of each semiconductor wafer 15, for example, holding grooves 12 at the same interval as the storage interval of each semiconductor wafer 15. The holding groove 12 is a semiconductor wafer 15 to be chucked at one time.
Are formed in a number corresponding to the number of sheets. In order to support the edge portion of the semiconductor wafer 15, it is sufficient that the short axis 6 is provided with irregularities, and a plurality of projections may be formed instead of the holding groove 12.

The short axis 6 of the tip side chuck portion 4 is used to connect the edge of the back side of each semiconductor wafer 15 to each semiconductor wafer 1.
5 is supported at a position laterally offset with respect to a reference diameter L (FIG. 2) extending in the passing direction.

The base-side chuck portions 7 and 8 have two support surfaces for supporting the front edge portions of the respective semiconductor wafers 15 at positions separated from each other. That is, each of the base-side chuck portions 7 and 8 has a large holding portion 7 serving as two support surfaces.
a, 8a and small holding parts 7b, 8b are formed. The holding portions 7a, 7b, 8a, 8b support the front edge portion of each semiconductor wafer 15 at positions on both sides of the reference diameter.

Each holding portion 7a, 7b, 8a, 8b has
Irregularities supporting the edge portion of each semiconductor wafer 15, for example, holding grooves 14 are formed at the same interval as the accommodation interval of each semiconductor wafer 15. The holding grooves 14 are formed in a number corresponding to the number of semiconductor wafers 15 to be chucked at one time. It is sufficient that the pressing portions 7a, 7b, 8a, 8b supporting the edge portion of the semiconductor wafer 15 have irregularities, and a plurality of projections or the like may be formed instead of the holding grooves 14. . In the present embodiment, five holding grooves 12 and 14 are formed to chuck five semiconductor wafers 15 at a time.

The proximal chuck portions 7, 8 form a pair. Then, these proximal chuck portions 7 and 8 are installed on both sides of the distal chuck portion 4, that is, on one side and the other side of the distal chuck portion 4 in plan view as shown in FIG. The large holding portions 7a, 8a of the base end chuck portions 7, 8 and the small holding portions 7b, 8b of the respective base end chuck portions 7, 8 are arranged at positions symmetrical with respect to the front end chuck portion 4. That is, when a virtual vertical plane passing through the distal chuck section 4 is considered, the proximal chucks 7 and 8 are positioned symmetrically with respect to the vertical plane. The parts 7 and 8 are attached to the chuck holding part 3.

The large holding portion 7 of the base side chuck portion 7 is also provided.
The connecting portion 7c for integrating the small holding portion 7a with the large holding portion 8a and the small holding portion 8b of the base end side chuck portion 8 are formed at vertically shifted positions. I have. Therefore, even if the base-side chuck portions 7 and 8 are attached to the chuck holding portion 3 at the same height, the base-side chuck portions 7 and 8 do not interfere with each other.

Each of the proximal chuck portions 7 and 8 is selectively moved (advanced / retracted) in the direction in which the distal chuck portion 4 passes through the actuator (for example, a motor) (not shown) accommodated in the chuck holding portion 3. .

A spring is interposed between the chuck 4 at the distal end, the chucks 7 and 8 at the proximal end, and the chuck holder 3. Each spring adjusts a chucking force by being deformed.

The chuck device 1 is incorporated in a wafer refilling machine 18 shown in FIG. This wafer refilling machine 18
Is the lift and carry transfer device 19 and the wafer storage device 2
0, cleaning cassette transport device 21 and positioning device 22
It is configured with.

In the lift and carry transfer device 19, a number of horizontal cassettes 16 are arranged in a line. Each of the horizontal cassettes 16 stores a large number of semiconductor wafers 15 at predetermined intervals horizontally, for example, at a pitch of 10 mm. In the wafer storage device 20, a number of vertical cassettes 17 are arranged in a line. Each of the vertically placed cassettes 17 stores a large number of semiconductor wafers 15 vertically at regular intervals, for example, at a pitch of 5 mm. Further, the positioning device 22 moves the chuck device 1 between the lift and carry transfer device 19 and the wafer storage device 20, moves the chuck device 1 in a direction along each of the cassettes 16 and 17, and further turns. The direction in which the chuck device 1 is moved between the lift and carry transfer device 19 and the wafer storage device 20 is the direction in which the tip-side chuck portion 4 passes between the semiconductor wafers 15.

