JP3264543B2 - Highly decorative decorative board and method for producing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a decorative plate having a decorative sheet with a decorative sheet adhered to a substrate, and more particularly to a decorative sheet having a decorative sheet with an embossed and embossed pattern. Regarding the board.

[0002]

2. Description of the Related Art Conventionally, a hard resin layer is formed on a thermoplastic resin sheet such as a vinyl chloride sheet having an uneven pattern on its surface to protect the surface, with or without a design such as a picture. The decorative sheet thus formed is stuck on a substrate to which the adhesive has been applied while heating it using a heating roller or the like to produce a decorative plate.

[0003]

In the conventional method of manufacturing a decorative sheet, the decorative sheet is attached to a substrate to which an adhesive has been applied while heating it using a heating roller or the like. In order to increase the adhesiveness to the substrate and the heat resistance of the adhesive, the heating temperature is usually required to be 180 ° C. or higher, especially about 200 ° C. due to the softening point of the adhesive.

[0004] When a decorative sheet in which fine and fine irregularities are embossed on a thermoplastic resin sheet is used, the embossing irregularities disappear due to a high temperature in a bonding process by heating and pressing with a heating roll, and in particular, embossing is difficult. Polyvinyl chloride, which is a general-purpose decorative sheet, tends to rapidly lose irregularities at a temperature exceeding 150 ° C., and has a problem in high design.

On the other hand, in order to prevent defects such as disappearance of the precision emboss of the decorative sheet, if the decorative sheet and the substrate are bonded to each other by setting the heating temperature to 150 ° C. or less in the above-mentioned conventional method, the emboss is not formed. Although the disappearance can be avoided, such low-temperature bonding weakens the adhesive strength between the decorative sheet and the substrate at the environmental temperature, and fails to give a desired adhesive strength to the obtained decorative plate.

[0006] The desired adhesive strength between the decorative sheet and the substrate in the decorative board to which the decorative sheet is adhered requires the following initial adhesive strength and final adhesive strength. In other words, the initial adhesive strength is such that the decorative sheet and the substrate are not easily peeled off by hand, and the cut surface is not peeled off when the decorative sheet adhered substrate is cut, and does not float up.
The peel strength is 50 g / cm width or more, more preferably 100 g / cm.
g / cm width or more, and the adhesive force immediately after bonding is required to be the adhesive force necessary for handling and processing of the decorative board.

The final adhesive strength is such that the adhesive does not undergo creep deformation even at the maximum environmental temperature of 100 ° C. (It is desirable that the adhesive is crosslinked and polymerized to form a cured product.) Is more preferably 1000 g / cm width or more, more preferably 2000 g / cm width or more. Therefore, the present invention provides a method for manufacturing a high-design decorative board in which the precision emboss applied to the decorative sheet is not lost in the attaching step by heating and pressurizing the decorative board, and a high-design decorative board obtained by the manufacturing method. It is intended to provide a decorative board.

[0008]

In order to solve the above-mentioned problems, the present invention adopts the following constitutional requirements. That is, in the present invention , the width of the concave portion, the convex portion on at least one surface of the thermoplastic resin sheet provided with or without the pattern layer
Department of width and depth to emboss the uneven pattern of 0.1~100μm as a decorative sheet, the decorative sheet, 100
A ℃ veneer method of manufacturing at the environmental temperature to adhere to thermal bonding to the substrate surface by thermal fusion type adhesive capable of maintaining adequate adhesion, the heat-fusible type adhesives, modified Urethane
Resin and / or unsaturated polyester resin
In other words, the heat-fusible adhesive has a crystalline region at least in part, and is thermoplastic at least under the conditions at the time of bonding, and has a melting point T _{m of the} crystalline region, an emboss of the transparent thermoplastic resin sheet. relationship between the maximum environmental temperature T _a of the heat resistant temperature T _em and during _{use, T a <T m <T} em ( However, T _m is within 0.99 ° C. 100 ° C. or higher, T _em 1
20 ° C or more and 150 ° C or less. ) And an adhesive whose adhesive temperature T _L satisfies T _m ≦ T _L <T _em is provided.

