JP3279875B2 - Polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus, and more particularly, to a surface plate having a polishing surface formed on a surface thereof for polishing a work, a pressing portion for pressing the work against the polishing surface, and a pressing portion. The present invention relates to a polishing apparatus provided with a movement mechanism for relatively moving a work pressed against the polishing surface by the polishing surface and the surface plate, and polishing a surface of the work. As this polishing device,
For example, there is a wafer polishing apparatus used for mirror-polishing a wafer surface for a semiconductor chip.

[0002]

2. Description of the Related Art In recent years, as the degree of integration of semiconductor devices has increased, the flatness and surface quality of a silicon wafer as a substrate have been strictly required to be improved. Further, in polishing an interlayer insulating film and a metal wiring deposited when a device is formed on the wafer surface, there is an increasing demand for flattening with higher precision. Therefore, there is a demand for a wafer polishing apparatus that can mirror-polish the wafer surface with higher precision or that can perform high-precision polishing with reference to the surface.

Conventionally, in a wafer polishing apparatus, a pressing portion for pressing a wafer has an airbag function so that the entire surface of the wafer can be pressed with a uniform pressure against a polishing surface of a surface plate in contact with the wafer surface. Some have. An example of the holding unit of the polishing apparatus will be described below with reference to FIG. As shown in FIG. 3, a polishing surface 60 is formed by bonding a polishing cloth 58 made of soft elastic fiber on a rotating platen 56, and a pressing portion 41 that can rotate and move up and down is formed above the polishing surface 60.
Is provided. The pressing portion 41 includes a concave head member 11 that opens downward, an outer portion 13 a fixed to the inner bottom surface of the head member 11, and an inner portion 13 b fixed to the board member 17. A plate-like elastic member 13 for suspending the vertical and horizontal movements within a small range, and
The pressure chamber 19 includes a pressure chamber 19 that is a closed space defined by the elastic member 7 and the plate-shaped elastic member 13, and a fluid supply unit (not shown) that supplies a fluid at a predetermined pressure to the pressure chamber 19. Reference numeral 27 denotes a ring-shaped elastic member, which is an O-ring-shaped member formed of synthetic rubber or the like. The ring-shaped elastic member 27 is disposed between the outer peripheral surface of the disk-shaped member 17 and the inner peripheral surface of the outer wall side portion 11a, and moves relative to the head member 11 of the disk-shaped member 17 (for example, relative movement). (Rotation).

According to this polishing apparatus, the surface of the wafer 24 held by the board-like member 17 with water or the like can quickly follow the inclination of the polishing surface 60 by the airbag action of the plate-like elastic member 13. Even in such a state where the wafer 24 follows the inclination of the polishing surface 60, the entire surface of the wafer 24 can be pressed against the polishing surface 60 with a uniform pressure. Therefore, the surface of the wafer 24 can be suitably mirror-polished while maintaining high parallelism and flatness of the wafer 24. In addition, a sheet-like backing material having a surface having a high adsorptivity is generally attached to the surface of the board-shaped member 17 so that the wafer 24 can be filled with water reliably.

[0005]

However, in the above-described wafer polishing apparatus, the wafer 24 is indirectly pressed through the disk-shaped member 17, so that the accuracy of the flatness of the disk-shaped member 17 and the disk-shaped There is a problem that it is easily affected by dimensional changes due to deformation when a pressing force acts on the member 17 and the accuracy of the thickness of the backing material, and it is difficult to polish the entire surface of the wafer 24 with very high accuracy. Was. Further, there is a problem that the outer peripheral portion of the wafer 24 tends to be polished a lot, so-called sagging of the outer periphery is liable to occur, and it is not possible to cope with a case where very high precision flatness is required for the entire surface of the wafer 24. Was. Then, since the backing material comes into contact with the wafer 24 and is pressed against the polished surface, foreign matter enters between the wafer 24 and the backing material, and the wafer 24 is damaged.

