JP3270785B2 - Optical package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical package in which optical integrated circuits as photoelectric conversion elements or optical integrated circuits and optical elements such as optical fibers are optically coupled.

[0002]

2. Description of the Related Art Conventionally, an optical package for optically coupling an optical integrated circuit and an optical fiber has been used for mounting the optical integrated circuit and installing the optical fiber as shown in a schematic perspective view of FIG. A groove 12, a mounting body 13 having lead pins 16 connected to the optical integrated circuit, and a lid 14 covering the mounting body 13.
After the optical fiber is set in the package 2, the package 13 and the cover 14 are integrated with each other. In addition, when an optical integrated circuit is used, heat is generated, and this heat generation causes a temperature rise in the optical package, which greatly changes the characteristics of the optical integrated circuit itself. 4, or each substrate 26a, 26b having a cooling passage groove 24 or cooling passage holes 25a, 25b on the bottom surface of the mounting body 23, as shown in the schematic perspective view of FIG.
26c are integrated, and fluid is input / output from the fluid inlet / outlet piping portions 27a, 27b connected to the cooling passage hole 25b, and the cooling passage groove 24 and the cooling passage holes 25a, 25
By the method of circulating in b, the inside of the optical package is cooled to minimize the change in the characteristics of the optical integrated circuit due to the temperature change.

[0003]

However, in the structure of the conventional optical package as shown in FIG. 3, when a surface emitting type optical integrated circuit is used, a light emitting portion or a light receiving portion of the optical integrated circuit and an optical fiber are not used. In some cases, it is necessary to provide a means for converting the optical path in the lid 14 in order to couple the optical signal to the optical signal with low loss. However, no solution has been proposed for the conventional optical package. Further, in the conventional method of disposing an element serving as a cooling means inside a package, there is a problem that the optical package itself becomes large, and the cooling method as shown in FIG. Because of the cooling method, the method of cooling the internal heat was very inefficient.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-described problem, and is directed to an optical package including a package for mounting an optical integrated circuit and a cover for covering the package. Is formed of any one of aluminum nitride, sapphire, and copper tungsten, and any one of aluminum, silver, platinum, gold, and silicon is adhered to the inner surface of the lid at a position facing the light emitting unit or the light receiving unit in the mounting body. And a concave portion is formed, and the light emitted from the light emitting portion is reflected by the concave portion, and is condensed and incident on a light receiving portion in the mounting body.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show two embodiments of the present invention. In the drawings, the same members are denoted by the same reference numerals. FIG. 1 shows a first embodiment of the present invention.
As shown in the schematic cross-sectional view of FIG. 1A, an optical package 1 mounts an optical integrated circuit A and has a groove 2 for installing a plurality of optical fibers C. The package 3 includes a body 3 and a cover 4 that covers the package 3. The package 3 is provided with bonding wires 5 and lead pins 6 for electrically connecting the optical integrated circuit A to the outside. Here, a member having a high thermal conductivity and a high light reflectance is used for the lid 4 and becomes an inner surface of the optical package 1 as shown in a partially enlarged schematic sectional view of FIG. A concave portion 4a for changing an incident optical path is formed in the portion.

As described above, the cover 4 is made of a member having a high light reflectance, and the recess 4a is formed. The light emitted from the light emitting portion B of the optical integrated circuit A is reflected by the recess 4a. By causing the light to enter the optical fiber C, it is possible to form an optical path D for coupling the optical signal between the light emitting section B of the optical integrated circuit A and the optical fiber C with low loss, and a member having a high thermal conductivity Is used to shorten the optical signal propagation path between the light emitting portion B of the optical integrated circuit A and the optical fiber C via the cover 4 and to couple the optical signal with low loss.
Is small as much as possible so that the heat generated inside can be efficiently conducted to the lid 4 even if the installation area of the element serving as the cooling means is not provided inside the optical package 1. By connecting a cooling means such as a Peltier element, a heat sink, a refrigerant flowing device, or a radiating fin, heat generated inside can be easily and efficiently cooled.

The lid 4 is formed by coating, vapor-depositing or bonding a member having a high thermal conductivity and a high light reflectance on a member having a high thermal conductivity to form a concave portion. . As a member having a high thermal conductivity, any one of aluminum nitride (AlN), sapphire, and copper tungsten is used. As a member having a higher thermal conductivity and a higher light reflectance, aluminum, silver, platinum, and gold are used. , Or silicon may be used. Further, the positions of the optical integrated circuit A and the optical fiber C may be set at any positions as long as optical signals can be transmitted through the concave portion 4a of the cover 4. In this embodiment, the optical integrated circuit A and the optical fiber C
However, instead of the optical fiber C, an optical integrated circuit, a light emitting diode (LED), and a laser diode (L
D), the same can be applied to the case where an optical element such as a photodiode (PD) is used.

FIG. 2 is a sectional view showing a second embodiment of the present invention.
FIG. 2 is a schematic diagram showing two optical integrated circuits A; ₁, A_TwoIs the optical signal
Is mounted on a plate 7 that can transmit light. this
Like optical fiber B₁Signal from the optical integrated circuit A₁
To the optical integrated circuit A via the concave portion 4a of the lid 4.
_TwoTo the optical integrated circuit A_TwoFrom optical fiber B_Two
Multiple optical integration
Low loss coupling between circuit and optical fiber, and lid
Peltier element, heat sink, refrigerant only on outer surface of 4
Flow device or cooling means such as radiating fins
Generated internally while maintaining compactness
Heat can be easily and efficiently cooled
You.

[0009]

As described above, according to the optical package of the present invention, the lid is formed of a material having high thermal conductivity, and is emitted from the light emitting portion to a position facing the light emitting portion or the light receiving portion in the mounting body. By forming a concave part that reflects the reflected light and enters the light receiving part in the mounting body, the optical signal can be coupled with low loss, and a small size that does not take up the installation area of the element serving as the cooling means inside Even with the optical package, an optical package that easily and efficiently cools the heat generated inside can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of an optical package of the present invention.

FIG. 2 is a schematic sectional view showing a second embodiment of the optical package of the present invention.

FIG. 3 is a schematic perspective view showing a conventional optical package.

FIG. 4 is a schematic perspective view showing a conventional optical package.

[Explanation of symbols]

1: optical package 24: groove for cooling passage 2, 12: groove 25a, 25
b: Cooling passage holes 3, 13, 23: Mounted bodies 26a, 26
b, 26c: Substrate 4, 14: Lid 27a, 27
b: fluid inlet / outlet piping section 4a: concave section A: optical integrated circuit 5: bonding wire B: light emitting section 6, 16: lead pin C: optical fiber 7: plate D: optical path

Claims (1)

(57) [Claims] 1. An optical package comprising a package for mounting an optical integrated circuit and a lid for covering the package, wherein the lid is made of aluminum nitride, sapphire, copper tungsten or the like.
Formed by either displacement, and aluminum on the inner surface of the lid at a position opposing to the light emitting portion or light receiving portion of the mounting body, silver,
One of platinum, gold, and silicon is adhered and a concave portion is formed, and light emitted from the light emitting portion is reflected by the concave portion and condensed and incident on a light receiving portion in a mounting body. An optical package, characterized in that the optical package is adapted to be used.