Next, the operation of the chuck device 1 will be described together with the operation of the wafer refilling machine 18.

Now, when the semiconductor wafers 15 stored in the horizontal cassette 16 of the lift and carry transfer device 19 at a pitch of 10 mm are arranged in the vertical cassette 17 of the wafer storage device 20 at a pitch of 5 mm while alternately turning the front and back. think of.

First, the chuck device 1 is opposed to a predetermined horizontal cassette 16 of the lift and carry transfer device 19, and the front chuck 4 is turned to the first turning position so that the short axis 6 is moved to each semiconductor wafer. 15 to be in parallel.

Next, the chuck device 1 is advanced toward the lift and carry transfer device 19, and the tip side chuck portion 4 is inserted between the semiconductor wafers 15 stored in the horizontal cassette 16. At this time, for example, when chucking five semiconductor wafers 15 collectively, 5
The height of the chuck device 1 is adjusted in advance so that the tip side chuck portion 4 can be inserted between the first and sixth semiconductor wafers 15. Further, the tip-side chuck portion 4 is offset with respect to each semiconductor wafer 15 so that the tip-side chuck portion 4 passes through a position separated from the center of each semiconductor wafer 15 by a predetermined distance laterally (for example, left side). insert.

When the short axis 6 of the tip side chuck portion 4 passes between the semiconductor wafers 15, the chuck device 1
Is stopped, and then the tip-side chuck 4 is rotated to the second rotation position. Thereby, the short axis 6 faces upward.

Next, the chuck device 1 is slightly retracted, and at the same time, one of the proximal chuck portions (for example, the proximal chuck portion 7) is advanced by a predetermined distance. As a result, FIG.
As shown by the solid line, the distal-side chuck portion 4 and the proximal-side chuck portion 7, more specifically, the short shaft 6 and each holding portion 7
Five semiconductor wafers 15 are collectively chucked at three points a and 7b. That is, the chuck device 1
Performs chucking by combining the retreating operation of the distal chuck 4 with the retreat of the shaft unit 2 and the advancing operation of only the proximal chuck 7.

In this state, the chuck device 1 is retracted, and
The semiconductor wafers 15 are pulled out from the horizontal cassette 16 and taken out. In this case, immediately before each semiconductor wafer 15 is pulled out, the chuck device 1 is slightly raised so that each semiconductor wafer 15 is raised.

Next, the chuck device 1 is moved toward the vertically placed cassette 17 and the chuck holding unit 3 is rotated so that the chucked semiconductor wafers 15 are set up vertically. At this time, the tip side chuck unit 4 is positioned below the center of each of the chucked semiconductor wafers 15, that is, the chuck holding unit 3 is positioned in the offset direction of the tip side chuck unit 4 with respect to each semiconductor wafer 15. Is rotated. By doing so, the short axis 6 of the distal chuck section 4 and the small pressing section 7b of the proximal chuck section 7 support the lower edge portion of each semiconductor wafer 15, and the large pressing section 7a It supports the upper edge portion of the wafer 15 and prevents the semiconductor wafer 15 from falling off. Therefore, for example, when the semiconductor wafer 15 is held by using the proximal chuck section 7, the distal chuck section 4 is offset to the left, so that the proximal chuck section 7 is shifted from the proximal chuck section 8. What is necessary is just to rotate the chuck holding | maintenance part 3 to the left so that it may become upper. That is, when rotating the chuck holding unit 3 in the left direction, each semiconductor wafer 15 is chucked by the right-side proximal chuck unit 7 and the distal-side chuck unit 4.

Thereafter, the chuck device 1 holds the semiconductor wafer 15 in a predetermined vertical placing cassette 17
To be stored. The storage pitch of the vertical cassette 17 is 5
mm, each semiconductor wafer 15 is stored at every other pitch. Next, the base chuck 7 is retracted by a predetermined distance, and the tip chuck 4 is slightly advanced to release the chucking of each semiconductor wafer 15. Then, the front chuck 4 is rotated to the first rotation position so that the short axis 6 is parallel to each semiconductor wafer 15, and then the front chuck 4 is pulled out from between the semiconductor wafers 15. Thus, a plurality of semiconductor wafers, 5 in this embodiment,
The semiconductor wafers 15 are conveyed at the same time, and are further rotated 90 degrees during the conveyance to stand upright.