SUMMARY OF THE INVENTION It is an object of the present invention to prevent the work from being damaged, and to uniformly press the entire surface of the work against the polishing surface, thereby uniformly polishing the entire work to prevent the outer periphery of the work from sagging and to flatten the work surface. An object of the present invention is to provide a polishing apparatus capable of improving the degree.

[0007]

To achieve the above object, the present invention has the following arrangement. That is, the present invention
A surface plate on which a polishing surface for polishing a work is formed, a pressing portion for pressing the work against the polishing surface, and the work and the surface plate pressed against the polishing surface by the pressing portion are relatively moved. and a movement mechanism for a polishing apparatus for polishing a surface of workpiece, the the pressing portion is provided on the pressing surface of the pressing portion work to adsorb the workpiece by the surface tension of water
A backing material for holding the pressing portion Te, provided through the backing material <br/>, during polishing, from the pressing portion so as to press the workpiece to the polishing surface to the polishing surface side fluid a plurality of ejection ports for ejecting is connected to the spout by setting
When the fluid is ejected from the ejection port,
An ejection fluid supply means for supplying the fluid ejected from the ejection port , wherein the fluid is supplied from the ejection fluid supply means.
And the plurality of ejection ports correspond to the entire surface of the workpiece.
It is characterized by being provided so as to be evenly located . Further, a surface plate on which a polishing surface for polishing the work is formed, a pressing portion for pressing the work against the polishing surface, and the work and the surface plate pressed against the polishing surface by the pressing portion. A polishing mechanism for polishing the surface of the work, wherein a film material layer or a coating formed on the pressing surface of the pressing portion as a protective layer of the work sucked on the pressing surface of the pressing portion. Layer, the pressing portion , provided through the film material layer or coating layer as a protective layer of the work , when polishing, from the pressing portion to the polishing surface side so as to press the work against the polishing surface , And sucks the work into the pressing section.
When that includes a plurality of ejection ports for sucking the workpiece, the
It is provided connected to the spout, and flows from the spout.
When ejecting the body, the fluid is ejected from the ejection fluid supply means.
It is supplied, when sucking the workpiece on the pressing surface of the front Symbol pressing portion, provided with a fluid chamber which is under reduced pressure, the plurality of injection
The outlet is located uniformly over the entire surface of the workpiece.
It is characterized by being provided as follows .

[0008] Also, a surface plate having a polishing surface formed thereon for polishing a work, a pressing portion for pressing the work against the polishing surface, a work pressed against the polishing surface by the pressing portion, and the surface plate. And a movement mechanism for relatively moving the workpiece, and the polishing device for polishing the surface of the work ,
Is a head member having a concave portion that opens downward,
A disk-shaped member disposed inside the recess of the head member, and one side is fixed to the wall of the head member, and the other side is fixed to the disk-shaped member, and the disk-shaped member is moved vertically and horizontally. An elastic member for suspending the movement of the head member within a minute range, a pressure chamber defined by defining the inside of the head member by the board-shaped member and the elastic member, and supplying a pressure fluid to the pressure chamber. It is provided et the pressure fluid supply means for
From the surface of the disk-shaped member provided on the disk-shaped member
Multiple jets for jetting fluid toward the polishing surface
The wafer is placed on the platen by the two-stage action of the pressure chamber and the ejected fluid.
Fluid ejected from the ejection port so as to press against the polishing surface
Ejection fluid supply means for supplying the plurality of ejection fluids.
The outlet is located uniformly over the entire surface of the workpiece.
The work is balanced on the polished surface
Can be pressed evenly and well .

[0009] The front Symbol pressure fluid supply means, provided with a pressure fluid regulator for adjusting the pressure of the fluid supplied to the pressure chamber, the said jetting fluid supply means adjust the pressure of fluid ejected from said ejection port With the provision of the ejected fluid adjusting device, various polishing conditions can be suitably dealt with.

