JP3276504B2 - Die bonding equipment - Google Patents

Abstract

PURPOSE:To realize a compact device and to enable improvement of wettability of a pellet. CONSTITUTION:A die bonding device 20 is provided with a pellet unloading mechanism 25 for unloading a pellet 22 from a wafer 21, a pellet position correcting mechanism 26 by mounting the unloaded pellet on a gauging stand 32 and a bonding mechanism 27 for bonding the pellet whose position is corrected to a lead frame 23 by using paste 42. Therefore, a paste containing part 33 which enables charge of paste is formed in a gauging stand and a pallet unloading by a pellet unloading mechanism can be mounted on a paste surface inside a paste containing part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus, and more particularly to a die bonding apparatus having an improved bonding agent application mechanism for bonding a pellet to a lead frame.

[0002]

2. Description of the Related Art One of semiconductor manufacturing processes is a die bonding process using a die bonding apparatus. That is, as shown in FIG.
Is the pellet transfer 3 of the pellet take-out mechanism 2,
The pellet 5 is taken out from the wafer 4, and the pellet 5 is placed on the gauging table 7 of the pellet position correcting mechanism 6,
Next, the gauging table 7 is rotated as necessary to correct the displacement of the pellet, and then the bonding unit 9 of the bonding mechanism 8 picks up the pellet 5 on the gauging table 7 and pastes it as a bonding agent. Is bonded to the lead frame 10 via the.

[0003] The above paste is supplied to
Pasting mechanism 13 including 1 and dispenser 12
Is applied to the lead frame. That is, the dispensing unit 11 includes the syringe 1 filled with the paste.
The syringe 14 moves up and down, left and right, and the amount of paste discharged from the application nozzle is controlled by the dispenser 12, so that a predetermined amount of paste is applied to a predetermined position of the lead frame 10. Thereafter, the bonding unit 9 places the pellet 5 on the lead frame 10 to which the paste is attached, and joins the pellet 5 to the lead frame 10 using the paste.

[0004]

However, in the die bonding apparatus 1, since the bonding mechanism 8 and the paste application mechanism 13 are provided in the transport direction of the lead frame 10, the transport distance of the lead frame 10 becomes longer. As a result, the size of the die bonding apparatus 1 increases.

[0005] The syringe 14 of the dispensing unit 11 is configured as a multi-nozzle type having a plurality of paste application nozzles, and it is considered that voids (bubbles and the like) are not generated in the paste joining the lead frame 10 and the pellet 5. However, there is a possibility that the application area of the paste on the back surface of the pellet 5 is small and the wettability of the pellet is not good.

The present invention has been made in consideration of the above circumstances, and has as its object to provide a die bonding apparatus capable of reducing the size of an apparatus and improving the wettability of pellets.

[0007]

SUMMARY OF THE INVENTION The present invention provides a pellet removing mechanism for removing pellets from a wafer, a pellet position correcting mechanism for mounting the removed pellets on a gauging table and correcting the position, and a pellet whose position has been corrected. And a bonding mechanism for bonding the lead frame to the lead frame using a bonding agent.
The bonding agent storage section capable of filling the bonding agent is installed on the gaging table, and the pellets removed by the pellet removal mechanism can be placed on the bonding agent surface in the bonding agent storage section. is there.

[0008]

Therefore, according to the die bonding apparatus of the present invention, the bonding agent accommodating portion is installed on the gauging table, and the pellets taken out by the pellet removing mechanism are placed on the surface of the bonding agent filled in the bonding agent accommodating portion. The pellet is placed and the position of the pellet is corrected in this state, and the bonding agent is attached to the back surface of the pellet. This eliminates the need for a bonding agent application device for applying the bonding agent to the lead frame, shortens the lead frame transport distance, and makes the die bonding device compact.

Further, by placing the pellets taken out by the pellet take-out mechanism on the surface of the bonding agent in the bonding agent accommodating portion, the bonding agent can be adhered to the entire area on the back surface of the pellet. The wettability can be improved.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view schematically showing one embodiment of a die bonding apparatus according to the present invention. FIG. 2 shows FIG.
It is a top view which shows the pellet position correction mechanism of FIG. FIG.
FIG. 3 is a longitudinal sectional view of the pellet position correcting mechanism of FIG. 2.

The die bonding apparatus 20 shown in FIG.
A large number of pellets 22 obtained by dicing and separating the wafer 21 are taken out one by one and bonded to an island portion (not shown) of the lead frame 23.
This die bonding apparatus 20 is a
5. Pellet position correcting mechanism 26 and bonding mechanism 2
7.

The above-mentioned pellet removing mechanism 25
Wafer stage (not shown) for installing
And a pick-up unit 29 for picking up the pellet 2. A pellet transfer 30 is mounted on the pick-up unit 29 so as to be movable in the horizontal and vertical directions. This pellet transfer 30 is used for the pellet 2
2 and rotate in the horizontal direction.
Gauging table 32 of pellet position correcting mechanism 26 (described later)
Is placed on the surface of a paste 42 (described later) in a paste storage section 33 (described later) formed in the above.

As shown in FIGS. 1 and 3, the pellet position correcting mechanism 26 includes a gauging table 32 which is rotated by a rotation driving mechanism 31 and a paste storage section formed on the gaging table 32 as a bonding agent storage section. 33 and a detection camera (not shown) that is disposed vertically above the gauging table 32 and detects the position of the pellet 22.