[0009] The present invention also relates to a colored thermoplastic resin sheet having a transparent thermoplastic resin sheet, with or without a pattern layer provided thereon, and at least one surface of the obtained laminated sheet having a width of a concave portion, The width and depth of the projection are 0.1 to 1
The embossed pattern of the irregularities of 00 μm was embossed to make a decorative sheet, and the obtained decorative sheet was sufficiently contacted even at an environmental temperature of 100 ° C.
A method for producing a decorative board, which is heat-fused to a substrate surface with a heat-fusion-type adhesive capable of maintaining adhesiveness, and is bonded.
Type adhesive is a modified urethane resin and / or unsaturated poly
It is intended to include an ester resin, the heat-fusible type adhesive, at least a has a partially crystalline region, under conditions at least the adhesive is a thermoplastic, the melting point T _m of a crystal region, the transparent relationship between the embossed heat-resistant temperature T _em and when using the maximum environmental temperature T _a of the thermoplastic resin _{sheet, T a <T m <T} em ( However, T _m is within 0.99 ° C. 100 ° C. or higher, T _em 1
20 ° C or more and 150 ° C or less. ) And an adhesive whose adhesive temperature T _L satisfies T _m ≦ T _L <T _em is provided.

[0010] The present invention also relates to a substrate, an adhesive layer formed on the substrate, and the width of the concave portion, the width of the convex portion, and the depth of at least one surface laminated on the adhesive layer. A decorative sheet comprising a decorative sheet including a transparent thermoplastic resin sheet having an embossed pattern having a roughness of 0.1 to 100 μm, wherein the adhesive layer comprises a modified urethane resin and / or The heat-sealing adhesive containing a saturated polyester resin is used.
0 ℃ melting point T _m of a crystalline region of adhesive can maintain a sufficient adhesion also at ambient temperature, the decorative sheet of the embossed heat-resistant temperature T _em, and the maximum environmental temperature T _a at the time of use, T _a <T _m < T _em (where T _m is 100 ° C. or more and 150 ° C. or less, T _em is 1
20 ° C or more and 150 ° C or less. ), And and bonding temperature T _L of the adhesive layer, in which a high decorative veneer, which is a _{T m ≦ T L <T em} .

The substrate, printing ink and printing method, uneven pattern, adhesive and bonding treatment used or applied in the present invention will be described in detail below. Substrate: Various substrates such as a metal plate, a wooden plate, and a synthetic resin plate can be used as the substrate used for the decorative decorative plate of the present invention.
For the metal plate, iron, stainless steel, carbon steel, aluminum, copper, or the like is used. In addition, it is desirable to form an oxide passivation film or the like on these metal plates by, for example, galvanizing or alumite treatment.

Transparent thermoplastic resin sheet: As the material used for the transparent thermoplastic resin sheet used in the present invention, those commonly used can be applied. Particularly when the substrate to be adhered is a metal steel plate, the material applicable to the transparent thermoplastic resin sheet is preferably a semi-hard to soft polyvinyl chloride containing 17 to 30 parts by weight of dioctyl phthalate or the like as a plasticizer. And others, for example, polyethylene, polypropylene, polystyrene, acrylonitrile-styrene copolymer (abbreviated as AS), acrylonitrile-butadiene-styrene copolymer (abbreviated as ABS), polycarbonate, acrylate or methacrylic Acid ester polymers and the like can be used.

Printing ink and printing method: A pattern or the like is printed on the transparent thermoplastic resin sheet used in the present invention, if necessary. In the printing ink used in the present invention, a transparent thermoplastic resin is used as a vehicle, and the transparent thermoplastic resin includes, for example, cellulose such as ethyl cellulose, cellulose nitrate, cellulose acetate, ethyl hydroxyethyl cellulose, and cellulose acetate propionate. Derivatives: Styrene resins or styrene copolymers such as polystyrene and poly-α-methylstyrene; Acrylic resins such as polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, and polybutyl acrylate; polyvinyl chloride, polyvinyl acetate , Vinyl chloride-vinyl acetate copolymers, vinyl polymers such as polyvinyl butyral;
Rosin ester resins such as rosin, rosin-modified maleic resin, rosin-modified phenol resin, and polymerized rosin; chroman resins; vinyl toluene resins; and natural or synthetic resins such as polyamide resins.