[0010]

The pressing portion is provided in a ring shape so as to surround the ejection port and the work, and when the work is pressed against the polishing surface, the work is pressed by the pressing portion and the polishing surface.
By providing the ring member that regulates the flow of the fluid ejected from the ejection port, it is possible to prevent the ejected fluid from flowing out needlessly.

[0012]

According to the invention according to claim 1 or 2 ,
At the time of polishing, the work surface provided on the pressing surface
Protects the wafer sucked by the packing material or the pressing surface
Fluid can be ejected from the surface of the pressing portion toward the polishing surface side so as to press the work against the polishing surface of the surface plate from the ejection port formed through the film material layer or the coating layer .
For this reason, it is possible to prevent the fluid from intervening between the pressing portion and the work, so that the work is pressed against the polishing surface, and the work and the pressing portion come into contact with each other and damage the work. What presses the work is the fluid pressure, and the fluid pressure can act on the entire surface of the work at an equal pressure. Therefore, the entire surface of the work can be uniformly polished, and the outer periphery of the work can be prevented from sagging . And the spout
Multiple units are provided so as to be evenly positioned on the entire surface of the work
The workpiece to the polished surface in a well-balanced and even manner
Pressing can improve the flatness of the work surface. According to the third aspect of the present invention, the board-shaped member is suspended by the elastic member so that the movement inside the head member is allowed within a minute range, and the pressure fluid is supplied to the pressure chamber. In addition, the disc-shaped member can be pressed following the polishing surface, and the work can be pressed against the polished surface by ejecting a fluid from an ejection port provided in the disc-shaped member. In other words, the plate-shaped member is pressed against the polishing surface with uniform pressure by the pressure of the pressure chamber, and the parallelism between the plate-shaped member and the surface of the platen is secured with high accuracy. Work can be evenly pressed against the polished surface with higher accuracy. Therefore,
The entire surface of the work can be uniformly polished.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments in which the present invention is applied to a wafer polishing apparatus will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a pressing portion 4 of a wafer polishing apparatus.
FIG. 2 is an enlarged front sectional view showing a state where the wafer 24 is polished by the wafer polishing apparatus of FIG. 1. Reference numeral 10 denotes a head member, which is formed in a concave shape that opens downward, and is provided as an outer portion of a pressing portion that presses the wafer 24 that is a work. In this embodiment, the head member 10 includes a flat plate wall portion 10b and a cylindrical side wall portion 10c, and the flat plate wall portion 10b and the cylindrical side wall portion 10c.
Are hermetically sealed by an O-ring 11. Reference numeral 12 denotes a board-shaped member, which is an embodiment of a pressing member for pressing a wafer. This board-shaped member 12 is arranged inside the concave portion of the head member 10.

Reference numeral 14 denotes a plate-like elastic member which is an embodiment of an elastic member, and is formed in a donut shape by, for example, a hard rubber plate (in this embodiment, cloth-containing nitrile rubber). The outer portion 14a is fixed to the inner bottom surface of the head member 10 and the inner portion 14b is fixed to the board-shaped member 12. As a result, the plate-like elastic member 14 is
Is vertically suspended within a very small range in the vertical and horizontal directions. Outer portion 14a of plate-like elastic member 14
Is fixed to the inner bottom surface 10a of the head member 10 by being clamped by a ring member 16 by tightening a bolt (not shown). Also, the inner portion 14b of the plate-like elastic member 14
The holding ring 18 is tightened with a bolt (not shown).
And is fixed to the board-shaped member 12.