Next, when the chuck device 1 chucks five semiconductor wafers 15 stored in the horizontal cassette 16 of the lift and carry transfer device 19 at a time, the tip-side chuck portion 4 is connected to each semiconductor wafer 15. The wafer 15 is offset in a direction opposite to the offset direction at the time of the previous chucking. That is, the tip side chuck portion 4 is inserted in a state where the tip side chuck portion 4 is offset with respect to each semiconductor wafer 15 so that the tip side chuck portion 4 passes through a position separated by a predetermined distance to the right side of the center of each semiconductor wafer 15. As a result, the short axis 6 of the tip-side chuck portion 4 that has passed through between the semiconductor wafers 15 is positioned such that the back edge portion of each semiconductor wafer 15 is offset to the right as shown by the two-dot chain line in FIG. Support with.

For chucking in this case, a proximal chuck 8 is used instead of the proximal chuck 7. That is, when the chuck device 1 is slightly retracted and the proximal chuck portion 8 is advanced by a predetermined distance, the five chuck wafers 5 are collectively collected by the distal chuck portion 4 and the proximal chuck portion 8. Can be chucked.

Then, in this state, the chuck device 1 is retracted, and the five semiconductor wafers 15 are horizontally placed in the cassette 1.
After being pulled out of the chuck 6, the chuck holding unit 3 is rotated in a direction opposite to the previous chucking, specifically, to the right.
As a result, the short axis 6 of the distal chuck section 4 and the small holding section 8b of the proximal chuck section 8 support the lower edge portion of each semiconductor wafer 15, and the large holding section 8a holds each semiconductor wafer 15 To support the upper edge portion of the semiconductor wafer 15 to prevent the semiconductor wafers 15 from falling off. In other words, when the chuck holding unit 3 is rotated to the right, the semiconductor wafer 1 is separated by the proximal chuck unit 8 and the distal chuck unit 4 to the left.
Chucking 5 That is, each semiconductor wafer 15
Is vertically set in the opposite direction to the previous chucking.

In this state, the chuck device 1 inserts the currently chucked semiconductor wafers 15 between the semiconductor wafers 15 already arranged at every other pitch in the vertical cassette 17 by the previous chucking. Line up.
Since the direction in which the semiconductor wafers 15 are rotated and set up is different between the last chucking and the current (current) chucking, the semiconductor wafers are turned upside down one by one in the vertical cassette 17. 15 are arranged. That is,
Each of the semiconductor wafers 1 adjacent to each other is
5 is stored with the front and the front and the back and the back facing each other.

Then, by repeating the above operation, the wafer refilling machine 18 refills the semiconductor wafers 15 from the horizontal cassette 16 to the vertical cassette 17 by changing the posture of the semiconductor wafers 15 one by one, alternately upside down. .
Since the chuck device 1 can chuck a plurality of, in this embodiment, five, semiconductor wafers 15 at a time, the work efficiency can be improved and the device can be downsized. Further, since the plurality of semiconductor wafers 15 are chucked by the distal-side chuck portion 4 and the proximal-side chuck portion 7 or the proximal-side chuck portion 8, even if the semiconductor wafer 15 becomes large, for example, it becomes about 300 mm in diameter. Even if it does, this chuck device 1 can sufficiently cope with it.

The above embodiment is an example of a preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention. For example, in the present embodiment, the semiconductor wafer 1
Although the chuck device for chucking and transporting the substrate 5 has been described, it is needless to say that the chuck device can be used as a device for chucking and transporting another disk-shaped substrate such as an optical disk or a music box disk having protrusions. It is.

In the above description, the semiconductor wafer 15
Is described while changing the position of the semiconductor wafer 15 from horizontal to vertical. However, it is needless to say that the semiconductor wafer 15 may be refilled without changing the position of the semiconductor wafer 15 or while turning the semiconductor wafer 15 upside down.