As the printing method, various known printing methods such as a gravure method and a silk screen can be applied. Concavo-convex pattern: Various concavo-convex patterns can be applied to the concavo-convex pattern in the present invention, for example, a conduit groove of a wood grain board, a linear groove,
Grains, pears and the like can be mentioned. In particular, the feature of the concavo-convex pattern in which the effect of the present invention is remarkably conspicuous is a pattern in which the width of the concave portion, the width of the convex portion, and the depth are about 0.1 to 100 μm.

Adhesive and adhesive treatment: The adhesive used in the present invention has a high degree of crystallinity, and the viscosity of the resin component of the adhesive changes sharply from the crystalline region when heated, indicating fluidity.
The one having the relational expression shown above is used. That is, the melting point T _m of a crystal region is chosen to be smaller than the embossed heat-resistant temperature T _em of transparent thermoplastic resin sheet (T _a
< _Tm < _Tem ). If the crystallinity of the adhesive is less than 100% or if the adhesive contains an additive, the gradient of the melt viscosity rises slowly as in a complete crystal. However, between the rise of viscosity of the T _a and T _em,
When completed, the present invention can be used without any problem.

By using such an adhesive, the adhesive used in the present invention has the characteristics shown in Table 1 below.
In Table 1 below, the adhesive used in the present invention and a conventional amorphous heat-sealing adhesive, a pressure-sensitive adhesive, and a two-part curable adhesive (uncured liquid) were used. And a comparison with a decorative board obtained by attaching an embossed decorative sheet.

[0017]

[Table 1]

The reason for the difference as shown in Table 1 will be described with reference to FIGS. FIG. 4 shows the temperature-melt viscosity characteristic of the conventional adhesive or pressure-sensitive adhesive, and FIG. 5 shows the temperature-melt viscosity characteristic of the hot-melt adhesive used in the present invention.
In the case of the amorphous heat-fusible adhesive, since the rise of the temperature-melt viscosity curve is gentle, when embossing at a temperature at which unevenness does not disappear, the adhesive has fluidity even at the use environment temperature,
Creep deformation occurs and the adhesive properties become insufficient (see FIG. 4).
(B)), and if an attempt is made to provide sufficient adhesive properties at the operating temperature, in order to develop the adhesive strength, the embossed portion enters the region where the embossed irregularities disappear (FIG. 4 (A)). Such a phenomenon is because the emboss heat resistance and the adhesive property are not compatible.

On the other hand, in the hot-melt adhesive used in the present invention, the temperature-melt viscosity curve rises sharply near the melting point as shown in FIG. The temperature can be brought between the temperature and the use environment temperature, and it is possible to achieve both the heat resistance and the adhesive property of the emboss. The adhesive usable in the present invention includes, for example, modified urethane resin (acrylic polyol,
Prepolymers such as polyether polyols and epoxy polyols), unsaturated polyester resins and the like can be used.

More specifically, for example, Japanese Patent Publication No.
No. 36860, (i) terephthalic acid, (ii) isophthalic acid, adipic acid, azelaic acid, sebacic acid, P-oxybenzoic acid, naphthalene-2,6-dicarboxylic acid and diphenylsulfone It consists of one or more compounds selected from the group consisting of dicarboxylic acids, and has a reduced viscosity η sp /c=0.15 in which the terminal hydroxyl group is blocked by an aromatic monocarboxylic acid or a derivative thereof.
A hot-melt adhesive comprising a linear polyester resin or prepolymer containing as an active ingredient a crystalline copolymer polyester having a melting point of 140 to 200 ° C. and a melting point of 140 to 200 ° C .;
Further, a urethane prepolymer having isocyanate groups at both molecular terminals, as described in JP-B-51-30898, and an ethylene-vinyl acetate copolymer 2
A reactive hot-melt adhesive comprising 25% by weight of an abietic acid-type rosin derivative and / or a terpene-phenol copolymer resin can be used.