Reference numeral 20 denotes a pressure chamber, which is provided by defining the inside of the head member 10 with a board-like member 12 and a plate-like elastic member 14. A fluid having a predetermined pressure is supplied into the pressure chamber 20 by pressure fluid supply means (not shown). Reference numeral 22 denotes a first pipe, which communicates the pressure source of the pressure fluid supply means with the pressure chamber 20. The pressure fluid supply means is provided with a pressure fluid regulator (not shown) for regulating the pressure of the fluid supplied to the pressure chamber 20. In addition, air or water can be used as the pressure fluid.
Reference numeral 26 denotes a ring-shaped elastic member, which is, for example, an O-ring-shaped member formed of rubber or the like. The ring-shaped elastic member 26 is disposed so as to abut both the outer peripheral surface of the disk-shaped member 12 and the inner peripheral surface of the cylindrical side wall portion 10c, so that the horizontal movement of the disk-shaped member 12 is within a small range. Is acceptable. Thereby, the acting force in the horizontal direction (particularly in the radial direction) generated when the wafer is polished can be absorbed.

Reference numeral 32 denotes a fluid chamber, which is a space provided between the upper plate 12a and the lower plate 12b of the plate member 12. A fluid having a predetermined pressure is supplied into the fluid chamber 32 by an ejection fluid supply unit (not shown). In addition,
The pressure source of the ejection fluid supply means communicates with the fluid chamber 32 via the second pipe 33 and the pipe joint 34. Further, the ejection fluid supply means is provided with an ejection fluid adjusting device (not shown) for adjusting the pressure of the fluid supplied to the fluid chamber 32. Reference numeral 30 denotes a backing material, which is adhered to the outer surface of the board-shaped member 12. The backing material 30 is a sheet-shaped member having a surface that is rich in elasticity and highly adsorbable. Utilizing the surface of the backing material 30, the wafer 24 can be adsorbed by the surface tension of water and held on the board-shaped member 12. In the present embodiment, the backing material 30 is provided on the surface of the board-shaped member 12, but instead of this backing material 30, a thin film portion in which the surface of the film material layer or the coating layer is finished to have flatness is provided. It goes without saying that the wafer 24 can be pressed by utilizing the surface of the board-shaped member 12 as it is, not to mention providing it.

Reference numeral 36 denotes a spout, which is provided through the lower plate 12b and the backing material 30. This spout 3
A large number 6 are provided on the lower plate portion 12b so as to be uniformly located corresponding to the entire surface of the wafer 24. This spout 36
Thus, the workpiece 24 can be pressed against the polishing surface 60 by ejecting the fluid toward the polishing surface 60 as shown in FIG. Note that air or water can be used as the fluid to be ejected. Further, by reducing the pressure in the fluid chamber 32, the wafer 2
In a case where the wafer 4 is transported by suction, the wafer 24 may be protected by providing a film material layer or a coating layer on the surface of the disk-shaped member 12 without using a backing material as in this embodiment.

Reference numeral 28 denotes a concave portion, which is provided on the head member 10. A plurality of the concave portions 28 are provided at predetermined intervals in the circumferential direction of the head member 10. Reference numeral 38 denotes a pin-shaped member, and a plurality of pins are provided on the board-shaped member 12 at predetermined intervals corresponding to the concave portions 28. Pin-shaped member 3
Numeral 8 is an embodiment of a projection inserted into and engaged with the recess 28. The pin-shaped member 38 is provided with a flange-shaped tip 3.
8a, and the movement is restricted between the inner bottom surface 28a forming the concave portion 28 and the inner diameter portion 28b. This allows
The vertical movement of the board-shaped member 12 is restricted. In addition, the distal end portion 38a of the pin-shaped member functions as an engaging portion that engages with the concave portion 28 while being loosely fitted within a predetermined minute range so as to be relatively movable. Therefore, the head member 1
0 and relative movement in a minute range between the board-shaped member 12 and
The composite force acting on the plate-like elastic member 14 can be reduced. Thereby, the plate-shaped elastic member can be prevented from being damaged, and as a result, a decrease in the airbag function can be prevented. In the present embodiment, a pin-shaped member 38 (engaging portion) is provided on the board-shaped member 12 (holding member) side, and the head member 1
Although the concave portion 28 (engaged portion) is provided on the zero side, the engaged portion may be provided on the holding member and the engaging portion may be provided on the head member 10 side.