[0052]

As is clear from the above description, the disk-shaped substrate according to the first aspect of the present invention is provided with a support member extending between the disk-shaped substrates and extending perpendicularly to the direction of the disk-shaped substrates. A front-side chuck portion that supports an edge portion on the back side of the substrate; and a proximal-side chuck portion that moves in a through direction of the front-side chuck portion and supports a front edge portion of each disk-shaped substrate. The tip-side chuck portion is rotatable at least between a first rotation position where the support member is parallel to each of the disc-shaped substrates and a second rotation position where the support member is perpendicular to the disk-shaped substrate, and the first rotation position. While passing through between the respective disc-shaped substrates in a state in which the disc-shaped substrate is rotated to the second turning position, the back-side edge portion of each disc-shaped substrate is supported in a state in which the disc-shaped substrate is turned in a state in which the base-side chuck portion is
Since it has two support surfaces that support the front edge portion of each disk-shaped substrate at positions separated from each other, a plurality of disk-shaped substrates are supported at three places, respectively, Can be handled. For this reason, it is possible to improve the working efficiency while reducing the size of the apparatus and saving the space. Further, by rotating the distal-side chuck portion to the first rotation position, the support member can be made parallel to each of the disk-shaped substrates, so that the protrusion of the distal-side chuck portion with respect to each of the disk-shaped substrates. It can be made thin by eliminating parts.

Further, in the disk-shaped substrate chuck apparatus according to the second aspect, an edge portion of each disk-shaped substrate is supported on the support member of the distal-side chuck portion and the respective support surfaces of the proximal-side chuck portion. Since the irregularities are formed at the same intervals as the storage intervals of the respective disc-shaped substrates, the edges (outer peripheries) of the respective disc-shaped substrates are sandwiched between the respective irregularities and chucked at the same time. be able to.

In the chucking apparatus for a disk-shaped substrate according to the third aspect, the distal-side chuck portion and the proximal-side chuck portion include:
These chuck portions are attached to a chuck holding portion that is rotatable in a direction of inverting the chuck portions. When the chuck holding portions rotate, the tip-side chuck portion moves between the first rotation position and the second rotation position. Since the chuck holding portions are rotated, the posture of the distal chuck portion and the proximal chuck portion, that is, their postures such that a plurality of disc-shaped substrates are collectively inverted. Can be changed.

Further, in the disk-shaped substrate chuck device according to the fourth aspect, the width of the support member of the distal-side chuck portion is smaller than the storage interval of each disk-shaped substrate. Does not come in contact with each other when passing through between the respective disc-shaped substrates, thereby preventing damage.

Further, in the disk substrate chuck apparatus according to the fifth aspect, the supporting member of the tip side chuck portion is configured such that the edge portion on the back side of each disk substrate is defined by the diameter of each disk substrate. While supporting at a position laterally offset with respect to the reference diameter extending in the passing direction, each support surface of the base-side chuck portion is located on both sides of the front edge portion of each disc-shaped substrate with the reference diameter therebetween. Position, and the chuck holding portion is rotated so as to position the support member of the tip side chuck portion downward, so that three support positions for each disk-shaped substrate can be set apart from each other. it can. For this reason, even when each disk-shaped substrate is rotated, it is possible to reliably and stably chuck these disk-shaped substrates, and to prevent damage.

Further, in the disk-shaped substrate chucking device according to the present invention, a pair of base-side chuck portions are provided, and these base-side chuck portions are installed on both sides of the front-end side chuck portion. When each support surface of the side chuck portion is disposed at a position symmetrical with respect to the distal side chuck portion, and the chuck holding portion is rotated in one side, one of the base side chuck portion and the distal side chuck portion is rotated. When chucking each disk-shaped substrate with, and when rotating the chuck holding portion in the other direction, chuck each disk-shaped substrate with the other base-side chuck portion and the distal-side chuck portion. Therefore, the direction of reversal of each disc-shaped substrate can be selected by properly using the base-side chuck portion. For example, when each disc-shaped substrate is erected, the direction of the front and back can be changed. For this reason, when transferring a disk-shaped substrate stored in a cassette in the same direction to another cassette, it is possible to refill the disk-shaped substrates in a state where the front surfaces of the disk-shaped substrates and the back surfaces thereof face each other. Usability can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a disk-shaped substrate chuck device of the present invention.