If necessary, a crosslinking agent such as a polyvalent isocyanate is added to these adhesives. The crosslinking agent includes, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate, 1,5-naphthylene diisocyanate with respect to the polyol prepolymer. And the like.

When the transparent thermoplastic resin sheet is made of semi-rigid to soft polyvinyl chloride, the embossing heat resistance temperature T _em = 120 to 150 ° C. In the case of a normal decorative board, the maximum environmental temperature is Since T _a ≦ 100 ° C., 1
00 ° C. <may be selected such that the melting point T _m <120 to 150 ° C. in the crystalline regions. Bonding temperature T _adh is, T _a <T _m ≦ T
_adh <T _em , 100 ° C <adhesion temperature T for the polyvinyl chloride sheet (so-called PVC sheet)
_adh <120-150 ° C.

After bonding, the decorative board is cooled to 100 ° C. or less, so that the resin crystallizes and the sheet is fixed. In contrast to the above-mentioned adhesive used in the present invention, in order to maintain sufficient adhesiveness even at an environmental temperature of 100 ° C. at maximum, a state showing fluidity required for adhesion is 18%.
Since the temperature is 0 ° C. or higher, the precision emboss is impaired due to the softening flow of the sheet, the release of residual stress, and the like.

The bonding time t _L and the bonding pressure P _L vary depending on the bonding method, but in the case of lamination using a roller, they are usually t ≦ 1 sec and P ≦ 5 kg / cm ² . Incidentally, the adhesive, at least during the above bonding conditions,
It may be thermoplastic (that is, it is melted by heat to exhibit adhesiveness), and may be cured by crosslinking and polymerization by a chemical reaction over time after bonding. For this purpose, for example, when the adhesive uses a resin such as unsaturated polyester or polyurethane, the above-mentioned isocyanate is added as a cross-linking agent and heat bonding is performed while cross-linking hardly proceeds. Gives final adhesion and heat creep resistance.

When the embossed sheet is heated under the bonding time t _L at the time of thermal lamination and the bonding pressure P _L , the uneven pattern gradually disappears as the temperature rises.
When the depth of the unevenness is 50% or more before the test, disappearance of the unevenness is hardly noticeable. Therefore, under the bonding time t _L and the bonding pressure P _L , the embossing heat-resistant temperature T _em is set to the maximum temperature at which the depth of the unevenness maintains 50% of that before the test.
When the thermoplastic resin sheet is a polyvinyl chloride sheet, the embossing heat resistance temperature T _em is 120 to 150.
° C.

[0026]

Example 1 A pattern layer was formed on the back surface of a 100 μm-thick transparent PVC sheet (20 parts by weight of a plasticizer) using Chemical X ink (trade name, manufactured by Showa Ink Industries, Ltd.) as an ink.
On a surface of the formed pattern layer, a pattern of a linear groove embossment having a concave portion width and a convex portion width of 10 μm and a depth of 5 μm, respectively, was hot-embossed at an embossing temperature of 160 ° C. to produce a decorative sheet.

On a galvanized steel sheet, Takenate TD917 (trade name) was used as an adhesive with a roll coater for 5 times.
0 parts by weight, 42.5 parts of Polystar T # 115 (trade name)
A reactive hot melt adhesive consisting of 7.5 parts by weight of an ethylene-vinyl acetate copolymer was applied. The steel plate coated with the adhesive is heated to 130 ° C., and the plate temperature is 130 ° C.
In the state of above, the decorative sheet having been subjected to the precision embossing described above is pressure-pressed with a rubber roll at room temperature at a linear pressure of 2 to 3 kgf / cm so as to overlap the pattern layer and the adhesive applied layer, and is pressed to a high pressure. A decorative veneer was manufactured.