Reference numeral 40 denotes a template, which is a board-shaped member 40.
And is formed in a ring shape so as to surround the plurality of ejection ports 36 and the wafer 24, thereby preventing the wafer 24 from skidding. When the wafer 24 is pressed against the polishing surface 60, the template 40 is pressed by the disc-shaped member 40 of the pressing portion and the polishing surface 60, and is a ring member that regulates the flow of the fluid ejected from the ejection port. Act as The flow of the regulated fluid can be adjusted by the pressure applied to the polishing surface 60 of the template 40. The pressure of the ejected fluid that presses the wafer 24 can be suitably secured. The thickness of the template 40 is set to be equal to the thickness of the wafer 24 (in this embodiment, it is provided slightly smaller than the thickness of the wafer 24). Note that a plurality of grooves may be provided on the surface of the template 40 so that the abrasive (a liquid abrasive containing abrasive grains) is suitably supplied into the template 40. By providing the template 40 in this manner, the plate-shaped member 12 is received on the polishing surface 60 of the platen 56 by the template 40 (see FIG. 2), so that it is possible to prevent the outer periphery of the wafer 24 from sagging. .

The above-described pressing portion of the wafer and the wafer 24 provided on the pressing portion of the wafer and polishing the wafer 24 to the polished surface 60
In addition to the pressing means for pressing the wafer with a predetermined pressing force, the basic configuration of the wafer polishing apparatus includes a surface plate 56 (see FIGS. 2 and 3) having a polishing surface 60 formed on the surface, and a wafer surface. A contact / separation means for moving the pressing portion of the wafer and the platen 56 so that the wafer 24 comes into contact with the polishing surface 60, and the wafer 24 and the platen 56 while the wafer 24 is in contact with and pressed against the polishing surface 60. There are driving means for relatively moving by rotation and / or reciprocation, and means for supplying a liquid abrasive containing slurry or the like.

Next, the operation of the wafer polishing apparatus having the above configuration will be described. First, the pressing portion 41a is moved to cause the wafer 24 to be adsorbed to the outer side surface of the backing material by the surface tension of water. The fluid chamber 32 may be depressurized and the wafer 24 may be sucked and held securely. Then, the pressing portion 41 a is moved to position the wafer 24 on the polishing surface 60 of the platen 56. Next, by supplying a fluid at a predetermined pressure to the pressure chamber 20 by the pressure fluid supply means, the entire plate-shaped member 12 is pressed to follow the polishing surface 60. Even if the polishing surface 60 is inclined with respect to the surface of the disk-shaped member 12 before pressing, the entire surface of the disk-shaped member 12 can be uniformly pressed by suitably following the polishing surface 60 by the action of the fluid pressure. Then, a fluid having a predetermined pressure is supplied to the fluid chamber 32 by the ejection fluid supply means, so that a fluid having a predetermined pressure is ejected from the ejection port 36. The ejected fluid passes between the backing material 30 and the wafer 24, passes between the outer peripheral side surface of the wafer 24 and the inner peripheral side surface of the template 40, and is discharged through the polishing pad 58. The wafer 24 is pressed by the pressure of the ejected fluid.
Since the wafer 24 can be directly pressed by the ejected fluid, the entire surface of the wafer 24 can be uniformly pressed against the polishing surface 60. That is, the entire plate-shaped member 12 is pressed against the polishing surface 60 with a uniform pressure by the pressure of the pressure chamber 20 to secure the parallelism between the plate-shaped member 12 and the surface of the platen 56 with high accuracy. The wafer 24 can be pressed more directly by the pressure of
Can be pressed evenly. Therefore, the entire surface of the wafer 24 can be uniformly polished. In particular, it is effective for highly accurate polishing based on the surface.