The gaging table shaft 34 of the gaging table 32 is rotatably provided via a bearing 35, and a driven pulley 36 is fixed to the gaging table shaft 34. On the other hand, a drive pulley 39 is fixed to a motor shaft 38 of the motor 37. The drive belt 40 is wound around the drive pulley 39 and the driven pulley 36, and the gauging table 32 is rotatably provided.
The driven pulley 36, the motor 37, the drive pulley 39, and the drive belt 40 are configured as the rotation drive mechanism 31.

A peripheral wall 41 is erected from the periphery of the gauging table 32 and is surrounded by the gauging table 32 and the peripheral wall 41.
The paste accommodating section 33 is configured. The paste accommodating section 33 is filled with a paste 42 such as a silver paste or a gold paste as a bonding agent. When the pellet 22 is placed on the paste 42 by the pellet transfer 30, the paste 42
Is attached.

The paste 4 in the paste container 33 is
The detection camera detects the position of the pellet 22 at the stage where the pellet 22 is placed on the 2. Based on the detected value, the rotation drive mechanism 31 drives to rotate the gauging table 32 to correct the position of the pellet 22.

The bonding mechanism 27 has a bonding unit 43 having a bonding head 44 that can move in the horizontal and vertical directions. The bonding head 44 picks up the pellet 22 placed on the surface of the paste 42 in the paste accommodating section 33 and the position of which has been corrected, and sends it to a lead frame transport device (not shown).
The pellet 22 is bonded to the island portion of the lead frame 23 mounted thereon. This bonding is performed by the paste 42 attached to the entire back surface of the pellet 22.
Made through.

Adjacent to the paste accommodating portion 33, a paste surface leveling mechanism 45 as a bonding agent surface leveling mechanism.
Are arranged (FIGS. 2 and 3). In the paste surface leveling mechanism 45, a leveling plate 47 is connected to one end of a swing arm 46, and a piston rod 49 of a cylinder device 48 is connected to the other end. Swing arm 46
Is configured to be rotatable in a horizontal direction around a bearing 51 via an arm shaft 50. Therefore, when the piston rod 49 of the cylinder device 48 moves forward and backward, and the swing arm 46 reciprocates around the arm shaft 50, the leveling plate 47 levels the surface of the paste 42 in the paste accommodating portion 33. Thereby, the depression on the surface of the pellet 42 generated after the pellet 22 is picked up by the bonding head 44 is leveled, and a constant level surface is secured.

According to the above embodiment, the bonding agent accommodating portion 33 is formed on the gauging table 32, and the pellet 2 taken out by the pellet transfer 30 of the pellet take-out mechanism 25 is formed.
2 is placed on the surface of the paste 42 filled in the paste accommodating portion 33, and in this state, the position of the pellet 22 is
The paste 42 is attached to the back surface of the second. Therefore, the conventional paste applying mechanism 13 (FIG. 4) for applying the paste 42 to the island portion of the lead frame 23 becomes unnecessary. As a result, the transport distance of the lead frame 23 is shortened, and the die bonding apparatus 10 can be made compact.

The pellets 22 taken out by the pellet transfer mechanism 30 of the pellet take-out mechanism 25 are placed on the surface of the paste 42 in the paste accommodating portion 33, so that the paste 42 adheres to the back surface of the pellets 22. Therefore, the paste 42 is applied to the entire back surface of the pellet 22.
Can be attached. As a result, the wettability of the pellet 22 with respect to the paste 42 can be improved, voids can be prevented from being generated at the time of bonding, and the pellet 22 can be securely bonded to the island portion of the lead frame 23, thereby improving the quality of the product. it can.

In the prior art, the bonding material was hardened during the period from the application of the bonding material to the placement of the pellet on the bonding material, and there was a possibility that a bonding failure might occur. In the example, since the paste is applied to the pellet 22 immediately before the pellet 22 is bonded to the lead frame 23 by the bonding head 44,
Bonding failure due to the curing of the bonding material is also prevented.

Further, in the above embodiment, the paste accommodating section 3
By placing the pellets 22 on the front surface of the paste 42 in 3, the paste 42 is applied to the back surface of the pellets 22. Therefore, even if the size of the pellets 22 changes due to, for example, product type change, there is no change. Therefore, it is possible to immediately respond to a change in variety.

[0023]

As described above, according to the die bonding apparatus according to the present invention, the apparatus can be made compact and the wettability of the pellets with the adhesive can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing one embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a plan view showing a pellet position correcting mechanism of FIG. 1;

FIG. 3 is a longitudinal sectional view of the pellet position correcting mechanism of FIG. 2;

FIG. 4 is a plan view schematically showing a conventional die bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 20 Die bonding apparatus 21 Wafer 22 Pellet 23 Lead frame 25 Pellet take-out mechanism 26 Pellet position correcting mechanism 27 Bonding mechanism 31 Rotary drive mechanism 32 Gauging table 33 Paste accommodating part 41 Peripheral wall 42 Paste 45 Paste surface leveling mechanism 47 Leveling blade

Claims (2)

(57) [Claims] 1. A pellet take-out mechanism for taking out a pellet from a wafer, a pellet position correcting mechanism for placing the taken-out pellet on a gauging table and correcting the position, and using a bonding agent for the position-corrected pellet in a lead frame. A bonding mechanism capable of filling the bonding agent, the bonding agent accommodating section is provided on the gaging table, and the pellets removed by the pellet removing mechanism are connected to the bonding agent. A die bonding apparatus that can be placed on the surface of the bonding agent in the housing. 2. A bonding agent surface leveling mechanism is provided adjacent to the bonding agent storage section, and the surface of the bonding agent filled in the bonding agent storage section is leveled by the bonding agent surface leveling mechanism. 2. The die bonding apparatus according to 1.