FIG. 1 is a cross-sectional view of the obtained decorative decorative board. On an electrogalvanized steel sheet 1, an adhesive layer 2, a picture layer 3, and a transparent PVC sheet 4 with a precision embossed backside are laminated in this order.

[0029]

Example 2 A pattern layer was formed on a surface of a colored PVC sheet (30 parts by weight of a plasticizer) having a thickness of 100 μm with a chemical X ink (trade name, manufactured by Showa Ink Industries Co., Ltd.).
A transparent PVC sheet (30 parts by weight of a plasticizer) having a thickness of 80 μm was prepared, and the transparent PVC sheet was overlaid on a pattern layer formed on the surface of the colored PVC sheet and thermally laminated. A decorative sheet was manufactured by hot embossing a linear groove embossed pattern having a concave width and a convex width of 10 μm and a depth of 5 μm on the surface (transparent PVC surface) of the laminated PVC sheet at an embossing temperature of 160 ° C.

The same adhesive as used in Example 1 was applied on an electrogalvanized steel sheet by a roll coater.
The steel sheet coated with the adhesive is heated to 130 ° C., and at a sheet temperature of 130 ° C., the temperature is adjusted to room temperature so that the colored PVC sheet surface of the precision embossed decorative sheet and the adhesive layer overlap with each other. Linear pressure 2-3kgf / cm using rubber roll
And press-bonded to produce a highly decorative decorative board.

FIG. 2 shows a cross-sectional view of the obtained decorative board. On an electrogalvanized steel sheet 1, an adhesive layer 2, a colored PVC sheet 5, a picture layer 3, and a transparent PVC sheet 4 whose surface is precisely embossed are laminated in this order.

[0032]

Example 3 A pattern layer was formed on the back surface of a 100 μm-thick transparent PVC sheet (20 parts by weight of a plasticizer) with Chemical X ink (trade name, manufactured by Showa Ink Industries Co., Ltd.) as an ink.
On the transparent PVC sheet surface where the picture layer is not formed,
A decorative sheet was manufactured by embossing a pattern of a linear groove embossment having a concave portion width and a convex portion width of 10 μm and a depth of 5 μm, respectively, at an embossing temperature of 160 ° C.

On a galvanized steel sheet, the same adhesive as that used in Example 1 was applied as an adhesive by a roll coater. The steel sheet on which the adhesive is applied is heated to 130 ° C., and at a sheet temperature of 130 ° C., the decorative sheet on which the precision embossing is performed is set to room temperature so that the picture layer and the adhesive applied layer overlap. Linear pressure 2-3 using rubber roll
It was pressed and pressed at kgf / cm to produce a high-design decorative board.

FIG. 3 shows a cross-sectional view of the decorative plate obtained. On an electrogalvanized steel sheet 1, an adhesive layer 2, a picture layer 3, and a transparent PVC sheet 4 whose surface is precisely embossed are laminated in this order.

[0035]

According to the present invention, the adhesion between the substrate and the decorative sheet made of a thermoplastic resin sheet is 100 to 150 ° C.
As a result, it is possible to provide a high-decorative decorative board having a precision embossed pattern that could not be expressed conventionally, without the precision embossing applied to the decorative sheet being damaged by heat.

In addition, the initial adhesion immediately after adhesion, the adhesion at ambient temperature, and the heat creep resistance are good.

[Brief description of the drawings]

FIG. 1 shows a cross section of a high-design decorative board subjected to precision embossing of Example 1.

FIG. 2 shows a cross section of a high-design decorative board on which precision embossing has been performed in Example 2.

FIG. 3 shows a cross section of a high-design decorative board on which precision embossing has been performed in Example 3.

FIG. 4 shows temperature-melt viscosity characteristics of a conventional adhesive or pressure-sensitive adhesive.

FIG. 5 shows temperature-melt viscosity characteristics of the hot-melt adhesive used in the present invention.