The pressure chamber 2 is controlled by the pressure fluid adjusting device.
The polishing conditions can be easily changed by adjusting the pressure of the fluid supplied to zero and adjusting the pressure of the ejected fluid by the ejected fluid adjusting device. Therefore, the pressure value of the pressure fluid acting on the pressure chamber 20 and the pressure value of the ejected fluid, and the balance between the two pressure values can be easily adjusted according to the wafer polishing conditions, and the versatility of the polishing apparatus is improved. it can.

Further, since the wafer 24 can be pressed against the polishing surface by the two-stage action of the pressure chamber 20 and the jetting fluid, even if the polishing surface 60 has a relatively large inclination (runout),
It is possible to suitably follow the inclination. In addition, according to this wafer polishing apparatus, a workpiece (eg, a surface of a hard brittle material such as a thin glass plate or crystal) that is a member to be polished other than the wafer can also be polished to a mirror surface.

In the above embodiment, the disk-shaped member 12 is caused to follow the polishing surface 60 by the air bag effect generated by supplying the pressure fluid to the pressure chamber 20, but the invention is not limited to this.
You may employ | adopt the structure which suspends and presses the board-shaped member 12 with a universal joint. Further, the plate-like elastic member 1
A bellows-like member may be used instead of 4. Further, an adjusting mechanism for measuring the distance between the outer surface of the plate-shaped member 12 and the surface of the surface plate 56 and adjusting the both surfaces to be parallel may be adopted. Also, in the embodiment described above, the pressure chamber 20
Although the case where the wafer 24 is pressed against the polishing surface via the board-shaped member 12 by supplying compressed air to the
Other fluid pressures, such as water pressure or hydraulic pressure, can also be used. As described above, various preferred embodiments of the present invention have been described, but the present invention is not limited to these embodiments.
Of course, many more modifications can be made without departing from the spirit of the invention.

[0025]

According to the first or second aspect of the present invention, a workpiece provided on a pressing surface is attracted during polishing.
Protects backing material or wafer sucked by pressing surface
The fluid can be ejected from the surface of the pressing portion toward the polishing surface side so as to press the work against the polishing surface of the surface plate from a plurality of ejection ports formed penetrating the film material layer or the coating layer . Since the fluid is interposed between the pressing part and the work, and the work is pressed directly to the polishing surface, it is possible to prevent the work and the pressing part from contacting and damaging the work, and to uniformly polish the entire surface of the work. In addition, it is possible to prevent the outer periphery of the work from sagging and to improve the flatness of the work surface. According to the third aspect of the present invention,
The plate-shaped member is pressed against the polishing surface by the pressure of the pressure chamber with uniform pressure, and the parallelism between the plate-shaped member and the surface of the platen is secured with high accuracy.
In addition, since the work can be directly pressed by the pressure of the ejected fluid, the work can be evenly pressed to the polishing surface with higher accuracy. Therefore, there is a significant effect that the entire surface of the work can be uniformly polished.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a pressing portion of a polishing apparatus according to the present invention.

FIG. 2 is an enlarged front sectional view of a main part showing a use state of the embodiment of FIG. 1;

FIG. 3 is a sectional view showing a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Head member 12 Board-shaped member 14 Plate-shaped elastic member 14a Outside part 14b Inner part 20 Pressure chamber 24 Wafer 30 Elastic thin film 32 Fluid chamber 36 Spout port 40 Template 41a Pressing part 56 Surface plate 58 Polishing cloth 60 Polishing surface

Continuation of the front page (56) References JP-A-6-79618 (JP, A) JP-A-64-78757 (JP, A) JP-A-8-150558 (JP, A) Jpn. , U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B24B 37/00 B24B 37/04 H01L 21/304 621 H01L 21/304 622

Claims (5)