FIG. 2 is a plan view showing an embodiment of the chuck device of the present invention.

FIG. 3 is a schematic configuration diagram showing a detection switch in the chuck device of the present invention.

FIG. 4 is a plan view showing a wafer refilling machine incorporating the chuck device of the present invention.

FIG. 5 is a side view of the refilling machine of FIG. 4;

6A and 6B show a main part of a conventional chuck device, wherein FIG. 6A is a side view showing a state of inserting a support, and FIG. 6B is a side view showing a state of taking out a disk-shaped substrate.

FIG. 7 is a perspective view showing a carrier (cassette) for storing the disk-shaped substrate of FIG. 6;

FIG. 8 is a perspective view showing a main part of the chuck device of FIG. 6;

[Explanation of symbols]

 Reference Signs List 1 chuck device for disk-shaped substrate 3 chuck holding unit 4 distal chuck unit 6 short axis (supporting member) 7, 8 base chuck unit 7a, 8a large holding unit (supporting surface) 7b, 8b small holding unit (support) Surface) 12 Holding groove (unevenness) 14 Holding groove (unevenness) 15 Semiconductor wafer (disk-shaped substrate) L Reference diameter

Claims (6)

(57) [Claims] An apparatus for chucking and taking out a plurality of disk-shaped substrates, which are stored in parallel at predetermined intervals and collectively, passes through each disk-shaped substrate. A tip-side chuck portion that supports an inner edge portion of each of the disc-shaped substrates by a support member that extends perpendicular to the direction, and moves in a direction in which the tip-side chuck portion passes through the disc-shaped substrate. A proximal chuck portion for supporting a front edge portion, wherein the distal chuck portion is at least perpendicular to a first rotation position where at least the support member is parallel to each of the disc-shaped substrates. It is rotatable between two rotation positions, and passes through each of the disc-shaped substrates in a state of being rotated to the first rotation position, and is in a state of being rotated to the second rotation position. Support the back edge of each disk-shaped substrate. The chuck device for a disk-shaped substrate, wherein the base-side chuck portion has two support surfaces that support front-side edges of the disk-shaped substrates at positions separated from each other. 2. The unevenness for supporting the edge portion of each of the disk-shaped substrates is provided on the support member of the distal-side chuck portion and each of the support surfaces of the proximal-side chuck portion. 2. The chuck device for a disk-shaped substrate according to claim 1, wherein the chucking device is formed at the same interval as the above. 3. The chuck unit according to claim 1, wherein the chuck unit on the distal end and the chuck unit on the proximal end are attached to a chuck holder rotatable in a direction in which the chuck units are reversed. The chuck device for a disk-shaped substrate according to claim 1, wherein the distal-end-side chuck portion rotates between a first rotation position and a second rotation position. 4. The chuck for a disk-shaped substrate according to claim 1, wherein a width of the support member of the tip-side chuck portion is smaller than a storage interval of each of the disk-shaped substrates. apparatus. 5. The supporting member of the tip-side chuck portion moves a rear edge portion of each of the disk-shaped substrates to a side of a diameter of each of the disk-shaped substrates with respect to a reference diameter extending in the through direction. While supporting at the offset position, each support surface of the base-side chuck portion supports the front edge portion of each of the disc-shaped substrates at positions on both sides of the reference diameter, and the chuck holding portion is 4. The disk-shaped substrate chuck apparatus according to claim 3, wherein the chuck member is rotated so that the support member of the tip side chuck portion is positioned downward. 6. A pair of said base-side chuck portions are provided, and each of said base-side chuck portions is installed on both sides of said front-side chuck portion, and each support surface of each of said base-side chuck portions is connected to said front-side chuck portion. When the chuck holding portion is rotated in one direction, the disc-shaped substrate is chucked by one of the base-side chuck portion and the distal-side chuck portion. 6. The disk-shaped substrate is chucked by the other base end chuck portion and the front end chuck portion when the chuck holding portion is rotated in the other side direction. For chucking disk-shaped substrates.