[Explanation of symbols]

 1 Electrogalvanized steel sheet 2 Adhesive layer 3 Picture layer 4 Transparent PVC sheet 5 Colored PVC sheet

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B32B 1/00-35/00

Claims (5)

(57) [Claims] (1) A concave portion is formed on at least one surface of a thermoplastic resin sheet provided with or without a picture layer .
Embossing a concavo-convex pattern having a width, a width of a convex portion, and a depth of 0.1 to 100 μm to form a decorative sheet; (2) The decorative sheet can be sufficiently used even at an environmental temperature of 100 ° C.
A method for producing a decorative board, which is heat-fused to a substrate surface with a heat-fusible adhesive capable of maintaining excellent adhesiveness and adheres to the substrate surface, (3) the heat-fusible adhesive comprises a modified urethane resin and
It is intended to include the / or unsaturated polyester resin, (4) the heat-fusible type adhesive has at least a portion thereof crystal region, a thermoplastic under the conditions of at least the adhesive, the crystal region melting point T _m of a, the relationship between the embossing heat resistance temperature T _em and use up to the ambient temperature T _a when the transparent thermoplastic resin _{sheet, T a <T m <T} em ( However, T _m is 0.99 ° C. 100 ° C. or higher Within, T _em is 1
20 ° C or more and 150 ° C or less. ) And an adhesive whose adhesive temperature _TL is such that _Tm ≦ _TL < _Tem . (2) A colored thermoplastic resin sheet is laminated on a transparent thermoplastic resin sheet with or without a pattern layer, and (2) at least one of the laminated sheets obtained in (1) above. The width of the concave portion, the width of the convex portion, and the depth of 0.1 to
Embossing the embossed pattern of 100 μm into a decorative sheet, (3) The decorative sheet can be sufficiently used at an environmental temperature of 100 ° C.
A method for producing a decorative board, wherein the decorative board is heated and fused to the surface of a substrate with a heat-fusible adhesive capable of maintaining excellent adhesiveness , and (4) the heat-fusible adhesive comprises a modified urethane resin and
And (5) the heat-sealing adhesive has a crystalline region at least in part, and is thermoplastic at least under the conditions at the time of bonding. melting point T _m of a, the relationship between the embossing heat resistance temperature T _em and use up to the ambient temperature T _a when the transparent thermoplastic resin _{sheet, T a <T m <T} em ( However, T _m is 0.99 ° C. 100 ° C. or higher Within, T _em is 1
20 ° C or more and 150 ° C or less. ) And an adhesive whose adhesive temperature _TL is such that _Tm ≦ _TL < _Tem . 3. The adhesive according to claim 1, wherein a cross-linking agent is added to the adhesive, and the decorative sheet and the substrate are bonded to each other, and then the adhesive is cross-linked and cured by a chemical reaction.
The method for producing a decorative decorative board according to the above. (1) a substrate; (2) an adhesive layer formed on the substrate; and (3) a width of a concave portion and a convex portion on at least one surface laminated on the adhesive layer. Part width and depth 0.1
A laminated decorative board comprising a decorative sheet including a transparent thermoplastic resin sheet having an embossed pattern of １００100 μm, wherein (4) the adhesive layer is a modified urethane resin and / or an unsaturated polyester. consists heat fusion adhesive containing a resin, (5) the melting point T _m of a crystalline region of adhesive can maintain sufficient adhesion at 100 ° C. of ambient temperature of the adhesive layer, the embossed heat-resistant temperature of the decorative sheet T _em, and the maximum environmental temperature T _a during _{use, T a <T m <T} em ( However, T _m is within 0.99 ° C. 100 ° C. or higher, T _em 1
20 ° C or more and 150 ° C or less. ), And and the bonding temperature T _L of the adhesive layer is, high design decorative plate, which is a _{T m ≦ T L <T em} . 5. The decorative decorative board according to claim 4, wherein the adhesive layer is cross-linked and cured by a cross-linking agent.