(57) [Claims] 1. A surface plate having a polishing surface formed on a surface thereof for polishing a work, a pressing portion for pressing the work against the polishing surface,
And a movement mechanism that relatively movement between the pressed workpiece and the surface plate in the polishing surface by the pressing portion, in a polishing apparatus for polishing a surface of a workpiece, said pressing portion, the pressing portion workpiece et al provided on the pressing surface
Is a backing material for holding the pressing portion adsorbs the workpiece by the surface tension of water, et al provided through said backing material
During polishing, a plurality of ejection ports for ejecting fluid from the pressing portion toward the polishing surface side so as to press the work against the polishing surface, and a fluid ejected from the ejection port is supplied. And a plurality of ejection ports , wherein the plurality of ejection ports are uniform with respect to the entire surface of the workpiece.
A polishing apparatus, wherein the polishing apparatus is provided so as to be located at 2. A platen on which a polishing surface for polishing a work is formed on a surface, and a pressing portion for pressing the work against the polishing surface;
A polishing device for polishing the surface of the work, comprising a movement mechanism for relatively moving the work pressed against the polishing surface by the pressing portion and the surface plate, wherein the work sucked by the pressing surface of the pressing portion; as the protective layer, and formed on the pressing surface of the pressing portion film material layer or coating layer, the pressing portion, provided through the film material layer or coating layer as a protective layer of the workpiece
Is, at the time of polishing, the fluid ejected toward the pressing portion so as to press the workpiece to the polishing surface to the polishing surface side, Wah
When sucking the workpiece to the pressing portion, a plurality of ejection ports for sucking the work, and provided to be connected to the ejection port
When the fluid is ejected from the ejection port, the fluid
There is supplied from the ejection fluid supply means, when sucking the workpiece on the pressing surface of the front Symbol pressing portion, provided with a fluid chamber which is under reduced pressure, the plurality of ejection ports, corresponding to the entire surface of the workpiece Then uniform
A polishing apparatus, wherein the polishing apparatus is provided so as to be located at 3. A surface plate on which a polishing surface for polishing a workpiece is formed, and a pressing portion for pressing the workpiece against the polishing surface.
And a movement mechanism that relatively movement between the pressed workpiece and the surface plate in the polishing surface by the pressing portion, in a polishing apparatus for polishing a surface of workpiece, the the pressing portion is downwardly open A head member having a concave portion to be formed, a plate-shaped member arranged inside the concave portion of the head member, and one side fixed to the wall of the head member and the other side fixed to the plate-shaped member, An elastic member that suspends the member in a vertical range and a horizontal direction so as to allow movement within a minute range, and a pressure chamber provided by defining the inside of the head member by the board-shaped member and the elastic member. Pressure fluid supply means for supplying a pressure fluid to the pressure chamber is provided , and polishing is performed from the surface of the disk-shaped member provided on the disk-shaped member.
A plurality of jets for jetting fluid toward the surface side;
Polishing of wafer to surface plate by two-stage action of force chamber and ejected fluid
The fluid ejected from the ejection port is supplied so as to press against the surface.
And a jet fluid supply means for supplying the jet fluid, wherein the plurality of jet ports are uniformly formed corresponding to the entire surface of the work.
A polishing apparatus, wherein the polishing apparatus is provided so as to be located at 4. The pressure fluid supply means is provided with a pressure fluid adjustment device for adjusting the pressure of the fluid supplied to the pressure chamber, and the ejection fluid supply means is adapted to adjust the pressure of the fluid ejected from the ejection port. 4. The polishing apparatus according to claim 3, further comprising a jetting fluid adjusting device that performs the jetting. 5. The pressing portion surrounds the ejection port and the work.
Is provided in a ring shape, and the workpiece is pressed against the polishing surface.
Is pressed by the pressing part and the polishing surface,
The polishing apparatus according to any one of claims 1 to 4, further comprising a ring member that regulates a flow of a fluid ejected from the polishing apparatus.